Cooling quick release device under negative pressure reflow soldering and reflow soldering equipment

Abstract

The utility model discloses a cooling quick release device under negative pressure reflow soldering and reflow soldering equipment, which comprises an air duct box, a condenser assembly and a locking piece, the front end of the air duct box is provided with an opening, and a guide rail is arranged in the air duct box; a sliding plate is arranged at the bottom of the condenser assembly and slidably connected to the guide rail, and the condenser assembly can extend into or move out of the air duct box from the opening through the sliding plate. The locking piece is used for detachably connecting the condenser assembly to a lower furnace pipe of reflow soldering equipment. When maintenance is needed, the locking piece is unlocked firstly, then the condenser assembly is pulled outwards, and the condenser assembly can be moved out of the air duct box. Therefore, the condenser assembly which is easy to adhere to the soldering flux is designed to be in a movable drawing type and can be drawn out at the same time and cleaned and maintained outside the air duct box, after the condenser assembly is drawn out, a larger space is provided for observing and cleaning the soldering flux in the lower cooling cavity, and compared with existing equipment, labor intensity can be effectively reduced, and maintenance efficiency can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of welding, in particular to a negative pressure reflow soldering lower cooling quick-disassembly device and reflow soldering equipment. Background Art

[0002] In the production process of negative pressure reflow soldering equipment, the high temperature of solder paste will vaporize the flux in it. Negative pressure reflow soldering is a structure that uses upper cooling air outlet and lower cooling air return, and then the cold air is transported to the upper cooling. When the vaporized flux passes through the condenser, the temperature drops and the flux gradually liquefies. After liquefaction, the flux will flow into the lower cooling air duct box. If it is not cleaned and maintained for a long time, the accumulated excessive flux will solidify on the condenser and filter net, affecting the cooling effect, thereby reducing product quality and even causing batch defects. Moreover, after long-term accumulation, the liquefied flux will penetrate into the high-temperature motor, causing the motor to malfunction, which will then cause the entire production line to shut down for maintenance, costing more time and manpower and material resources.

[0003] If the existing reflow soldering equipment needs to maintain the lower cooling zone air duct box, it is necessary to remove the upper guide rail mesh first, and then disassemble the parts from top to bottom for cleaning and maintenance. After the maintenance is completed, it is reinstalled and the guide rail needs to be re-adjusted and calibrated, which takes a lot of manpower and time.

[0004] Therefore, how to improve the maintenance efficiency of the lower cooling air duct box is a technical problem that technicians in this field currently need to solve. Utility Model Content

[0005] One purpose of the utility model is to provide a quick-release device for cooling under negative pressure reflow soldering, which can effectively reduce labor intensity and improve maintenance efficiency. Another purpose is to provide a reflow soldering device including the quick-release device for cooling under negative pressure reflow soldering.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A negative pressure reflow soldering bottom cooling quick release device, comprising:

[0008] An air duct box, wherein the front end of the air duct box is provided with an opening, and a guide rail is provided inside the air duct box;

[0009] A condenser assembly, wherein a slide plate is provided at the bottom of the condenser assembly, the slide plate is slidably connected to the guide rail, and the condenser assembly extends into or moves out of the air duct box from the opening through the slide plate;

[0010] A locking piece is used to detachably connect the condenser assembly to the lower furnace of the reflow soldering equipment.

[0011] Preferably, a wind shield is provided on each of the two sides of the bottom of the air duct box, and one guide rail is provided on each of the two wind shields.

[0012] Preferably, the front and rear ends of the bottom of the wind shield are respectively provided with a supporting leg, and the supporting leg is fixed to the inner bottom of the air duct box.

[0013] Preferably, the air duct box includes a trough-shaped bottom shell, a front partition, a rear partition and a return air plate, the front partition is connected to the front end of the trough-shaped bottom shell, the opening is located on the front partition, the rear partition is connected to the rear end of the trough-shaped bottom shell, and the return air plate covers the upper end of the trough-shaped bottom shell.

[0014] Preferably, the air duct box further comprises two return air plate mounting brackets, and the front and rear ends of the return air plate are respectively connected to the front partition plate and the rear partition plate through the return air plate mounting brackets.

[0015] Preferably, a push-pull handle is provided at the front end of the condenser assembly.

[0016] Preferably, air outlets are respectively provided at the bottom of the air duct box and the middle of the slide plate.

[0017] Preferably, a pressurized air hood is provided above the air outlet of the air duct box.

[0018] Preferably, the locking member is a compression toggle clamp.

[0019] A reflow soldering device comprises any one of the above-mentioned quick-release devices for cooling down the negative pressure reflow soldering.

