Computer heat dissipation cooling device

Abstract

The utility model discloses a computer radiating and cooling device, and relates to the technical field of computers. The cooling device comprises a water pipe, the two ends of the water pipe are fixedly connected with a cooling device and a refrigerating mechanism respectively, the cooling device comprises a first box body, a first water inlet and a first water outlet are formed in the lower end of the first box body, a pump is fixedly installed at the lower end of the first water inlet, and a cooling pipe is fixedly installed on the inner surface of the first box body. Wherein one end of one water pipe is fixedly connected with the pump machine, the other end of the pump machine is connected with the cooling pipe, one end of the other water pipe is fixedly connected with the first water outlet, a fixing frame is fixedly installed on the outer surface of one side of the first box body, and a guide pad is fixed to the side, back to the first box body, of the fixing frame. Water in the cooling pipe can cool the computer and then circulates through the cooling device, heat of hot water is conducted into the heat dissipation plate through the cooling device, and then the heat dissipation plate is cooled through the fan.

Description

Technical Field

[0001] The utility model relates to the technical field of computers, in particular to a computer heat dissipation cooling device. Background Art

[0002] At present, the use of computers is gradually becoming popular and is used in all walks of life. It has become an essential office equipment and is used for a long time every day. However, after the computer has been used for a period of time, the components inside the chassis will dissipate heat, causing the temperature inside the chassis to rise, thereby affecting the running speed of the computer.

[0003] Upon checking the announcement number CN208848160U, a computer heat dissipation cooling device is disclosed. This technology discloses "including a base frame, a vent sliding door, a transmission wheel group, a slide rail, a ventilation fan and a heat dissipation device, the base frame includes a panel, an L-shaped slide rail, an air outlet, an air inlet and a baffle; the upper and lower ends of the panel are relatively fixedly connected to an L-shaped slide rail respectively; the air outlet and the air inlet are respectively arranged at the left and right ends of the panel; the left and right ends of the panel are fixedly connected to a baffle and other technical solutions, which have the characteristics that when the computer is working at a low load, the vent sliding door is closed and the air can be circulated in the chassis through the ventilation fan, and the high temperature area is dissipated through the heat dissipation device; when the computer is working at a high load, the vent sliding door is opened, and the high temperature air in the computer chassis will be discharged from the air outlet by the ventilation fan, and the cold air from the outside will enter from the air inlet due to the air pressure. At the same time, when the cold air enters, the heat dissipation device will be cooled and other technical effects are achieved."

[0004] However, the prior art still has the following problems:

[0005] First, existing computer cooling devices usually use fans to exchange air inside and outside the chassis for heat dissipation. However, if the indoor temperature is too high and the computer chip is running at high speed, the cooling efficiency of relying solely on fans becomes very low. Secondly, when exchanging air inside and outside, the air inlet and outlet are easily blocked and need to be cleaned frequently.

[0006] In view of the above problems, the inventor proposes a computer heat dissipation cooling device to solve the above problems. Utility Model Content

[0007] In order to solve the problem of easy blockage and noise of the air outlet of the existing computer heat dissipation device; the purpose of the utility model is to provide a computer heat dissipation cooling device.

[0008] To solve the above technical problems, the utility model adopts the following technical solutions: a computer heat dissipation cooling device comprises a water pipe, two water pipes are provided, and two ends of the water pipes are fixedly connected with a heat dissipation device and a refrigeration mechanism respectively, the heat dissipation device comprises a first box body, a first water inlet and a first water outlet are opened at the lower end of the first box body, a pump is fixedly installed at the lower end of the first water inlet, a cold pipe is fixedly installed on the inner surface of the first box body, one end of one of the water pipes is fixedly connected to the pump, and the other end of the pump is fixedly connected to the cold pipe, a waterproof film is provided at the connection between the pump and the cold pipe, another end of the water pipe is fixedly connected to the first water outlet, a fixing frame is fixedly installed on the outer surface of one side of the first box body, a guide pad is fixed on the side of the fixing frame facing away from the first box body, the pump and the second water outlet are connected with the same water pipe, and the first water outlet and the second water inlet are connected with another water pipe.

