Inductance device and inverter
By setting the heat dissipation fin assembly and filling the insulating thermal conductivity glue in the inductor device of the inverter, the temperature increase caused by the heat generation of the inductor component in the inverter is solved, and more efficient heat dissipation and cooling effect and longer equipment service life are achieved. .
Patent Information
- Application Number
- CN202420356961.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-26
- Publication Date
- 2025-02-14
- Estimated Expiration
- 2034-02-26
AI Technical Summary
The heat generation of the inductor components in the inverter is large, which leads to an increase in component temperature, affecting the performance and product life of the inverter.
An inductor device is designed, including a first housing, a second housing, a control assembly and an insulating thermal adhesive. The heat dissipation fin assembly is provided on the side of the back of the first housing leaving the opening, and the second housing is connected to the first housing to define a receiving cavity for mounting the control assembly, and the insulating thermal conductivity glue is filled in the receiving cavity to improve the thermal conductivity effect.
By setting up the heat dissipation fin assembly and filling the insulating thermal conductivity glue, the heat dissipation and cooling effect of the inductor device is improved, maintaining the efficient operation of related equipment and extending the service life.
Smart Images

Figure CN222483060U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of inverter equipment, and in particular to an inductor device and an inverter. Background Art
[0002] The inverter is a converter that converts DC power (battery, storage bottle) into constant frequency and voltage or frequency and voltage adjustable AC power. The inverter adopts independent boost mode. The inductor components in the inverter mainly play the role of energy storage, boost, filtering, and EMI elimination. The related components generate a lot of heat. The increase in component temperature affects the performance and product life of the inverter. Considering how to improve the heat dissipation and cooling performance of the inverter has become an urgent problem to be solved. Utility Model Content
[0003] The purpose of the utility model is to provide an inductor device and an inverter, improve the internal structure, enhance the heat dissipation and cooling effect, thereby maintaining the efficient operation of related equipment and extending the service life of related equipment.
[0004] A first aspect of the utility model provides an inductive device, which comprises a first shell, a second shell, a control component and an insulating heat-conductive adhesive.
[0005] The first shell has an opening, and a heat dissipation fin assembly is arranged on a side of the first shell away from the opening; the second shell cover is arranged on the opening, and the second shell is connected to the first shell and defines a accommodating cavity; the control assembly is arranged in the accommodating cavity; the insulating thermal conductive adhesive is filled in the accommodating cavity.
[0006] In a possible embodiment of the present invention, the control assembly is disposed on a bottom surface of the accommodating cavity, and the bottom surface is located on a side of the accommodating cavity close to the heat dissipation fin assembly.
[0007] In a possible embodiment of the present invention, the heat dissipation fin assembly includes a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged at intervals along a first direction, and gaps are provided between adjacent heat dissipation fins.
[0008] In a possible embodiment of the present invention, a side of the first shell close to the heat dissipation fin assembly extends toward two opposite sides along the first direction to form an arc-shaped edge structure.
[0009] In a possible embodiment of the present invention, the second shell is provided with at least two glue injection holes.
[0010] In a possible embodiment of the present invention, the glue injection hole includes a first glue injection hole and a second glue injection hole, and the insulating thermally conductive glue can flow into the accommodating cavity through the first glue injection hole or the second glue injection hole in a molten state.
[0011] In a possible embodiment of the present invention, the first glue filling hole and the second glue filling hole are respectively arranged at opposite ends of the second shell along the first direction.
[0012] In a possible embodiment of the present invention, the inductive device further includes a mounting assembly, and the mounting assembly can abut against the first shell and the second shell to form a sealing structure.
[0013] In a possible embodiment of the present invention, a plurality of notches are formed on the side wall of the first shell, and the mounting assembly includes a plurality of mounting members, with one mounting member corresponding to one notch.
[0014] A second aspect of the utility model provides an inverter, comprising the inductor device described in any one of the above embodiments.
[0015] Compared with the prior art, the beneficial effects of the utility model are as follows: the inductor device and inverter provided by the utility model improve the internal structure and are applied to inverter equipment. The heat dissipation fin assembly is provided to facilitate the heat dissipation of the inductor device and improve the heat dissipation and cooling effect. The second shell and the first shell define a accommodating cavity for installing the control component. The insulating thermal conductive glue is provided to fill the accommodating cavity to facilitate the conduction of temperature, improve the thermal conductivity and heat dissipation effects of the control component, thereby maintaining the efficient operation of the related equipment and extending the service life of the related equipment. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.
