Compression-resistant moisture-proof and moisture-proof chip capacitor

Abstract

The utility model belongs to the technical field of chip capacitors, and discloses a compression-resistant moisture-proof and moisture-proof chip capacitor, which comprises a barrel-shaped shell, a chip capacitor and a bottom ring, the chip capacitor is arranged in the shell, the bottom ring is arranged at the bottom of the shell, and the chip capacitor is arranged in the bottom ring. The surface of the bottom ring and the side wall of the bottom ring are respectively provided with a second tin ring and a first tin ring, and the second tin ring and the first tin ring are respectively used for welding between the bottom ring and the shell and welding between the bottom ring and the tin disc. And the shell and the bottom ring are welded through the second tin ring, so that moisture cannot enter the shell through a gap, meanwhile, the rubber disc blocks the residual space in the middle of the bottom ring, the sealing performance in the shell is further improved, and the problems that a current plug-in installation mode is poor in moisture-proof effect and poor in moisture-proof effect are solved. And certain potential safety hazards exist in a humid environment.

Description

Technical Field

[0001] The utility model belongs to the technical field of patch capacitors, and in particular relates to a pressure-resistant, moisture-resistant and moisture-proof patch capacitor. Background Art

[0002] At present, some chip capacitors on the market are installed by insertion. This installation method makes the surface of the chip capacitor directly exposed to the external air. In an environment with high air humidity such as southerly days, the dielectric loss of the chip capacitor will gradually increase, causing the capacitance value to change, which in turn affects the stability of the equipment. At the same time, excessive air humidity is also very likely to induce short circuit and leakage problems, and has certain fire hazards. Therefore, a pressure-resistant, moisture-resistant and moisture-proof chip capacitor is designed to solve the problem that the current insertion installation method has poor moisture-proof and moisture-proof effect and certain safety hazards in humid environments. Utility Model Content

[0003] The purpose of the utility model is to provide a pressure-resistant moisture-proof chip capacitor to solve the problem that the current plug-in installation method mentioned in the background technology has poor moisture-proof effect and has certain safety hazards in a humid environment.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a pressure-resistant, moisture-resistant and moisture-proof chip capacitor comprises a shell, a chip capacitor and a bottom ring, the shell is barrel-shaped, and a chip capacitor is arranged inside the shell, the bottom ring is arranged at the bottom of the shell, and a second tin ring and a first tin ring are respectively arranged on the surface and side wall of the bottom ring, and the second tin ring and the first tin ring are respectively used for welding between the bottom ring and the shell and between the bottom ring and the tin plate.

[0005] Preferably, a rubber disk is fixedly provided inside the bottom ring, through holes are symmetrically provided on the surface of the rubber disk, the connection end of the chip capacitor passes through the rubber disk through the small hole, and a rubber ring is installed at the bottom of the bottom ring.

[0006] Preferably, heat conducting plates are symmetrically arranged at equal intervals on the surface of the bottom ring and inside the second tin ring, guide grooves are symmetrically opened at equal intervals on the inner wall of the shell, the heat conducting plates are embedded in the guide grooves, and the height of the heat conducting plates and the inside of the shell are both greater than the height of the chip capacitor.

[0007] Preferably, the end of the heat conducting plate is an arc-shaped surface, and the end of the heat conducting plate is in contact with the outer wall of the chip capacitor, and the outer wall of the housing is provided with heat dissipation grooves symmetrically and equidistantly relative to the position of the heat conducting plate.

[0008] Preferably, a through hole is opened on the top of the shell, and a transparent plastic plate and a support plate are respectively arranged inside the through hole. The transparent plastic plate is arranged above the support plate, and the support plate is symmetrically installed on the inner wall of the through hole at equal intervals, and humidity color-changing paper is placed between the transparent plastic plate and the support plate.

[0009] Preferably, the top of the transparent plastic plate is flush with the top of the housing, and the diameter of the humidity color-changing paper is greater than the distance between the support plates.

[0010] Compared with the prior art, the beneficial effects of the utility model are:

[0011] (1) The utility model is provided with a shell, a bottom ring and a second tin ring. When in use, since the chip capacitor is arranged in the shell and the shell and the bottom ring are welded by the second tin ring, moisture cannot enter the shell through the gap. At the same time, the setting of the rubber disk blocks the remaining space in the middle of the bottom ring, further improving the sealing of the shell, and solving the problem that the current plug-in installation method has poor moisture and humidity resistance and has certain safety hazards in a humid environment.

