Adsorption platform of high-speed chip mounter

Abstract

The utility model discloses a high-speed chip mounter adsorption platform, which relates to the technical field of chip mounter adsorption platforms and comprises a chip mounter adsorption platform, a first tray is fixedly mounted on one side of the chip mounter adsorption platform, a second tray is fixedly mounted on one side of the first tray, and a third tray is fixedly mounted on the surface of one side of the second tray. The inclination angle of a connecting rod is adjusted by arranging a connecting shaft, a cleaning brush is in direct contact with the surface of the top end of a chip mounter adsorption table, at the moment, one of a third tray, a second tray and a first tray is installed on the chip mounter adsorption table for use, and then a sliding disc slides at the position of a sliding rail; therefore, the cleaning brush is used for cleaning the surface of the third tray, dust is brushed away in time, the dust is prevented from being plugged into the negative-pressure adsorption holes and affecting the stability of negative-pressure adsorption, meanwhile, the dust is prevented from being attached to a machined part, and the cleaning degree of the adsorption table of the chip mounter in use is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of chip mounter adsorption platforms, in particular to a high-speed chip mounter adsorption platform. Background Art

[0002] With the rapid development of modern science and technology, electronic devices are rapidly penetrating into all aspects of people's lives. As the core technology of the electronics manufacturing industry, surface mount technology (SMT) provides a solid foundation for high-performance, high-density, and high-reliability electronic devices. On the SMT production line, the placement machine undoubtedly plays a pivotal role. During the processing, dust will adhere to the surface of the adsorption equipment, directly blocking the adsorption holes and reducing the adsorption efficiency of the device. In order to reduce the impact of dust on the adsorption device, we redesigned a high-speed placement machine adsorption platform. Utility Model Content

[0003] The utility model aims to provide a high-speed chip placement machine adsorption platform.

[0004] To solve the above technical problems, the utility model provides the following technical solutions: a high-speed placement machine adsorption platform, including a placement machine adsorption table, a first tray is fixedly installed on one side of the placement machine adsorption table, a second tray is fixedly installed on one side of the first tray, a third tray is fixedly installed on the surface of one side of the second tray, a mounting chassis is fixedly installed on one edge of one side of the placement machine adsorption table, a slide rail is fixedly installed on the top of the mounting chassis, a sliding disk is slidably connected to the top of one side of the slide rail, a mounting disk is fixedly installed on the top of one side of the sliding disk, a connecting shaft is rotatably connected to the inside of the mounting disk, a connecting rod is fixedly connected to the top of one side of the connecting shaft, and a cleaning brush is detachably installed on the bottom end of the connecting rod.

[0005] Preferably, a mounting clip plate is fixedly mounted on the bottom end of the connecting rod, a mounting top plate is detachably mounted on the bottom end of the mounting clip plate, and a clip groove is provided inside the top end of the mounting top plate.

[0006] Preferably, the cleaning brush is located on the bottom surface of the mounting top plate, and the connection between the cleaning brush and the mounting top plate is a fixed connection.

[0007] Preferably, the connection relationship between the mounting snap plate and the snap groove is a movable snap connection.

[0008] Preferably, a first negative pressure adsorption hole is provided on the top surface of the adsorption platform of the chip mounter, a chip mounting plate is fixedly installed in the middle of the surface of the first tray, and a second negative pressure adsorption hole is provided on the surface of the third tray.

[0009] Preferably, the surface of the second tray is provided with second negative pressure adsorption holes, the second negative pressure adsorption holes on the surface of the third tray and the second negative pressure adsorption holes on the surface of the second tray correspond one to one, and the second negative pressure adsorption holes and the first negative pressure adsorption holes are connected.

[0010] Compared with the related art, the high-speed placement machine adsorption platform provided by the utility model has the following beneficial effects:

[0011] 1. The utility model provides a high-speed placement machine adsorption platform. By setting a connecting shaft to adjust the connecting rod to an inclined angle, a cleaning brush is used to directly contact the top surface of the placement machine adsorption platform. At this time, the third tray, the second tray and the first tray are installed on the placement machine adsorption platform for use, and then the sliding plate slides at the position of the slide rail, so that the cleaning brush is used to clean the surface of the third tray, and dust is brushed off in time to prevent dust from being blocked in the negative pressure adsorption hole and affecting the stability of the negative pressure adsorption. At the same time, dust is prevented from adhering to the workpiece, thereby ensuring the cleanliness of the placement machine adsorption platform.

