Solar silicon wafer splitting device and solar silicon wafer laser cutting and splitting equipment

Abstract

The utility model discloses a solar silicon wafer splitting device and solar silicon wafer laser cutting and splitting equipment, the solar silicon wafer splitting device comprises a mounting rack, a cutting mechanism, a heating mechanism and a cooling mechanism, the cutting mechanism is used for cutting two ends of a preset splitting line on a silicon wafer; the heating mechanism is located on one side of the cutting mechanism and used for heating the part, between the two ends of a preset split line, of the silicon wafer, the cooling mechanism is located on one side of the heating mechanism and provided with a cooling head, and the cooling head is used for spraying low-temperature fluid to the preset split line, heated by the heating mechanism, of the silicon wafer. According to the technical scheme of the utility model, the solar silicon wafer splitting device can reduce the risks of edge breakage, subfissure and the like of the solar silicon wafer caused by external force.

Description

Technical Field

[0001] The utility model relates to the technical field of solar silicon wafer splitting, in particular to a solar silicon wafer splitting device and solar silicon wafer laser cutting and splitting equipment. Background Art

[0002] The global energy transformation is an inevitable trend. The scale of the photovoltaic market will accelerate and the production capacity will further expand. In the process of producing and processing solar silicon wafers, the solar silicon wafers need to be cut. At present, a laser beam is usually used to produce a groove of a certain depth on the surface of the solar silicon wafer, and then the solar silicon wafer is cracked along the groove under the action of external force to achieve the effect of solar silicon wafer splitting. However, in the process of external force splitting of solar silicon wafers, there are risks such as edge collapse and hidden cracks of solar silicon wafers. Utility Model Content

[0003] The main purpose of the utility model is to provide a solar silicon wafer splitting device, aiming to reduce the risks of edge collapse, hidden cracks, etc. of solar silicon wafers caused by external forces.

[0004] To achieve the above-mentioned purpose, the solar silicon wafer splitting device proposed by the utility model comprises:

[0005] Mounting frame;

[0006] A cutting mechanism, arranged on the mounting frame, and used for cutting two ends of a preset splitting line on the silicon wafer;

[0007] A heating mechanism is provided on the mounting frame and is located on one side of the cutting mechanism, the heating mechanism being used to heat a portion between two ends of a preset splitting line on the silicon wafer; and

[0008] The cooling mechanism is arranged on the mounting frame and is located on one side of the heating mechanism. The cooling mechanism is provided with a cooling head, and the cooling head is used to spray low-temperature fluid onto the preset splitting line on the silicon wafer after being heated by the heating mechanism.

[0009] Optionally, the cutting head of the cutting mechanism, the heating element of the heating mechanism and the cooling head are arranged in sequence along a cutting direction of a splitting line reserved on the silicon wafer.

[0010] Optionally, the solar silicon wafer splitting device also includes a sliding seat and a driving mechanism, the driving mechanism is installed on the mounting frame, the sliding seat is slidably installed on the mounting frame along a first direction and is connected to the driving mechanism, the first direction is parallel to the surface of the silicon wafer and perpendicular to the reserved splitting line on the silicon wafer, the cutting mechanism, the heating mechanism and the cooling mechanism are all installed on the sliding seat.

[0011] Optionally, the sliding seat includes a mounting plate and a fixed frame, the mounting plate is slidably mounted on the mounting frame, the fixed frame is mounted on a side of the mounting plate away from the mounting frame, and is enclosed with the mounting plate to form an installation space that passes through from top to bottom, the heating mechanism and the cooling mechanism are both mounted on the mounting plate and are both located in the installation space, and the cutting mechanism is mounted on a side of the fixed frame away from the mounting plate.

[0012] Optionally, the cutting mechanism includes a cutting head, a first connecting seat and a first locking assembly, the cutting head is mounted on the first connecting seat, the first connecting seat is slidably mounted on the fixed frame along a second direction, the first locking assembly is adjustably connected between the fixed frame and the first connecting seat to lock the fixed frame and the first connecting seat, and the second direction is perpendicular to the silicon wafer.

[0013] Optionally, the heating mechanism includes a heating element, a second connecting seat and a second locking assembly, the heating element is installed on the second connecting seat, the second connecting seat is slidably installed on the sliding seat along the first direction, and the second locking assembly is adjustably connected between the sliding seat and the second connecting seat to lock the sliding seat and the second connecting seat.

[0014] Optionally, the cooling mechanism includes a cooling head, an adjustment seat and a third locking assembly, the cooling head is installed on the adjustment seat, the adjustment seat is slidably installed on the sliding seat along the first direction, and the third locking assembly is adjustably connected between the sliding seat and the adjustment seat to lock the sliding seat and the adjustment seat.

