Liquid cooling heat dissipation device of power device and vehicle-mounted charger

Abstract

The utility model provides a liquid cooling heat dissipation device of a power device and a vehicle-mounted charger, the liquid cooling heat dissipation device comprises a circuit board, a power device and a heat dissipation assembly which are stacked in sequence, one side of the power device is connected with the circuit board through a pin on the power device, and the other side of the power device is installed on a heat dissipation surface of the heat dissipation assembly; according to the utility model, the power device is directly arranged on the heat dissipation surface of the heat dissipation assembly, compared with the prior art, the middle heat transfer levels such as an aluminum substrate and the like are reduced, the contact thermal resistance is reduced, the heat dissipation performance is improved, and meanwhile, the aluminum substrate is not used, so that an extra pressing strip does not need to be used for pressing the aluminum substrate, and the cost is reduced. Not only is the installation complexity reduced, but also the installation space required by the power device can be reduced.

Description

Technical Field

[0001] The utility model belongs to the field of cooling improvement, and more specifically, relates to a liquid cooling device for power devices and a vehicle-mounted charger. Background Art

[0002] Power devices are one of the key components in an on-board charger (OBC), used to rectify AC power into DC power for battery charging and convert DC power output from the battery into AC power for external electrical appliances. The heat dissipation capacity of power devices directly determines the performance and efficiency of OBC to a certain extent. With the continuous development of electric vehicle technology and the continuous increase in charging power, higher requirements are also placed on the heat dissipation of power devices.

[0003] In the common heat dissipation scheme for power devices at present, power devices are mostly installed on aluminum substrates, which are installed on cooling plates and pressed with pressure strips. There are two more significant disadvantages in the above heat dissipation scheme: 1. Aluminum substrates usually have a three-layer structure: circuit layer, insulation layer, and metal base layer. Compared with other layers in the heat dissipation path, the thermal conductivity of the insulation layer in the aluminum substrate is very low (usually around 3W / (m*k)), and a certain thickness needs to be ensured in order to achieve insulation, which will lead to a large thermal resistance of the insulation layer, thereby increasing the total thermal resistance and affecting the performance of the power device. 2. The use of aluminum substrates requires the addition of additional pressure strips to fix the aluminum substrate on the cooling plate, which is more complicated to install and will also increase the installation space required for the entire power device. Utility Model Content

[0004] The utility model aims to provide a liquid cooling device for power devices and a vehicle-mounted charger, so as to solve the problem that the heat dissipation performance of the existing power device heat dissipation solution is affected by the use of an aluminum substrate.

[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0006] First, the utility model provides a liquid cooling device for a power device, comprising a circuit board, a power device and a heat dissipation assembly stacked in sequence, wherein one side of the power device is connected to the circuit board through pins thereon, and the other side of the power device is mounted on the heat dissipation surface of the heat dissipation assembly.

[0007] Furthermore, a thermal interface material, thermal silica gel or solder is provided between the power device and the heat dissipation surface.

[0008] Furthermore, the heat dissipation component includes a liquid inlet, a liquid outlet, a coolant flow channel connecting the liquid inlet and the liquid outlet, and a shell and a cooling plate that cooperate to form the coolant flow channel, the liquid inlet and the liquid outlet are arranged on the shell, the shell is provided with a liquid storage chamber connecting the liquid inlet and the liquid outlet, the cooling plate cover is arranged at the open part of the liquid storage chamber, the cooling plate is provided with a first spoiler fin on the side facing the liquid storage chamber, and the surface of the cooling plate on the side facing away from the liquid storage chamber is a heat dissipation surface connected to the power device.

[0009] Furthermore, the heat dissipation component includes a liquid inlet, a liquid outlet, a coolant flow channel connecting the liquid inlet and the liquid outlet, a shell and a cooling pipe, the shell is provided with a receiving groove, the cooling pipe is embedded in the receiving groove, the liquid inlet and the liquid outlet are arranged on the cooling pipe, the interior of the cooling pipe is hollow to form the coolant flow channel, and the side surface of the shell on which the cooling pipe is embedded is a heat dissipation surface connected to the power device.

[0010] Furthermore, the heat dissipation assembly includes a liquid inlet, a liquid outlet, a coolant flow channel connecting the liquid inlet and the liquid outlet, a shell, and a first heat-conducting component and a cover plate arranged on both sides of the shell, one side of the shell is provided with a storage groove, the first heat-conducting component is embedded in the storage groove, the liquid inlet and the liquid outlet are arranged at both ends of the shell, the coolant flow channel is arranged on the other side of the shell, a second spoiler fin is provided on the wall surface of the coolant flow channel, the cover plate is covered at the open part of the coolant flow channel, and the side surface of the shell on which the first heat-conducting component is embedded is a heat dissipation surface connected to the power device.

[0011] Furthermore, a support plate is provided in the liquid storage chamber.

[0012] Furthermore, the shape of the first spoiler fin is any one of a tooth shape, a cylinder shape and a rectangle shape.

[0013] Furthermore, a heat conducting fin is provided on a side of the cooling plate facing the liquid storage chamber.

[0014] Furthermore, a heat conducting plate is embedded in the side of the cooling plate facing away from the liquid storage chamber.

[0015] Furthermore, a second heat-conducting component is embedded in the side of the cooling plate facing away from the liquid storage chamber.

[0016] Furthermore, two heat-conducting bosses are arranged on the heat dissipation surface at intervals, a heat-conducting layer is arranged between the circuit board and the power device, and two ends of the heat-conducting layer are mounted on the two heat-conducting bosses through fasteners.

[0017] Furthermore, a first insulating layer is provided between the circuit board and the heat conducting layer.

[0018] Furthermore, a second insulating layer is provided between the power device and the heat dissipation surface.

[0019] Then, a vehicle-mounted charger is also provided, comprising a liquid cooling device for any power device as described above.

[0020] Compared with the prior art, the liquid cooling and heat dissipation device of the power device and the on-board charger provided by the utility model have the following beneficial effects:

[0021] 1. The power device is directly mounted on the heat dissipation surface of the heat dissipation component, which reduces the intermediate heat transfer level such as the aluminum substrate, reduces the contact thermal resistance, and thus improves the heat dissipation performance. At the same time, since no aluminum substrate is used, there is no need to use additional pressure strips to press the aluminum substrate, which not only reduces the complexity of installation, but also reduces the installation space required for the power device.

[0022] 2. Use a cooling plate or a shell with spoiler fins to effectively increase the contact area with the coolant, increase the convection heat transfer coefficient, reduce the thermal resistance of convection heat transfer, significantly improve the heat dissipation efficiency of the power device, and increase the power density of the device.

[0023] 3. A heat-conducting layer and a heat-dissipating component are provided on the upper and lower sides of the power device. The heat generated by the power device is not only transferred to the heat-dissipating component from its lower side, but also transferred to the heat-dissipating component from its upper side by the heat-conducting layer, forming a double-sided heat-dissipating structure, thereby better improving the heat-dissipating efficiency of the power device.

