Atomization assembly and electronic atomization device

By designing the special structure of the seal avoidance through holes and heating element in the atomization assembly of the electronic atomization device, the problem of slow temperature rise and effusion caused by poor contact in traditional devices is solved, and a more efficient atomization effect is achieved .

CN222486220UActive Publication Date: 2025-02-18DONGGUAN QISHUNTONG TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202421105463.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-20
Publication Date
2025-02-18
Estimated Expiration
2034-05-20

AI Technical Summary

Technical Problem

In traditional electronic atomization devices, seals are used to prevent leakage of the atomized matrix, but at the same time affect the contact between the heating element and the atomized matrix, resulting in slow temperature rise, poor fluidity and fluid accumulation problems.

Method used

Atomization assembly is designed in which the seal is provided with a through hole, and the heating element passes through the through hole and cooperates with the hole wall to ensure that the heating element comes into contact with the bottom of the atomized substrate, while increasing contact through the annular groove and the contact groove area.

Benefits of technology

The heating rate of the atomization matrix and the fluidity of the atomization gas are improved, the liquid accumulation problem is reduced, and the atomization effect is enhanced.

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Abstract

The utility model discloses an atomization assembly and an electronic atomization device, and the atomization assembly comprises a sealing part and a heating body. The sealing element is used for being arranged at the bottom of the atomization substrate, and an avoiding through hole formed in the preset direction is formed in the sealing element; the heating body penetrates through the avoiding through hole and is in interference fit with the hole wall of the avoiding through hole, the end, close to the atomization matrix in the preset direction, of the heating body is provided with a contact face, at least part, close to the atomization matrix in the preset direction, of the heating body is exposed out of the avoiding through hole, and the contact face is used for abutting against the bottom of the atomization matrix. According to the atomization assembly, the atomization effect can be improved.
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Description

Technical Field

[0001] The present application relates to the field of electronic atomization devices, and in particular to an atomization component and an electronic atomization device. Background Art

[0002] Electronic atomization devices are usually used in the field of electronic atomization, and are used to generate atomized gas from the atomization matrix for users to inhale. In the aerosol generating device, the heating element used to heat the atomization matrix is ​​a key component that determines the heating state of the atomization matrix. In the atomization assembly of a traditional electronic atomization device, the heating element is arranged at the bottom of the atomization matrix so that the atomized gas can be inhaled by the user from the top of the atomization matrix. At the same time, in order to prevent the atomization matrix from leaking into other structures of the electronic atomization device, a seal is usually arranged at the bottom of the atomization matrix, but it will also affect the contact between the heating element and the atomization matrix, resulting in a slow temperature rise of the atomization matrix, poor fluidity, and easy generation of large-area liquid accumulation problems. Utility Model Content

[0003] In view of this, the purpose of the present application is to overcome the deficiencies in the prior art and to provide an atomization assembly that can improve the atomization effect.

[0004] The present application also provides an electronic atomization device.

[0005] To achieve the above objectives, the technical solutions adopted in this application are as follows:

[0006] According to the first aspect of the present application, the atomization component includes: a sealing member, which is used to be arranged at the bottom of an atomization substrate, and the sealing member is provided with an avoidance through hole opened along a preset direction; a heating element, which is passed through the avoidance through hole and has an interference fit with the hole wall of the avoidance through hole, and the heating element has a contact surface at one end close to the atomization substrate along the preset direction, and at least a portion of the heating element close to the atomization substrate along the preset direction is exposed outside the avoidance through hole, and the contact surface is used to abut against the bottom of the atomization substrate.

[0007] The atomization assembly of the present application has the following advantages:

[0008] In the above-mentioned atomizing assembly, since the heating element is inserted into the sealing member avoidance through hole and has an interference fit with the hole wall of the avoidance through hole, the sealing member can be used to seal the heating element and the bottom of the atomizing matrix to improve the atomization effect and reduce the possibility of oil leakage of the above-mentioned atomizing assembly. Furthermore, since the heating element has a contact surface at one end close to the atomizing matrix along a preset direction, at least part of the heating element close to the atomizing matrix along the preset direction is exposed outside the avoidance through hole, and the contact surface is used to abut against the bottom of the atomizing matrix, so that the heating element can be close to the atomizing matrix along the preset direction. At least part of the atomizing matrix passes through the avoidance through hole, so that the contact surface of the heating element can be exposed outside the avoidance through hole and abut against the bottom of the atomizing matrix, thereby realizing the contact between the heating element and the atomizing matrix. At the same time, since at least part of the heating element close to the atomizing matrix along a preset direction passes through the avoidance through hole, the influence of the seal on the contact area between the heating element and the atomizing matrix can be reduced, so as to expand the contact area between the heating element and the atomizing matrix, thereby increasing the heating rate of the atomizing matrix, improving the fluidity of the atomizing gas, reducing the problem of liquid accumulation in the atomizing matrix, and improving the atomization effect.