[0015] Optionally, the first locking assembly includes a fixing plate and a first screw, one end of the fixing plate is fixed to the first connecting seat, and the other end is provided with a first strip hole extending along the second direction, the fixing frame is provided with a first screw hole at a position corresponding to the first strip hole, and the first tightening screw is screwed to the first screw hole through the first strip hole.

[0016] Optionally, the cutting mechanism further comprises a screw rod and a first knob component arranged at one end of the screw rod, the screw rod is rotatably mounted on the fixing frame, the first connecting seat is arranged in a second screw hole, and the screw rod is located in the second screw hole.

[0017] Optionally, the second locking assembly includes a connecting block and a second screw, one end of the connecting block is fixed to the second connecting seat, and the other end is provided with a second strip hole extending along the first direction, the sliding seat is provided with a third screw hole at a position corresponding to the second strip hole, and the second screw is screwed to the third screw hole through the second strip hole.

[0018] Optionally, the cooling mechanism also includes a first connecting plate, a first adjusting screw and a first rotating shaft, the cooling head is installed at one end of the first connecting plate, the other end of the first connecting plate is provided with a first axial hole and a first arc-shaped hole located on the periphery of the first axial hole, the adjustment seat is provided with a second axial hole corresponding to the first axial hole, and a sixth screw hole corresponding to the first arc-shaped hole, the arc center of the first arc-shaped hole is located in the sixth screw hole, the first rotating shaft is inserted into the second axial hole through the first axial hole, and the first adjusting screw is screwed to the sixth screw hole through the first arc-shaped hole.

[0019] Optionally, the solar splitting device further comprises a blower mechanism, wherein the blower mechanism is mounted on the mounting frame, and the blower mechanism is used to blow airflow toward a preset splitting line on the silicon wafer.

[0020] The utility model also proposes a solar silicon wafer laser cutting and splitting device, comprising a machine base, a loading device, a unloading device and the solar silicon wafer splitting device as described above, wherein the loading device, the unloading device and the solar silicon wafer splitting device are all arranged on the machine base, and the solar silicon wafer splitting device is located between the loading device and the unloading device, the loading device is used for loading silicon wafers to be cut, and the unloading device is used for unloading silicon wafers split by the solar silicon wafer splitting device.

[0021] The technical solution of the utility model is to set a cutting mechanism, a heating mechanism and a cooling mechanism on the mounting frame, and cut the two ends of the preset splitting line on the silicon wafer by the cutting mechanism, so that the opposite sides of the silicon wafer form a gap, and the heating mechanism is set on one side of the cutting mechanism to heat the part between the two ends of the preset splitting line on the silicon wafer, and the cooling mechanism is set on one side of the heating mechanism, and a cooling head is set, and the cooling head is used to spray a low-temperature fluid on the preset splitting line on the silicon wafer after being heated by the heating mechanism. In this way, the two ends of the preset cutting line of the silicon wafer are first cut by the cutting mechanism, and then the part between the two ends of the preset splitting line on the silicon wafer is heated by the heating component. After the heating is completed, the cooling head sprays a low-temperature fluid on the preset splitting line on the silicon wafer after being heated by the heating mechanism. So that the silicon wafer is split along the cutting direction of the preset splitting line under the action of thermal expansion and contraction, so that the silicon wafer can be split without external force, reducing the risk of edge collapse and hidden cracks of the silicon wafer under the action of external force, which is conducive to improving the production quality of solar silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0023] Figure 1 This is a schematic structural diagram of an embodiment of a solar silicon wafer splitting device of the utility model;

[0024] Figure 2 for Figure 1 A schematic diagram of the structure of the solar silicon wafer splitting device;

[0025] Figure 3 for Figure 1 A schematic diagram of the structure of the solar silicon wafer splitting device;

[0026] Figure 4 for Figure 1 A schematic diagram of the structure of the solar silicon wafer splitting device;

[0027] Figure 5 It is a structural schematic diagram of an embodiment of the solar silicon wafer laser cutting and splitting equipment of the utility model.

[0028] Description of Figure Numbers:

[0029] 10. Mounting frame; 11. Guide rail; 20. Cutting mechanism; 22. First connecting seat; 23. Fixing plate; 231. First strip hole; 24. First knob component; 30. Heating mechanism; 32. Second connecting seat; 321. First connecting member; 322. Second connecting member; 33. Third connecting member; 331. Second arc hole; 33. Second knob component; 34. Connecting block; 40. Cooling mechanism; 41. Cooling head; 42. Adjustment Joint seat; 43, first connecting plate; 431, first shaft hole; 432, first arc hole; 50, sliding seat; 51, mounting plate; 52, fixing frame; 60, driving mechanism; 61, motor; 62, screw rod; 70, blower mechanism; 80, machine base; 81, loading device; 82, unloading device; 83, solar silicon wafer splitting device; 84, alternating transport device; 85, first imaging device; 86, second imaging device; 87, drying device

[0030] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0033] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text is to include three parallel solutions. Taking "A and / or B" as an example, it includes solution A, or solution B, or a solution that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0034] The utility model provides a solar silicon wafer splitting device.