[0020] Compared with the prior art, the above technical solution has the following advantages:

[0021] The utility model provides a negative pressure reflow soldering lower cooling quick-release device and reflow soldering equipment. During assembly, the condenser assembly can be extended into the air duct box through a slide plate, and then the condenser assembly can be fixed by a locking piece. When maintenance is required, the locking piece is first unlocked, and then the condenser assembly is pulled outward to remove the condenser assembly from the air duct box. Therefore, the condenser assembly that is easy to adhere to the solder flux is designed to be movable and pull-out, which can be pulled out at the same time and cleaned and maintained outside the air duct box. After the condenser assembly is pulled out, there is more space to observe and clean the solder flux in the lower cooling cavity. Therefore, the operation is simple and convenient. Compared with the existing equipment, it can effectively reduce the labor intensity and improve the maintenance efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0023] Figure 1 A schematic diagram of the partial structure of a reflow soldering device provided by a specific implementation mode of the utility model;

[0024] Figure 2 for Figure 1 A schematic diagram of the structure after the condenser assembly is removed;

[0025] Figure 3 A schematic diagram of the structure of a quick-release device for cooling under negative pressure reflow soldering provided by a specific embodiment of the utility model;

[0026] Figure 4 for Figure 3 A schematic diagram of the structure when the condenser assembly is in a removed state;

[0027] Figure 5 This is an exploded view of the cooling quick-release device under negative pressure reflow soldering.

[0028] The reference numerals are as follows:

[0029] 1 is a condenser assembly, 11 is a push-pull handle, 12 is a slide plate, and 13 is a disc-shaped locking screw;

[0030] 2 is a locking member;

[0031] 3 is the lower furnace;

[0032] 4 is an air duct box, 41 is a grooved bottom shell, 42 is a front baffle, 43 is a rear baffle, 44 is a return air plate, 45 is a return air plate mounting bracket, 46 is a guide rail, and 47 is a wind shield;

[0033] 5 is a pressurized air hood;

[0034] 6 is a motor assembly. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0036] Please refer to Figure 1 to Figure 3 The embodiment of the utility model provides a negative pressure reflow soldering bottom cooling quick-release device, comprising: an air duct box 4, a condenser assembly 1 and a locking member 2, wherein the front end of the air duct box 4 is provided with an opening, and a guide rail 46 is provided inside the air duct box 4; a slide plate 12 is provided at the bottom of the condenser assembly 1, and the slide plate 12 can be fixed to the bottom of the condenser assembly 1 by a disc-shaped locking screw 13, and the slide plate 12 is slidably connected to the guide rail 46, and the condenser assembly 1 can be extended into or moved out of the air duct box 4 from the opening through the slide plate 12; the locking member 2 is used to detachably connect the condenser assembly 1 to the lower furnace 3 of the reflow soldering equipment. During assembly, the condenser assembly 1 can be extended into the air duct box 4 through the slide plate 12, and then the condenser assembly 1 can be fixed by the locking member 2. When maintenance is required, first unlock the locking member 2, and then pull the condenser assembly 1 outward to move the condenser assembly 1 out of the air duct box 4. Therefore, the condenser assembly 1, which is easy to adhere to the flux, is designed to be movable and pull-out, and can be pulled out at the same time and cleaned and maintained outside the air duct box 4. After the condenser assembly 1 is pulled out, there is more space to observe and clean the flux in the cooling cavity, and drain it from the drain pipe. After the condenser assembly 1 is cleaned, it can be assembled again, so the operation is simple and convenient. Compared with the existing equipment, it can effectively reduce the labor intensity and improve the maintenance efficiency.

[0037] In some embodiments, a windshield 47 is provided on both sides of the inner bottom of the air duct box 4, and a guide rail 46 is provided on each of the two windshields 47. The purpose of the windshield 47 is to prevent the wind from flowing downward. A support leg is provided at the front and rear ends of the bottom of the windshield 47, and the support leg is fixed to the inner bottom of the air duct box 4. The function of the support leg is to support the windshield 47.