[0012] (2) The utility model is provided with a transparent plastic plate, a support plate and humidity color-changing paper. When inspecting the equipment, the operator can directly observe the color change of the humidity color-changing paper above the support plate through the transparent glass plate, and use the humidity color-changing paper to detect the humidity inside the shell, so that the operator can determine whether the chip capacitor needs to be replaced. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the structure of the utility model;

[0014] Figure 2 It is a horizontal cross-sectional view of the utility model;

[0015] Figure 3 for Figure 1 A in the enlarged view;

[0016] In the figure: 1. Shell; 2. Heat conduction plate; 3. Bottom ring; 4. Rubber ring; 5. Rubber disk; 6. First tin ring; 7. Second tin ring; 8. SMD capacitor; 9. Guide groove; 10. Transparent plastic plate; 11. Heat dissipation groove; 12. Humidity color-changing paper; 13. Support plate. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0018] See also Figure 1-Figure 2 As shown, the utility model provides the following technical solutions: a pressure-resistant, moisture-resistant and moisture-proof chip capacitor comprises a shell 1, a chip capacitor 8 and a bottom ring 3, the shell 1 is barrel-shaped, and a chip capacitor 8 is arranged inside the shell 1, the bottom ring 3 is arranged at the bottom of the shell 1, and a second tin ring 7 and a first tin ring 6 are respectively arranged on the surface and side wall of the bottom ring 3, the second tin ring 7 and the first tin ring 6 are respectively used for welding between the bottom ring 3 and the shell 1 and the bottom ring 3 and the tin disk, a rubber disk 5 is fixedly arranged on the inner ring of the bottom ring 3, through holes are symmetrically opened on the surface of the rubber disk 5, and the connection end of the chip capacitor 8 passes through the rubber disk 5 through the small hole, a rubber ring 4 is installed at the lower part of the bottom ring 3, and a heat conducting plate 2 is symmetrically arranged at equal intervals on the surface of the bottom ring 3 and inside the second tin ring 7, and guide grooves 9 are symmetrically opened on the inner wall of the shell 1, and the heat conducting plate 2 is embedded in the guide groove 9, and the height of the heat conducting plate 2 and the inside of the shell 1 are both greater than the height of the chip capacitor 8.

[0019] Through the above technical solution: when in use, the bottom ring 3 is first placed on the surface of the tin plate, and then the chip capacitor 8 is placed on the surface of the bottom ring 3, so that its end passes through the small hole through the rubber plate 5 and is connected with the tin plate. At this time, the shell 1 is sleeved on the chip capacitor 8, and the heat conducting plate 2 is embedded in the guide groove 9. The second tin ring 7 and the first tin ring 6 are used to complete the welding between the bottom ring 3 and the shell 1 and the bottom ring 3 and the tin plate. The chip capacitor 8 is sealed while being fixed and installed by welding, which solves the problem that the current plug-in installation method has poor moisture and humidity proof effect and certain safety hazards in a humid environment. At the same time, since the height of the heat conducting plate 2 and the inside of the shell 1 are both greater than the height of the chip capacitor 8, after the sleeve is completed, there is still a certain distance between the chip capacitor 8 and the top of the inner wall of the shell 1, and then the heat conducting plate 2 is used to support the top of the shell 1 to prevent pressure from being directly applied to the surface of the chip capacitor 8, thereby achieving the purpose of increasing the pressure resistance of the chip capacitor 8, and the setting of the rubber ring 4 and the rubber plate 5 forms a multi-layer seal inside the bottom ring 3, thereby maintaining the dry state of the main environment of the chip capacitor 8.

[0020] See also Figure 1-Figure 3As shown, a through hole is provided on the top of the shell 1, and a transparent plastic plate 10 and a support plate 13 are respectively arranged inside the through hole, the transparent plastic plate 10 is arranged above the support plate 13, and the support plate 13 is symmetrically installed on the inner wall of the through hole at equal intervals, and a humidity color-changing paper 12 is placed between the transparent plastic plate 10 and the support plate 13. The top of the transparent plastic plate 10 is flush with the top of the shell 1, and the diameter of the humidity color-changing paper 12 is greater than the distance between the support plates 13. The end of the heat conducting plate 2 is an arc surface, and the end of the heat conducting plate 2 is in contact with the outer wall of the chip capacitor 8, and the outer wall of the shell 1 and relative to the heat conducting plate 2 are symmetrically provided with heat dissipation grooves 11 at equal intervals.