[0035] In the embodiment of the present utility model, Figures 1 to 4 As shown, the solar silicon wafer splitting device 83 includes a mounting frame 10 , a cutting mechanism 20 , a heating mechanism 30 and a cooling mechanism 40 .

[0036] Specifically, the cutting mechanism 20, the heating mechanism 30 and the cooling mechanism 40 are all arranged on the mounting frame 10. The cutting mechanism 20 is used to cut the two ends of the preset splitting line on the silicon wafer. The heating mechanism 30 is located on one side of the cutting mechanism 20, and the heating mechanism 30 is used to heat the portion between the two ends of the preset splitting line on the silicon wafer. The cooling mechanism 40 is located on one side of the heating mechanism 30, and the cooling mechanism 40 is provided with a cooling head 41, and the cooling head 41 is used to spray a low-temperature fluid onto the preset splitting line on the silicon wafer after being heated by the heating mechanism 30.

[0037] Specifically, the cutting mechanism 20 is a laser emitter, which emits laser to cut the two ends of the preset cutting line on the silicon wafer. The two ends of the preset splitting line on the silicon wafer can be cut into grooves of a certain length or cut into notches of a certain length, which can be set according to actual conditions.

[0038] The heating assembly heats the portion between the two ends of the preset splitting line on the silicon wafer, and the cooling head 41 sprays a low-temperature fluid onto the preset splitting line on the silicon wafer heated by the heating mechanism 30 for cooling. The stress of the silicon wafer is changed by thermal expansion and contraction, and the silicon wafer is naturally split along the cutting direction of the preset splitting line under the action of the stress, and the cracked gap is combined with the two ends of the preset cutting line, thereby realizing the segmentation of the silicon wafer.

[0039] Regarding the division of silicon wafers, the solar silicon wafer splitting device 83 can be selectively configured. Specifically, the selective configuration means that the solar silicon wafer splitting device 83 has multiple ways to divide the silicon wafers.

[0040] For example, in some embodiments, the cutting mechanism 20 may first cut one end of a preset splitting line on the silicon wafer, and then heat the portion between the two ends of the preset splitting line on the silicon wafer through the heating mechanism 30. After the heating is completed, the cooling head 41 sprays a low-temperature fluid onto the preset splitting line on the silicon wafer after being heated by the heating mechanism 30. In the process of the cooling head 41 spraying the low-temperature fluid onto the preset splitting line on the silicon wafer, the cutting mechanism 20 cuts the other end of the preset splitting line on the silicon wafer, so that when the silicon wafer is split from one end of the preset splitting line to the other end, the two ends of the preset splitting line are merged, thereby realizing the division of the silicon wafer.

[0041] For another example, in another embodiment, the cutting mechanism 20 first cuts the two ends of a preset splitting line on the silicon wafer, and then heats the portion between the two ends of the preset splitting line on the silicon wafer through the heating mechanism 30. After the heating is completed, the cooling head 41 sprays a low-temperature fluid onto the preset splitting line on the silicon wafer that has been heated by the heating mechanism 30. In this way, when the silicon wafer is split from one end of the preset splitting line to the other end, it can be combined with the two ends of the preset splitting line, thereby realizing the splitting of the silicon wafer.

[0042] It is worth noting that the cutting mechanism 20 can be selectively set, as long as it can cut the two ends of the preset split line on the silicon wafer. For example, the cutting mechanism 20 can be but not limited to: a laser cutter, a blade cutter, etc. Similarly, the heating mechanism 30 can heat the portion between the two ends of the preset split line on the silicon wafer. For example: laser heating.

[0043] Furthermore, the cryogenic fluid sprayed by the cooling head 41 may be a cryogenic liquid or a cryogenic gas. This application does not impose any specific limitation on this and the choice may be made based on actual conditions.

[0044] The technical solution of the utility model is to set a cutting mechanism 20, a heating mechanism 30 and a cooling mechanism 40 on the mounting frame 10, and the cutting mechanism 20 is used to cut the two ends of the preset splitting line on the silicon wafer so that a notch is formed on the opposite sides of the silicon wafer, and the heating mechanism 30 is set on one side of the cutting mechanism 20 to heat the part between the two ends of the preset splitting line on the silicon wafer, and the cooling mechanism 40 is set on one side of the heating mechanism 30, and a cooling head 41 is set, and the cooling head 41 is used to spray a low-temperature fluid on the preset splitting line on the silicon wafer after being heated by the heating mechanism 30. In this way, the two ends of the preset cutting line of the silicon wafer are first cut by the cutting mechanism 20, and then the part between the two ends of the preset splitting line on the silicon wafer is heated by the heating component. After the heating is completed, the cooling head 41 sprays a low-temperature fluid on the preset splitting line on the silicon wafer after being heated by the heating mechanism 30. So that the silicon wafer is split along the cutting direction of the preset splitting line under the action of thermal expansion and contraction, so that the silicon wafer can be split without external force, reducing the risk of edge collapse and hidden cracks of the silicon wafer under the action of external force, which is conducive to improving the production quality of solar silicon wafers.

