Special evaporation clamp suitable for semiconductor process production

Abstract

The utility model relates to a special evaporation clamp suitable for semiconductor process production, which comprises a horizontally arranged bushing ring, a cover plate is matched above the bushing ring, the bushing ring comprises a chassis, an evaporation cavity is arranged on the chassis, the evaporation cavity vertically penetrates through the chassis, an interphase area is further arranged on the chassis, the interphase area is an annular notch, and the annular notch is communicated with the cover plate. The chips to be evaporated are placed on the base plate, and the chips in the interphase areas do not make contact with the base plate; the cover plate can be placed on the base plate, and when the cover plate and the base plate are matched to clamp the chip between the cover plate and the base plate, an accommodating cavity is formed between the chip and the cover plate and does not make direct contact with the chip; the beneficial effects of the utility model are that the contact area between the chip and the cover plate and the contact area between the chip and the bushing ring are reduced, damage and scratches caused by friction are reduced, the process efficiency and the yield are improved, and the cost is saved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor device processing, and in particular relates to a special evaporation fixture suitable for semiconductor process production. Background Art

[0002] Evaporation coating is a technology that heats the material to evaporate it and then deposits it on the surface of the substrate to form a thin film. The process of evaporation followed by deposition can obtain high-purity materials and high-quality films. It is currently widely used in the semiconductor industry, optical instruments, aerospace and other fields. In the prior art, a multifunctional fixture for target metallization evaporation coating is disclosed, and the document number is: CN201990720U. The solution adjusts the distance between the clamping strips by tightening the screws, so that the fixture can meet the requirements of target metallization coating of different sizes and shapes within the applicable maximum size range. The operation is simple and generally applicable.

[0003] The above scheme can be applied to targets of different sizes and shapes, but after the coating comes into contact, the coating deposited on the surface of the target will cause large-area adhesion between the target and the clamping strip, affecting the demolding of the target. Forced demolding will damage or even break both the target and the coating, which will affect the processing efficiency. Utility Model Content

[0004] The utility model aims to provide a special evaporation fixture which can clamp a chip without contacting the chip over a large area and has high processing efficiency and is suitable for semiconductor process production.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a special evaporation fixture suitable for semiconductor process production, including a horizontally placed liner ring, a cover plate is matched on the top of the liner ring, the liner ring includes a chassis, an evaporation chamber is provided on the chassis, the evaporation chamber vertically penetrates the chassis, and an interlaced area is also provided on the chassis, the interlaced area is a ring-shaped notch, the chip to be evaporated is placed on the chassis, the chip in the interlaced area will not contact the chassis, the cover plate can be placed on the chassis, and when the cover plate and the chassis cooperate to clamp the chip, there is a accommodating cavity between the chip and the cover plate.

[0006] Furthermore, the interlaced area divides the chassis into two parts: a special-shaped step and a platform. The special-shaped step is connected to the platform, and the cover plate can contact the platform.

[0007] Furthermore, the cover plate includes a cover plate, and a protrusion is provided on the outer side of the cover plate. The upper end of the protrusion is fixed to the cover plate, and the lower end extends vertically downward and can contact the platform.

[0008] Furthermore, a T-shaped handle is connected to the upper surface of the gland plate, and the lower end of the T-shaped handle is fixedly connected to the gland plate.

[0009] Furthermore, a protrusion is provided on the platform, the lower end of the protrusion is fixed to the platform, and the upper end of the protrusion extends vertically upward.

[0010] Furthermore, the upper end of the protrusion is connected to an epitaxial ring, and the outer diameter of the epitaxial ring is greater than the outer diameter of the platform.

[0011] Compared with the prior art, the utility model has the following beneficial effects: by providing the raised portion, a receiving cavity is formed inside the cover plate, and a receiving cavity is provided between the chip and the cover plate, thereby avoiding direct contact between the chip and the cover plate, facilitating the disassembly and separation of the cover plate and the chip, and avoiding adhesion and breakage between the cover plate and the chip; by providing the protruding portion, the liner ring can be in a stable state when the liner ring rotates with the planetary disk, and it is not easy to shake; by providing the special-shaped step, the contact area between the chip and the liner ring is reduced, that is, the friction damage to the chip is reduced, and at the same time, the table surface at the edge of the chip is avoided from being evaporated and coated, and no photolithography process is required;

[0012] The utility model reduces the contact areas between the chip and the cover plate and the liner ring, reduces the damage and scratches caused by friction, improves the process efficiency and yield rate, and saves costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the overall main cross-sectional structure of the utility model;

[0014] Figure 2 This is a schematic diagram of the main cross-sectional structure of the liner ring of the utility model;

[0015] Figure 3 It is a schematic diagram of the top view of the liner ring of the utility model;

[0016] Figure 4 It is a schematic diagram of the main cross-sectional structure of the cover plate of the utility model;