[0009] According to the atomization assembly of the first aspect embodiment of the present application, the sealing member is further provided with an annular groove, which is opened on the hole wall of the avoidance through hole and is connected to the avoidance through hole, the heating element includes a heating part and an annular limiting part, the heating part is passed through the avoidance through hole, the contact surface is located at one end of the heating part close to the atomization substrate along the preset direction, the annular limiting part is connected to the heating part and is arranged close to one end of the heating part away from the atomization substrate along the preset direction, and the annular limiting part protrudes from the heating part, and the annular limiting part is passed through the annular groove.

[0010] According to the atomizer assembly of the first embodiment of the present application, the shape of the annular groove is the same as the shape of the annular limiting portion, and the annular limiting portion abuts against the side wall of the annular groove.

[0011] According to the atomization assembly of the first aspect of the present application, a contact groove is provided on the heating part, and the contact groove is extended from the contact surface along the preset direction toward the inside of the heating part, and each groove wall of the contact groove is against the atomization matrix.

[0012] According to the atomizer assembly of the first aspect of the present application, the contact groove has a first side wall, a second side wall, a third side wall and a fourth side wall, the first side wall and the second side wall are both arranged parallel to the preset direction, and the first side wall and the second side wall are arranged at intervals, the two sides of the third side wall are respectively connected to the first side wall and the second side wall, one side of the fourth side wall is connected to the side of the first side wall away from the third side wall, and the other side of the fourth side wall is connected to the side of the second side wall away from the third side wall;

[0013] Wherein, the third side wall and the fourth side wall are both arranged at an angle to the preset direction.

[0014] According to the atomization assembly of the first aspect of the present application, the angles between the third side wall and the fourth side wall and the preset direction are both α, satisfying: 20°≤α≤45°.

[0015] According to the atomizing assembly of the first aspect of the present application, the sealing member is further provided with a connecting hole connected to the avoiding through hole, the connecting hole is arranged at one end of the avoiding through hole close to the atomizing substrate along the preset direction, and at least a portion of the heating element close to the atomizing substrate along the preset direction is exposed outside the avoiding through hole and is located in the connecting hole;

[0016] Wherein, the hole wall of the connecting hole is used to abut against the atomized matrix.

[0017] According to the atomization assembly of the first aspect of the present application, in the preset direction, the aperture of the connection hole gradually increases in the direction away from the bottom of the atomization substrate.

[0018] According to the atomization assembly of the first aspect of the present application, the angle between the hole wall of the connecting hole and the preset direction is β, which satisfies: 45°≤β≤60°.

[0019] The electronic atomization device according to the second embodiment of the present application includes: the atomization component as described above.

[0020] The electronic atomization device of the present application has the following advantages:

[0021] In the above-mentioned electronic atomization device, since the above-mentioned atomization component can improve the heating effect of the atomization matrix, increase the heating rate of the atomization matrix, increase the fluidity of the atomization gas, reduce the liquid accumulation problem of the atomization matrix, and improve the atomization effect, the above-mentioned electronic atomization device has a better atomization effect, so that the user has a better use experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 A schematic cross-sectional view of the atomization assembly in the present application is shown;

[0024] Figure 2 A schematic diagram showing the structure of the sealing member and the heating element in the present application is shown;

[0025] Figure 3 The cross-sectional structure diagram of the heating element in this application is shown Figure 1 ;

[0026] Figure 4 The cross-sectional structure diagram of the heating element in this application is shown Figure 2 ;

[0027] Figure 5 A schematic cross-sectional structure diagram of the sealing member in the present application is shown.