[0045] Furthermore, the cutting head of the cutting mechanism 20, the heating element of the heating mechanism 30 and the cooling head 41 are arranged in sequence along the cutting direction of the splitting line reserved on the silicon wafer. In this way, when splitting the silicon wafer, it is only necessary to move the silicon wafer from the position of the cutting mechanism 20 toward the cooling mechanism 40. When the silicon wafer moves out of the position of the cooling mechanism 40, the silicon wafer can be split. There is no need to move back and forth between the cutting mechanism 20, the heating mechanism 30 and the cooling mechanism 40, thereby improving the cutting efficiency of the silicon wafer.

[0046] Furthermore, the solar silicon wafer splitting device 83 also includes a sliding seat 50 and a driving mechanism 60. The driving mechanism 60 is installed on the mounting frame 10. The sliding seat 50 is slidably installed on the mounting frame 10 along a first direction and is connected to the driving mechanism 60. The first direction is parallel to the surface of the silicon wafer and perpendicular to the reserved splitting line on the silicon wafer. The cutting mechanism 20, the heating mechanism 30 and the cooling mechanism 40 are all installed on the sliding seat 50.

[0047] Specifically, by driving the sliding seat 50 to slide on the mounting frame 10 through the driving mechanism 60, the positions of the cutting mechanism 20, the heating mechanism 30 and the cooling mechanism 40 can be adjusted at the same time to reduce the driving difficulty of the cutting mechanism 20, the heating mechanism 30 and the cooling mechanism 40. In addition, when the cutting head of the cutting mechanism 20, the heating element of the heating mechanism 30 and the cooling head 41 are not aligned with the preset splitting line on the silicon wafer, the positions of the cutting mechanism 20, the heating mechanism 30 and the cooling mechanism 40 can be adjusted by driving the sliding seat 50 to slide on the mounting frame 10, and the cutting head of the cutting mechanism 20, the heating element of the heating mechanism 30 and the cooling head 41 are aligned with the preset splitting line on the silicon wafer to improve the quality of the silicon wafer after segmentation.

[0048] Of course, in other embodiments, the cutting mechanism 20, the heating mechanism 30 and the cooling mechanism 40 are slidably installed on the mounting frame 10, and a driving member is respectively provided corresponding to the cutting mechanism 20, the heating mechanism 30 and the cooling mechanism 40, and each driving member drives the corresponding mechanism to slide on the mounting frame 10.

[0049] Further, the mounting frame 10 is provided with a guide rail 11, and the sliding seat 50 is provided with a slider, which slides with the guide rail 11. It can be understood that the sliding cooperation between the guide rail 11 and the slider makes the sliding seat 50 more stable when sliding on the mounting frame 10, that is, the sliding stability of the sliding seat 50 is improved.

[0050] Furthermore, the sliding seat 50 includes a mounting plate 51 and a fixing frame 52. The mounting plate 51 is slidably mounted on the mounting frame 10. The fixing frame 52 is mounted on the side of the mounting plate 51 away from the mounting frame 10, and is enclosed with the mounting plate 51 to form an installation space that passes through from top to bottom. The heating mechanism 30 and the cooling mechanism 40 are both mounted on the mounting plate 51 and are both located in the installation space. The cutting mechanism 20 is mounted on the side of the fixing frame 52 away from the mounting plate 51.

[0051] Specifically, the installation space is formed by enclosing the installation plate 51 and the fixing frame 52, and the heating mechanism 30 and the cooling mechanism 40 are installed in the installation space, so that a large sliding seat 50 is not required to install the cutting mechanism 20, the heating mechanism 30 and the cooling mechanism 40, so that the overall structure of the solar silicon wafer splitting device 83 is more compact, and the compactness of the structure of the solar silicon wafer splitting device 83 is improved. The installation space that runs through from top to bottom can facilitate the extension of the heating element of the heating mechanism 30 and the cooling head 41 of the cooling mechanism 40.

[0052] Of course, in other embodiments, the sliding seat 50 only includes the mounting plate 51 , and the cutting mechanism 20 , the heating mechanism 30 and the cooling mechanism 40 are all mounted on a side of the mounting plate 51 away from the mounting frame 10 .