[0017] Figure 5 It is a bottom view structural diagram of the cover plate of the utility model;

[0018] Figure 6 It is a structural schematic diagram of a liner ring of another embodiment of the utility model;

[0019] Among them, 1-lining ring, 2-cover plate, 3-bottom plate, 4-evaporation chamber, 5-interphase area, 6-special-shaped step, 7-platform, 8-protrusion, 9-extension ring, 10-pressure cover plate, 11-raised part, 12-accommodating chamber, 13-T-shaped handle, 14-hoop. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the utility model, and are not used to limit the utility model. Obviously, the described embodiments are only a part of the embodiments of the utility model, rather than all of the embodiments. The components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various configurations. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the utility model. In the embodiment, the components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but only represents the selected embodiments of the present application.

[0021] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be an electrical connection; it can be a hydraulic oil circuit connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0022] See also Figure 1 As shown, a special evaporation fixture suitable for semiconductor process production includes a horizontally placed liner ring 1, and a cover plate 2 is matched on the top of the liner ring 1. The chip to be evaporated and coated can be placed between the liner ring 1 and the cover plate 2, and a part of the cover plate 2 will fit into the liner ring 1. The liner ring 1 and the cover plate 2 can form a clamp for the chip, and then the liner ring 1 is placed in the hole of a planetary disk. The planetary disk is provided with an evaporation source material, and the evaporation source material can be heated, so that the evaporation source material molecules that obtain energy and escape are deposited on the surface of the chip through the liner ring 1, thereby realizing the evaporation coating of the chip.

[0023] See also Figures 2 to 3 As shown, the material used for the above-mentioned liner ring 1 is stainless steel. Stainless steel has great strength, is not easy to deform, and is also resistant to high-temperature heating. The liner ring 1 includes a horizontally arranged chassis 3, and an evaporation chamber 4 is arranged in the chassis 3. The evaporation chamber 4 vertically penetrates the chassis 3, so that the chassis 3 is in a circular ring shape. The upper and lower ends of the evaporation chamber 4 are both open. The chip to be evaporated can be placed above the evaporation chamber 4, and the edge of the chip can be placed on the platform 7; when the chip needs to be evaporated and coated, the evaporation source material molecules can escape through the evaporation chamber 4 and be evenly deposited on the surface of the chip.

[0024] In the process of high-power rectifier chips, the cathode of the chip is required to be coated, and the table does not need to be coated. Generally, the metal film on the table is removed by photolithography after the evaporation coating is completed. In this scheme, the chassis 3 can block the table at the edge of the chip to prevent the formation of coating on this part, but the contact area between the chassis 3 and the chip is large, which is easy to cause large-area friction and damage to the chip, affecting the yield rate. Therefore, an interphase area 5 is set on the chassis 3. The interphase area 5 is an annular notch. The interphase area 5 divides the chassis 3 into two parts: a special-shaped step 6 and a platform 7. The special-shaped step 6 is connected to the platform 7, and the special-shaped step 6 is located on the side close to the evaporation chamber 4, and the platform 7 is located on the side away from the evaporation chamber 4. The chip above the interphase area 5 will not contact the chassis 3, reducing the contact area between the chip and the liner ring 1, thereby reducing the friction, damage, and even scratches caused by the contact between the chip and the liner ring 1. At the same time, it ensures that the table at the edge of the chip will not form a coating, thereby improving the yield rate and process efficiency of the chip, reducing one photolithography process, and saving costs.

[0025] A protrusion 8 is arranged on the platform 7. The protrusion 8 can be arranged as a cylindrical fence or as a plurality of vertical support rods. The vertical support rods are distributed in an array along the circumferential direction on the chassis 3. The lower end of the protrusion 8 is fixed to the platform 7, and the upper end extends vertically upward and is connected with an extension ring 9. The outer diameter of the extension ring is larger than the outer diameter of the platform, so that the extension ring 9 is arranged on the outside of the protrusion 8. The arrangement of the protrusion 8 and the extension ring 9 can facilitate the placement of the liner ring 1 in the hole of the planetary disk, wherein the protrusion 8 can contact the hole of the planetary disk, and the extension ring 9 is arranged above the planetary disk, so as to position the liner ring 1 so that the liner ring 1 will not shake easily during the rotation of the planetary disk.