[0024] 4. An insulating layer and a thermal conductive layer are provided between the power device and the circuit board. The insulating layer can play an insulating role. If the thermal conductive layer is made of a metal material with high thermal conductivity, the thermal conductive layer can not only dissipate heat but also shield electromagnetic interference. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0026] Figure 1 This is an overall structural assembly diagram of a liquid cooling device for power devices provided in the first embodiment of the utility model;

[0027] Figure 2 This is an overall structural assembly diagram of the liquid cooling device for power devices without the circuit board provided in the first embodiment of the utility model;

[0028] Figure 3 An exploded schematic diagram of the overall structure of a liquid cooling and heat dissipation device for power devices provided in the first embodiment of the utility model;

[0029] Figure 4 A schematic diagram of the structure of a housing provided in Embodiment 1 of the present utility model;

[0030] Figure 5 A schematic diagram of a cooling plate provided with a toothed first spoiler fin according to the first embodiment of the utility model Figure 1 ;

[0031] Figure 6 A schematic structural diagram of a cooling plate provided with a cylindrical first spoiler fin provided in Embodiment 1 of the present utility model;

[0032] Figure 7 A schematic structural diagram of a cooling plate provided with rectangular first spoiler fins provided in Embodiment 1 of the present utility model;

[0033] Figure 8 A schematic diagram of the structure of a cooling plate with a heat conducting plate embedded therein provided in the first embodiment of the utility model;

[0034] Fig. 9 An exploded schematic diagram of a cooling plate with a heat conducting plate embedded therein provided in the first embodiment of the utility model;

[0035] Fig.10 A schematic diagram of the structure of a cooling plate with a second heat-conducting component embedded therein provided in the first embodiment of the utility model;

[0036] Fig.11 An exploded schematic diagram of a cooling plate with a second heat-conducting component embedded therein provided in the first embodiment of the utility model;

[0037] Fig.12 The structure of the cylindrical first spoiler fin provided in the first embodiment of the utility model is shown in FIG. Figure 2 ;

[0038] Fig.13 An exploded schematic diagram of the overall structure of a liquid cooling device for power devices provided in the second embodiment of the utility model;

[0039] Fig.14 A schematic diagram of the structure of a heat dissipation assembly provided in Embodiment 3 of the present utility model;

[0040] Fig.15 This is an exploded schematic diagram of the overall structure of the liquid cooling and heat dissipation device for power devices provided in the third embodiment of the utility model;

[0041] Fig.16 A schematic diagram of the structure of a heat dissipation assembly provided in Embodiment 4 of the present utility model;

[0042] Fig.17 A side view and a cross-sectional view of a heat dissipation assembly provided in Embodiment 4 of the present utility model;

[0043] Fig.18 An exploded schematic diagram of the overall structure of the liquid cooling device provided in the fourth embodiment of the utility model;

[0044] Among them, the main marks of the drawings in the figure are:

[0045] 01. Circuit board; 02. Second fastener; 03. First fastener; 04. First insulating layer; 05. Heat conducting layer; 06. First connecting layer; 07. Power device; 08. Second connecting layer; 09. Cooling plate; 10. Housing;

[0046] 11. second insulating layer; 12. third connecting layer;

[0047] 13. tooth-shaped first spoiler fin; 14. cylindrical first spoiler fin; 15. rectangular first spoiler fin;

[0048] 16. heat conducting plate; 17. second heat conducting component;

[0049] 18. Shell liquid inlet; 19. Liquid storage chamber; 20. Shell and cooling plate welding or sealing ring installation area; 21. Shell liquid outlet;

[0050] 22. Cooling pipe; 23. Cooling pipe liquid inlet; 24. Cooling pipe liquid outlet;

[0051] 25. first heat conducting component; 26. second spoiler fin; 27. cover plate;

[0052] 31. Cylindrical heat conducting fins; 32. Rectangular heat conducting fins;

[0053] 40. heat dissipation component, 41. thermal conductive boss. DETAILED DESCRIPTION

[0054] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0055] Embodiment 1:

[0056] Please also read Figure 1 , Figure 2 and Figure 3, this embodiment provides a liquid cooling device for power devices, the device includes a circuit board 01, a power device 07 and a heat dissipation component 40 which are stacked in sequence. Among them, one side of the power device 07 is connected to the circuit board 01 through the pins thereon, and the other side of the power device 07 is installed on the heat dissipation surface of the heat dissipation component 40. The heat dissipation component 40 has a liquid inlet, a liquid outlet, and a coolant flow channel connecting the liquid inlet and the liquid outlet. When the power device 07 is working, the coolant in the coolant flow channel exchanges heat with the power device 07, and the heat generated by the power device 07 can be taken away by the coolant flowing in the coolant flow channel, thereby realizing liquid cooling and heat dissipation of the power device 07. At the same time, this embodiment adopts the method of directly installing the power device 07 on the heat dissipation surface of the heat dissipation component 40, reducing the intermediate heat transfer level such as the aluminum substrate, reducing the contact thermal resistance, and thus improving the heat dissipation performance. On the other hand, since the utility model does not use an aluminum substrate, there is no need to use an additional pressure strip to press the aluminum substrate, which not only reduces the complexity of installation, but also reduces the installation space required for the power device.

[0057] It is understandable that the power device 07 is located between the circuit board 01 and the heat dissipation component 40. There can be multiple power devices 07. This embodiment is described by taking three power devices 07 as an example. Of course, in other embodiments, the number of power devices 07 can be other values ​​besides three. The types of the multiple power devices 07 can be different. Considering that the heat generated by different power devices 07 during operation is different, the power device 07 with higher heat generation power can be installed at a position closer to the liquid inlet of the heat dissipation component 40, so as to ensure the temperature uniformity of the power device 07 with higher heat generation power.

[0058] like Figure 3 As shown, three power devices 07 are arranged side by side, and each power device 07 is provided with a pair of pins at intervals, and the pins in each pair of pins are arranged vertically. The circuit board 01 is provided with three pairs of small holes, and the three pairs of small holes of the circuit board 01 correspond to the three pairs of pins of the three power devices 07 respectively. Figure 1 As shown, after the device is assembled, the pins of the power device 07 are inserted into the corresponding small holes of the circuit board 01 to achieve the connection between the power device 07 and the circuit board 01.

[0059] like Figure 3 and Figure 4 As shown, the heat dissipation assembly 40 includes a housing 10 and a cooling plate 09. The housing 10 has a housing liquid inlet 18 and a housing liquid outlet 21 at both ends. The housing liquid inlet 18 serves as the liquid inlet of the heat dissipation assembly 40, and the housing liquid outlet 21 serves as the liquid outlet of the heat dissipation assembly 40. At the same time, the housing 10 cooperates with the cooling plate 09 to form a coolant flow channel of the heat dissipation assembly 40, and one side surface of the cooling plate 09 serves as a heat dissipation surface connected to the power device 07.

[0060] like Figure 3 and Figure 4 As shown, the shell 10 is provided with a liquid storage chamber 19, and the liquid storage chamber 19 is connected with the shell liquid inlet 18 and the shell liquid outlet 21 respectively. The liquid storage chamber 19 has an opening, and the cooling plate 09 is covered on the opening of the liquid storage chamber 19. At the same time, the shell 10 is provided with a welding or sealing ring installation area with the cooling plate 09, and the cooling plate 09 and the shell 10 are sealed by a sealing ring or welding installation. In addition, the cooling plate 09 is provided with a first spoiler fin, and the first spoiler fin extends into the liquid storage chamber 19, so that the flow path of the coolant can be extended through the first spoiler fin, so that the coolant can effectively take away more heat. It can be understood that the shell 10 and the cooling plate 09 recorded above cooperate to form a coolant flow channel, specifically, the liquid flow space formed by the first spoiler fin on the cooling plate 09 and the liquid storage chamber 19 of the shell 10 is the coolant flow channel.

[0061] In order to better improve the heat dissipation performance, the length of the first spoiler fin should be equal to the depth of the liquid storage chamber 19. In order to reduce the manufacturing cost, the length of the first spoiler fin should be designed to be shorter. In this regard, in order to take into account both the heat dissipation performance and the cost, when the length of the first spoiler fin is shorter, a support plate is further provided in the liquid storage chamber 19, and the first spoiler fin abuts against the support plate.

[0062] In order to better improve the heat dissipation performance, in addition to the first spoiler fins, the cooling plate 09 may also be provided with heat-conducting fins. The number of heat-conducting fins is less than the number of first spoiler fins. The shape of the heat-conducting fins and the shape of the first spoiler fins can be the same or different. The size of the heat-conducting fins is usually larger than the size of the first spoiler fins. The heat-conducting fins are arranged in the middle of the cooling plate 09, and the remaining space on the cooling plate 09 except for the heat-conducting fins is filled with the first spoiler fins. On the one hand, the size of the heat-conducting fins is relatively large, which effectively increases the contact area with the coolant, which is beneficial to improve the heat dissipation efficiency of the power device 07; on the other hand, the heat-conducting fins are hollow inside, which can be penetrated by fasteners such as bolts, so as to lock the power device 07 on the cooling plate 09. The latter point is described in more detail below.

