Efficient semiconductor refrigeration device and refrigeration mirror cabinet

Abstract

The utility model discloses an efficient semiconductor refrigeration device and a refrigeration mirror cabinet, the semiconductor refrigeration device comprises a semiconductor refrigeration sheet, a heat pipe and a refrigerant box with a refrigerant cavity, the heat pipe comprises an input pipe and an output pipe, and the heat pipe body is connected between the input pipe and the output pipe; the upper surface of the semiconductor chilling plate is configured as a heating surface, and the lower surface of the semiconductor chilling plate is configured as a refrigerating surface; the refrigerant box is horizontally arranged on the heating surface of the semiconductor chilling plate; the heat pipe is located above the refrigerant box, and an input pipe and an output pipe of the heat pipe penetrate through the upper surface of the refrigerant box to be connected with the refrigerant cavity. The input pipe of the heat pipe obliquely extends upwards or vertically extends upwards from the upper surface of the refrigerant box. The input pipe is arranged to obliquely and upwards extend from the upper surface of the refrigerant box or vertically and upwards extend from the upper surface of the refrigerant box, so that refrigerant media can enter the heat pipe more smoothly, the heat dissipation efficiency of the heat pipe is improved, and the semiconductor refrigeration device has efficient refrigeration performance.

Description

Technical Field

[0001] The utility model relates to the technical field of refrigeration, and in particular designs a high-efficiency semiconductor refrigeration device and a refrigeration mirror cabinet. Background Art

[0002] Chinese patent CN2021224621540 discloses a high-efficiency semiconductor refrigeration device, such as Figure 1 As shown, it includes: at least two semiconductor cooling sheets 91 arranged side by side, and the two opposite sides of each semiconductor cooling sheet 91 are respectively a hot end face and a cold end face; a refrigerant box 92 arranged in contact with the hot end face of each semiconductor cooling sheet 91, and the refrigerant box 92 includes a medium cavity storing a refrigerant; at least two heat conducting pipes 93 arranged separately from each other, and the two ends 931 and 932 of each heat conducting pipe 93 are respectively connected to the medium cavity. In the above technical scheme, the semiconductor cooling sheet 91 and the refrigerant box 92 are both arranged vertically on the side of the product to be refrigerated, and the input end 931 and the output end 932 of the heat conducting pipe 93 are both arranged horizontally. After the refrigerant mixed with gas and liquid in the medium cavity enters the heat conducting pipe 93 from the input end 931 under pressure, it is easy to be blocked at the elbow between the input end 931 and the vertical upward part of the heat conducting pipe 93, resulting in unsmooth flow, so that the heat on the hot end face of the semiconductor cooling sheet 91 cannot be quickly dissipated through the refrigerant, thereby affecting the refrigeration performance of the semiconductor refrigeration device. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art, and provides a high-efficiency semiconductor refrigeration device with simple structure and good refrigeration performance, and a refrigeration mirror cabinet using the high-efficiency semiconductor refrigeration device.

[0004] The utility model provides a high-efficiency semiconductor refrigeration device, comprising a semiconductor refrigeration sheet, a heat pipe and a refrigerant box with a refrigerant cavity, wherein the heat pipe comprises an input pipe and an output pipe connected to a heat pipe body between the input pipe and the output pipe; the semiconductor refrigeration sheet is arranged horizontally, and its upper surface is configured as a heating surface, and its lower surface is configured as a cooling surface; the refrigerant box is arranged horizontally on the heating surface of the semiconductor refrigeration sheet; the heat pipe is located above the refrigerant box, and the input pipe and the output pipe of the heat pipe are both connected to the refrigerant cavity through the upper surface of the refrigerant box; wherein the input pipe of the heat pipe is arranged to extend upward obliquely or vertically from the upper surface of the refrigerant box.

[0005] In some preferred embodiments, the output pipe is arranged to extend obliquely downward or vertically downward from the lower end of the heat pipe body toward the refrigerant box.