[0026] See also Figures 4 to 5 As shown, the cover plate 2 is arranged above the liner ring 1, and the cover plate 2 includes a pressure cover disk 10. A protrusion 11 is provided on the outer side of the pressure cover disk 10. The protrusion 11 has the same structure as the protrusion 8. The upper end of the protrusion 11 is connected to the pressure cover disk 10, and the lower end extends vertically toward the liner ring 1. The space formed between the protrusion 11 and the pressure cover disk 10 is a receiving cavity 12; when the chip is not set on the platform 7, the cover plate 2 is directly placed in the liner ring 1, and the lower end of the protrusion 11 can contact the platform 7. When the chip is set above the platform 7, the cover plate is placed above the chip. At this time, the lower end of the protrusion 11 is pressed on the edge of the chip, and there is a receiving cavity 12 between the chip and the pressure cover disk 10. The receiving cavity 12 avoids the pressure cover disk 10 from directly contacting the chip, resulting in the problem of adhesion between the pressure cover disk 10 and the chip and difficulty in disassembly. At the same time, it also avoids the friction caused by the contact between the pressure cover disk 10 and the chip, which damages the chip surface.

[0027] In order to facilitate the separation of the cover plate 2 from the chip, a T-shaped handle 13 is connected to the upper surface of the pressure cover plate 10, and the lower end of the T-shaped handle 13 is fixedly connected to the pressure cover plate 10. The setting of the T-shaped handle 13 facilitates the separation of the cover plate 2 from the chip and facilitates the disassembly between the cover plate 2 and the liner ring 1 during the process.

[0028] When the cover plate 2 and the liner ring 1 cooperate to clamp the chip therebetween, that is, the platform 7 on the chassis 3 and the raised portion 11 cooperate to clamp the chip, the raised portion 11 is always located in the area surrounded by the protrusion 8. When clamping the chip, the cover plate 2 is placed above the chip so that the raised portion 11 is pressed against the edge of the chip. At this time, the cover plate 2 and the liner ring 1 cooperate with each other to achieve clamping of the chip.

[0029] See also Figure 6 As shown, another embodiment of the utility model: in the above scheme, the shielding area formed by the special-shaped step 6 on the table surface at the edge of the chip is fixed, and the shielding area of ​​the chip cannot be changed according to demand, so the special-shaped step 6 and the platform 7 can be set to be movably connected, specifically: the special-shaped step 6 is formed by a combination of a plurality of hoops 14 with different diameters, and the plurality of hoops 14 are adjacent to each other and are mutually nested. The more the number of hoops 14 is, the smaller the area of ​​the evaporation chamber 4 is, so that the contact area between the chip and the special-shaped step 6 can be made as small as possible, reducing friction and damage;

[0030] The connection between two adjacent hoops 14 is detachable, and the hoop 14 with the largest diameter is also detachable to the platform 7. The hoops 14 can be installed or removed to increase or decrease the shielding area of ​​the chip, thereby adjusting the area of ​​the evaporation chamber 4, and further achieving control of the size of the coating area on the chip.

[0031] Threads are engraved on the inner wall and the outer wall of the hoop 14, so that two adjacent hoop 14 can be screwed together by threads. At the same time, threads are also engraved on the inner wall of the evaporation chamber 4, so that the hoop 14 with the largest diameter is screwed together with the evaporation chamber 4. When it is necessary to increase the coating area, the hoop 14 can be disassembled one by one according to the diameter from small to large. When it is necessary to reduce the coating area, the hoop 14 can be screwed together one by one according to the diameter from large to small.

[0032] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A special evaporation fixture suitable for semiconductor process production, comprising a horizontally placed backing ring, with a cover plate on the top of the backing ring, characterized in that: The liner ring includes a chassis, an evaporation chamber is provided on the chassis, and the evaporation chamber vertically penetrates the chassis. The chassis is also provided with an interlaced area, and the interlaced area is a circular notch. The chip to be evaporated is placed on the chassis, and the chip in the interlaced area does not contact the chassis; The cover plate can be placed on the bottom plate. When the cover plate and the bottom plate cooperate to clamp the chip, a containing cavity exists between the chip and the cover plate.

2. The evaporation fixture for semiconductor process production according to claim 1, characterized in that: The interlaced area divides the chassis into two parts: a special-shaped step and a platform. The special-shaped step is connected to the platform, and the cover plate can contact the platform.

3. The evaporation fixture for semiconductor process production according to claim 2, characterized in that: The cover plate comprises a cover pressing plate, and a protrusion is arranged on the outer side of the cover pressing plate. The upper end of the protrusion is fixed to the cover pressing plate, and the lower end of the protrusion extends vertically downward and can contact the platform.

4. The evaporation fixture for semiconductor process production according to claim 3, characterized in that: The upper surface of the capping plate is connected with a T-shaped handle, and the lower end of the T-shaped handle is fixedly connected to the capping plate.

5. The evaporation fixture for semiconductor process production according to claim 3, characterized in that: The platform is provided with a protrusion, the lower end of the protrusion is fixed to the platform, and the upper end of the protrusion extends vertically upward.

6. The evaporation fixture for semiconductor process production according to claim 5, characterized in that: The upper end of the protrusion is connected with an epitaxial ring, and the outer diameter of the epitaxial ring is greater than the outer diameter of the platform.

Images