[0063] In this embodiment, the first spoiler fins have various shapes, including but not limited to tooth shape, cylindrical shape and rectangular shape. Meanwhile, the heat conducting fins also have various shapes, including but not limited to cylindrical shape and rectangular shape.

[0064] like Figure 5 As shown, the cooling plate 09 is provided with toothed first spoiler fins 13 and cylindrical heat conducting fins 31. The number of cylindrical heat conducting fins 31 is five, and the number of toothed first spoiler fins 13 is much greater than five. The cylindrical heat conducting fins 31 are hollow inside, and the toothed first spoiler fins 13 can be solid.

[0065] Through simulation and experiments, when the liquid cooling device of the power device adopts the cooling plate 09 with the toothed first spoiler fin 13, the highest temperature of the device in the temperature cloud diagram is 138.85°C, and the junction temperature of the device is lower than the allowable temperature, which can effectively improve the heat dissipation efficiency of the power device 07.

[0066] like Figure 6 As shown, a cylindrical first spoiler fin 14 and a cylindrical heat conducting fin 31 are provided on the cooling plate 09. The diameter of the cylindrical heat conducting fin 31 is greater than the diameter of the cylindrical first spoiler fin 14. The number of the cylindrical heat conducting fins 31 is five, and the number of the cylindrical first spoiler fins 14 is much greater than five. The cylindrical heat conducting fin 31 is hollow inside, and the cylindrical first spoiler fin 14 can be solid.

[0067] Through simulation and experiments, when the liquid cooling device of the power device adopts the cooling plate 09 with the cylindrical first spoiler fin 14, the highest temperature of the device in the temperature cloud diagram is 139.36°C, and the junction temperature of the device is lower than the allowable temperature, which can effectively improve the heat dissipation efficiency of the power device 07.

[0068] like Figure 7 As shown, a rectangular first spoiler fin 15 and a rectangular heat conducting fin 32 are provided on the cooling plate 09. The width of the rectangular heat conducting fin 32 is greater than the width of the rectangular first spoiler fin 15. The number of the rectangular heat conducting fin 32 is one, and the number of the rectangular first spoiler fin 15 is multiple. The rectangular heat conducting fin 32 is hollow inside, or the rectangular heat conducting fin 32 is solid and is provided with five fastening holes. The rectangular first spoiler fin 15 can be solid.

[0069] Through simulation and experiment, when the liquid cooling device of the power device adopts the cooling plate 09 with the rectangular first spoiler fin 15, the highest temperature of the device in the temperature cloud diagram is 134.60°C, and the junction temperature of the device is lower than the allowable temperature, which can effectively improve the heat dissipation efficiency of the power device 07.

[0070] In this embodiment, a heat conducting plate 16 or a second heat conducting component 17 may be further provided on the cooling plate 09. The materials of the heat conducting plate 16 and the second heat conducting component 17 may be metal materials with good thermal conductivity to better improve the heat dissipation efficiency of the power module. At the same time, the heat conducting plate 16 and the first spoiler fin are arranged on opposite sides of the cooling plate 09, and the second heat conducting component 17 and the first spoiler fin are also arranged on opposite sides of the cooling plate 09.

[0071] like Figure 3 , Figure 8 and Fig. 9As shown, the shape of the heat conducting plate 16 is rectangular, the number of the heat conducting plates 16 is three, and three rectangular grooves are provided on the cooling plate 09, and the heat conducting plates 16 are embedded in the corresponding rectangular grooves. The heat conducting plates 16 correspond one to one with the power devices 07. When the number of the power devices 07 is three, the number of the heat conducting plates 16 is also three. In this embodiment, the geometric center of the power device 07 is preferably aligned with the geometric center of the heat conducting plate 16. In other embodiments, the number of the heat conducting plates 16 can be a value other than three, and at the same time, the number of the heat conducting plates 16 is consistent with the number of the power devices 07. In addition, the utility model does not limit the surface area of ​​the heat conducting plate 16, nor does it limit whether the geometric center of the power device 07 is aligned with the geometric center of the heat conducting plate 16.

[0072] like Fig.10 and Fig.11 As shown, the second heat-conducting component 17 is in an S-shaped shape, the number of the second heat-conducting components 17 is two, and the two second heat-conducting components 17 are symmetrically arranged. Two curved grooves are provided on the cooling plate 09, and the second heat-conducting components 17 are embedded in the corresponding curved grooves. In addition, the second heat-conducting component 17 is preferably a solid structure.

[0073] In this embodiment, a heat-conducting layer 05 is further provided between the power device 07 and the circuit board 01 to better improve the heat dissipation efficiency of the power module.

[0074] like Figure 3 As shown, the heat conducting layer 05 is located on the side of the power device 07 close to the circuit board 01, and two heat conducting bosses 41 are arranged on the cooling plate 09. The two ends of the heat conducting layer 05 are mounted on the two heat conducting bosses 41 of the cooling plate 09 by fasteners. When the power device 07 is working, the heat generated by the power device 07 is not only directly transferred to the cooling plate 09 through the bottom thereof, but also can be transferred to the heat conducting bosses 41 and the cooling plate 09 in sequence through the heat conducting layer 05 above it, forming a double-sided heat dissipation structure, thereby improving the heat dissipation efficiency of the power device 07.

[0075] In this embodiment, a first insulating layer 04 is further provided between the circuit board 01 and the heat-conducting layer 05, and the first insulating layer 04 can play an insulating role. The heat-conducting layer 05 is usually made of a material with high thermal conductivity, and the heat-conducting layer 05 can be made of a metal material or a non-metal material. If the heat-conducting layer 05 is made of a metal material, the heat-conducting layer 05 not only plays a heat dissipation role, but also can shield electromagnetic interference.

[0076] like Figure 3 As shown, the first insulating layer 04 is located on the heat-conducting layer 05 , and the size and shape of the first insulating layer 04 are consistent with the size and shape of the heat-conducting layer 05 .

[0077] In this embodiment, there are multiple ways to connect the power device 07 and the cooling plate 09, including but not limited to using thermal interface material (TIM), thermal silica gel and solder.

[0078] For example, a thermally conductive interface material is applied between the power device 07 and the cooling plate 09 and connected by fasteners. The thermally conductive interface material can reduce the interface thermal resistance.

[0079] For another example, thermal silicone is coated between the power device 07 and the cooling plate 09. The thermal silicone can not only fill the gap between the cooling plate 09 and the power device 07, but also reduce the contact thermal resistance and the connection effect.

[0080] For another example, the power device 07 and the cooling plate 09 are welded together using solder, and the solder can reduce the contact thermal resistance and facilitate installation.

[0081] When the aforementioned connection methods are used, the power device 07 is directly mounted on the heat dissipation surface of the cooling plate 09. Different from the existing solution of mounting on a cast aluminum shell (the thermal conductivity of cast aluminum is 121W / (m*k)), the cooling plate 09 can use materials with higher thermal conductivity, such as 6 series aluminum, copper and other materials, and adopt forging and machining processes. At the same time, compared with the traditional heat dissipation solution, the intermediate heat transfer level such as the aluminum substrate is reduced, which significantly reduces the total thermal resistance.

[0082] In this embodiment, there are also multiple ways to connect the power device 07 and the heat-conducting layer 05, including but not limited to using TIM material, thermal silica gel and solder. That is, the connection method between the power device 07 and the heat-conducting layer 05 can be the same as the connection method between the power device 07 and the cooling plate 09, which will not be elaborated in detail here.

[0083] For ease of understanding, the overall structure of the liquid cooling device for power devices provided in this embodiment is further described below:

[0084] like Figure 3 As shown, the liquid cooling device of the power device includes a circuit board 01, a first fastener 03, a second fastener 02, a first insulating layer 04, a heat conducting layer 05, a first connecting layer 06, a power device 07, a second connecting layer 08, a cooling plate 09 and a shell 10 which are stacked in sequence from top to bottom.