[0006] In some preferred embodiments, the lower end of the input tube is located at the upper layer of the refrigerant cavity, and the lower end of the output tube is located at the bottom layer of the refrigerant cavity.

[0007] In some preferred embodiments, a first flow guide pipe is provided between the input pipe and the heat pipe body, and the first flow guide pipe is extended upward from the upper end of the input pipe toward the heat pipe body with an arc bending transition structure.

[0008] In some preferred embodiments, a second flow guide pipe is provided between the output pipe and the heat pipe body, and the second flow guide pipe extends downward from the heat pipe body toward the upper end of the output pipe with an arc bending transition structure.

[0009] In some preferred embodiments, the heat pipe body includes one or more sub-heat pipes arranged at intervals, and each sub-heat pipe is bent and extended to form a heat dissipation network.

[0010] The utility model also discloses a refrigeration mirror cabinet, comprising a cabinet body with a refrigeration cavity, a cabinet door with a mirror surface is arranged on the opening side of the cabinet body, and the cabinet body is provided with the high-efficiency semiconductor refrigeration device.

[0011] In some preferred embodiments, the high-efficiency semiconductor refrigeration device is arranged above the refrigeration chamber.

[0012] In some preferred embodiments, a support platform is provided at the upper end of the back side of the cabinet, the semiconductor refrigeration plate is pressed and fixed on the support platform by a refrigerant box, and the heat pipe is exposed and fixed above the support platform.

[0013] Compared with the prior art, the utility model has the following beneficial effects:

[0014] By arranging the semiconductor refrigeration sheet and the refrigerant box in a flat manner, a prerequisite is provided for changing the direction of the input pipe of the heat pipe; by arranging the input pipe to extend obliquely upward or vertically upward from the upper surface of the refrigerant box, the refrigerant in the refrigerant box moves vertically upward or obliquely upward along the input pipe under the action of pressure, and is less likely to be blocked, allowing the refrigerant to enter the heat pipe more smoothly, which is beneficial to improving the heat dissipation efficiency of the heat pipe and thus allowing the semiconductor refrigeration device to have efficient refrigeration performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of a high-efficiency semiconductor refrigeration device in the prior art.

[0016] Figure 2 It is a schematic diagram of the decomposed structure of the high-efficiency semiconductor refrigeration device of the present application.

[0017] Figure 3 It is a three-dimensional structural schematic diagram of the high-efficiency semiconductor refrigeration device of the present application.

[0018] Figure 4 It is a schematic diagram of the three-dimensional structure of the refrigeration mirror cabinet when the back side is displayed.

[0019] Figure 5 It is a three-dimensional structural diagram of a refrigeration mirror cabinet. DETAILED DESCRIPTION

[0020] In order to further explain the technical means and effects adopted by the present application to achieve the predetermined purpose, the specific implementation methods, structures, features and effects of the present application are described in detail below in conjunction with the accompanying drawings and preferred embodiments. In the following description, different "one embodiment" or "embodiment" does not necessarily refer to the same embodiment. In addition, specific features, structures, or characteristics in one or more embodiments may be combined in any suitable form.

[0021] like Figure 2 and Figure 3 As shown, the utility model discloses a high-efficiency semiconductor refrigeration device, including a semiconductor refrigeration sheet 1, a heat pipe 3 and a refrigerant box 2 with a refrigerant cavity, the heat pipe 3 includes an input pipe 31, an output pipe 33, a heat pipe body 32 connected between the input pipe 313 and the output pipe 33, the input pipe 31 and the output pipe 33 are both connected to the refrigerant cavity, the refrigerant medium in the refrigerant cavity enters the heat pipe from the input pipe 31, flows through the heat pipe body 32, and then flows back to the refrigerant box 2 from the output pipe 33, and the heat carried by the refrigerant medium is dissipated by conduction with the heat pipe 3 with a larger heat dissipation surface.

