Intelligent sensor for measuring thickness of precise coating layer

Abstract

The utility model provides an intelligent sensor for measuring the thickness of a precise coating layer, and relates to the technical field of sensors, the intelligent sensor comprises a circuit board (1), a magnetic core (2), a first F-type coil (3), a second F-type coil (4) and a Type-C interface (5), the circuit board (1) is electrically connected with the first F-type coil (3) and the second F-type coil (4) respectively, and the Type-C interface (5) is electrically connected with the magnetic core (2). The magnetic core (2) is arranged at the axis of a framework on the first F-type coil (3) and the second F-type coil (4), and the circuit board (1) is provided with a sine wave generation circuit (5), a precise detection circuit (6) and an ARM microprocessor (7). According to the utility model, the stability and the anti-interference performance of the oscillation circuit in the sensor are improved, the coating measurement precision is further improved, and the volume and the cost are reduced by integrating a plurality of circuits into the circuit board.

Description

Technical Field

[0001] The utility model relates to the technical field of mechanical processing, in particular to an intelligent sensor for measuring the thickness of a precision coating layer. Background Art

[0002] The thickness of non-magnetic plating or coating on ferromagnetic substrates, such as zinc, chromium, paint and other plating and coatings on steel surfaces and the thickness of gold, silver, copper, rubber, plastic and other films, is generally between tens of microns and hundreds of microns, and must be measured with a special coating thickness tester. A coating thickness gauge is an instrument that measures the thickness of non-magnetic coatings on magnetic substrates and the thickness of insulating coatings on non-magnetic conductive substrates. It is divided into F-type probes / sensors and N-type probes / sensors, and is widely used in the power, automotive, petroleum, non-ferrous metals, chemicals, ships and other industries. Coating thickness gauges generally measure through the sensors inside their probes.

[0003] The common problems of the sensors in the coating thickness gauges currently on the market include: (1) The sensor outputs an analog signal, and even a vibration loop is formed between the sensor, lead wire, and host, which is easily interfered by the external electromagnetic field; (2) In order to improve the stability of the oscillation circuit, large and expensive devices such as CBB capacitors must be used, which restricts the miniaturization of the instrument and the reduction of costs; (3) The oscillation circuit is greatly affected by temperature, and it is very easy to cause the coating output value to change due to hand-pinching of the probe. The existence of the above interference factors leads to many faults of the coating thickness gauge: the oscillation circuit does not vibrate, the value jumps and the repeatability is poor, which greatly limits the application of the coating thickness gauge. Utility Model Content

[0004] The utility model aims to provide an intelligent sensor for measuring the thickness of a precise coating layer, which can stably measure the coating layer and improve the accuracy of the measurement.

[0005] The embodiment of the utility model is achieved as follows:

[0006] An embodiment of the present application provides an intelligent sensor for measuring the thickness of a precision coating, comprising a circuit board, a magnetic core, a first F-type coil, a second F-type coil and a Type-C interface, wherein the circuit board is electrically connected to the first F-type coil and the second F-type coil, respectively, and the magnetic core is located at the axis of the skeleton of the first F-type coil and the second F-type coil. A sine wave generating circuit, a precision detection circuit, an ARM microprocessor and a peripheral circuit are arranged on the circuit board, one end of the sine wave generating circuit is electrically connected to the ARM microprocessor, and the other end of the sine wave generating circuit is connected to the first F-type coil; one end of the precision detection circuit is electrically connected to the second F-type coil, and the other end of the precision detection circuit is electrically connected to the ARM microprocessor.

[0007] In some embodiments of the present invention, the above-mentioned sine wave generating circuit includes a resistor R52, a resistor R56, a resistor R57, a resistor R58, a resistor R37, a capacitor C51, a capacitor C52, a capacitor C53, and an amplifier U31B. One end of the resistor R52 is connected to the sine wave input signal end, and the other end of the resistor R52 is respectively connected to one end of the resistor R56 and one end of the capacitor C51. The other end of the resistor R56 is respectively connected to one end of the capacitor C52, one end of the capacitor C53, and one end of the resistor R58. The capacitor C51 is connected to the The other end is respectively connected to the other end of resistor R58 and the positive input terminal 5 of amplifier U31B, the other end of capacitor C52 is respectively connected to a +1.65V power supply, one end of resistor R57, the output terminal 7 of amplifier U31B, and one end of resistor R37, the other end of capacitor C53 is respectively connected to the other end of resistor R57 and the reverse input terminal 6 of amplifier U31B, the other end of resistor R37 is connected to the sinusoidal wave output signal terminal, pin 8 of amplifier U31B is connected to a +3.3V power supply, and pin 4 of amplifier U31B is grounded.