[0009] Preferably, the refrigeration mechanism includes a second box body, the top and bottom ends of the second box body are respectively provided with a second water inlet and a second water outlet, a heat sink is fixedly installed on the inner wall of one side of the second box body, a heat sink is fixedly installed on one side of the heat sink, an air outlet is fixedly provided on the outer side of the box body, and a fan is fixedly connected to the inner wall of one side of the air outlet.

[0010] Compared with the prior art, the beneficial effects of the present invention are:

[0011] 1. In this application, the heat dissipation device is used, and the cold water flowing in the cold pipe can take away the heat from the computer chip, and then the water heated by the computer chip is sent to the cooling device through a water pump, and then new cold water is pumped out from the cooling device.

[0012] 2. In this application, through the refrigeration mechanism, the hot water flowing from the heat dissipation device enters the gap of the heat dissipation plate, the heat of the hot water is transferred into the heat dissipation plate and the heat dissipation fins, and then the fan blows in cool air to cool the heat dissipation plate and the heat dissipation fins. The mesh plate installed on one side of the fan can effectively prevent dust from entering. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0014] Figure 1 It is a schematic diagram of the structure of the utility model.

[0015] Figure 2 This is a schematic diagram of the structure of the heat dissipation device of the utility model.

[0016] Figure 3 This is a schematic diagram of the refrigeration mechanism structure of the utility model.

[0017] Figure 4 This is a structural schematic diagram of the refrigeration mechanism of the utility model from another perspective.

[0018] In the figure: 1. water pipe; 2. heat dissipation device; 3. refrigeration mechanism; 201. fixing frame; 202. adhesive label; 203. first water inlet; 204. pump; 205. first box body; 206. cold pipe; 207. guide pad; 208. first water outlet; 209. waterproof membrane; 301. second box body; 302. heat sink; 303. heat sink; 304. fan; 305. second water outlet; 306. mesh plate; 307. second water inlet; 308. air outlet. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] Example: Figure 1-4As shown, a computer heat dissipation cooling device includes a water pipe 1. Two water pipes 1 are provided. The two ends of the water pipe 1 are respectively fixedly connected with a heat dissipation device 2 and a refrigeration mechanism 3. The heat dissipation device 2 includes a first box body 205. The lower end of the first box body 205 is provided with a first water inlet 203 and a first water outlet 208. A pump 204 is fixedly installed at the lower end of the first water inlet 203. A cold pipe 206 is fixedly installed on the inner surface of the first box body 205. One end of one of the water pipes 1 is fixedly connected to the pump 204, and the other end of the pump 204 is connected to the cold pipe 206. A waterproof film 209 is provided at the connection between the pump 204 and the cold pipe 206 to prevent water leakage. One end of the other water pipe 1 is fixedly connected to the first water outlet 208. One end of one of the two water pipes 1 is connected to the pump 204, and the other end of the pump 204 is connected to the cold pipe 206. The other A water pipe 1 is directly fixedly connected to the cold pipe 206, a fixing frame 201 is fixedly installed on the outer surface of one side of the first box body 205, a guide pad 207 is fixedly installed on the side of the fixing frame 201 facing away from the first box body 205, four adhesive stickers 202 are fixedly installed on the outer surface of the fixing frame 201, and the four adhesive stickers 202 are distributed in a rectangular array. The fixing frame 201 and the adhesive stickers 202 thereon can install the device on a computer chip, and the conductive pad 207 can better transfer the temperature in the computer chip to the cold pipe 206. First, the fixing frame 201 is fixed on the chip with the adhesive sticker 202. When the computer is running under load, the heat generated by the chip will be transferred to the cold pipe 206 through the guide pad 207, and the cold water flowing in the cold pipe 206 will absorb the heat. When the pump 204 delivers new cold water, the old cold water will be squeezed into the water pipe 1, and then enter the refrigeration mechanism 3 through the water pipe 1.