[0028] Description of main component symbols:

[0029] 100 - sealing member; 110 - avoidance through hole; 120 - annular groove; 130 - connection hole;

[0030] 200 - heating element; 210 - contact surface; 220 - heating portion; 221 - contact groove; 2211 - first side wall; 2212 - second side wall; 2213 - third side wall; 2214 - fourth side wall; 230 - annular limiting portion. DETAILED DESCRIPTION

[0031] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0032] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0033] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0034] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0035] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0036] Reference Figure 1 as well as Figure 2 As shown, the atomization assembly involved in the embodiment of the present application includes: a sealing member 100 and a heating element 200 .

[0037] Specifically, the sealing member 100 is used to be arranged at the bottom of the atomizing substrate, and the sealing member 100 is provided with an avoidance through hole 110 opened along a preset direction; the heating element 200 is passed through the avoidance through hole 110 and is interference fit with the hole wall of the avoidance through hole 110, and the heating element 200 has a contact surface 210 at one end close to the atomizing substrate along the preset direction, and at least a portion of the heating element 200 close to the atomizing substrate along the preset direction is exposed outside the avoidance through hole 110, and the contact surface 210 is used to abut against the bottom of the atomizing substrate.

[0038] It should be noted that the preset direction is Figure 1 The direction that x points to.

[0039] Specifically, in the above-mentioned embodiment, the sealing member 100 is a silicone sealing member 100 , and the heating element 200 is a ceramic heating element 200 .

[0040] In the above-mentioned atomization assembly, since the heating element 200 is inserted into the avoidance through hole 110 of the sealing member 100 and has an interference fit with the hole wall of the avoidance through hole 110, the sealing member 100 can be used to seal the heating element 200 and the bottom of the atomization matrix to improve the atomization effect and reduce the possibility of oil leakage of the above-mentioned atomization assembly. Furthermore, since the heating element 200 has a contact surface 210 at one end close to the atomization matrix along a preset direction, at least part of the heating element 200 close to the atomization matrix along the preset direction is exposed outside the avoidance through hole 110, and the contact surface 210 is used to abut against the bottom of the atomization matrix, so that the heating element 200 can be close to the atomization matrix along the preset direction. At least part of the atomizing matrix passes through the avoidance through hole 110, so that the contact surface 210 of the heating element 200 can be exposed outside the avoidance through hole 110 and abut against the bottom of the atomizing matrix, thereby achieving contact between the heating element 200 and the atomizing matrix. At the same time, since at least part of the heating element 200 close to the atomizing matrix along the preset direction passes through the avoidance through hole 110, the influence of the sealing element 100 on the contact surface 210 area between the heating element 200 and the atomizing matrix can be reduced, so as to expand the contact surface 210 area between the heating element 200 and the atomizing matrix, thereby increasing the heating rate of the atomizing matrix, increasing the fluidity of the atomizing gas, reducing the problem of liquid accumulation in the atomizing matrix, and improving the atomization effect.

[0041] Reference Figure 3 as well as Figure 5As shown, the seal 100 is also provided with an annular groove 120, which is opened on the hole wall of the avoidance through hole 110 and is connected to the avoidance through hole 110. The heating body 200 includes a heating portion 220 and an annular limiting portion 230. The heating portion 220 is penetrated through the avoidance through hole 110, and the contact surface 210 is located at one end of the heating portion 220 close to the atomizing substrate along a preset direction. The annular limiting portion 230 is connected to the heating portion 220 and is arranged close to one end of the heating portion 220 away from the atomizing substrate along a preset direction, and the annular limiting portion 230 protrudes from the heating portion 220, and the annular limiting portion 230 is penetrated in the annular groove 120.

[0042] Specifically, the opening of the annular groove 120 is arranged toward the avoidance through hole 110 , and the bottom of the annular groove 120 is located between the hole wall of the avoidance through hole 110 and the surface of the seal 100 , and the two side walls of the annular groove 120 are arranged at intervals along a preset direction.

[0043] It can be understood that at least a portion of the heating portion 220 close to the atomizing substrate can pass through the avoidance hole 110 along a preset direction, so that the contact surface 210 of the heating portion 220 can be exposed outside the avoidance hole 110 and abut against the bottom of the atomizing substrate, thereby achieving contact between the heating portion 220 and the atomizing substrate. Since the annular limiting portion 230 protrudes from the heating portion 220 and the annular limiting portion 230 is penetrated into the annular groove 120, the annular limiting portion 230 can be limited in a preset direction by the annular groove 120 to prevent the annular limiting portion 230 from moving in the preset direction, thereby preventing the heating portion 220 connected to the annular limiting portion 230 from moving in the preset direction, thereby improving the stability of the connection structure between the heating element 200 and the sealing member 100.