[0053] In some embodiments, the cutting mechanism 20 includes a cutting head, a first connecting seat 22 and a first locking assembly. The cutting head is installed on the first connecting seat 22. The first connecting seat 22 is slidably installed on the fixed frame 52 along the second direction. The first locking assembly is adjustably connected between the fixed frame 52 and the first connecting seat 22 to lock the fixed frame 52 and the first connecting seat 22. The second direction is perpendicular to the silicon wafer.

[0054] Specifically, the second direction is perpendicular to the surface of the silicon wafer, and by driving the first connection seat 22 to slide in the second direction, the cutting mechanism 20 can be moved away from or close to the silicon wafer, that is, by sliding in the second direction, the depth of the groove cut by the cutting mechanism 20 at both ends of the preset splitting line on the silicon wafer can be adjusted. After the adjustment is completed, the position adjusted by the cutting mechanism 20 can be locked by the first locking component, thereby improving the user experience. Of course, in other embodiments, the cutting mechanism 20 component is fixedly installed on the fixing frame 52.

[0055] Furthermore, the first locking assembly includes a fixing plate 23 and a first screw, one end of the fixing plate 23 is fixed to the first connecting seat 22, and the other end is provided with a first strip hole 231 extending along the second direction, and the fixing frame 52 is provided with a first screw hole at a position corresponding to the first strip hole 231, and the first screw is screwed to the first screw hole through the first strip hole 231.

[0056] In this way, when the position of the cutting mechanism 20 needs to be adjusted, it is not necessary to completely screw out the first screw from the first screw hole, but only to screw it until the first connecting seat 22 can slide on the fixing frame 52, thereby reducing the difficulty of adjustment for the user. At the same time, the long hole is also arranged to facilitate fine adjustment of the cutting mechanism 20. Of course, in other embodiments, one end of the fixing plate 23 is fixed to the first connecting seat 22, and the other end is provided with a plurality of first through holes, and the plurality of first through holes are arranged at intervals along the second direction.

[0057] Furthermore, the cutting mechanism 20 also includes a first screw and a first knob component 24 provided at one end of the first screw, the first screw can be rotatably mounted on the fixing frame 52, the first connecting seat 22 is provided with a second screw hole, and the first screw is located in the second screw hole. Specifically, the first knob component 24 can drive the first screw to extend and retract, the fixing frame 52 is provided with a mounting portion, the first screw is rotatably mounted on the mounting portion on the fixing frame 52, and extends out of the second screw hole, and the first screw is driven to rotate by screwing the first knob portion, so as to achieve fine adjustment of the cutting mechanism 20, thereby improving the user experience.

[0058] In some embodiments, the heating mechanism 30 includes a heating element, a second connecting seat 32 and a second locking assembly. The heating element is installed on the second connecting seat 32. The second connecting seat 32 is slidably installed on the sliding seat 50 along the first direction. The second locking assembly is adjustably connected between the sliding seat 50 and the second connecting seat 32 to lock the sliding seat 50 and the second connecting seat 32.

[0059] Specifically, by driving the second connection seat 32 to slide in the first direction, the position of the heating mechanism 30 can be adjusted. When there is a deviation between the heating element of the heating mechanism 30 and the cutting head of the cutting mechanism 20, the position of the heating mechanism 30 can be adjusted separately by sliding the second connection seat 32, so that the heating element of the heating mechanism 30 is aligned with the cutting head of the cutting mechanism 20, so as to improve the quality of the silicon wafer after segmentation. After the adjustment is completed, the adjusted position of the heating mechanism 30 can be locked by the second locking assembly, thereby improving the user experience. Of course, in other embodiments, the heating mechanism 30 assembly is fixedly mounted on the mounting plate 51.

[0060] Furthermore, the second locking assembly includes a connecting block 34 and a second screw, one end of the connecting block 34 is fixed to the second connecting seat 32, and the other end is provided with a second strip hole extending along the first direction, and the sliding seat 50 is provided with a third screw hole at the position corresponding to the second strip hole, and the second screw is screwed to the third screw hole through the second strip hole.

[0061] Specifically, when the position of the heating mechanism 30 needs to be adjusted, it is not necessary to completely screw the second screw out of the second screw hole, but only to screw it until the second connection seat 32 can slide on the fixing frame 52, thereby reducing the difficulty of adjustment for the user. At the same time, the long hole is also convenient for fine-tuning the heating mechanism 30. Of course, in other embodiments, one of the two connection parts is fixed to the second connection seat 32, and the other connection part is provided with a plurality of second via holes, and the plurality of second via holes are arranged at intervals along the second direction.

