Spray head structure and plasma etching system

Abstract

The utility model discloses a spray header structure and a plasma etching system. The spray header structure comprises a mounting seat and at least one blocking needle. The mounting base is provided with a plurality of first through holes, and a blocking needle is arranged in at least one first through hole. Wherein at least part of the blocking needles are provided with second through holes, the direction in which the blocking needles are inserted into the first through holes is the first direction, and the second through holes penetrate through the blocking needles in the first direction. The spray header structure provided by the utility model can finely adjust the passing airflow, thereby improving the etching uniformity of a plasma etching system using the spray header structure provided by the utility model.

Description

Technical Field

[0001] The utility model relates to the field of ion etching, in particular to a shower head structure and a plasma etching system. Background Art

[0002] Vacuum plasma etching is a technique used in semiconductor manufacturing that aims to precisely remove material on a silicon wafer or other substrate. Uniformity is a key factor in this process, as it ensures that the etching effect is consistent across the entire substrate. To achieve this, the gas needs to be evenly distributed through a special device - a showerhead.

[0003] The design of the showerhead is critical to etching uniformity. It first receives gas from the main pipeline and introduces it into a buffer zone. Next, the gas flows evenly to the substrate surface through the small holes in the showerhead. This uniform gas distribution helps ensure the consistency of the etching process.

[0004] However, because the holes in the showerhead are pre-drilled during the manufacturing process, they cannot be easily changed. This poses a problem: if the desired process requires a significant adjustment in gas flow or exceeds the rectification capabilities of the showerhead, etch uniformity may be severely affected.

[0005] To solve this problem, it is common practice to stick a metal sheet or high-temperature tape on the showerhead. Doing so can change the flow path of the gas, thereby improving etching uniformity. However, this method also has its disadvantages. For example, the adhesive in the tape or the organic matter in the tape itself may be released at high temperatures, forming particle contamination. In addition, long-term high temperatures may also cause the adhesive to solidify, be etched away, or fall off, thereby affecting the performance of the equipment. Utility Model Content

[0006] The main purpose of the utility model is to provide a shower head structure and a plasma etching system. The shower head structure can finely adjust the airflow passing through, thereby improving the etching uniformity of the plasma etching system using the shower head structure of the utility model.

[0007] To achieve the above-mentioned purpose, the embodiment of the first aspect of the utility model proposes a shower head structure, including a mounting seat and at least one blocking needle. The mounting seat has a plurality of first through holes, and at least one first through hole is provided with a blocking needle. Among them, at least some of the blocking needles have a second through hole, the direction in which the blocking needle is inserted into the first through hole is a first direction, and the second through hole passes through the blocking needle along the first direction.

[0008] In some embodiments, at least part of the blocking needles have a third through hole, the third through hole penetrates the blocking needles along the first direction, and the aperture of the third through hole is different from that of the second through hole.

[0009] In some embodiments, the opening shape of the third through hole includes but is not limited to a circle, a polygon and an ellipse.

[0010] In some embodiments, the blocking needle includes a connecting portion and a stopping portion, one end of the connecting portion is connected to the stopping portion, the connecting portion is arranged in the first through hole to connect the mounting seat and the blocking needle, and when viewed along the first direction, the opening of the first through hole is located inside the outer contour of the stopping portion.

[0011] In some embodiments, a surface of the stopper portion close to the connecting portion is perpendicular to an axis of the second through hole.

[0012] In some embodiments, the opening shape of the first through hole includes but is not limited to a circle, a polygon and an ellipse.

[0013] In some embodiments, the material of the blocking needle is the same as the material of the mounting seat.

[0014] In some embodiments, a plurality of first through holes are arrayed on the mounting base.

[0015] In some embodiments, the opening shape of the second through hole includes but is not limited to a circle, a polygon, and an ellipse.

[0016] Some embodiments of the second aspect of the present invention further provide a plasma etching system, comprising any of the above shower head structures, the plasma etching system comprising:

[0017] A gas supply system, used for introducing a mixed gas into a semiconductor reaction chamber;

[0018] A showerhead structure is used to rectify the mixed gas and guide the mixed gas to the semiconductor reaction chamber;

[0019] The semiconductor reaction chamber is used to input a mixed gas to etch a target material.

[0020] According to the above embodiments, the beneficial effects of the utility model are:

[0021] The shower head structure of the utility model includes a mounting hole and a blocking needle. The mounting hole is provided with a plurality of first through holes for airflow to pass through, and the blocking needle is inserted into at least part of the first through holes. Part of the blocking needles are solid, and part of the blocking needles are provided with second through holes. The direction in which the blocking needle is inserted into the first through hole is the first direction, the direction in which the airflow passes through the first through hole is the same as the first direction, and the second through hole passes through the blocking needle along the first direction.