[0044] Reference Figure 1 As shown, the shape of the annular groove 120 is the same as that of the annular limiting portion 230 , and the annular limiting portion 230 abuts against the side wall of the annular groove 120 .

[0045] It can be understood that since the shape of the annular groove 120 is the same as the shape of the annular limiting portion 230, and the annular limiting portion 230 abuts against the side wall of the annular groove 120, the annular limiting portion 230 can be further limited in a preset direction by abutting against the side wall of the annular groove 120 to prevent the annular limiting portion 230 from moving in the preset direction, thereby preventing the heating portion 220 connected to the annular limiting portion 230 from moving in the preset direction.

[0046] Reference Figure 1 , Figure 3 as well as Figure 4As shown, a contact groove 221 is provided on the heating portion 220 , and the contact groove 221 is extended from the contact surface 210 along a preset direction toward the inside of the heating portion 220 , and each groove wall of the contact groove 221 abuts against the atomized matrix.

[0047] It can be understood that since the contact groove 221 is extended from the contact surface 210 along a preset direction toward the inside of the heating part 220, and each groove wall of the contact groove 221 is offset against the atomizing matrix, the contact groove 221 can be used to increase the contact surface 210 area between the atomizing matrix and the heating part 220, and the original contact surface 210 area is increased from the area of ​​the contact surface 210 to the contact surface 210 area is the sum of the area of ​​the contact surface 210 and the area of ​​each groove wall of the contact groove 221. In this way, the heating effect of the heating part 220 on the atomizing matrix can be further improved, thereby further improving the heating rate of the atomizing matrix, improving the fluidity of the atomizing gas, reducing the problem of liquid accumulation in the atomizing matrix, and improving the atomization effect.

[0048] Reference Figure 3 as well as Figure 4 As shown, the contact groove 221 has a first side wall 2211, a second side wall 2212, a third side wall 2213 and a fourth side wall 2214, the first side wall 2211 and the second side wall 2212 are both arranged parallel to the preset direction, and the first side wall 2211 and the second side wall 2212 are arranged at intervals, the two sides of the third side wall 2213 are respectively connected to the first side wall 2211 and the second side wall 2212, one side of the fourth side wall 2214 is connected to the side of the first side wall 2211 away from the third side wall 2213, and the other side of the fourth side wall 2214 is connected to the side of the second side wall 2212 away from the third side wall 2213;

[0049] The third side wall 2213 and the fourth side wall 2214 are both disposed at an angle to the preset direction.

[0050] It can be understood that since the third side wall 2213 and the fourth side wall 2214 are both set at an angle to the preset direction, the contact groove 221 can be made into a three-dimensional trapezoidal structure. In this way, the three-dimensional trapezoidal structure can further increase the contact surface 210 area between the atomizing matrix and the groove wall of the contact groove 221, that is, the inclined setting of the third side wall 2213 and the fourth side wall 2214 can further increase the contact surface 210 area between the atomizing matrix and the groove wall of the contact groove 221, which can further improve the heating effect of the heating element 200 on the atomizing matrix, thereby further improving the heating rate of the atomizing matrix, improving the fluidity of the atomizing gas, reducing the problem of liquid accumulation in the atomizing matrix, and improving the atomization effect. At the same time, the three-dimensional trapezoidal structure can also facilitate the insertion of the heating part 220 into the bottom of the atomizing matrix.

[0051] Specifically, in other embodiments, the first side wall 2211 and the second side wall 2212 may also be arranged at an angle to the preset direction, so that the contact groove 221 has a terrace structure, further increasing the contact surface 210 area between the atomized matrix and the groove wall of the contact groove 221 .

[0052] Reference Figure 3 As shown, the angles between the third side wall 2213 and the fourth side wall 2214 and the preset direction are both α, satisfying: 20°≤α≤45°.

[0053] Specifically, in the above embodiments, the angle α between the third side wall 2213 and the fourth side wall 2214 and the preset direction can be 20°, 30°, 35°, 40°, 45°, etc.