[0008] In some embodiments of the utility model, the above-mentioned precision detection circuit includes a voltage-dividing resistor R22, a voltage-dividing resistor R23, a resistor R11, a resistor R13, a resistor R14, a resistor R15, a resistor R16, a resistor R41, a resistor R42, a resistor R43, a diode D1, a diode D2, an operational amplifier U3A, an operational amplifier U3B, an operational amplifier U4A, an operational amplifier U4B, a capacitor C40, a capacitor C41 and a capacitor C42. The voltage-dividing resistor R22 and the voltage-dividing resistor R23 form an inverting amplifier with the operational amplifier U3A. The resistor R11, the resistor R13, the resistor R14, the resistor R15, the resistor R16, the diode D1, the diode D2, the operational amplifier U3B and the operational amplifier U4A form a precision detection circuit. The resistor R41, the resistor R42, the resistor R43, the capacitor C40, the capacitor C41, the capacitor C42 and the operational amplifier U4B form a third-order active low-pass filter.

[0009] In some embodiments of the present invention, the ARM microprocessor adopts the GD32F350G6U6 chip.

[0010] In some embodiments of the present invention, the ARM microprocessor is embedded with a Type-c interface.

[0011] In some embodiments of the present invention, the peripheral circuit includes a low voltage difference power supply circuit, a +2V reference source for generating current, and an MCU circuit.

[0012] In some embodiments of the present invention, a shielding cover is disposed outside the circuit board.

[0013] Compared with the prior art, the embodiments of the present invention have at least the following advantages or beneficial effects:

[0014] (1) The utility model is an intelligent sensor for measuring the thickness of precision coatings. The square wave broadband signal output from the sine wave generating circuit is filtered out by a precision detection circuit through a third-order bandpass frequency selection filter, and other frequency costs in the signal are removed, and the sine wave of the main frequency is retained, thereby obtaining an accurate measurement result, which significantly improves the coating measurement accuracy of the sensor;

[0015] (2) The utility model reduces the volume and cost by integrating multiple circuits such as a sine wave generating circuit, a precision detection circuit, a low voltage difference power supply circuit, a +2V reference source current generating circuit and an MCU circuit on a micro-circuit board, thereby improving the stability and anti-interference of the internal oscillation circuit of the sensor and thus improving the coating measurement accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 This is a schematic structural block diagram of an intelligent sensor for measuring the thickness of a precision coating layer according to the utility model;

[0018] Figure 2 This is a schematic diagram of a sine wave generating circuit;

[0019] Figure 3 This is a schematic diagram of the precision detection circuit.

[0020] Icons: 1. Circuit board; 2. Magnetic core; 3. First F-type coil; 4. Second F-type coil; 5. Sine wave generating circuit; 6. Precision detection circuit; 7. ARM microprocessor; 8. Peripheral circuit; 9. Type-C interface. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0022] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0023] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0024] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0025] In the description of the present application, it should be noted that the terms "upper", "lower", "inside" or "outside" etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are orientations or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0026] In the description of this application, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "disposed" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0027] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Example

[0028] See also Figure 1 , Figure 1 Shown is a schematic structural block diagram of an intelligent sensor for measuring the thickness of a precision coating provided in an embodiment of the present application.

[0029] An embodiment of the present application provides an intelligent sensor for measuring the thickness of a precision coating, which includes a circuit board 1, a magnetic core 2, a first F-type coil 3 and a second F-type coil 4. The circuit board 1 is electrically connected to the first F-type coil 3 and the second F-type coil 4 respectively, and the magnetic core 2 is located at the axis of the skeleton of the first F-type coil 3 and the second F-type coil 4. A sine wave generating circuit 5, a precision detection circuit 6, an ARM microprocessor 7 and a peripheral circuit 8 are arranged on the circuit board 1. One end of the sine wave generating circuit 5 is electrically connected to the ARM microprocessor 7, and the other end of the sine wave generating circuit 5 is connected to the first F-type coil 3; one end of the precision detection circuit 6 is electrically connected to the second F-type coil 4, and the other end of the precision detection circuit 6 is electrically connected to the ARM microprocessor 7.