[0022] The blocking needle is inserted into the first through hole, which can change the position of the mounting seat for airflow to pass, thereby affecting the airflow through the mounting seat to achieve the rectification of the airflow. Specifically, when the blocking needle is a solid structure, the blocking needle will block the first through hole that cooperates with it, so that the airflow cannot pass through there. Therefore, the blocking needle is inserted into the first through hole at a different position to rectify the airflow through the mounting seat. When the blocking needle is a hollow structure, the blocking needle has a second through hole that penetrates along the first direction. The aperture of the second through hole is smaller than the aperture of the first through hole. Therefore, when the hollow blocking needle is inserted into the first mounting hole, the flow rate of the airflow passing there is smaller than the flow rate directly through the first through hole. Therefore, the second through hole has a rectifying effect on the airflow passing through it. Therefore, by using a hollow blocking needle and a solid blocking needle in cooperation with each other, the airflow passing through the mounting seat can be rectified in a refined manner, thereby finely adjusting the stability of the gas flow to better improve the etching uniformity. Furthermore, in the shower head structure of the utility model, the blocking needle is installed in the first through hole in a plug-in manner, which is convenient for replacing and assembling the blocking needle, thereby facilitating the adjustment of the shower head mechanism to shape the shower head structure according to different requirements to meet different working needs.

[0023] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0025] Figure 1 It is a partial structural schematic diagram of a shower head structure in one embodiment of the utility model;

[0026] Figure 2 for Figure 1 A schematic diagram of the cross-sectional structure of;

[0027] Figure 3 This is a structural schematic diagram of a mounting base in one embodiment of the utility model;

[0028] Figure 4 This is a schematic diagram of the structure of the needle blocking in one embodiment of the utility model;

[0029] Figure 5 for Figure 4 Top view of the middle plugging needle;

[0030] Figure 6 This is a schematic diagram of the structure of a needle blocking device in another embodiment of the utility model;

[0031] Figure 7 for Figure 6 Top view of the middle plugging needle;

[0032] Figure 8 This is a schematic diagram of a top view of a needle blocking structure in another embodiment of the utility model;

[0033] Fig. 9 It is a schematic structural diagram of a plasma etching system in one embodiment of the utility model.

[0034] Description of Figure Numbers:

[0035] Sprinkler head structure 10;

[0036] Mounting seat 100; first through hole 110;

[0037] Needle blocking 200; connecting portion 210; stopping portion 220; second through hole 230; third through hole 240;

[0038] Substrate 20;

[0039] Mixed gas 30;

[0040] Uniform plasma40;

[0041] The first direction Y.

[0042] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0044] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0045] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or", "and / or" or "and / or" appears in the full text, its meaning includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0046] In the related technology, metal sheets or high-temperature tapes are attached to the showerhead to change the gas flow path, thereby improving etching uniformity. However, the organic matter in the adhesive or tape itself is easily precipitated by particles under high temperature, and the adhesive or tape itself has the risk of solidification, etching, and falling off after being exposed to continuous high temperature.

[0047] Reference below Figures 1 to 9 The showerhead structure 10 and the plasma etching system according to the embodiment of the present invention are described. The showerhead structure 10 has a rectifying effect on the airflow passing through it. Figure 1 In some embodiments, the shower head structure 10 includes a mounting hole and a blocking needle 200. The mounting hole is provided with a plurality of first through holes 110 for airflow to pass through, and the blocking needle 200 is inserted into at least part of the first through holes 110. Part of the blocking needle 200 is solid, and part of the blocking needle 200 is provided with a second through hole 230. The direction in which the blocking needle 200 is inserted into the first through hole 110 is the first direction Y, and the direction in which the airflow passes through the first through hole 110 is the same as the first direction Y, and the second through hole 230 passes through the blocking needle 200 along the first direction Y.

[0048] The blocking needle 200 is inserted into the first through hole 110, and can change the position of the mounting base 100 for airflow to pass through, thereby affecting the airflow passing through the mounting base 100 to achieve airflow rectification. Specifically, when the blocking needle 200 is a solid structure, the blocking needle 200 will block the first through hole 110 matched therewith, so that the airflow cannot pass therethrough, so the blocking needle 200 is inserted into the first through hole 110 at different positions to rectify the airflow passing through the mounting base 100. When the blocking needle 200 is a hollow structure, the blocking needle 200 has a second through hole 230 penetrating along the first direction Y, and the aperture of the second through hole 230 is smaller than the aperture of the first through hole 110, so when the hollow blocking needle 200 is inserted into the first mounting hole, the flow rate of the airflow passing therethrough is smaller than the flow rate directly passing through the first through hole 110, so the second through hole 230 has a rectifying effect on the airflow passing through it. Therefore, the hollow blocking needle 200 and the solid blocking needle 200 cooperate with each other to finely rectify the airflow passing through the mounting seat 100, thereby finely adjusting the stability of the airflow to better improve the etching uniformity. In addition, in the shower head structure 10 of the utility model, the blocking needle 200 is pluggable and installed in the first through hole 110, which is convenient for replacing and assembling the blocking needle 200, thereby facilitating the adjustment of the shower head mechanism, and shaping the shower head structure 10 according to different requirements to meet different working requirements.