[0017] Figure 1 A schematic diagram of the internal structure of an inductor device provided in some embodiments of the utility model;
[0018] Figure 2 It is a schematic diagram of the three-dimensional structure of the inductor device provided in some embodiments of the utility model;
[0019] Figure 3 A top view of an inductive device provided in some embodiments of the present utility model;
[0020] Figure 4 It is a three-dimensional assembly schematic diagram of the inductor device provided in some embodiments of the utility model.
[0021] Description of main component symbols;
[0022] 100-inductor device; 110-first shell; 111-opening; 112-heat sink fin assembly; 1121-heat sink fin; 1122-gap; 113-accommodating cavity; 1131-bottom surface; 120-second shell; 121-first glue injection hole; 122-second glue injection hole; 130-control assembly; 140-installation assembly; 141-installation piece; 150-notch. DETAILED DESCRIPTION
[0023] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.
[0024] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0025] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0026] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the utility model product is usually placed when in use, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0027] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0028] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0029] In conjunction with the accompanying drawings, some embodiments of the present invention are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.
[0030] Example 1
[0031] refer to Figure 1 As shown, an embodiment of the present application provides an inductive device 100 , which includes a first housing 110 , a second housing 120 , a control component 130 , and an insulating thermal conductive adhesive.
[0032] It should be noted that the inductive device includes an inductor, which can be called a reactor. It is generally composed of a skeleton, a winding, a magnetic core, a shielding cover, a packaging material, etc. It is a component that can convert electrical energy into magnetic energy and store it. The inductor is one of the most critical components in the inverter. The insulating thermal conductive adhesive can be a polyurethane potting adhesive. The potting adhesive has the characteristics of low viscosity and good leveling. After curing, it has good toughness, elasticity, good impact resistance, high thermal conductivity and good sealing effect.
[0033] Combination Figures 2 to 4 As shown, specifically, the first shell 110 is provided with an opening 111, and a heat dissipation fin assembly 112 is arranged on a side of the first shell 110 away from the opening 111; the second shell 120 covers the opening 111, and the second shell 120 is connected to the first shell 110 and defines a accommodating cavity 113; the control component 130 is arranged in the accommodating cavity 113; the insulating thermal conductive adhesive is filled in the accommodating cavity 113, the inductor device 100 improves the internal structure, and the heat dissipation fin assembly 112 is arranged to facilitate the heat dissipation of the inductor device 100 and improve the heat dissipation and cooling effect, the second shell 120 and the first shell 110 define an accommodating cavity 113 for installing the control component 130, and the insulating thermal conductive adhesive is arranged to fill the accommodating cavity 113 to facilitate temperature conduction, improve the thermal conductivity and heat dissipation effects of the control component 130, thereby maintaining the efficient operation of the relevant equipment and extending the service life of the relevant equipment.
[0034] It can be understood that the heat sink assembly 112 is a type of heat sink, which is classified as a "passive heat sink element" in the field of electronic engineering design. It is made of metal with good thermal conductivity, light weight, and easy processing (mostly aluminum or copper, silver is too expensive and generally not used) attached to the heat-generating surface to dissipate heat in a composite heat exchange mode. After the heat sink fins 1121 in the heat sink fin assembly 112 absorb heat, they dissipate the heat in the form of convection. In the process of convection heat dissipation, the heat dissipation area is mainly determined by the size of the surface area of the heat sink fin assembly 112. The larger the surface area, the better the heat dissipation effect.
[0035] In one embodiment, specifically, the control component 130 is arranged on the bottom surface 1131 of the accommodating cavity 113, and the bottom surface 1131 is located on a side of the accommodating cavity 113 close to the heat dissipation fin assembly 112, that is, the bottom surface 1131 of the accommodating cavity 113 and the heat dissipation fin assembly 112 are two opposite sides of the side wall surface of the first shell 110. Since the control component 130 generates a large amount of heat and has a higher temperature during operation, the heat dissipation fin assembly 112 can quickly dissipate heat and cool down the control component 130 through the side wall surface of the first shell 110.
[0036] Combination Figure 3 and Figure 4 As shown, the inductor device 100 has a first direction. Exemplarily, the first direction is the length direction of the inductor device 100. It is understood that the above definition is only for the purpose of facilitating the understanding of the relative position relationship of the various parts in the inductor device 100, and should not be construed as a limitation to the present application.
[0037] Alternatively, if Figure 3 As shown, the heat dissipation fin assembly 112 includes a plurality of heat dissipation fins 1121, and the plurality of heat dissipation fins 1121 are arranged at intervals along the first direction, and gaps 1122 are arranged between adjacent heat dissipation fins 1121. Of course, the plurality of heat dissipation fins 1121 may be arranged at equal intervals, that is, the size of the gaps 1122 is equal, and accordingly, the heat dissipation space formed by the heat dissipation fin assembly 112 has a uniform and continuous heat dissipation effect on the control component 130, and will not cause a poor heat dissipation effect at a local position.