[0030] In some embodiments of the present invention, Figure 2 The figure shows a schematic diagram of a sine wave generating circuit. The sine wave generating circuit 5 includes a resistor R52, a resistor R56, a resistor R57, a resistor R58, a resistor R37, a capacitor C51, a capacitor C52, a capacitor C53, and an amplifier U31B. One end of the resistor R52 is connected to the sine wave input signal terminal, and the other end of the resistor R52 is respectively connected to one end of the resistor R56 and one end of the capacitor C51. The other end of the resistor R56 is respectively connected to one end of the capacitor C52, one end of the capacitor C53, and one end of the resistor R58. The other end of the capacitor C51 is respectively connected to one end of the capacitor C52, one end of the capacitor C53, and one end of the resistor R58. One end is respectively connected to the other end of resistor R58 and the positive input terminal 5 of amplifier U31B, the other end of capacitor C52 is respectively connected to a +1.65V power supply, one end of resistor R57, the output terminal 7 of amplifier U31B, and one end of resistor R37, the other end of capacitor C53 is respectively connected to the other end of resistor R57 and the reverse input terminal 6 of amplifier U31B, the other end of resistor R37 is connected to the sinusoidal wave output signal terminal, pin 8 of amplifier U31B is connected to a +3.3V power supply, and pin 4 of amplifier U31B is grounded.

[0031] In some embodiments of the present invention, Figure 3The figure shows a schematic diagram of a precision detection circuit. The precision detection circuit 6 includes a voltage-dividing resistor R22, a voltage-dividing resistor R23, a resistor R11, a resistor R13, a resistor R14, a resistor R15, a resistor R16, a resistor R41, a resistor R42, a resistor R43, a diode D1, a diode D2, an operational amplifier U3A, an operational amplifier U3B, an operational amplifier U4A, an operational amplifier U4B, a capacitor C40, a capacitor C41 and a capacitor C42. The voltage-dividing resistor R22 and the voltage-dividing resistor R23 form an inverting amplifier with the operational amplifier U3A. The resistor R11, the resistor R13, the resistor R14, the resistor R15, the resistor R16, the diode D1, the diode D2, the operational amplifier U3B and the operational amplifier U4A form a precision detection circuit. The resistor R41, the resistor R42, the resistor R43, the capacitor C40, the capacitor C41, the capacitor C42 and the operational amplifier U4B form a third-order active low-pass filter.

[0032] In some embodiments of the present invention, the ARM microprocessor 7 uses a GD32F350G6U6 chip.

[0033] In this embodiment, the GD32F350G6U6 chip is used as the main control chip. After being programmed, it can send out a square wave excitation signal, so that the level signal processed by the precision detection circuit can be collected, and the coating thickness can be calculated according to the built-in algorithm; and the sine wave generating circuit and the precision detection circuit are mainly built with the small-package operational amplifier RS8552XTDE8, and the overall volume is reduced by these small-package devices.

[0034] In some embodiments of the present invention, the ARM microprocessor 7 is embedded with a Type-c interface 9.

[0035] Therefore, the Type-c interface 9 can be connected to electronic display devices such as mobile phones, digital companions and dedicated display terminals.

[0036] In some embodiments of the present invention, the peripheral circuit 8 includes a low voltage difference power supply circuit, a +2V reference source for generating current, and an MCU circuit.

[0037] It should be noted that the low voltage difference power supply circuit, +2V reference source current generation and MCU circuit are all common circuits.

[0038] In some embodiments of the present invention, a shielding cover is disposed outside the circuit board 1 .

[0039] Therefore, by setting a shielding cover, the anti-interference ability of the sensor can be further enhanced and the measurement accuracy can be improved.

[0040] Working principle:

[0041] The sine wave generating circuit 5 generates a 10kHz sine wave driven by the ARM microprocessor 7, which is applied to the first F-type coil 3. In the magnetic circuit formed by the magnetic core 2, the substrate and the air, the second F-type coil 4 will induce an induced electromotive force, the magnitude of which is related to the distance between the magnetic core 2 and the substrate. The second F-type coil 4 generates a sine wave with the same frequency as the excitation sine wave. To detect its amplitude, detection must be performed. Therefore, the utility model adopts a precision detection circuit 6 for detection, and then uses a third-order active low-pass filter for filtering to achieve a DC voltage proportional to the amplitude of the induced sine wave, which is input into the A / D pin of the ARM microprocessor 7, thereby collecting the final signal, and further converting it into a coating thickness value to obtain the final measurement result.

[0042] It is understood that the structure shown in the figure is only for illustration, and the intelligent sensor for measuring the thickness of precision coatings may also include more or fewer components than shown in the figure, or have a different configuration than shown in the figure. Each component shown in the figure may be implemented by hardware, software or a combination thereof.

[0043] In the embodiments provided in the present application, it should be understood that the disclosed device can also be implemented in other ways. The device embodiments described above are merely schematic. For example, the block diagrams in the accompanying drawings show the possible architecture, functions and operations of the devices according to the multiple embodiments of the present application. In this regard, each box in the block diagram can represent a part of a module, and a part of the module contains one or more executable instructions for implementing the specified logical functions. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in an order different from that marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram, and the combination of boxes in the block diagram, can be implemented with a dedicated hardware-based system that performs a specified function or action, or can be implemented with a combination of dedicated hardware and computer instructions.