[0022] The utility model optimizes the structure of the high-efficiency semiconductor refrigeration device as follows: the semiconductor refrigeration plate 1 is arranged horizontally, and its upper surface is configured as a heating surface, and the lower surface is configured as a cooling surface; the refrigerant box 2 is arranged horizontally on the heating surface of the semiconductor refrigeration plate 1; the heat pipe 3 is located above the refrigerant box 2, and the input pipe 31 and the output pipe 33 of the heat pipe 3 are both connected to the refrigerant cavity through the upper surface of the refrigerant box 2; wherein, the input pipe 31 of the heat pipe 3 is arranged to extend upward obliquely or vertically from the upper surface of the refrigerant box 2.

[0023] By arranging the semiconductor refrigeration sheet 1 and the refrigerant box 2 in a flat manner, a prerequisite is provided for changing the direction of the input pipe 31 of the heat pipe 3; by arranging the input pipe 31 to extend obliquely upward or vertically upward from the upper surface of the refrigerant box 2, the refrigerant in the refrigerant box 2 moves vertically upward or obliquely upward along the input pipe 31 under the action of pressure, and is less likely to be blocked, allowing the refrigerant to enter the heat pipe 3 more smoothly, which is beneficial to improving the heat dissipation efficiency of the heat pipe 3 and thus allowing the semiconductor refrigeration device to have efficient refrigeration performance.

[0024] Among them, the output pipe 33 can also be extended obliquely downward or vertically downward from the lower end of the heat pipe body 32 toward the refrigerant box 2, so that the refrigerant can more easily flow back to the refrigerant box 2 from the heat pipe body 32 through the output pipe 33 inclined downward or vertically downward, so that the heat dissipation cycle of the refrigerant between the refrigerant box 2 and the heat pipe 3 is smoother and the heat dissipation efficiency is higher.

[0025] The lower end of the input pipe 31 is arranged at the upper layer of the refrigerant cavity, and the lower end of the output pipe 33 is arranged at the bottom layer of the refrigerant cavity. When the semiconductor refrigeration device is working, the heat of the heating surface of the semiconductor refrigeration sheet 1 is transferred to the refrigerant in the refrigerant box 2, so that part of the refrigerant changes from liquid to gas and gathers in the upper layer of the refrigerant cavity, which also causes the pressure in the refrigerant cavity to increase. The pressure effect enables the gas refrigerant carrying a large amount of heat to enter the heat pipe from the input pipe 31; and after the gaseous refrigerant enters the heat pipe 3, it exchanges heat through the heat pipe 3 and changes into liquid again. The liquid refrigerant flows back to the bottom layer of the refrigerant cavity from the output pipe 33.

[0026] A first flow guide tube 34 is provided between the input tube 31 and the heat pipe body 32. The first flow guide tube 34 extends upward from the upper end of the input tube toward the heat pipe body 32 with an arc bending transition structure. The first flow guide tube 34 allows the movement of the refrigerant to be smoother and reduces the collision between the refrigerant and the wall of the heat pipe 3.

[0027] Of course, a second guide tube 35 can also be provided between the output tube 33 and the heat pipe body 32 . The second guide tube 35 extends downward from the heat pipe body 32 toward the upper end of the output tube 33 with an arc bending transition structure to improve the smoothness of the refrigerant medium reflux.

[0028] In addition, the heat pipe body 32 includes one or more spaced-apart sub-heat pipes 321 , each of which is bent and extended to form a heat dissipation network, which is beneficial to increasing the heat dissipation surface area of ​​the heat pipe 3 to improve the heat dissipation effect.

[0029] Even further, a heat dissipation net 36 may be installed on the outer side of the heat pipe body 32 to improve the heat dissipation performance of the heat pipe 3. The heat dissipation net 36 is usually formed by welding a thin steel wire on the outer side of the heat pipe body 32.

[0030] Further integration Figure 4 and Figure 5 The utility model also discloses a refrigeration mirror cabinet, including a cabinet body 81 with a refrigeration cavity, a cabinet door 82 with a mirror surface is provided on the opening side of the cabinet body 81, and the cabinet body 81 is provided with the high-efficiency semiconductor refrigeration device, and the high-efficiency semiconductor refrigeration device is used to provide a high-efficiency refrigeration function for the refrigeration cavity.