[0085] It should be noted that Figure 3The power device 07 shown is an internal insulation device. The circuit board 01 may be, but is not limited to, a printed circuit board 01 (PCB), and the circuit board 01 is provided with small holes for the pins on the power device 07 to penetrate. Now, the description is expanded by taking the first connection layer 06 using TIM material and the second connection layer 08 using thermal silica gel as an example. Of course, in other examples, the second connection layer 08 may also be TIM material or solder. At the same time, considering that when the first connection layer 06 is made of TIM material, since the TIM material is not sticky, it is also necessary to fix the power device 07 and the thermal conductive layer 05 together by fasteners. In this regard, the left and right ends of the first connecting layer 06 are provided with notches for fasteners to engage, the left and right ends of the power device 07 are provided with recessed portions for fasteners to engage, the cooling plate 09 is provided with hollow thermal fins on the side facing away from the power device 07, and the cooling plate 09 is provided with a through hole for connecting to the inside of the thermal fins on the side facing the power device 07 so that the fasteners can penetrate into the thermal fins. The notches of the first connecting layer 06, the recessed portions of the power device 07 and the thermal fins of the cooling plate 09 are arranged correspondingly.

[0086] It should also be noted that two heat-conducting bosses 41 are spaced apart on the side of the cooling plate 09 facing the power device 07. The heat-conducting bosses 41, the first insulating layer 04 and the heat-conducting layer 05 are all provided with first threaded holes for the first fastener 03 to pass through, and the first insulating layer 04 and the heat-conducting layer 05 are all provided with second threaded holes for the second fastener 02 to pass through. The first fastener 03 and the second fastener 02 are both bolts.

[0087] It should also be noted that a shell liquid inlet 18 and a shell liquid outlet 21 are provided at the left and right ends of the shell 10, and the shell 10 is provided with a liquid storage chamber 19 connected to the shell liquid inlet 18 and the shell liquid outlet 21, and the liquid storage chamber 19 has an open opening. At the same time, a support plate is provided in the liquid storage chamber 19.

[0088] It should also be noted that a first spoiler fin is provided on the side of the cooling plate 09 facing away from the power device 07. Figures 5 to 7 As shown, the shape of the first spoiler fin can be tooth-shaped, cylindrical or rectangular.

[0089] During assembly, the first fastener 03 is used to sequentially connect the first insulating layer 04, the heat-conducting layer 05, the first connecting layer 06 and the power device 07, and the first fastener 03 is inserted into the heat-conducting fins of the cooling plate 09. The second fastener 02 is also used to sequentially connect the first insulating layer 04, the heat-conducting layer 05 and the power device 07, and the second fastener 02 is inserted into the heat-conducting boss 41 of the cooling plate 09. The cooling plate 09 is covered at the opening of the liquid storage chamber 19 of the housing 10, and the cooling plate 09 is sealed and connected to the housing 10 by welding or setting a sealing ring, and the first spoiler fins and the heat-conducting fins on the cooling plate 09 are in contact with the support plate in the liquid storage chamber 19. The pins of the power device 07 are correspondingly inserted into the small holes of the circuit board 01.

[0090] It is understandable that the heat dissipation assembly 40 in the device is composed of a cooling plate 09 and a housing 10, and the housing 10 having a liquid storage chamber 19 and the cooling plate 09 having a first spoiler fin and a heat conducting fin cooperate to form a coolant flow channel. In this embodiment, the coolant can be but is not limited to water.

[0091] It can also be understood that in the device, the upper side of the power device 07 is connected to the heat-conducting layer 05 through the first connecting layer 06, and the first connecting layer 06 is made of TIM material. The gap between the power device 07 and the heat-conducting layer 05 is filled with TIM material, and connected by the first fastener 03. The TIM material can play a role in reducing the contact thermal resistance. At the same time, the lower side of the power device 07 is connected to the cooling plate 09 through the second connecting layer 08. The second connecting layer 08 uses thermal silica gel to fill the gap between the power device 07 and the cooling plate 09. The thermal silica gel can not only play a role in reducing the contact thermal resistance, but also play a role in connection. Of course, in other examples, the second connecting layer 08 can also be TIM material or solder. If TIM material is used to fill the gap between the power device 07 and the cooling plate 09, the TIM material can play a role in reducing the contact resistance; if solder is used to solder the power device 07 and the cooling plate 09, the solder can not only play a role in connection and fixing, but also reduce the contact thermal resistance. When the power device 07 is working, the heat generated by the power device 07 can be transferred from the bottom of the device to the cooling plate 09. At the same time, the heat generated by the power device 07 can also be transferred from the top of the device through the heat conducting layer 05 to the heat conducting boss 41, and then transferred to the cooling plate 09, thereby forming two heat transfer paths, thereby greatly improving the heat dissipation efficiency of the power device 07.

[0092] It can also be understood that in the device, a first spoiler fin is provided under the cooling plate 09, and the first spoiler fin has a variety of shapes. By providing the first spoiler fin, the contact area with the coolant is effectively increased, and the convective heat transfer coefficient is increased. At the same time, due to the turbulent effect of the first spoiler fin, the coolant will generate strong turbulence when passing through the first spoiler fin, reducing the thermal resistance of the convective heat transfer, thereby significantly improving the heat dissipation efficiency of the power device 07 and improving the power density of the device.

[0093] It can also be understood that in the device, a first insulating layer 04 is provided on the upper side of the power device 07 and between the heat-conducting layer 05 and the circuit board 01, and the first insulating layer 04 can play an insulating role. The heat-conducting layer 05 is usually made of a material with high thermal conductivity, and the heat-conducting layer 05 can be made of a metal material or a non-metal material. If the heat-conducting layer 05 is a metal material, the heat-conducting layer 05 not only plays a heat dissipation role, but also can shield electromagnetic interference.

[0094] Embodiment 2:

[0095] The difference between this embodiment and the aforementioned embodiment 1 is that: in the liquid cooling heat dissipation device for power devices provided in the embodiment 1, Figure 3 The power device 07 shown is an internally insulated device, that is, an insulating structure is provided inside the power device 07. Fig.13 The power device 07 shown is an external insulating device, that is, no insulating structure is arranged inside the power device 07. In this regard, in this embodiment, on the basis of the liquid cooling heat dissipation device of the power device provided in the first embodiment, a second insulating layer 11 and a third connecting layer 12 are added, that is, a second insulating layer 11 is also arranged between the power device 07 and the cooling plate 09, and the second insulating layer 11 is connected to the cooling plate 09 through the third connecting layer 12. Among them, the second insulating layer 11 can adopt a copper-clad ceramic carrier (Direct Copper Bonding, DCB), and the third connecting layer 12 can adopt any one of TIM material, thermal silica gel and solder. In addition, the other structures in the device are the same as those in the first embodiment, and will not be repeated here.

[0096] For ease of understanding, the overall structure of the liquid cooling device for power devices provided in this embodiment is further described below:

[0097] like Fig.13 As shown, the liquid cooling device of the power device includes a circuit board 01, a first fastener 03, a second fastener 02, a first insulating layer 04, a heat conductive layer 05, a first connecting layer 06, a power device 07, a second connecting layer 08, a second insulating layer 11, a third connecting layer 12, a cooling plate 09 and a shell 10 which are stacked in sequence from top to bottom.

[0098] It should be noted that the circuit board 01 can be but is not limited to a printed circuit board 01 (Printed Circuit Board, PCB), and the circuit board 01 is provided with small holes for the pins on the power device 07 to pass through. Now, the description will be expanded by taking the example that the first connection layer 06 adopts TIM material, and the second connection layer 08 and the third connection layer 12 both adopt thermal silicone. Of course, in other examples, the second connection layer 08 and the third connection layer 12 can also adopt TIM material or solder. At the same time, considering that when the first connection layer 06 adopts TIM material, since the TIM material is not sticky, it is also necessary to fix the power device 07 and the thermal conductive layer 05 together by fasteners. In this regard, the left and right ends of the first connection layer 06 are provided with notches for the fasteners to be engaged, and the left and right ends of the power device 07 are provided with recessed portions for the fasteners to be engaged, please refer to Figures 5 to 7 A hollow heat-conducting fin is provided on the side of the cooling plate 09 facing away from the power device 07, and a through hole for connecting to the inside of the heat-conducting fin is provided on the side of the cooling plate 09 facing the power device 07 so that the fastener can penetrate into the heat-conducting fin. The notch of the first connecting layer 06, the recessed portion of the power device 07 and the heat-conducting fin of the cooling plate 09 are arranged correspondingly.