[0038] In summary, the inductor device 100 has an improved internal structure, and the heat dissipation fin assembly 112 is provided to facilitate the heat dissipation of the inductor device 100 and improve the heat dissipation and cooling effect. The second shell 120 and the first shell 110 define a accommodating cavity 113 for installing the control component 130. The insulating thermal conductive adhesive is provided to fill the accommodating cavity 113 to facilitate temperature conduction, thereby improving the thermal conductivity and heat dissipation effects of the control component 130, thereby maintaining the efficient operation of related equipment and extending the service life of related equipment.
[0039] Example 2
[0040] refer to Figures 1 to 3 As shown, an embodiment of the present application provides another inductive device 100 , which includes a first housing 110 , a second housing 120 , a control component 130 , and an insulating thermal conductive adhesive.
[0041] Combination Figures 2 to 4 As shown, specifically, the first shell 110 has an opening 111 , and a heat dissipation fin assembly 112 is disposed on a side of the first shell 110 away from the opening 111 . The heat dissipation fin assembly 112 can facilitate heat dissipation of the inductive device 100 and improve the heat dissipation and cooling effect.
[0042] Specifically, the second shell 120 covers the opening 111, and the second shell 120 is connected to the first shell 110 and defines a accommodating cavity 113; the control component 130 is arranged in the accommodating cavity 113, and the second shell 120 and the first shell 110 define an accommodating cavity 113 for installing the control component 130; the insulating thermally conductive adhesive is filled in the accommodating cavity 113, and the insulating thermally conductive adhesive is arranged to be filled in the accommodating cavity 113 to facilitate temperature conduction, improve the thermal conductivity and heat dissipation effects of the control component 130, thereby maintaining the efficient operation of related equipment and extending the service life of related equipment.
[0043] In one embodiment, specifically, the control assembly 130 is disposed on the bottom surface 1131 of the accommodating cavity 113, and the bottom surface 1131 is located on one side of the accommodating cavity 113 close to the heat dissipation fin assembly 112, that is, the bottom surface 1131 of the accommodating cavity 113 and the heat dissipation fin assembly 112 are two opposite sides of the side wall surface of the first housing 110. Since the control assembly 130 generates a large amount of heat and has a high temperature during operation, the heat dissipation fin assembly 112 can quickly dissipate heat and cool down the control assembly 130 through the side wall surface of the first housing 110. Accordingly, the control assembly 130 includes a main power element, so that the heat conduction path for the heat dissipation fin assembly 112 to dissipate heat from the main power element is shorter, thereby improving the heat dissipation efficiency.
[0044] It should be noted that the main power element can be a power field effect transistor (MOSFET), or a Darlington power transistor (BJT), or an insulated gate transistor (IGBT), etc., among which the power field effect transistor (MOSFET) has a lower on-state voltage drop and a higher switching frequency, and its on-state resistance increases with the increase of voltage.
[0045] In this embodiment, reference Figure 3 and Figure 4As shown, the inductor device 100 has a first direction. Exemplarily, the first direction is the length direction of the inductor device 100. It is understood that the above definition is only for the purpose of facilitating the understanding of the relative position relationship of the various parts in the inductor device 100, and should not be construed as a limitation to the present application.
[0046] Alternatively, if Figure 3 As shown, the heat dissipation fin assembly 112 includes a plurality of heat dissipation fins 1121, and the plurality of heat dissipation fins 1121 are arranged at intervals along the first direction, and gaps 1122 are arranged between adjacent heat dissipation fins 1121. Of course, the plurality of heat dissipation fins 1121 can be arranged at equal intervals, that is, the specification and size of the gaps 1122 are equal. Accordingly, the heat dissipation space formed by the heat dissipation fin assembly 112 has a uniform and continuous heat dissipation effect on the control component 130, and will not cause a poor heat dissipation effect at a local position. Furthermore, the plurality of heat dissipation fins 1121 can cover one side of the side wall surface of the first housing 110, so that the heat dissipation fins 1121 have a larger heat dissipation surface area, thereby having a better heat dissipation and cooling effect on the control component 130.
[0047] In one embodiment, specifically, one side of the first shell 110 close to the heat dissipation fin assembly 112 extends toward opposite sides along the first direction to form an arc-shaped edging structure, and the arc-shaped edging structure forms a protruding portion relative to the first shell 110. The opposite ends of the arc-shaped edging structure can be used for hand-held carrying and movement to improve convenience.