[0031] Among them, the high-efficiency semiconductor refrigeration device is arranged above the refrigeration cavity, so that the high-efficiency semiconductor refrigeration device cools the refrigeration cavity from top to bottom, which is conducive to making the refrigeration temperature in the refrigeration cavity more balanced.

[0032] Furthermore, the upper end of the back side of the cabinet 81 has a support platform 83, the semiconductor cooling plate is fixed on the support platform 83 through the refrigerant box 2, and the heat pipe 3 is exposed and arranged above the support platform 83. For example, the refrigerant box 2 is pressed on the heating surface of the semiconductor cooling plate, and the refrigerant box 2 is locked on the support platform 83 through the bracket 84; and the heat pipe 3 and the heat dissipation net 36 are locked on the back side of the cabinet 81 through the fixing plate 37.

[0033] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A high-efficiency semiconductor refrigeration device, comprising a semiconductor refrigeration sheet (1), a heat pipe (3) and a refrigerant box (2) having a refrigerant cavity, wherein the heat pipe (3) comprises an input pipe (31), an output pipe (33), and a heat pipe body (32) connected between the input pipe (31) and the output pipe (33); characterized in that: The semiconductor cooling sheet (1) is arranged horizontally, with its upper surface configured as a heating surface and its lower surface configured as a cooling surface; The refrigerant box (2) is placed flat on the heating surface of the semiconductor refrigeration sheet (1); The heat pipe (3) is located above the refrigerant box (2), and the input pipe (31) and the output pipe (33) of the heat pipe (3) both pass through the upper surface of the refrigerant box (2) and are connected to the refrigerant cavity; The input pipe (31) of the heat pipe (3) is arranged to extend obliquely upward or vertically upward from the upper surface of the refrigerant box.

2. The high-efficiency semiconductor refrigeration device according to claim 1, characterized in that: The output pipe (33) is arranged to extend obliquely downward or vertically downward from the lower end of the heat pipe body (32) toward the refrigerant box (2).

3. The high-efficiency semiconductor refrigeration device according to claim 1, characterized in that: The lower end of the input pipe (31) is located at the upper layer of the refrigerant cavity, and the lower end of the output pipe (33) is located at the bottom layer of the refrigerant cavity.

4. The high-efficiency semiconductor refrigeration device according to claim 1, characterized in that: A first flow guide tube (34) is provided between the input tube (31) and the heat pipe body (32), and the first flow guide tube (34) extends upwards from the upper end of the input tube toward the heat pipe body (32) using an arc bending transition structure.

5. The high-efficiency semiconductor refrigeration device according to claim 1, characterized in that: A second flow guide tube (35) is provided between the output tube (33) and the heat pipe body (32); the second flow guide tube (35) extends downward from the heat pipe body (32) toward the upper end of the output tube (33) using an arc bending transition structure.

6. The high-efficiency semiconductor refrigeration device according to claim 1, characterized in that: The heat pipe body (32) comprises one or more sub-heat pipes (321) arranged at intervals, and each sub-heat pipe (321) is bent and extended to form a heat dissipation network.

7. A refrigeration mirror cabinet, comprising a cabinet body (81) having a refrigeration cavity, a cabinet door (82) with a mirror surface being provided on an opening side of the cabinet body (81), characterized in that: A high-efficiency semiconductor refrigeration device as claimed in any one of claims 1 to 6 is provided on the cabinet (81).

8. The refrigerating mirror cabinet according to claim 7, characterized in that: The high-efficiency semiconductor refrigeration device is arranged above the refrigeration chamber.

9. The refrigerating mirror cabinet according to claim 8, characterized in that: A support platform (83) is provided at the upper end of the back side of the cabinet (81); the semiconductor refrigeration plate (1) is pressed and fixed on the support platform (83) by a refrigerant box (2); and the heat pipe (3) is exposed and arranged above the support platform (83).

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