[0099] It should also be noted that two heat-conducting bosses 41 are spaced apart on the side of the cooling plate 09 facing the power device 07. The heat-conducting bosses 41, the first insulating layer 04 and the heat-conducting layer 05 are all provided with first threaded holes for the first fastener 03 to pass through, and the first insulating layer 04 and the heat-conducting layer 05 are all provided with second threaded holes for the second fastener 02 to pass through. The first fastener 03 and the second fastener 02 are both bolts.

[0100] It should also be noted that a shell liquid inlet 18 and a shell liquid outlet 21 are provided at the left and right ends of the shell 10, and the shell 10 is provided with a liquid storage chamber 19 connected to the shell liquid inlet 18 and the shell liquid outlet 21, and the liquid storage chamber 19 has an open opening. At the same time, a support plate is provided in the liquid storage chamber 19.

[0101] It should also be noted that a first spoiler fin is provided on the side of the cooling plate 09 facing away from the power device 07. Figures 5 to 7 As shown, the shape of the first spoiler fin can be tooth-shaped, cylindrical or rectangular.

[0102] During assembly, the power device 07 is mounted on the second insulating layer 11, and the power device 07 is connected to the second insulating layer 11 through the second connecting layer 08. The power device 07 and the second insulating layer 11 are then mounted on the cooling plate 09, and the second insulating layer 11 is connected to the cooling plate 09 through the third connecting layer 12. The first insulating layer 04, the heat conducting layer 05, the first connecting layer 06 and the power device 07 are connected in sequence using the first fastener 03, and the first fastener 03 is inserted into the heat conducting fins of the cooling plate 09. The first insulating layer 04, the heat conducting layer 05 and the power device 07 are also connected in sequence using the second fastener 02, and the second fastener 02 is inserted into the heat conducting boss 41 of the cooling plate 09. The cooling plate 09 covers the opening of the liquid storage chamber 19 of the housing 10, and the cooling plate 09 is sealed and connected to the housing 10 by welding or setting a sealing ring, and the first spoiler fins and heat conducting fins on the cooling plate 09 abut against the support plate in the liquid storage chamber 19. The pins of the power device 07 are inserted into the small holes of the circuit board 01 accordingly.

[0103] It is understandable that the heat dissipation assembly 40 in the device is composed of a cooling plate 09 and a housing 10, and the housing 10 having a liquid storage chamber 19 and the cooling plate 09 having a first spoiler fin and a heat conducting fin cooperate to form a coolant flow channel. In this embodiment, the coolant can be but is not limited to water.

[0104] It can also be understood that in the device, the upper side of the power device 07 is connected to the heat-conducting layer 05 through the first connection layer 06, and the first connection layer 06 adopts TIM material. The gap between the power device 07 and the heat-conducting layer 05 is filled with TIM material, and connected by the first fastener 03. The TIM material can play a role in reducing the contact thermal resistance. At the same time, the lower side of the power device 07 is connected to the cooling plate 09 through the second connection layer 08, the second insulating layer 11, and the third connection layer 12 in sequence. Now, the second connection layer 08 and the third connection layer 12 are both made of thermal silica gel. The gap between the power device 07 and the second insulating layer 11 and the gap between the second insulating layer 11 and the cooling plate 09 are filled with thermal silica gel. The thermal silica gel can not only play a role in reducing the contact thermal resistance, but also play a role in connection. Of course, in other examples, the second connection layer 08 and the third connection layer 12 can also be made of TIM material or solder. If TIM material is used to fill the gap between the power device 07 and the second insulating layer 11 and between the second insulating layer 11 and the cooling plate 09, the TIM material can play a role in reducing the contact resistance; if solder is used to weld the power device 07 and the second insulating layer 11 and the second insulating layer 11 and the cooling plate 09, the solder can not only play a role in connection and fixing, but also reduce the contact thermal resistance. When the power device 07 is working, the heat generated by the power device 07 can be transferred from the lower side of the device through the second insulating layer 11 to the cooling plate 09. At the same time, the heat generated by the power device 07 can also be transferred from the upper side of the device through the heat conductive layer 05 to the heat conductive boss 41, and then transferred to the cooling plate 09, thereby forming two heat transfer paths, thereby greatly improving the heat dissipation efficiency of the power device 07.

[0105] It can also be understood that in the device, a first spoiler fin is provided under the cooling plate 09, and the first spoiler fin has a variety of shapes. By providing the first spoiler fin, the contact area with the coolant is effectively increased, and the convective heat transfer coefficient is increased. At the same time, due to the turbulent effect of the first spoiler fin, the coolant will generate strong turbulence when passing through the first spoiler fin, reducing the thermal resistance of the convective heat transfer, thereby significantly improving the heat dissipation efficiency of the power device 07 and improving the power density of the device.

[0106] It can also be understood that in the device, a first insulating layer 04 is provided on the upper side of the power device 07 and between the heat-conducting layer 05 and the circuit board 01, and a second insulating layer 11 is provided on the lower side of the power device 07 and between the power device 07 and the cooling plate 09, and the first insulating layer 04 and the second insulating layer 11 can play an insulating role. The heat-conducting layer 05 on the upper side of the power device 07 is usually made of a material with high thermal conductivity, and the heat-conducting layer 05 can be made of a metal material or a non-metal material. If the heat-conducting layer 05 is a metal material, the heat-conducting layer 05 not only plays a heat dissipation role, but also can shield electromagnetic interference.

[0107] Embodiment three:

[0108] Please also read Fig.14 and Fig.15 , this embodiment provides a liquid cooling device for a power device.

[0109] The device includes a circuit board 01, a power device 07 and a heat dissipation component 40 which are stacked in sequence. One side of the power device 07 is connected to the circuit board 01 through the pins thereon, and the other side of the power device 07 is installed on the heat dissipation surface of the heat dissipation component 40. The heat dissipation component 40 has a liquid inlet, a liquid outlet, and a coolant flow channel connecting the liquid inlet and the liquid outlet. When the power device 07 is working, the coolant in the coolant flow channel exchanges heat with the power device 07, and the heat generated by the power device 07 can be taken away by the coolant flowing in the coolant flow channel, thereby realizing liquid cooling of the power device 07. At the same time, the present embodiment adopts the method of directly installing the power device 07 on the heat dissipation surface of the heat dissipation component 40, which reduces the intermediate heat transfer layers such as the aluminum substrate, reduces the contact thermal resistance, and thus improves the heat dissipation performance.

[0110] It is understandable that the power device 07 is located between the circuit board 01 and the heat dissipation component 40. There can be multiple power devices 07. This embodiment is described by taking three power devices 07 as an example. Of course, in other embodiments, the number of power devices 07 can be other values ​​besides three. The types of multiple power devices 07 can be different. Considering that different power devices 07 generate different amounts of heat during operation, the power device 07 with higher heat generation power is installed at a position closer to the liquid inlet of the heat dissipation component 40, thereby ensuring the temperature uniformity of the power device 07 with higher heat generation power.

[0111] like Fig.15 As shown, three power devices 07 are arranged side by side, and a pair of pins are arranged on each power device 07 at intervals, and the pins in each pair of pins are arranged vertically. The circuit board 01 is provided with three pairs of small holes, and the three pairs of small holes of the circuit board 01 correspond to the three pairs of pins of the three power devices 07. After the device is assembled, the pins of the power device 07 are inserted into the corresponding small holes of the circuit board 01 to achieve the connection between the power device 07 and the circuit board 01.

[0112] like Fig.15 and Fig.16As shown, the heat dissipation assembly 40 includes a shell 10 and a cooling pipe 22. The shell 10 is provided with a receiving groove, and the cooling pipe 22 is embedded in the receiving groove. The interior of the cooling pipe 22 is hollow to form a coolant flow channel of the heat dissipation assembly 40, and a cooling pipe liquid inlet 23 and a cooling pipe liquid outlet 24 are provided at both ends of the cooling pipe 22. The cooling pipe liquid inlet 23 serves as the liquid inlet of the heat dissipation assembly 40, and the cooling pipe liquid outlet 24 serves as the liquid outlet of the heat dissipation assembly 40. The side surface of the shell 10 in which the cooling pipe 22 is embedded is the heat dissipation surface connected to the power device 07. This embodiment does not use a cooling plate, but uses a shell 10 in which the cooling pipe 22 is embedded, and the power device 07 is installed on the shell 10, thereby improving the heat dissipation efficiency of the power device 07.

