Semiconductor wafer rotating table device

Abstract

The utility model discloses a semiconductor wafer rotating table device which comprises a substrate and a rotating table, the top of the rotating table is fixedly connected with an auxiliary clamping plate, the inner wall of the rotating table is rotatably connected with a rotating plate through a torsion spring shaft, the top of the rotating table is fixedly connected with a stop block, and the stop block is arranged at the top of the rotating plate. According to the utility model, after a semiconductor wafer is prepared, the rotary table rotates to a designated position, an L-shaped inclined push rod is pressed downwards through a circular block, the L-shaped inclined push rod can extrude a supporting plate, the supporting plate can drive a movable column to move downwards, the movable column can drive a movable clamping plate to sink into a rotary plate, and then a baffle can drive a limiting plate to move downwards; and when the baffle is in contact with the limiting plate, the L-shaped inclined push rod can move from the supporting plate so as to extrude the included angle between the movable column and the supporting plate, so that the rotating plate can be rotated, and the semiconductor wafer can slide off when the rotating plate rotates to be in an inclined shape so as to facilitate blanking.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a semiconductor wafer rotating table device. Background Art

[0002] Semiconductor refers to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. Whether from the perspective of science and technology or economic development, the importance of semiconductors is enormous. The core units of most electronic products, such as computers, mobile phones or digital recorders, are closely related to semiconductors.

[0003] When preparing semiconductors on an existing semiconductor wafer turntable, workers first place the semiconductor wafer to be processed on a cardboard on the turntable, and then rotate it to be processed by semiconductor processing equipment such as optical inspection and laser printing around the turntable. After the processing is completed, workers will manually remove the semiconductor wafer. However, since the semiconductor wafer is too small, it is easy for workers to damage the circuit on the wafer by hard picking with their hands, so it is very troublesome to manually remove the semiconductor wafer from the cardboard on the turntable. Utility Model Content

[0004] The purpose of the utility model is to provide a semiconductor wafer rotating table device in order to solve the above-mentioned problem.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A semiconductor wafer rotating table device comprises a base plate and a rotating table, wherein an auxiliary clamping plate is fixedly connected to the top of the rotating table, and a rotating plate is rotatably connected to the inner wall of the rotating table via a torsion spring shaft, a stopper is fixedly connected to the top of the rotating table, and the stopper is arranged on the top of the rotating plate, a movable clamping plate is slidably connected to the top of the rotating plate, a baffle is fixedly connected to the top of the movable clamping plate, a limiting plate is fixedly connected to the inner wall of the rotating plate, a supporting assembly is fixedly connected to the bottom of the movable clamping plate, and an extrusion assembly is arranged on one side of the supporting assembly.

[0007] Preferably, the support assembly comprises a movable column, a bottom of the movable column is fixedly connected to a support plate, and a top of the support plate is fixedly connected to a first spring.

[0008] Preferably, a discharge plate is fixedly connected to the top of the base plate, a storage box is provided on one side of the discharge plate, and a buffer pad is fixedly connected to the inner wall of the storage box.

[0009] Preferably, the extrusion assembly comprises a support block, the support block is fixedly connected to one side of the discharge plate, and the inner wall of the support block is slidably connected to an L-shaped oblique push rod.

[0010] Preferably, one end of the L-shaped oblique push rod is fixedly connected to a circular block, and one side of the circular block is fixedly connected to a second spring.

[0011] In summary, due to the adoption of the above technical solution, the beneficial effects of the utility model are:

[0012] In the present application, after the semiconductor wafer is prepared, the rotating table rotates to the specified position, and the staff can press the L-shaped oblique push rod downward through the circular block, and the L-shaped oblique push rod will squeeze the support plate, and the support plate will drive the movable column to move downward, and the movable column will drive the movable clamping plate to sink into the rotating plate, and then the baffle plate will drive the limit plate to move downward, and when the baffle plate contacts the limit plate, the L-shaped oblique push rod will move from the support plate to squeeze the angle between the movable column and the support plate, so that the rotating plate will be rotated, and the rotating plate will rotate in an inclined state, which will cause the semiconductor wafer to slide off and facilitate unloading. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 The overall structure schematic diagram provided according to the embodiment of the utility model is shown;

[0014] Figure 2 A cross-sectional view of a rotating plate structure provided according to an embodiment of the utility model is shown;

[0015] Figure 3 A schematic diagram showing the distribution of the support assembly and the extrusion assembly provided according to an embodiment of the utility model is shown;

[0016] Legend:

[0017] 1. Base plate; 2. Rotating table; 3. Auxiliary clamping plate; 4. Rotating plate; 5. Movable clamping plate; 6. Baffle plate; 7. Limiting plate; 8. Movable column; 9. Support plate; 10. First spring; 11. Discharge plate; 12. Storage box; 13. Buffer pad; 14. Support block; 15. L-shaped oblique push rod; 16. Round block; 17. Second spring; 18. Baffle block. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] See also Figure 1-3 , the utility model provides a technical solution:

[0020] A semiconductor wafer rotating table device comprises a substrate 1 and a rotating table 2, wherein the rotating table 2 is rotatably connected to the top of the substrate 1, an auxiliary clamping plate 3 is fixedly connected to the top of the rotating table 2, and the auxiliary clamping plate 3 can cooperate with a movable clamping plate 5 to limit the semiconductor wafer, the inner wall of the rotating table 2 is rotatably connected to a rotating plate 4 through a torsion spring shaft, a stopper 18 is fixedly connected to the top of the rotating table 2, and the stopper 18 is arranged on the top of the rotating plate 4, and a movable clamping plate 5 is slidably connected to the top of the rotating plate 4, and the movable clamping plate 5 can be inserted into the interior of the rotating plate 4 after moving, and a sliding groove having an area larger than that of the movable clamping plate 5 is provided inside the rotating plate 4, a baffle 6 is fixedly connected to the top of the movable clamping plate 5, and the area of ​​the baffle 6 is larger than that of the movable clamping plate 5, a limiting plate 7 is fixedly connected to the inner wall of the rotating plate 4, and the through groove area provided in the limiting plate 7 is larger than that of the movable plate 5, and a supporting component is fixedly connected to the bottom of the movable clamping plate 5, and an extrusion component is provided on one side of the supporting component.