[0012] 2. The utility model provides a high-speed placement machine adsorption platform, which facilitates the installation and use between the connecting rod and the mounting top plate by setting the connection between the snap groove and the mounting snap plate, and facilitates the effect of easy installation and disassembly. The mounting top plate is removed from the mounting snap plate, and the cleaning brush can be directly cleaned, which is convenient for the subsequent multiple use of the cleaning brush and ensures the cleanliness of the cleaning brush. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0014] Figure 2 This is a schematic diagram of the overall side view of the device of the utility model;

[0015] Figure 3 It is a schematic diagram of the side view structure of the cleaning device of the utility model;

[0016] Figure 4 This is a schematic diagram of the structure of the cleaning brush of the utility model when it is disassembled and viewed from above.

[0017] Numbers in the figure: 1. SMT machine adsorption table; 2. First tray; 3. Second tray; 4. Third tray; 5. Mounting chassis; 6. Slide rail; 7. Sliding plate; 8. Mounting plate; 9. Connecting shaft; 10. Connecting rod; 11. Mounting snap plate; 12. Mounting top plate; 13. Cleaning brush; 14. Snap groove; 16. First negative pressure adsorption hole; 17. Chip mounting plate; 18. Second negative pressure adsorption hole. DETAILED DESCRIPTION

[0018] Embodiment 1:

[0019] See also Figure 1-4 The utility model provides a technical solution: a high-speed placement machine adsorption platform, including a placement machine adsorption platform 1, a first tray 2 is fixedly installed on one side of the placement machine adsorption platform 1, a second tray 3 is fixedly installed on one side of the first tray 2, a third tray 4 is fixedly installed on one side surface of the second tray 3, a mounting chassis 5 is fixedly installed on one side edge of the placement machine adsorption platform 1, a slide rail 6 is fixedly installed on the top of the mounting chassis 5, a sliding plate 7 is slidably connected to the top of one side of the slide rail 6, a mounting plate 8 is fixedly installed on the top of one side of the sliding plate 7, a connecting shaft 9 is rotatably connected to the inside of the mounting plate 8, and the connecting shaft 9 A connecting rod 10 is fixedly connected to the top end of one side, and a cleaning brush 13 is detachably installed on the bottom end of the connecting rod 10. A first negative pressure adsorption hole 16 is provided on the top surface of the placement machine adsorption table 1, and a chip mounting plate 17 is fixedly installed in the middle of the surface of the first tray 2. A second negative pressure adsorption hole 18 is provided on the surface of the third tray 4, and a second negative pressure adsorption hole 18 is provided on the surface of the second tray 3. The positions of the second negative pressure adsorption holes 18 on the surface of the third tray 4 and the second negative pressure adsorption holes 18 on the surface of the second tray 3 correspond one to one, and the second negative pressure adsorption holes 18 and the first negative pressure adsorption holes 16 are connected.

[0020] In the implementation scheme, the connecting shaft 9 is set to adjust the connecting rod 10 to an inclined angle, and the top surface of the placement machine adsorption table 1 is directly contacted by the cleaning brush 13. At this time, the third tray 4, the second tray 3 and the first tray 2 are installed on the placement machine adsorption table 1 for use, and then the sliding plate 7 is slid at the position of the slide rail 6, so that the cleaning brush 13 is used to clean the surface of the third tray 4, and dust is brushed off in time to prevent dust from being blocked in the negative pressure adsorption hole and affecting the stability of the negative pressure adsorption. At the same time, dust is prevented from adhering to the workpiece, thereby ensuring the cleanliness of the placement machine adsorption table 1 when used.

[0021] Embodiment 2:

[0022] See also Figure 1-4 The utility model provides a technical solution: a high-speed placement machine adsorption platform, including a connecting rod 10 with a mounting clip plate 11 fixedly installed at the bottom end, a mounting top plate 12 detachably installed at the bottom end of the mounting clip plate 11, a clip groove 14 is opened inside the top end of the mounting top plate 12, a cleaning brush 13 is located on the bottom end surface of the mounting top plate 12, the connection relationship between the cleaning brush 13 and the mounting top plate 12 is a fixed connection, and the connection relationship between the mounting clip plate 11 and the clip groove 14 is a movable clip connection.

