Heat dissipation device for circuit board production

Abstract

The utility model relates to a heat dissipation device for circuit board production, which comprises a frame body, an opening is arranged at the upper end of the frame body, a screen plate is arranged at the opening, a cavity communicated with the opening is arranged in the frame body, a moving frame capable of sliding up and down is arranged in the cavity, a heat dissipation fan is arranged on the moving frame, and the heat dissipation fan is arranged on the moving frame. The frame body is further provided with a fixing assembly capable of fixing the movable frame. The circuit board processed by the hot air leveling process is placed on the net plate of the frame body, then the cooling fan is used for blowing air, the circuit board is rapidly cooled, the circuit board does not need to wait in the conveying belt, the production efficiency is improved to a certain degree, and the frame body is small in overall size and small in occupied space; besides, the distance between the cooling fan and the screen plate can be adjusted by the moving frame according to requirements, so that the circuit board on the screen plate can be better cooled.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board production, in particular to a heat dissipation device for circuit board production. Background Art

[0002] The working principle of hot air leveling is to use hot air to remove excess solder on the surface and holes of the printed circuit board, and evenly cover the remaining solder on the pads, unobstructed solder lines and surface packaging points. It is one of the surface treatment methods for printed circuit boards.

[0003] After the hot air leveling process is applied, the surface temperature of the circuit board is very high, so it is often necessary to extend the distance between each workstation so that the circuit board can gradually dissipate heat during the transmission process. As a result, the circuit board production equipment not only occupies a large area and consumes a lot of energy, but also affects the production efficiency. Utility Model Content

[0004] The utility model aims to solve one of the problems existing in the existing related technologies to at least a certain extent. To this end, the utility model provides a heat dissipation device for circuit board production.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A heat dissipation device for circuit board production includes a frame, the upper end of the frame is an opening, and a mesh plate is arranged at the opening, a cavity connected to the opening is arranged in the frame, a movable frame that slides up and down is arranged in the cavity, a heat dissipation fan is arranged on the movable frame, and a fixing component that can fix the movable frame is also arranged on the frame.

[0007] In some embodiments, the fixing assembly includes a fixing pin, and a plurality of through holes arranged along the vertical intervals are provided on the left and right sides of the frame body, and fixing holes are provided on the left and right sides of the movable frame. One end of the fixing pin can pass through any through hole and then be inserted into the fixing hole.

[0008] In some embodiments, a corner of one end of the fixing pin inserted into the fixing hole is beveled.

[0009] In some embodiments, a recessed step is provided at the edge of the opening, and the mesh plate is embedded in the recessed step.

[0010] In some embodiments, a hollow opening is provided in the middle portion of the movable frame, and slide grooves extending forward and backward are provided on both sides of the hollow opening, a fan mounting frame is connected and slidably connected in the two slide grooves, and the cooling fan is installed in the fan mounting frame.

[0011] In some embodiments, transparent side baffles are provided on the left and right sides of the frame.

[0012] In some embodiments, a transparent rear baffle is disposed on the rear side of the frame.

[0013] In some embodiments, the side baffles and the rear baffle are both acrylic panels.

[0014] In some embodiments, a movable wheel with a brake is provided at the lower end of the frame.

[0015] Compared with the prior art, the beneficial effects of the utility model are: the circuit board treated by the hot air leveling process is placed on the mesh plate of the frame, and then the heat dissipation fan is used to blow air to quickly dissipate the heat and cool the circuit board. The circuit board does not need to wait in the conveyor belt, which improves the production efficiency to a certain extent, and the overall volume of the frame is small and does not occupy much space. In addition, its mobile frame can adjust the distance between the heat dissipation fan and the mesh plate according to needs, so that it can better dissipate heat and cool the circuit board on the mesh plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0017] Figure 2 It is a schematic diagram of the top view structure of the utility model;

[0018] Figure 3 For this utility model Figure 2 A schematic cross-sectional view at AA of FIG.

[0019] Figure 4 It is a schematic diagram of the exploded structure of the utility model. DETAILED DESCRIPTION

[0020] The following specific implementation contents provide a variety of different embodiments or examples for implementing the utility model. Of course, these are only embodiments or examples and are not intended to be limiting. In addition, repeated reference numerals may be used in different embodiments, such as repeated numbers and / or letters. These repetitions are for the purpose of simply and clearly describing the utility model and do not represent a specific relationship between the different embodiments and / or structures discussed.

[0021] like Figure 1-Figure 4 A heat dissipation device for circuit board production shown in the figure includes a frame 1, the upper end of the frame 1 is an opening 2, and a mesh plate 3 is arranged at the opening 2, a cavity 4 connected to the opening 2 is arranged in the frame 1, a movable frame 5 that slides up and down is arranged in the cavity 4, a heat dissipation fan 6 is arranged on the movable frame 5, and a fixing component that can fix the movable frame 5 is also arranged on the frame 1.