[0062] Furthermore, the heating mechanism 30 also includes a second screw and a second knob component 33 provided at one end of the screw, the second screw can be rotatably mounted on the sliding seat 50, the second connecting seat 32 is provided with a fifth screw hole, and the second screw is located in the second screw hole. Specifically, the second knob component 33 can drive the second screw to extend and retract, the sliding seat 50 is provided with a second mounting portion, the second screw is rotatably mounted on the second mounting portion on the sliding seat 50, and extends out of the fifth screw hole, and the second screw is driven to rotate by screwing the second knob portion, so as to achieve fine adjustment of the cutting mechanism 20, thereby improving the user experience.

[0063] Furthermore, the second connecting seat 32 includes a first connecting member 321 and a second connecting member 322, the first connecting member 321 is slidably installed on the sliding seat 50 along the first direction, the first connecting member 321 is slidably installed on the side of the first connecting member 321 away from the sliding seat 50 along the second direction, the cooling mechanism 40 is installed on the side of the second connecting member 322 away from the first connecting member 321, and the cooling mechanism 40 also includes a third locking assembly, which is adjustably connected between the first connecting member 321 and the second connecting member 322 to lock the first connecting member 321 and the second connecting member 322.

[0064] Specifically, by driving the second connecting member 322 to slide in the second direction, the heating mechanism 30 can be moved away from or close to the silicon wafer, that is, by sliding in the second direction, the heating temperature of the preset splitting line on the silicon wafer by the heating mechanism 30 can be adjusted to prevent the heating temperature from being too high or too low. After the adjustment is completed, the adjusted position of the heating mechanism 30 can be locked by the third locking assembly, thereby improving the user experience. Of course, in other embodiments, the heating mechanism 30 is fixedly mounted on the second connecting member 322.

[0065] Furthermore, the heating mechanism 30 also includes a third connecting member 33, a second adjusting screw and a second rotating shaft. The third connecting member 33 is provided with a connecting portion on one side parallel to the first direction, and the connecting portion is provided with a third axial hole and a second arc hole 331 located on the outer periphery of the third axial hole. The side wall of the second connecting member 322 is provided with a seventh screw hole corresponding to the second arc hole 331, and a fourth axial hole corresponding to the third axial hole. The arc center of the second arc hole 331 is located in the seventh screw hole, the second adjusting screw is screwed to the seventh screw hole through the second arc hole 331, and the second rotating shaft is inserted into the fourth axial hole through the third axial hole.

[0066] Specifically, the third axial hole is the rotation origin of the third connecting member 33. By driving the third connecting member 33 to rotate along the extension direction of the second arc-shaped hole 331, the angle of the heating member of the heating mechanism 30 can be adjusted. After the heating mechanism 30 is installed on the third connecting member 33, it is convenient to adjust the angle of the heating mechanism 30 to meet the requirements of splitting silicon wafers. After the adjustment is completed, the position can also be fixed by screwing the second adjustment screw, thereby improving the user experience. Of course, in other embodiments, the heating mechanism 30 is fixedly installed on the third connecting member 33.

[0067] In some embodiments, the cooling mechanism 40 includes a cooling head 41, an adjustment seat 42 and a fourth locking assembly, the cooling head 41 is installed on the adjustment seat 42, the adjustment seat 42 is slidably installed on the sliding seat 50 along the first direction, and the third locking assembly is adjustably connected between the sliding seat 50 and the adjustment seat 42 to lock the sliding seat 50 and the adjustment seat 42.

[0068] Specifically, by driving the adjustment seat 42 to slide in the first direction, the position of the cooling mechanism 40 can be adjusted. When there is a deviation between the heating element of the heating mechanism 30 and the cooling head 41 of the cooling mechanism 40, the position of the cooling mechanism 40 can be adjusted separately by sliding the adjustment seat 42 so that the cooling head 41 is aligned with the cutting head of the cutting mechanism 20 to improve the quality of the silicon wafer after segmentation. After the adjustment is completed, the adjusted position of the cooling mechanism 40 can be locked by the third locking assembly to prevent displacement, thereby improving the user experience. Of course, in other embodiments, the cooling mechanism 40 assembly is fixedly mounted on the adjustment seat 42.

[0069] Optionally, the cooling mechanism 40 also includes a first connecting plate 43, a first adjusting screw and a first rotating shaft. The cooling head 41 is installed at one end of the first connecting plate 43. The other end of the first connecting plate 43 is provided with a first axial hole 431 and a first arc-shaped hole 432 located on the periphery of the first axial hole. The adjustment seat 42 is provided with a second axial hole corresponding to the first axial hole 431 and a sixth screw hole corresponding to the first arc-shaped hole 432. The arc center of the first arc-shaped hole 432 is located in the sixth screw hole. The first adjusting screw is screwed to the sixth screw hole through the first axial hole 431, and the first rotating shaft is inserted into the second axial hole through the first axial hole.