[0021] Specifically, Figure 3 As shown, the supporting assembly includes a movable column 8, which is fixedly connected to the bottom of the movable clamping plate 5. The movable column 8 runs through the interior of the rotating plate 4. The bottom of the movable column 8 is fixedly connected to a supporting plate 9, and the top of the supporting plate 9 is fixedly connected to a first spring 10. The first spring 10 is fixedly connected to the bottom of the rotating table 2, and the first spring 10 is sleeved on the outside of the movable column 8. The first spring 10 can support the movable column 8.

[0022] Specifically, Figure 1 As shown, a discharge plate 11 is fixedly connected to the top of the substrate 1, and the discharge plate 10 is arranged in an inclined shape. The discharge plate 11 is arranged on one side of the rotating plate 4. A storage box 12 is provided on one side of the discharge plate 11. A buffer pad 13 is fixedly connected to the inner wall of the storage box 12. The buffer pad 13 is made of rubber material to prevent the falling semiconductor wafer from being damaged.

[0023] Specifically, Figure 3 As shown, the extrusion assembly includes a support block 14, which is fixedly connected to one side of the discharge plate 11. The inner wall of the support block 14 is slidably connected with an L-shaped oblique push rod 15, which is arranged on the top of the support plate 9.

[0024] Specifically, Figure 3 As shown, one end of the L-shaped oblique push rod 15 is fixedly connected to a circular block 16, one side of the circular block 16 is fixedly connected to a second spring 17, the second spring 17 is fixedly connected to the top of the support block 14, and the second spring 17 is sleeved on the outside of the L-shaped oblique push rod 15. The second spring 17 can reset the L-shaped oblique push rod 15 after moving.

[0025] When the semiconductor wafer is processed, the rotating table 2 will drive the semiconductor wafer to rotate to the specified position. At this time, the staff can press the circular block 16 by hand to make the L-shaped oblique push rod 15 move downward, and the L-shaped oblique push rod 15 will squeeze the supporting plate 9, and the supporting plate 9 will drive the movable column 8 to make the movable clamping plate 5 move downward, and the movable clamping plate 5 will gradually sink into the rotating plate 4 when it moves downward, so that the semiconductor wafer is released from the limit of the clamping plate, and then the movable clamping plate 5 will drive the baffle plate 6 to contact the limiting plate 7, and at the same time, the L-shaped oblique push rod 15 will also move to the angle between the movable column 8 and the supporting plate 9 on the supporting plate 9, and the L-shaped oblique push rod 15 will then move to make the movable column 8 drive the rotating plate 4 to rotate, and the rotating plate 4 will be inclined after rotating, and the semiconductor wafer will slide from the rotating plate 4 to the discharge plate 11, and then the semiconductor wafer will slide from the discharge plate 11 to the storage box 12 for the convenience of collection and sorting by the staff, so that the staff can conveniently remove the prepared semiconductor wafer from the rotating table 2.

[0026] The above description of the embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A semiconductor wafer turntable device, comprising a substrate (1) and a turntable (2), characterized in that: The top of the rotating platform (2) is fixedly connected to an auxiliary clamping plate (3); the inner wall of the rotating platform (2) is rotatably connected to a rotating plate (4) via a torsion spring shaft; the top of the rotating platform (2) is fixedly connected to a stopper (18); the stopper (18) is arranged on the top of the rotating plate (4); the top of the rotating plate (4) is slidably connected to a movable clamping plate (5); the top of the movable clamping plate (5) is fixedly connected to a baffle (6); the inner wall of the rotating plate (4) is fixedly connected to a limiting plate (7); the bottom of the movable clamping plate (5) is fixedly connected to a supporting assembly; one side of the supporting assembly is provided with an extrusion assembly.

2. The semiconductor wafer rotating stage device according to claim 1, wherein: The support assembly comprises a movable column (8), the bottom of the movable column (8) is fixedly connected to a support plate (9), and the top of the support plate (9) is fixedly connected to a first spring (10).

3. The semiconductor wafer rotating stage device according to claim 1, wherein: A discharge plate (11) is fixedly connected to the top of the base plate (1), a storage box (12) is provided on one side of the discharge plate (11), and a buffer pad (13) is fixedly connected to the inner wall of the storage box (12).

4. The semiconductor wafer rotating stage device according to claim 3, wherein: The extrusion assembly comprises a support block (14), the support block (14) being fixedly connected to one side of the discharge plate (11), and an L-shaped oblique push rod (15) being slidably connected to the inner wall of the support block (14).

5. The semiconductor wafer rotating stage device according to claim 4, wherein: One end of the L-shaped oblique push rod (15) is fixedly connected to a circular block (16), and one side of the circular block (16) is fixedly connected to a second spring (17).

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