[0113] In this embodiment, the cooling tube 22 and the receiving groove are both in a multi-curved shape. The depth of the receiving groove is equal to the diameter of the cooling tube 22, that is, when the cooling tube 22 is embedded in the receiving groove, the surface of the cooling tube 22 that can abut against the power device 07 is flush with the surface of the housing 10 that can abut against the power device 07, thereby ensuring that the side surface of the housing 10 where the cooling tube 22 is embedded (that is, the heat dissipation surface connected to the power device 07) is a horizontal surface.

[0114] In this embodiment, the material of the cooling tube 22 can be a metal material with good thermal conductivity.

[0115] In this embodiment, a heat-conducting layer 05 is further provided between the power device 07 and the circuit board 01 to better improve the heat dissipation efficiency of the power module.

[0116] like Fig.15 As shown, the heat conducting layer 05 is located on the side of the power device 07 close to the circuit board 01, and two heat conducting bosses 41 are arranged on the housing 10. The two ends of the heat conducting layer 05 are mounted on the two heat conducting bosses 41 of the housing 10 by fasteners. When the power device 07 is working, the heat generated by the power device 07 is not only directly transferred to the cooling pipe 22 through the bottom thereof, but also can be transferred to the heat conducting bosses 41 and the cooling pipe 22 in sequence through the heat conducting layer 05 above it, forming a double-sided heat dissipation structure, thereby improving the heat dissipation efficiency of the power device 07.

[0117] In this embodiment, a first insulating layer 04 is further provided between the circuit board 01 and the heat-conducting layer 05, and the first insulating layer 04 can play an insulating role. The heat-conducting layer 05 is usually made of a material with high thermal conductivity, and the heat-conducting layer 05 can be made of a metal material or a non-metal material. If the heat-conducting layer 05 is made of a metal material, the heat-conducting layer 05 not only plays a heat dissipation role, but also can shield electromagnetic interference.

[0118] like Fig.15 As shown, the first insulating layer 04 is located on the heat-conducting layer 05 , and the size and shape of the first insulating layer 04 are consistent with the size and shape of the heat-conducting layer 05 .

[0119] In this embodiment, there are many ways to connect the power device 07 and the housing 10 with the cooling pipe 22 embedded therein, including but not limited to using thermal interface material (TIM), thermal silica gel and solder.

[0120] For example, a thermal interface material is coated between the power device 07 and the housing 10 embedded with the cooling pipe 22, and the power device 07 is connected to the housing 10 embedded with the cooling pipe 22 by fasteners. The thermal interface material can reduce the interface thermal resistance.

[0121] For another example, thermal silicone is coated between the power device 07 and the shell 10 with the cooling pipe 22 embedded therein. The thermal silicone can not only fill the gap between the power device 07 and the shell 10 with the cooling pipe 22 embedded therein, but also play a role in reducing contact thermal resistance and connection.

[0122] For another example, solder is used to weld the power device 07 to the housing 10 with the cooling tube 22 embedded therein, and the solder can reduce the contact thermal resistance and facilitate installation.

[0123] There are also many ways to connect the power device 07 and the heat-conducting layer 05, including but not limited to using TIM materials, thermal silicone and solder. That is, the connection method between the power device 07 and the heat-conducting layer 05 can be the same as the connection method between the power device 07 and the housing 10 with the cooling pipe 22 embedded therein, which will not be elaborated in detail here.

[0124] For ease of understanding, the overall structure of the liquid cooling device for power devices provided in this embodiment is further described below:

[0125] like Fig.15 As shown, the liquid cooling device of the power device includes a circuit board 01, a first fastener 03, a second fastener 02, a first insulating layer 04, a heat conducting layer 05, a first connecting layer 06, a power device 07, a second connecting layer 08, a cooling pipe 22 and a shell 10 which are stacked in sequence from top to bottom.

[0126] It should be noted that Fig.15The power device 07 shown is an internal insulation device. The circuit board 01 may be, but is not limited to, a printed circuit board 01 (PCB), and the circuit board 01 is provided with a small hole for the pins on the power device 07 to penetrate. Now, the first connection layer 06 is made of TIM material, and the second connection layer 08 is made of thermal silica gel as an example for description. Of course, in other examples, the second connection layer 08 can also be TIM material or solder. At the same time, considering that the first connection layer 06 is made of TIM material, since the TIM material is not sticky, it is also necessary to fix the power device 07 and the thermal conductive layer 05 together by fasteners. In this regard, notches for fasteners to be engaged are provided at the left and right ends of the first connection layer 06, and recessed portions for fasteners to be engaged are provided at the left and right ends of the power device 07. A fastening hole for fasteners to penetrate is provided in the housing 10, and the notch of the first connection layer 06, the recessed portion of the power device 07 and the fastening hole of the housing 10 are arranged correspondingly.

[0127] It should also be noted that two heat-conducting bosses 41 are spaced apart on the housing 10. The heat-conducting bosses 41, the first insulating layer 04 and the heat-conducting layer 05 are all provided with first threaded holes for the first fastener 03 to pass through, and the first insulating layer 04 and the heat-conducting layer 05 are all provided with second threaded holes for the second fastener 02 to pass through. The first fastener 03 and the second fastener 02 are both bolts.

[0128] It should also be noted that a cooling pipe liquid inlet 23 and a cooling pipe liquid outlet 24 are provided at the left and right ends of the shell 10 , and the shell 10 is provided with a receiving groove for receiving the cooling pipe 22 .

[0129] During assembly, the cooling tube 22 is embedded in the receiving groove of the housing 10, and the first fastener 03 is used to sequentially connect the first insulating layer 04, the heat-conducting layer 05, the first connecting layer 06 and the power device 07, and the first fastener 03 is inserted into the fastening hole of the housing 10. The second fastener 02 is also used to sequentially connect the first insulating layer 04, the heat-conducting layer 05 and the power device 07, and the second fastener 02 is inserted into the heat-conducting boss 41 of the housing 10. The pins of the power device 07 are correspondingly inserted into the small holes of the circuit board 01.

[0130] It can be understood that the heat dissipation assembly 40 in the device is composed of a cooling pipe 22 and a housing 10, and the cooling pipe 22 has a cooling pipe liquid inlet 23, a cooling pipe liquid outlet 24, and a coolant flow channel connected to the cooling pipe liquid inlet 23 and the cooling pipe liquid outlet 24. In this embodiment, the coolant can be but is not limited to water.

[0131] It can also be understood that in the device, the upper side of the power device 07 is connected to the heat-conducting layer 05 through the first connecting layer 06, and the first connecting layer 06 is made of TIM material. The gap between the power device 07 and the heat-conducting layer 05 is filled with TIM material, and connected by the first fastener 03. The TIM material can play a role in reducing the contact thermal resistance. At the same time, the lower side of the power device 07 is connected to the housing 10 embedded with the cooling pipe 22 through the second connecting layer 08. The second connecting layer 08 is made of thermal silica gel. By using thermal silica gel to fill the gap between the power device 07 and the housing 10 embedded with the cooling pipe 22, it can not only play a role in reducing the contact thermal resistance, but also play a role in connection. Of course, in other examples, the second connecting layer 08 can also be TIM material or solder. If TIM material is used to fill the gap between the power device 07 and the housing 10 embedded with the cooling pipe 22, it can play a role in reducing the contact resistance; if solder is used to weld the power device 07 and the housing 10 embedded with the cooling pipe 22, it can not only play a role in connection and fixing, but also reduce the contact thermal resistance. When the power device 07 is working, the heat generated by the power device 07 can be transferred from the bottom of the device to the cooling pipe 22. At the same time, the heat generated by the power device 07 can also be transferred from the top of the device through the heat conductive layer 05 to the heat conductive boss 41, and then transferred to the cooling pipe 22, thereby forming two heat transfer paths, thereby greatly improving the heat dissipation efficiency of the power device 07.