[0044] To summarize, the embodiment of the present application provides an intelligent sensor for measuring the thickness of precision coatings, which reduces the volume and cost by integrating multiple circuits such as sinusoidal wave circuits and precision detection circuits on a micro-circuit board, and improves the stability and anti-interference ability of the internal oscillation circuit of the sensor, thereby improving the coating measurement accuracy.

[0045] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

[0046] It will be apparent to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above, and that the present application can be implemented in other specific forms without departing from the spirit or essential features of the present application. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present application. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. An intelligent sensor for measuring the thickness of precision coatings, characterized in that: The invention comprises a circuit board (1), a magnetic core (2), a first F-type coil (3) and a second F-type coil (4); the circuit board (1) is electrically connected to the first F-type coil (3) and the second F-type coil (4) respectively; the magnetic core (2) is located at the axis of the skeletons of the first F-type coil (3) and the second F-type coil (4); a sine wave generating circuit (5), a precision detection circuit (6), an ARM microprocessor (7) and a peripheral circuit (8) are arranged on the circuit board (1); one end of the sine wave generating circuit (5) is electrically connected to the ARM microprocessor (7), and the other end of the sine wave generating circuit (5) is connected to the first F-type coil (3); one end of the precision detection circuit (6) is electrically connected to the second F-type coil (4), and the other end of the precision detection circuit (6) is electrically connected to the ARM microprocessor (7).

2. The intelligent sensor for measuring the thickness of a precision coating as claimed in claim 1, characterized in that: The sine wave generating circuit (5) comprises a resistor R52, a resistor R56, a resistor R57, a resistor R58, a resistor R37, a capacitor C51, a capacitor C52, a capacitor C53, and an amplifier U31B, wherein one end of the resistor R52 is connected to the sine wave input signal end, the other end of the resistor R52 is respectively connected to one end of the resistor R56 and one end of the capacitor C51, the other end of the resistor R56 is respectively connected to one end of the capacitor C52, one end of the capacitor C53, and one end of the resistor R58, and the other end of the capacitor C51 is respectively connected to The other end of resistor R58 is connected to the positive input terminal 5 of amplifier U31B, the other end of capacitor C52 is respectively connected to a +1.65V power supply, one end of resistor R57, the output terminal 7 of amplifier U31B, and one end of resistor R37, the other end of capacitor C53 is respectively connected to the other end of resistor R57 and the reverse input terminal 6 of amplifier U31B, the other end of resistor R37 is connected to the sinusoidal wave output signal terminal, pin 8 of amplifier U31B is connected to a +3.3V power supply, and pin 4 of amplifier U31B is grounded.

3. The intelligent sensor for measuring the thickness of a precision coating as claimed in claim 1, characterized in that: The precision detection circuit (6) comprises a voltage-dividing resistor R22, a voltage-dividing resistor R23, a resistor R11, a resistor R13, a resistor R14, a resistor R15, a resistor R16, a resistor R41, a resistor R42, a resistor R43, a diode D1, a diode D2, an operational amplifier U3A, an operational amplifier U3B, an operational amplifier U4A, an operational amplifier U4B, a capacitor C40, a capacitor C41 and a capacitor C42; the voltage-dividing resistor R22 and the voltage-dividing resistor R23 and the operational amplifier U3A form an inverting amplifier; the resistor R11, the resistor R13, the resistor R14, the resistor R15, the resistor R16, the diode D1, the diode D2, the operational amplifier U3B and the operational amplifier U4A form a precision detection circuit; the resistor R41, the resistor R42, the resistor R43, the capacitor C40, the capacitor C41, the capacitor C42 and the operational amplifier U4B form a third-order active low-pass filter.

4. The intelligent sensor for measuring the thickness of a precision coating as claimed in claim 1, characterized in that: The ARM microprocessor (7) adopts the GD32F350G6U6 chip.

5. The intelligent sensor for measuring the thickness of a precision coating as claimed in claim 4, characterized in that: The ARM microprocessor (7) is embedded with a Type-C interface (9).

6. The intelligent sensor for measuring the thickness of a precision coating as claimed in claim 1, characterized in that: The peripheral circuit (8) comprises a low voltage difference power supply circuit, a +2V reference source for generating current, and an MCU circuit.

7. The intelligent sensor for measuring the thickness of a precision coating as claimed in claim 1, characterized in that: A shielding cover is arranged outside the circuit board (1).

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