[0021] Through the above technical solution: when inspecting the equipment, the operator can directly observe the color change of the humidity color-changing paper 12 above the support plate 13 through the transparent plastic plate 10, and use the humidity color-changing paper 12 to detect the humidity inside the shell 1, so that the operator can determine whether the chip capacitor 8 needs to be replaced. At the same time, the flush setting of the transparent plastic plate 10 makes the top of the shell 1 a plane, which facilitates the step of pressing and installing the shell 1 during installation. The design of the length of the support plate 13 limits the humidity color-changing paper 12 to move only between the transparent plastic plate 10 and the support plate 13, and prevents the humidity color-changing paper 12 from moving to the outside of the through hole, causing the operator to be unable to observe the humidity color-changing paper 12. In addition, the arc surface is used to increase the contact area between the heat conducting plate 2 and the chip capacitor 8, so that the heat generated during operation can be transferred from the heat conducting plate 2 to the shell 1 in time, and the surface area of ​​the shell 1 is increased in conjunction with the heat dissipation groove 11, thereby ensuring the heat dissipation effect of the chip capacitor 8.

[0022] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A pressure-resistant, moisture-resistant, and moisture-proof chip capacitor, characterized in that: The invention comprises a shell (1), a chip capacitor (8) and a bottom ring (3); the shell (1) is barrel-shaped, and a chip capacitor (8) is arranged inside the shell (1); the bottom ring (3) is arranged at the bottom of the shell (1), and a second tin ring (7) and a first tin ring (6) are arranged on the surface and side wall of the bottom ring (3), respectively; the second tin ring (7) and the first tin ring (6) are used for welding between the bottom ring (3) and the shell (1) and between the bottom ring (3) and the tin plate, respectively.

2. The pressure-resistant, moisture-resistant, and moisture-proof chip capacitor according to claim 1, characterized in that: A rubber disk (5) is fixedly arranged inside the bottom ring (3), through holes are symmetrically provided on the surface of the rubber disk (5), and the connection end of the chip capacitor (8) passes through the rubber disk (5) through the small hole, and a rubber ring (4) is installed at the bottom of the bottom ring (3).

3. The pressure-resistant, moisture-resistant, and moisture-proof chip capacitor according to claim 2, characterized in that: Heat conducting plates (2) are symmetrically arranged at equal intervals on the surface of the bottom ring (3) and inside the second tin ring (7); guide grooves (9) are symmetrically arranged at equal intervals on the inner wall of the outer shell (1); the heat conducting plates (2) are embedded in the guide grooves (9); and the height of the heat conducting plates (2) and the inside of the outer shell (1) are both greater than the height of the chip capacitor (8).

4. The pressure-resistant, moisture-resistant, and moisture-proof chip capacitor according to claim 3, characterized in that: The end of the heat conducting plate (2) is an arc-shaped surface, and the end of the heat conducting plate (2) is in contact with the outer wall of the chip capacitor (8), and the outer wall of the housing (1) is provided with heat dissipation grooves (11) symmetrically and at equal intervals relative to the position of the heat conducting plate (2).

5. The pressure-resistant, moisture-resistant, and moisture-proof chip capacitor according to claim 2, characterized in that: A through hole is provided at the top of the housing (1), and a transparent plastic plate (10) and a support plate (13) are respectively arranged inside the through hole. The transparent plastic plate (10) is arranged above the support plate (13), and the support plate (13) is symmetrically installed on the inner wall of the through hole at equal intervals. Humidity color-changing paper (12) is placed between the transparent plastic plate (10) and the support plate (13).

6. The pressure-resistant, moisture-resistant, and moisture-proof chip capacitor according to claim 5, characterized in that: The top of the transparent plastic plate (10) is flush with the top of the housing (1), and the diameter of the humidity color-changing paper (12) is greater than the distance between the support plates (13).

Images