[0054] It can be understood that when the angle α between the third side wall 2213 and the fourth side wall 2214 and the preset direction is less than 20°, the slope of the contact groove 221 of the three-dimensional trapezoidal structure will be insufficient, which is not conducive to the insertion of the heating unit 220 into the bottom of the atomized substrate. At the same time, the effect of increasing the contact surface 210 between the atomized substrate and the groove wall of the contact groove 221 cannot meet the requirements. When the angle α between the third side wall 2213 and the fourth side wall 2214 and the preset direction is greater than 45°, the three-dimensional trapezoidal structure will be insufficient. The area of ​​the bottom of the contact groove 221 of the trapezoidal structure is too small, which affects the heating effect of the bottom of the contact groove 221 on the atomized substrate. When the angle α between the third side wall 2213 and the fourth side wall 2214 and the preset direction satisfies: 20°≤α≤45°, it can facilitate the insertion of the heating part 220 into the bottom of the atomized substrate, and can also meet the requirement of increasing the contact surface 210 area between the atomized substrate and the groove wall of the contact groove 221, thereby improving the heating effect of the heating element 200 on the atomized substrate.

[0055] Reference Figure 1 as well as Figure 5 As shown, the sealing member 100 is further provided with a connecting hole 130 connected with the avoidance through hole 110, and the connecting hole 130 is arranged at one end of the avoidance through hole 110 close to the atomizing substrate along a preset direction, and at least a portion of the heating element 200 close to the atomizing substrate along the preset direction is exposed outside the avoidance through hole 110 and is located in the connecting hole 130;

[0056] The hole wall of the connecting hole 130 is used to abut against the atomized matrix.

[0057] It can be understood that, since the hole wall of the connecting hole 130 is used to abut against the atomizing matrix, the sealing performance of the seal 100 to the bottom of the atomizing matrix can be further improved through the hole wall of the connecting hole 130, thereby reducing the possibility of leakage of the atomizing matrix from the above-mentioned physical and chemical components. At the same time, since at least part of the heating element 200 close to the atomizing matrix along a preset direction is exposed outside the avoidance through hole 110 and is located in the connecting hole 130, the contact surface 210 area between the heating element 200 and the atomizing matrix can be further increased, that is, the outer wall of the heating element 200 located in the connecting hole 130 can be in contact with the atomizing matrix, thereby further improving the heating effect of the heating element 200 on the atomizing matrix.

[0058] Reference Figure 5 As shown, in a preset direction, the aperture of the connecting hole 130 gradually increases in a direction away from the bottom of the atomized substrate.

[0059] Specifically, in the above-mentioned embodiment, the connecting hole 130 is a conical hole, the top of the conical hole is close to the bottom of the atomizing substrate, and the bottom of the conical hole is far away from the bottom of the atomizing substrate.

[0060] It can be understood that, in the preset direction, since the aperture of the connecting hole 130 gradually increases in the direction approaching the atomizing matrix, in the partial structure where the heating element 200 is located in the connecting hole 130, the interval between the outer wall of the heating element 200 and the hole wall of the connecting hole 130 can be gradually increased in the preset direction toward the direction away from the bottom of the atomizing matrix. In this way, more atomizing matrix can be located between the outer wall of the heating element 200 and the hole wall of the connecting hole 130, thereby improving the heating effect of the heating element 200 on the atomizing matrix, increasing the heating rate of the atomizing matrix, increasing the fluidity of the atomizing gas, reducing the problem of liquid accumulation in the atomizing matrix, and improving the atomization effect.

[0061] Continue to refer to Figure 5 As shown, the angle between the hole wall of the connecting hole 130 and the preset direction is β, which satisfies: 45°≤β≤60°.

[0062] Specifically, in the above-mentioned embodiments, the angle β between the hole wall of the connecting hole 130 and the preset direction can be 45°, 50°, 55°, 60°, etc.