[0132] It can also be understood that in the device, a first insulating layer 04 is provided on the upper side of the power device 07 and between the heat-conducting layer 05 and the circuit board 01, and the first insulating layer 04 can play an insulating role. The heat-conducting layer 05 is usually made of a material with high thermal conductivity, and the heat-conducting layer 05 can be made of a metal material or a non-metal material. If the heat-conducting layer 05 is a metal material, the heat-conducting layer 05 not only plays a heat dissipation role, but also can shield electromagnetic interference.

[0133] Embodiment 4:

[0134] The difference between this embodiment and the third embodiment is that, based on the liquid cooling heat dissipation device for power devices provided in the third embodiment, the housing 10 with the cooling pipe 22 embedded therein is replaced by a housing 10 with the first heat conducting component 25 embedded therein.

[0135] like Fig.16 , Fig.17 As shown, the heat dissipation assembly 40 includes a shell 10 and a first heat-conducting component 25 and a cover plate 27 arranged on both sides of the shell 10. A storage groove is provided on one side of the shell 10, and the first heat-conducting component 25 is embedded in the storage groove. The shell liquid inlet 18 and the shell liquid outlet 21 are arranged at both ends of the shell 10, and the coolant flow channel is arranged on the other side of the shell 10. The cover plate 27 covers the open part of the coolant flow channel. The surface of one side of the shell 10 on which the first heat-conducting component 25 is embedded is a heat dissipation surface connected to the power device 07.

[0136] like Fig.17 As shown, a second spoiler fin 26 is provided on the wall surface of the coolant flow channel, and the second spoiler fin 26 can extend the flow path of the coolant, effectively increase the contact area with the coolant, and increase the convective heat transfer coefficient. At the same time, due to the turbulence effect of the second spoiler fin 26, the coolant will generate strong turbulence when passing through the second spoiler fin 26, reducing the thermal resistance of convective heat transfer, thereby significantly improving the heat dissipation efficiency of the power device 07 and improving the power density of the device. This embodiment does not limit the shape of the second spoiler fin 26, which can be any one of a tooth shape, a cylinder, and a rectangle.

[0137] In this embodiment, the first heat-conducting component 25 and the receiving groove are both in a multi-curved shape. The depth of the receiving groove is equal to the diameter of the first heat-conducting component 25, that is, when the first heat-conducting component 25 is embedded in the receiving groove, the surface of the first heat-conducting component 25 that can abut against the power device 07 is flush with the surface of the housing 10 that can abut against the power device 07, thereby ensuring that the side surface of the housing 10 where the first heat-conducting component 25 is embedded (that is, the heat dissipation surface connected to the power device 07) is a horizontal surface.

[0138] In this embodiment, the material of the first heat-conducting component 25 can be a metal material with good thermal conductivity. In addition, the first heat-conducting component 25 is preferably a solid structure.

[0139] In this embodiment, a heat-conducting layer 05 is further provided between the power device 07 and the circuit board 01 to better improve the heat dissipation efficiency of the power module.

[0140] like Fig.18 As shown, the heat conducting layer 05 is located on the side of the power device 07 close to the circuit board 01, and two heat conducting bosses 41 are arranged on the housing 10. The two ends of the heat conducting layer 05 are mounted on the two heat conducting bosses 41 of the housing 10 by fasteners. When the power device 07 is working, the heat generated by the power device 07 is not only directly transferred to the first heat conducting component 25 and the housing 10 through the bottom thereof, but also can be transferred to the heat conducting bosses 41, the first heat conducting component 25 and the housing 10 in sequence through the heat conducting layer 05 above it, forming a double-sided heat dissipation structure, thereby improving the heat dissipation efficiency of the power device 07.

[0141] In this embodiment, a first insulating layer 04 is further provided between the circuit board 01 and the heat-conducting layer 05, and the first insulating layer 04 can play an insulating role. The heat-conducting layer 05 is usually made of a material with high thermal conductivity, and the heat-conducting layer 05 can be made of a metal material or a non-metal material. If the heat-conducting layer 05 is made of a metal material, the heat-conducting layer 05 not only plays a heat dissipation role, but also can shield electromagnetic interference.

[0142] like Fig.18As shown, the first insulating layer 04 is located on the heat-conducting layer 05 , and the size and shape of the first insulating layer 04 are consistent with the size and shape of the heat-conducting layer 05 .

[0143] In this embodiment, there are multiple ways to connect the power device 07 and the housing 10 in which the first heat-conducting component 25 is embedded, including but not limited to using thermal interface material (TIM), thermal silica gel and solder.

[0144] For example, a thermal interface material is coated between the power device 07 and the housing 10 embedded with the first thermal conductive component 25, and the power device 07 is connected to the housing 10 embedded with the first thermal conductive component 25 by fasteners. The thermal interface material can reduce the interface thermal resistance.

[0145] For another example, thermal silicone is coated between the power device 07 and the shell 10 in which the first heat-conducting component 25 is embedded. The thermal silicone can not only fill the gap between the power device 07 and the shell 10 in which the first heat-conducting component 25 is embedded, but also reduce the contact thermal resistance and the connection effect.

[0146] For another example, the power device 07 is welded to the housing 10 in which the first heat-conducting component 25 is embedded by soldering, and the soldering can reduce the contact thermal resistance and facilitate installation.

[0147] There are also many ways to connect the power device 07 and the heat-conducting layer 05, including but not limited to using TIM materials, thermal silicone and solder. That is, the connection method between the power device 07 and the heat-conducting layer 05 can be the same as the connection method between the power device 07 and the housing 10 embedded with the first heat-conducting component 25, which will not be elaborated in detail here.

[0148] For ease of understanding, the overall structure of the liquid cooling device for power devices provided in this embodiment is further described below:

[0149] like Fig.18 As shown, the liquid cooling device of the power device includes a circuit board 01, a first fastener 03, a second fastener 02, a first insulating layer 04, a heat conducting layer 05, a first connecting layer 06, a power device 07, a second connecting layer 08, a first heat conducting component 25 and a shell 10 which are stacked in sequence from top to bottom.

[0150] It should be noted that Fig.18The power device 07 shown is an internal insulation device. The circuit board 01 may be, but is not limited to, a printed circuit board 01 (PCB), and the circuit board 01 is provided with a small hole for the pins on the power device 07 to penetrate. Now, the first connection layer 06 is made of TIM material and the second connection layer 08 is made of thermal silica gel as an example for description. Of course, in other examples, the second connection layer 08 may also be TIM material or solder. At the same time, considering that the first connection layer 06 is made of TIM material, since the TIM material is not sticky, it is also necessary to fix the power device 07 and the thermal conductive layer 05 together by fasteners. In this regard, notches for fasteners to engage are provided at the left and right ends of the first connection layer 06, and recessed portions for fasteners to engage are provided at the left and right ends of the power device 07. A fastening hole for fasteners to penetrate is provided in the housing 10, and the notch of the first connection layer 06, the recessed portion of the power device 07 and the fastening hole of the housing 10 are arranged correspondingly.

[0151] It should also be noted that two heat-conducting bosses 41 are spaced apart on the housing 10. The heat-conducting bosses 41, the first insulating layer 04 and the heat-conducting layer 05 are all provided with first threaded holes for the first fastener 03 to pass through, and the first insulating layer 04 and the heat-conducting layer 05 are all provided with second threaded holes for the second fastener 02 to pass through. The first fastener 03 and the second fastener 02 are both bolts.

[0152] It should also be noted that the left and right ends of the housing 10 are provided with a housing liquid inlet 18 and a housing liquid outlet 21, and the housing 10 is provided with a receiving groove for receiving the first heat conducting component 25. A coolant flow channel is provided inside the housing 10, and the coolant flow channel has an open opening, and a second spoiler fin 26 is provided on the wall surface of the coolant flow channel.