[0022] In the utility model, the circuit board treated by the hot air leveling process is placed on the mesh plate 3 of the frame 1, and then the cooling fan 6 is used to blow air to quickly dissipate the heat and cool the circuit board. The circuit board does not need to wait in the conveyor belt, which improves the production efficiency to a certain extent. The overall volume of the frame is small and the space occupied is not large. In addition, the mobile frame 5 can adjust the distance between the cooling fan 6 and the mesh plate 3 according to needs, so that it can better dissipate the heat and cool the circuit board on the mesh plate 3.

[0023] Furthermore, in order to facilitate the movement of the frame 1, a movable wheel with a brake (not shown in the drawings) is provided at the lower end of the frame 1.

[0024] See also Figure 3-Figure 4 As shown, the fixing assembly includes a fixing pin 21, and a plurality of through holes 22 arranged along the vertical interval are provided on the left and right sides of the frame body 1, and fixing holes 23 are provided on the left and right sides of the mobile frame 5. One end of the fixing pin 21 can pass through any through hole 22 and then be inserted into the fixing hole 23.

[0025] When the height of the mobile frame 5 is adjusted up and down, the fixing pin 21 is first pulled out, and then the height of the mobile frame 5 is adjusted according to the use situation, and then the fixing pin 21 passes through the corresponding through hole 22 and is inserted into the fixing hole 23 to fix the mobile frame 5. The structure is simple and the operation is convenient.

[0026] In order to facilitate the insertion of the fixing pin 21 into the fixing hole 23 , a corner of one end of the fixing pin 21 inserted into the fixing hole 23 is provided with a bevel.

[0027] See also Figure 1 Figure 4 As shown, a recessed step 41 is provided at the edge of the opening 2, and the mesh panel 3 is embedded and installed in the recessed step 41. During installation, the mesh panel 3 can be directly placed in the recessed step 41. After installation, the mesh panel 3 will not protrude, and the integrity is good.

[0028] In the utility model, a hollow opening 51 is provided in the middle portion of the movable frame 5, and slide grooves 52 extending forward and backward are provided on both the left and right sides of the hollow opening 51, and a fan mounting frame 53 is connected and slidably connected in the two slide grooves 52, and the cooling fan 6 is installed in the fan mounting frame 53; therefore, according to the usage, the position of the cooling fan 6 can be adjusted by moving the fan mounting frame 53 in the slide groove 52, thereby improving its practicality.

[0029] In the present invention, transparent side baffles 61 are provided on the left and right sides of the frame body 1 , and a transparent rear baffle 71 is provided on the rear side of the frame body 1 .

[0030] Furthermore, the side baffle 61 and the rear baffle 71 are both acrylic plates, which can be fixed to the frame 1 by screws and glue.

[0031] Combined with the drawings and the above display and description of the basic principles and main features of the utility model and the advantages of the utility model, the technical personnel in the industry should understand that the utility model is not limited to the above embodiments, and the above embodiments and descriptions are only to illustrate the principles of the utility model. Without departing from the spirit and scope of the utility model, the utility model will have various changes and improvements, and these changes and improvements fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A heat dissipation device for circuit board production, characterized in that: The invention comprises a frame (1), the upper end of the frame (1) is an opening (2), and a mesh plate (3) is arranged at the opening (2); a cavity (4) connected to the opening (2) is arranged in the frame (1); a movable frame (5) which slides up and down is arranged in the cavity (4); a cooling fan (6) is arranged on the movable frame (5); and a fixing component which can fix the movable frame (5) is also arranged on the frame (1).

2. A heat dissipation device for circuit board production according to claim 1, characterized in that: The fixing assembly comprises a fixing pin (21), a plurality of through holes (22) arranged at intervals in the vertical direction are arranged on both the left and right sides of the frame body (1), and fixing holes (23) are arranged on both the left and right sides of the movable frame (5), and one end of the fixing pin (21) can pass through any through hole (22) and then be inserted into the fixing hole (23).

3. A heat dissipation device for circuit board production according to claim 2, characterized in that: The corner of one end of the fixing pin (21) inserted into the fixing hole (23) is provided with an inverted bevel.

4. The heat dissipation device for circuit board production according to claim 1, characterized in that: A recessed step (41) is provided at the edge of the opening (2), and the mesh plate (3) is embedded and installed in the recessed step (41).

5. The heat dissipation device for circuit board production according to claim 1, characterized in that: The middle part of the movable frame (5) is provided with a hollow opening (51), and the left and right sides of the hollow opening (51) are provided with sliding grooves (52) extending forward and backward, and a fan mounting frame (53) is connected and slidably connected in the two sliding grooves (52), and the heat dissipation fan (6) is installed in the fan mounting frame (53).

6. The heat dissipation device for circuit board production according to claim 1, characterized in that: Transparent side baffles (61) are provided on the left and right sides of the frame (1).

7. A heat dissipation device for circuit board production according to claim 6, characterized in that: A transparent rear baffle (71) is provided on the rear side of the frame (1).

8. A heat dissipation device for circuit board production according to claim 7, characterized in that: The side baffle (61) and the rear baffle (71) are both acrylic plates.

9. The heat dissipation device for circuit board production according to claim 1, characterized in that: A movable wheel with a brake is arranged at the lower end of the frame (1).

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