[0063] It can be understood that when the angle β between the hole wall of the connecting hole 130 and the preset direction is less than 45°, the distance between the outer wall of the heating element 200 and the hole wall of the connecting hole 130 will be too small. In this way, when the heating element 200 heats the atomized substrate, the fluidity of the atomized gas generated by the atomized substrate between the outer wall of the heating element 200 and the hole wall of the connecting hole 130 will be too poor. In this way, it will further cause the problem of liquid accumulation between the outer wall of the heating element 200 and the hole wall of the connecting hole 130. When the angle β between the hole wall of the connecting hole 130 and the preset direction is greater than 45°, the distance between the outer wall of the heating element 200 and the hole wall of the connecting hole 130 will be too small. When the angle β between the wall of the connecting hole 130 and the preset direction satisfies: 45°≤β≤60°, the heating effect of the heating element 200 on the atomizing matrix can be improved, the heating speed of the atomizing matrix can be increased, the fluidity of the atomizing gas can be increased, the problem of liquid accumulation in the atomizing matrix can be reduced, and the atomization effect can be improved.

[0064] The electronic atomization device involved in the embodiment of the present application includes: the above-mentioned atomization component.

[0065] In the above-mentioned electronic atomization device, since the above-mentioned atomization component can improve the heating effect of the atomization matrix, increase the heating rate of the atomization matrix, increase the fluidity of the atomization gas, reduce the liquid accumulation problem of the atomization matrix, and improve the atomization effect, the above-mentioned electronic atomization device has a better atomization effect, so that the user has a better use experience.

[0066] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0067] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. An atomizing assembly, characterized in that: include: A sealing member, the sealing member is used to be arranged at the bottom of the atomized substrate, and the sealing member is provided with an avoidance through hole opened along a preset direction; A heating element, the heating element is passed through the avoidance through hole and has an interference fit with the hole wall of the avoidance through hole, the heating element has a contact surface at one end close to the atomizing substrate along the preset direction, at least a portion of the heating element close to the atomizing substrate along the preset direction is exposed outside the avoidance through hole, and the contact surface is used to abut against the bottom of the atomizing substrate.

2. The atomizer assembly according to claim 1, characterized in that: The sealing member is further provided with an annular groove, which is opened on the hole wall of the avoidance through hole and is communicated with the avoidance through hole. The heating element comprises a heating portion and an annular limiting portion, the heating portion is passed through the avoidance through hole, the contact surface is located at one end of the heating portion close to the atomizing substrate along the preset direction, the annular limiting portion is connected to the heating portion and is arranged close to one end of the heating portion away from the atomizing substrate along the preset direction, and the annular limiting portion protrudes from the heating portion, and the annular limiting portion is passed through the annular groove.

3. The atomizer assembly according to claim 2, characterized in that: The shape of the annular groove is the same as that of the annular limiting portion, and the annular limiting portion abuts against a side wall of the annular groove.

4. The atomizer assembly according to claim 2, characterized in that: The heating portion is provided with a contact groove, which is extended from the contact surface along the preset direction toward the interior of the heating portion, and each groove wall of the contact groove abuts against the atomizing matrix.

5. The atomizing assembly according to claim 4, characterized in that: The contact groove has a first side wall, a second side wall, a third side wall and a fourth side wall, the first side wall and the second side wall are both arranged parallel to the preset direction, and the first side wall and the second side wall are arranged at intervals, the two sides of the third side wall are respectively connected to the first side wall and the second side wall, one side of the fourth side wall is connected to the side of the first side wall away from the third side wall, and the other side of the fourth side wall is connected to the side of the second side wall away from the third side wall; Wherein, the third side wall and the fourth side wall are both arranged at an angle to the preset direction.

6. The atomizer assembly according to claim 5, characterized in that: Angles between the third side wall and the fourth side wall and the preset direction are both α, satisfying: 20°≤α≤45°.

7. The atomizer assembly according to any one of claims 1 to 6, characterized in that: The sealing member is further provided with a connecting hole connected to the avoidance through hole, the connecting hole being arranged at one end of the avoidance through hole close to the atomizing substrate along the preset direction, and at least a portion of the heating element close to the atomizing substrate along the preset direction is exposed outside the avoidance through hole and is located in the connecting hole; Wherein, the hole wall of the connecting hole is used to abut against the atomized matrix.

8. The atomizer assembly according to claim 7, characterized in that: In the preset direction, the aperture of the connecting hole gradually increases in a direction away from the bottom of the atomizing substrate.

9. The atomizer assembly according to claim 8, characterized in that: The angle between the hole wall of the connecting hole and the preset direction is β, which satisfies: 45°≤β≤60°.

10. An electronic atomization device, characterized in that: include: An atomizer assembly as claimed in any one of claims 1 to 9.