[0153] During assembly, the first heat-conducting component 25 is embedded in the receiving groove of the housing 10, and the cover plate 27 is placed on the open part of the coolant flow channel. The cover plate 27 is sealed and connected to the housing 10 by welding or using a sealing ring. The first fastener 03 is used to sequentially connect the first insulating layer 04, the heat-conducting layer 05, the first connecting layer 06 and the power device 07, and the first fastener 03 is inserted into the fastening hole of the housing 10. The second fastener 02 is also used to sequentially connect the first insulating layer 04, the heat-conducting layer 05 and the power device 07, and the second fastener 02 is inserted into the heat-conducting boss 41 of the housing 10. The pins of the power device 07 are correspondingly inserted into the small holes of the circuit board 01.

[0154] It can be understood that the heat dissipation assembly 40 in the device is composed of a first heat-conducting component 25, a housing 10 and a cover plate 27, and the housing 10 has a housing liquid inlet 18, a housing liquid outlet 21, and a coolant flow channel connected to the housing liquid inlet 18 and the housing liquid outlet 21. In this embodiment, the coolant can be but is not limited to water.

[0155] It can also be understood that in the device, the upper side of the power device 07 is connected to the heat-conducting layer 05 through the first connecting layer 06, and the first connecting layer 06 is made of TIM material. The gap between the power device 07 and the heat-conducting layer 05 is filled with TIM material, and connected by the first fastener 03. The TIM material can play a role in reducing the contact thermal resistance. At the same time, the lower side of the power device 07 is connected to the housing 10 embedded with the first heat-conducting component 25 through the second connecting layer 08, and the second connecting layer 08 is made of thermal conductive glue. The gap between the power device 07 and the housing 10 embedded with the first heat-conducting component 25 is filled with thermal silicone. The thermal silicone can not only play a role in reducing the contact thermal resistance, but also play a role in connection. Of course, in other examples, the second connecting layer 08 can also be TIM material or solder. If TIM material is used to fill the gap between the power device 07 and the housing 10 embedded with the first heat-conducting component 25, the contact resistance can be reduced; if solder is used to weld the power device 07 and the housing 10 embedded with the first heat-conducting component 25, it can not only play a role in connection and fixing, but also reduce the contact thermal resistance. When the power device 07 is working, the heat generated by the power device 07 can be transferred from the lower side of the device to the housing 10 embedded with the first heat-conducting component 25. At the same time, the heat generated by the power device 07 can also be transferred from the upper side of the device through the heat-conducting layer 05 to the heat-conducting boss 41, and then transferred to the housing 10 embedded with the first heat-conducting component 25, thereby forming two heat transfer paths, thereby greatly improving the heat dissipation efficiency of the power device 07.

[0156] It can also be understood that in the device, a first insulating layer 04 is provided on the upper side of the power device 07 and between the heat-conducting layer 05 and the circuit board 01, and the first insulating layer 04 can play an insulating role. The heat-conducting layer 05 is usually made of a material with high thermal conductivity, and the heat-conducting layer 05 can be made of a metal material or a non-metal material. If the heat-conducting layer 05 is a metal material, the heat-conducting layer 05 not only plays a heat dissipation role, but also can shield electromagnetic interference.

[0157] Embodiment five:

[0158] This embodiment provides an on-board charger, which includes a liquid cooling and heat dissipation device for a power device as provided in any one of the first to fourth embodiments.

[0159] The power device is one of the key components in the on-board charger, which is used to rectify AC power into DC power to charge the battery and convert the DC power output by the battery into AC power for external electrical appliances. The heat dissipation capacity of the power device directly determines the performance and efficiency of the OBC to a certain extent. By adopting any one of the liquid cooling devices provided in Examples 1 to 4, the heat dissipation efficiency of the power device is significantly improved, which can meet the higher requirements for the heat dissipation of the power device in the industry.

[0160] It should be noted that for any of the liquid cooling devices of the power devices in the above-mentioned embodiments 1 to 4, different water cooling plate design schemes, fin design schemes, and shell design schemes can be used in combination with each other without conflict, and are not limited to the above-mentioned four embodiments.

[0161] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A liquid cooling device for a power device, characterized in that: It comprises a circuit board (01), a power device (07) and a heat dissipation assembly (40) which are stacked in sequence, wherein one side of the power device (07) is connected to the circuit board (01) via pins thereon, and the other side of the power device (07) is mounted on the heat dissipation surface of the heat dissipation assembly (40).

2. The liquid cooling device for power devices according to claim 1, characterized in that: A thermal interface material or thermal silica gel or solder is provided between the power device (07) and the heat dissipation surface.

3. The liquid cooling device for power devices according to claim 1, characterized in that: The heat dissipation component (40) comprises a liquid inlet, a liquid outlet, a cooling liquid flow channel connecting the liquid inlet and the liquid outlet, and a shell (10) and a cooling plate (09) that cooperate to form the cooling liquid flow channel. The liquid inlet and the liquid outlet are arranged on the shell (10). The shell (10) is provided with a liquid storage chamber (19) connecting the liquid inlet and the liquid outlet. The cooling plate (09) is covered at the open part of the liquid storage chamber (19). The cooling plate (09) is provided with a first spoiler fin on the side facing the liquid storage chamber (19). The side surface of the cooling plate (09) facing away from the liquid storage chamber (19) is a heat dissipation surface connected to the power device (07).

4. The liquid cooling device for power devices according to claim 1, characterized in that: The heat dissipation component (40) comprises a liquid inlet, a liquid outlet, a coolant flow channel connecting the liquid inlet and the liquid outlet, a shell (10) and a cooling pipe (22); the shell (10) is provided with a receiving groove, the cooling pipe (22) is embedded in the receiving groove, the liquid inlet and the liquid outlet are arranged on the cooling pipe (22), the cooling pipe (22) is hollow inside to form the coolant flow channel, and a side surface of the shell (10) on which the cooling pipe (22) is embedded is a heat dissipation surface connected to the power device (07).

5. The liquid cooling device for power devices according to claim 1, characterized in that: The heat dissipation component (40) comprises a liquid inlet, a liquid outlet, a coolant flow channel connecting the liquid inlet and the liquid outlet, a shell (10), and a first heat-conducting component (25) and a cover plate (27) arranged on both sides of the shell (10); a storage groove is provided on one side of the shell (10), and the first heat-conducting component (25) is embedded in the storage groove; the liquid inlet and the liquid outlet are arranged at two ends of the shell (10); the coolant flow channel is arranged on the other side of the shell (10); a second spoiler fin (26) is provided on the wall surface of the coolant flow channel; the cover plate (27) is covered on the open part of the coolant flow channel; and a side surface of the shell (10) on which the first heat-conducting component (25) is embedded is a heat dissipation surface connected to the power device (07).

6. The liquid cooling device for power devices according to claim 3, characterized in that: A support plate is provided in the liquid storage chamber (19).

7. The liquid cooling device for power devices according to claim 6, characterized in that: The first spoiler fin may be in any one of a tooth shape, a cylindrical shape and a rectangular shape.

8. The liquid cooling device for power devices according to claim 3, characterized in that: The cooling plate (09) is also provided with heat-conducting fins on the side facing the liquid storage chamber (19).

9. The liquid cooling device for power devices according to claim 3, characterized in that: A heat conducting plate (16) is embedded in the cooling plate (09) on the side facing away from the liquid storage chamber (19).

10. The liquid cooling device for power devices according to claim 3, characterized in that: A second heat-conducting component (17) is embedded in the cooling plate (09) on the side facing away from the liquid storage chamber (19).

11. The liquid cooling device for power devices according to claim 1, characterized in that: Two heat-conducting bosses (41) are arranged at intervals on the heat dissipation surface, a heat-conducting layer (05) is arranged between the circuit board (01) and the power device (07), and two ends of the heat-conducting layer (05) are mounted on the two heat-conducting bosses (41) via fasteners.

12. The liquid cooling device for power devices according to claim 11, characterized in that: A first insulating layer (04) is provided between the circuit board (01) and the heat conducting layer (05).

13. The liquid cooling device for power devices according to claim 1, characterized in that: A second insulating layer (11) is provided between the power device (07) and the heat dissipation surface.

14. A vehicle-mounted charger, characterized in that: A liquid cooling device for a power device comprising the device described in any one of claims 1 to 13.

Images