[0021] The refrigeration mechanism 3 includes a second box body 301, and a second water inlet 307 and a second water outlet 305 are respectively provided at the top and bottom of the second box body 301. The second water inlet 307 is provided at the top of the second box body 301, and the second water outlet 305 is provided at the bottom. A heat sink 303 is fixedly installed on the inner wall of one side of the second box body 301, and a heat sink 302 is fixedly installed on one side of the heat sink 303. The heat sink 302 is distributed at equal intervals, so that the cold water can be evenly distributed. An air outlet 308 is fixedly provided on the outer side of the box body, and a fan 304 is fixedly connected to the inner wall of one side of the air outlet 308. The air outlet 308 is provided There are four air outlets 308 distributed on the four sides of the second box body 301 and the fan 304. A mesh plate 306 is installed on the side of the fan 304 facing away from the second box body 301. The mesh plate 306 can effectively prevent dust from entering and blocking the fan 304. The fan 304 blows cold air to the heat sink 303 to cool the heat sink 303. When hot water enters the refrigeration mechanism 3 from the second water inlet 307, the heat therein will be absorbed by the heat sink 302 and the heat sink 303, and then enter the water pipe 1 from the second water outlet 305. Then the fan 304 is started, and the fan 304 will blow out cold air to cool the heat sink 303.

[0022] The pump 204 and the second water outlet 305 are connected to the same water pipe 1 , and the first water outlet 208 and the second water inlet 307 are connected to the same water pipe 1 .

[0023] Working principle: First, the conductive pad 207 on the fixing frame 201 is attached to the chip of the computer, and then the adhesive sticker 202 is attached around the computer chip, and the second box body 301 is installed on the inner wall of the chassis;

[0024] Next, when the computer is running, the chip generates heat, and the cold water in the cold pipe 206 will cool it. When the cold water in the cold pipe 206 becomes hot, the pump 204 is started, and the pump 204 will send hot water into the refrigeration mechanism 3, and draw new cold water from the refrigeration mechanism 3 to cool the computer chip;

[0025] Then, when the hot water enters the refrigeration mechanism 3 , the heat sink 303 and the heat sink 302 in the refrigeration mechanism 3 will quickly absorb the heat in the hot water, and then the fan 304 will be started, and the fan 304 will blow out cool air to cool the heat sink 303 and the heat sink 302 .

[0026] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A computer heat dissipation cooling device, comprising a water pipe (1), characterized in that: Two water pipes (1) are provided, and the two ends of the water pipe (1) are respectively fixedly connected with a heat dissipation device (2) and a refrigeration mechanism (3); The heat dissipation device (2) comprises a first box body (205), the lower end of which is provided with a first water inlet (203) and a first water outlet (208), a pump (204) being fixedly mounted at the lower end of the first water inlet (203), a cooling pipe (206) being fixedly mounted on the inner surface of the first box body (205), one end of one of the water pipes (1) being fixedly connected to the pump (204), the other end of the pump (204) being connected to the cooling pipe (206), and one end of the other water pipe (1) being fixedly connected to the first water outlet (208), a fixing frame (201) being fixedly mounted on the outer surface of one side of the first box body (205), and a guide pad (207) being fixedly mounted on the side of the fixing frame (201) facing away from the first box body (205).

2. A computer heat dissipation cooling device as claimed in claim 1, characterized in that: The refrigeration mechanism (3) comprises a second box body (301), the top and bottom ends of the second box body (301) are respectively provided with a second water inlet (307) and a second water outlet (305), a heat sink (303) is fixedly mounted on an inner wall of one side of the second box body (301), a heat sink (302) is fixedly mounted on one side of the heat sink (303), an air outlet (308) is fixedly arranged on the outer side of the box body, and a fan (304) is fixedly connected to an inner wall of one side of the air outlet (308).

3. A computer heat dissipation cooling device as claimed in claim 1, characterized in that: Four adhesive stickers (202) are fixedly mounted on the outer surface of the fixing frame (201), and the four adhesive stickers (202) are distributed in a rectangular array.

4. A computer heat dissipation cooling device as claimed in claim 1, characterized in that: The pump (204) and the second water outlet (305) are connected to the same water pipe (1), and the first water outlet (208) and the second water inlet (307) are connected to the same water pipe (1).

5. A computer heat dissipation cooling device as claimed in claim 2, characterized in that: The heat sinks (302) are arranged at equal intervals.

6. A computer heat dissipation cooling device as claimed in claim 2, characterized in that: A mesh plate (306) is installed on the side of the fan (304) facing away from the second box body (301).

7. A computer heat dissipation cooling device as claimed in claim 1, characterized in that: A waterproof membrane (209) is provided at the connection between the pump (204) and the cooling pipe (206).

8. A computer heat dissipation cooling device as claimed in claim 2, characterized in that Four air outlets (308) are provided, and the air outlets (308) are distributed on four sides of the second box body (301) and the fan (304).

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