[0070] Specifically, the first axial hole is the rotation origin of the first connecting plate 43. By driving the first connecting plate 43 to rotate along the extension direction of the first arc-shaped hole 432, the angle of the cooling head 41 can be adjusted. After the cooling mechanism 40 is installed on the first connecting plate 43, it is convenient to adjust the angle of the cooling head 41 to meet the requirements of splitting silicon wafers. After the adjustment is completed, the position can also be fixed by screwing the first adjustment screw, thereby improving the user experience. Of course, in other embodiments, the cooling mechanism 40 is fixedly installed on the first connecting plate 43.

[0071] Optionally, the solar wafer splitting device further includes a blower mechanism 70, which is mounted on the mounting frame 10 and is used to blow air toward a preset splitting line on the silicon wafer. Specifically, during the silicon wafer cutting process of the cutting mechanism 20, debris will be generated, and the blower mechanism 70 blowing air toward the preset splitting line can blow the debris away from the silicon wafer surface to prevent the debris from adhering to the silicon wafer surface. Of course, in other embodiments, the solar wafer laser cutting and splitting device may not be provided with a blower mechanism 70.

[0072] The utility model also provides a solar silicon wafer laser cutting and splitting device, such as Figure 5 As shown, the solar silicon wafer laser cutting and splitting device includes a machine base 80, a loading device 81, a unloading device 82 and a solar silicon wafer splitting device 83. The specific structure of the solar silicon wafer splitting device 83 refers to the above embodiment. Since the present solar silicon wafer laser cutting and splitting device adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here. Among them, the loading device 81, the unloading device 82 and the solar silicon wafer splitting device 83 are all arranged on the machine base 80, and the solar silicon wafer splitting device 83 is located between the loading device 81 and the unloading device 82. The loading device 81 is used for loading the silicon wafers to be cut, and the unloading device 82 is used for unloading the silicon wafers split by the solar silicon wafer splitting device 83.

[0073] Specifically, the loading device 81 can load the split silicon wafers, and the unloading device 82 can unload the silicon wafers split by the solar silicon wafer splitting device 83, thereby realizing automatic loading, splitting and unloading of silicon wafers.

[0074] It is worth noting that in this embodiment, the production method of first cutting the solar silicon wafer and then performing other subsequent processing can improve the solar energy conversion rate of the solar silicon wafer compared to the method of first processing the solar silicon wafer and then cutting it in the prior art.

[0075] The solar silicon wafer equipment further includes a drying device 87, which is arranged on the machine base 80 and is located between the splitting device and the unloading device 82. Specifically, the drying device 87 is used to dry the silicon wafers split by the splitting device, so as to realize the automation of automatic loading, splitting, drying and unloading of silicon wafers, thereby improving the production efficiency of solar silicon wafers.

[0076] The solar silicon wafer laser cutting and splitting equipment also includes an alternating transport device 84, which is arranged between the loading device 81 and the drying device 87. The alternating transport device 84 is used to alternately transport silicon wafers between the loading device 81 and the drying device 87, and the splitting device is located on the transport path of the alternating transport device 84. Specifically, during the production process, the alternating transport device 84 removes the silicon wafers from the loading device 81, and the silicon wafers are transported by the alternating transport device 84. During the transportation process, the splitting device cuts the silicon wafers on the alternating transport device 84, and the alternating transport device 84 transports the cut silicon wafers to the drying device 87, and the drying device 87 dries the cut silicon wafers. After the silicon wafers are dried, the unloading device 82 unloads the split silicon wafers.

[0077] In some embodiments, the solar silicon wafer laser cutting and splitting device further comprises a first imaging device 85, which is disposed on the machine base 80 and is located between the loading device 81 and the transport device. Specifically, the first imaging device 85 is used to obtain an image of the silicon wafer to be split, and detect whether the silicon wafer to be split is damaged, so as to improve the production quality of the silicon wafer. Of course, in other embodiments, the solar silicon wafer laser cutting and splitting device may not be provided with the first imaging device 85.

[0078] Furthermore, the solar silicon wafer laser cutting and splitting device further includes a second imaging device 86, which is disposed on the machine base 80 and located between the splitting device and the drying device 87. Specifically, the second imaging device 86 is used to obtain images of the split silicon wafers and detect whether the split silicon wafers are damaged, so as to further improve the production quality of the silicon wafers.

[0079] The above are only preferred embodiments of the present invention, and do not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A solar silicon wafer splitting device, characterized in that: include: Mounting frame; A cutting mechanism, arranged on the mounting frame, and used for cutting two ends of a preset splitting line on the silicon wafer; A heating mechanism is provided on the mounting frame and is located on one side of the cutting mechanism, and is used to heat a portion between two ends of a preset splitting line on the silicon wafer; as well as The cooling mechanism is arranged on the mounting frame and is located on one side of the heating mechanism. The cooling mechanism is provided with a cooling head, and the cooling head is used to spray low-temperature fluid onto the preset splitting line on the silicon wafer after being heated by the heating mechanism.