[0048] In one embodiment, specifically, the second housing 120 is provided with at least two glue injection holes. The glue injection holes are used to inject insulating thermally conductive glue into the accommodating cavity 113 so that the insulating thermally conductive glue fills the gap in the entire accommodating cavity 113. On the one hand, it has a limiting effect on the control component 130 in the accommodating cavity 113 to keep the positions of various components from being misaligned. On the other hand, the insulating thermally conductive glue can have a larger contact area with the control component 130 in the accommodating cavity 113, and the heat generated by the control component 130 is quickly conducted, which is beneficial to the heat dissipation and cooling of various components in the accommodating cavity 113.
[0049] Optionally, the glue filling holes include a first glue filling hole 121 and a second glue filling hole 122, and the insulating thermally conductive glue can flow into the accommodating cavity 113 through the first glue filling hole 121 or the second glue filling hole 122 in a molten state. When the insulating thermally conductive glue flows into the accommodating cavity 113 through the first glue filling hole 121, the second glue filling hole 122 can keep the accommodating cavity 113 connected with the outside world, maintain the internal air pressure stable, and discharge the gas in the accommodating cavity 113.
[0050] Furthermore, along the first direction, the first glue filling hole 121 and the second glue filling hole 122 are respectively arranged at the opposite ends of the second shell 120. It can be understood that the first glue filling hole 121 and the second glue filling hole 122 are arranged at the opposite ends of the second shell 120 to facilitate the inflow of molten insulating thermally conductive glue, avoid the occurrence of uncovered areas when the insulating thermally conductive glue flows in, reduce the gap in the accommodating cavity 113, and fill the space of the entire accommodating cavity 113.
[0051] In one embodiment, in combination Figure 2 and Figure 4 As shown, specifically, the inductive device 100 also includes an installation component 140, and the installation component 140 can abut between the first shell 110 and the second shell 120 to form a sealing structure, so that the connection position of the first shell 110 and the second shell 120 has better sealing and improves the waterproof performance.
[0052] Alternatively, if Figure 4 As shown, the side wall of the first housing 110 is provided with a plurality of notches 150, and the mounting assembly 140 includes a plurality of mounting members 141, one mounting member 141 corresponds to one notch 150, and accordingly, the mounting member 141 is mounted at the notch 150 to prevent water from entering the notch 150 through the connection gap, thereby improving the waterproof sealing effect. The mounting member 141 may be a two-in-one AC connector, which is a power connector, and the mounting member 141 may also be a PV connector, which is a photovoltaic power connector.
[0053] Example 3
[0054] The embodiment of the utility model further provides an inverter, including the inductor device 100 in embodiment 1 or embodiment 2. The inverter including the inductor device 100 has all the beneficial effects of the inductor device 100, which will not be described in detail here.
[0055] In all examples shown and described herein, any specific values should be interpreted as merely exemplary and not as limiting, and thus other examples of the exemplary embodiments may have different values.
[0056] The above-mentioned embodiments only express several implementation methods of the present invention, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.
Claims
1. An inductor device, characterized in that: include: A first shell, wherein the first shell has an opening, and a heat dissipation fin assembly is disposed on a side of the first shell away from the opening; A second shell, the second shell is covered on the opening and connected to the first shell to define a receiving cavity; A control component, wherein the control component is disposed in the accommodating cavity; Insulating thermally conductive adhesive, the insulating thermally conductive adhesive is filled in the accommodating cavity.
2. The inductive device according to claim 1, characterized in that The control assembly is arranged on the bottom surface of the accommodating cavity, and the bottom surface is located on a side of the accommodating cavity close to the heat dissipation fin assembly.
3. The inductive device according to claim 2, characterized in that: The heat dissipation fin assembly includes a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged at intervals along a first direction, and gaps are arranged between adjacent heat dissipation fins.
4. The inductive device according to claim 1, characterized in that A side of the first shell close to the heat dissipation fin assembly extends toward two opposite sides along a first direction to form an arc-shaped edge structure.
5. The inductive device according to claim 1, characterized in that: The second shell is provided with at least two glue injection holes.
6. The inductive device according to claim 5, characterized in that: The glue injection holes include a first glue injection hole and a second glue injection hole, and the insulating thermally conductive glue can flow into the accommodating cavity through the first glue injection hole or the second glue injection hole in a molten state.
7. The inductive device according to claim 6, characterized in that: The first glue injection hole and the second glue injection hole are respectively arranged at two opposite ends of the second shell along the first direction.
8. The inductive device according to any one of claims 1 to 7, characterized in that: It also includes a mounting assembly, which can abut between the first shell and the second shell to form a sealing structure.
9. The inductive device according to claim 8, characterized in that: The side wall of the first shell is provided with a plurality of notches, and the mounting assembly includes a plurality of mounting members, and one mounting member corresponds to one notch.
10. An inverter, characterized in that: The inductive device comprises the inductive device as claimed in any one of claims 1 to 9.