[0023] In the implementation scheme, by setting the connection between the snap groove 14 and the mounting snap plate 11, the installation and use between the connecting rod 10 and the mounting top plate 12 are facilitated, and the installation and disassembly are convenient. The mounting top plate 12 is removed from the mounting snap plate 11, and the cleaning brush 13 can be directly cleaned, which is convenient for the subsequent multiple uses of the cleaning brush 13 and ensures the cleanliness of the cleaning brush 13.

[0024] Working principle:

[0025] According to actual needs, one of the first tray 2, the second tray 3 and the third tray 4 is selected and installed on the adsorption table 1 of the placement machine for use, and the workpiece is fixed by negative pressure adsorption to continue the processing effect;

[0026] By setting the connecting shaft 9 to adjust the connecting rod 10 to an inclined angle, the top surface of the placement machine adsorption table 1 is directly contacted by the cleaning brush 13. At this time, one of the third tray 4, the second tray 3 and the first tray 2 is installed on the placement machine adsorption table 1 for use, and then the sliding plate 7 slides at the position of the slide rail 6, so that the cleaning brush 13 is used to clean the surface of the third tray 4, and dust is brushed off in time to prevent dust from being stuffed into the inside of the negative pressure adsorption hole and affecting the stability of the negative pressure adsorption. At the same time, dust is prevented from adhering to the workpiece, thereby ensuring the cleanliness of the placement machine adsorption table 1 when used;

[0027] By setting the connection between the snap groove 14 and the mounting snap plate 11, the installation and use between the connecting rod 10 and the mounting top plate 12 are facilitated, and the installation and disassembly are convenient. The mounting top plate 12 is removed from the mounting snap plate 11, and the cleaning brush 13 can be directly cleaned, which is convenient for the subsequent multiple uses of the cleaning brush 13 and ensures the cleanliness of the cleaning brush 13.

Claims

1. A high-speed chip mounter adsorption platform, comprising a chip mounter adsorption table (1), a first tray (2) being fixedly mounted on one side of the chip mounter adsorption table (1), characterized in that: A second tray (3) is fixedly mounted on one side of the first tray (2), a third tray (4) is fixedly mounted on one side surface of the second tray (3), a mounting chassis (5) is fixedly mounted on one side edge of the placement machine adsorption platform (1), a slide rail (6) is fixedly mounted on the top of the mounting chassis (5), a sliding plate (7) is slidably connected to the top of one side of the slide rail (6), a mounting plate (8) is fixedly mounted on the top of one side of the sliding plate (7), a connecting shaft (9) is rotatably connected inside the mounting plate (8), a connecting rod (10) is fixedly connected to the top of one side of the connecting shaft (9), and a cleaning brush (13) is detachably mounted on the bottom of the connecting rod (10).

2. A high-speed chip mounter adsorption platform according to claim 1, characterized in that: A mounting clip plate (11) is fixedly mounted on the bottom end of the connecting rod (10), a mounting top plate (12) is detachably mounted on the bottom end of the mounting clip plate (11), and a clip groove (14) is provided inside the top end of the mounting top plate (12).

3. A high-speed placement machine adsorption platform according to claim 2, characterized in that: The cleaning brush (13) is located on the bottom surface of the mounting top plate (12), and the connection relationship between the cleaning brush (13) and the mounting top plate (12) is a fixed connection.

4. A high-speed placement machine adsorption platform according to claim 2, characterized in that: The connection relationship between the mounting buckle plate (11) and the buckle groove (14) is a movable buckle connection.

5. The high-speed chip mounter adsorption platform according to claim 1, characterized in that: The top surface of the chip mounter adsorption platform (1) is provided with a first negative pressure adsorption hole (16), a chip mounting plate (17) is fixedly mounted in the middle of the surface of the first tray (2), and the surface of the third tray (4) is provided with a second negative pressure adsorption hole (18).

6. A high-speed placement machine adsorption platform according to claim 5, characterized in that: The surface of the second tray (3) is provided with a second negative pressure adsorption hole (18); the second negative pressure adsorption hole (18) on the surface of the third tray (4) and the second negative pressure adsorption hole (18) on the surface of the second tray (3) correspond in position to each other; the second negative pressure adsorption hole (18) and the first negative pressure adsorption hole (16) are connected.

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