2. The solar silicon wafer splitting device according to claim 1, characterized in that: The cutting head of the cutting mechanism, the heating element of the heating mechanism and the cooling head are arranged in sequence along the cutting direction of the splitting line reserved on the silicon wafer.

3. The solar silicon wafer splitting device according to claim 1, characterized in that: The solar silicon wafer splitting device also includes a sliding seat and a driving mechanism, wherein the driving mechanism is mounted on the mounting frame, and the sliding seat is slidably mounted on the mounting frame along a first direction and is connected to the driving mechanism, wherein the first direction is parallel to the surface of the silicon wafer and perpendicular to a reserved splitting line on the silicon wafer, and the cutting mechanism, the heating mechanism and the cooling mechanism are all mounted on the sliding seat.

4. The solar silicon wafer splitting device according to claim 3, characterized in that: The sliding seat includes a mounting plate and a fixing frame, the mounting plate is slidably mounted on the mounting frame, the fixing frame is mounted on a side of the mounting plate away from the mounting frame, and is enclosed with the mounting plate to form an installation space that passes through from top to bottom, the heating mechanism and the cooling mechanism are both mounted on the mounting plate and are both located in the installation space, and the cutting mechanism is mounted on a side of the fixing frame away from the mounting plate.

5. The solar silicon wafer splitting device according to claim 4, characterized in that: The cutting mechanism includes a cutting head, a first connecting seat and a first locking assembly, wherein the cutting head is mounted on the first connecting seat, and the first connecting seat is slidably mounted on the fixing frame along a second direction, and the first locking assembly is adjustably connected between the fixing frame and the first connecting seat to lock the fixing frame and the first connecting seat, and the second direction is perpendicular to the silicon wafer.

6. The solar silicon wafer splitting device according to claim 5, characterized in that: The heating mechanism comprises a heating element, a second connecting seat and a second locking assembly, wherein the heating element is mounted on the second connecting seat, the second connecting seat is slidably mounted on the sliding seat along the first direction, and the second locking assembly is adjustably connected between the sliding seat and the second connecting seat to lock the sliding seat and the second connecting seat; and / or The cooling mechanism includes a cooling head, an adjustment seat and a third locking assembly. The cooling head is installed on the adjustment seat. The adjustment seat is slidably installed on the sliding seat along the first direction. The third locking assembly is adjustably connected between the sliding seat and the adjustment seat to lock the sliding seat and the adjustment seat.

7. The solar silicon wafer splitting device according to claim 6, characterized in that: The first locking assembly includes a fixing plate and a first screw, one end of the fixing plate is fixed to the first connecting seat, and the other end is provided with a first strip hole extending along the second direction, the fixing frame is provided with a first screw hole at a position corresponding to the first strip hole, and the first screw is screwed to the first screw hole through the first strip hole; The cutting mechanism also includes a screw rod and a first knob component arranged at one end of the screw rod, the screw rod can be rotatably mounted on the fixing frame, the first connecting seat is arranged in a second screw hole, and the screw rod is located in the second screw hole.

8. The solar silicon wafer splitting device according to claim 6, characterized in that: The second locking assembly includes a connecting block and a second screw, one end of the connecting block is fixed to the second connecting seat, and the other end is provided with a second strip hole extending along the first direction, the sliding seat is provided with a third screw hole at a position corresponding to the second strip hole, and the second screw is screwed to the third screw hole through the second strip hole; The cooling mechanism also includes a first connecting plate, a first adjusting screw and a first rotating shaft. The cooling head is installed at one end of the first connecting plate. The other end of the first connecting plate is provided with a first axial hole and a first arc-shaped hole located on the outer periphery of the first axial hole. The adjustment seat is provided with a second axial hole corresponding to the first axial hole and a sixth screw hole corresponding to the first arc-shaped hole. The arc center of the first arc-shaped hole is located in the sixth screw hole. The first rotating shaft is inserted into the second axial hole through the first axial hole. The first adjusting screw is screwed to the sixth screw hole through the first arc-shaped hole.

9. The solar silicon wafer splitting device according to claim 1, characterized in that: The solar silicon wafer splitting device further comprises an air blowing mechanism, which is mounted on the mounting frame and is used for blowing airflow toward a preset splitting line on the silicon wafer.

10. A solar silicon wafer laser cutting and splitting device, characterized in that: The solar silicon wafer laser cutting and splitting equipment includes a machine base, a loading device, a unloading device and a solar silicon wafer splitting device as claimed in any one of claims 1 to 9, wherein the loading device, the unloading device and the solar silicon wafer splitting device are all arranged on the machine base, and the solar silicon wafer splitting device is located between the loading device and the unloading device, the loading device is used for loading silicon wafers to be cut, and the unloading device is used for unloading silicon wafers split by the solar silicon wafer splitting device.

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