[0038] In some embodiments, Figure 5 As shown, the air duct box 4 includes a groove-shaped bottom shell 41, a front baffle 42, a rear baffle 43 and a return air plate 44. The front baffle 42 is connected to the front end of the groove-shaped bottom shell 41, and the opening is located on the front baffle 42. The rear baffle 43 is connected to the rear end of the groove-shaped bottom shell 41, and the return air plate 44 covers the upper end of the groove-shaped bottom shell 41. In addition, the air duct box 4 also includes two return air plate mounting brackets 45, and the front and rear ends of the return air plate 44 are respectively connected to the front baffle 42 and the rear baffle 43 through the return air plate mounting brackets 45. The groove-shaped bottom shell 41, the front baffle 42, the rear baffle 43 and the return air plate 44 are assembled by screws. The bottom of the air duct box 4 and the middle of the slide plate 12 are respectively provided with air outlets, and a booster hood 5 is provided above the air outlet of the air duct box 4. The booster hood 5 can be riveted in the air duct box 4 by rivets. A motor assembly 6 is provided below the air outlet of the air duct box 4, and the motor assembly 6 can be installed below the lower furnace 3.

[0039] In some embodiments, a push-pull handle 11 is provided at the front end of the condenser assembly 1. For example, a push-pull handle 11 can be provided on both sides of the front end of the condenser assembly 1. The push-pull handle 11 facilitates the staff to push the condenser assembly 1 into or pull out the air duct box 4.

[0040] In some embodiments, the locking member 2 is preferably a compression elbow clamp, wherein four compression elbow clamps may be distributed at the front end of the condenser assembly 1 to improve the connection stability of the condenser assembly 1, and the condenser assembly 1 is clamped by the compression elbow clamp to prevent air leakage.

[0041] An embodiment of the utility model also provides a reflow soldering device, including the quick-release device for cooling under negative pressure reflow soldering provided by any of the above embodiments. The beneficial effects of the reflow soldering device can be referred to the quick-release device for cooling under negative pressure reflow soldering, which will not be repeated here.

[0042] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0043] The above is a detailed introduction to a negative pressure reflow soldering cooling quick-release device and reflow soldering equipment provided by the utility model. This article uses specific examples to illustrate the principle and implementation method of the utility model. The description of the above embodiment is only used to help understand the method of the utility model and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the utility model, the utility model can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the claims of the utility model.

Claims

1. A quick-release device for cooling under negative pressure reflow soldering, characterized in that: include: An air duct box (4), wherein the front end of the air duct box (4) is provided with an opening, and a guide rail (46) is provided inside the air duct box (4); A condenser assembly (1), wherein a slide plate (12) is provided at the bottom of the condenser assembly (1), the slide plate (12) is slidably connected to the guide rail (46), and the condenser assembly (1) is extended into or moved out of the air duct box (4) from the opening via the slide plate (12); A locking member (2) is used to detachably connect the condenser assembly (1) to a lower furnace (3) of a reflow soldering device.

2. The quick-release device for cooling under negative pressure reflow soldering according to claim 1, characterized in that: A wind shield (47) is respectively provided on both sides of the inner bottom of the air duct box (4), and a guide rail (46) is respectively provided on the two wind shields (47).

3. The quick-release device for cooling under negative pressure reflow soldering according to claim 2, characterized in that: The front and rear ends of the bottom of the wind deflector (47) are respectively provided with a supporting leg, and the supporting leg is fixed to the inner bottom of the air duct box (4).

4. The quick-release device for cooling under negative pressure reflow soldering according to claim 3, characterized in that: The air duct box (4) comprises a trough-shaped bottom shell (41), a front baffle (42), a rear baffle (43) and a return air plate (44); the front baffle (42) is connected to the front end of the trough-shaped bottom shell (41); the opening is located on the front baffle (42); the rear baffle (43) is connected to the rear end of the trough-shaped bottom shell (41); and the return air plate (44) covers the upper end of the trough-shaped bottom shell (41).

5. The quick-release device for cooling under negative pressure reflow soldering according to claim 4, characterized in that: The air duct box (4) further comprises two return air plate mounting brackets (45), and the front and rear ends of the return air plate (44) are respectively connected to the front partition plate (42) and the rear partition plate (43) through the return air plate mounting brackets (45).

6. The quick-release device for cooling under negative pressure reflow soldering according to claim 5, characterized in that: The front end of the condenser assembly (1) is provided with a push-pull handle (11).

7. The quick-release device for cooling under negative pressure reflow soldering according to claim 6, characterized in that: The bottom of the air duct box (4) and the middle of the slide plate (12) are respectively provided with air outlets.

8. The quick-release device for cooling under negative pressure reflow soldering according to claim 7, characterized in that: A pressurized air cover (5) is provided above the air outlet of the air duct box (4).

9. The quick-release device for cooling under negative pressure reflow soldering according to claim 1, characterized in that: The locking member (2) is a compression toggle clamp.

10. A reflow soldering device, characterized in that: It comprises the quick-release device for cooling under negative pressure reflow soldering as described in any one of claims 1 to 9.

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