[0049] Reference Figure 1 and Figure 2 The mounting base 100 controls the passage for the airflow through the blocking needle 200. For example, for the over-etched portion of the substrate, a solid blocking needle 200 is used to completely block the first through hole 110 at the corresponding position, or a blocking needle 200 with a second through hole 230 is used to reduce the airflow flow at that location. It can be understood that the blocking needle 200 is used in conjunction with the first through hole 110 to rectify the airflow through the mounting base 100, which is essentially to change the diameter of the first through hole 110 to change the airflow flow through the first through hole 110, so as to rectify the airflow through the mounting base 100.

[0050] According to the above principle, it can be understood that in some embodiments, two layers of mounting seats 100 are provided, and the first through holes 110 of the two layers of mounting seats 100 cooperate together for airflow to pass through. In order to adjust the shaping of the airflow by the mounting seats 100, the two layers of mounting seats 100 rotate relatively, so that part of the opening of the first through hole 110 of the lower mounting seat 100 is blocked by the upper mounting seat 100, and part of the opening of the first through hole 110 of the upper mounting seat 100 is blocked by the lower mounting seat 100, so that the diameter of the through hole for airflow to pass through formed by the first through hole 110 of the upper mounting seat 100 and the first through hole 110 of the lower mounting seat 100 changes, so the sprinkler head structure 10 provided in this way is conducive to adjusting its own structure, thereby changing the shaping effect of the airflow.

[0051] It is understandable that, in some embodiments, a paddle is provided to adjust the structure of the shower head, thereby changing the shaping effect on the airflow. Specifically, the paddle is provided near the opening of the first through hole 110 of the mounting base 100, the paddle can rotate in a plane parallel to the surface of the mounting base 100, and the paddle is connected to the mounting base 100 on the side where the airflow flows out of the mounting base 100. In some cases, the paddle avoids the opening of the first through hole 110, and the airflow passes through the first through hole 110; in some cases, the paddle rotates to block the opening of the first through hole 110, and the airflow is blocked by the paddle when it flows out of the first through hole 110, thereby being rectified; in some cases, the paddle rotates to completely block the opening of the first through hole 110 to block the airflow that is about to pass through the mounting base 100 from there, thereby rectifying the airflow passing through the mounting base 100.

[0052] Reference Figures 4 to 8 and Figure 2 In some embodiments, part of the blocking needle 200 further includes a third through hole 240, and the third through hole 240 penetrates the blocking needle 200 along the first direction Y. When the blocking needle 200 having the third through hole 240 is disposed at the first through hole 110, the airflow can pass through the mounting base 100 from the third through hole 240. Since the opening of the third through hole 240 is smaller than the first through hole 110, the flow rate of the airflow passing through the third through hole 240 is different from the flow rate through the first through hole 110. Also, since the aperture of the third through hole 240 is different from that of the second through hole 230, the flow rate of the airflow passing through the third through hole 240 is different from the flow rate through the second through hole 230. Therefore, the third through hole 240 cooperates with the second through hole 230 and the first through hole 110 to more finely rectify the airflow passing through the mounting base 100.

[0053] Of course, it is understandable that the shape of the third through hole 240 includes but is not limited to circular, deformed and elliptical, and the flow rate of the airflow through the third through hole 240 is different from the flow rate through the first through hole 110 and the flow rate of the second through hole 230.

[0054] Reference Figure 2 and Figure 4In some embodiments, the blocking needle 200 includes a connecting portion 210 and a stopper 220, and one end of the connecting portion 210 is connected to the stopper 220. The connecting portion 210 is provided at the first through hole 110, so as to realize the assembly of the blocking needle 200 and the mounting seat 100. It can be understood that, in some embodiments, the connecting portion 210 and the first through hole 110 are clearance-matched to facilitate the assembly and disassembly of the blocking needle 200 and the mounting seat 100. The stopper 220 of the blocking needle 200 is connected to the connecting portion 210, and the stopper 220 is located on the side of the first through hole 110 relative to the mounting seat 100 where the airflow enters. When viewed along the first direction Y, the opening of the first through hole 110 is located inside the outer contour of the stopper 220, that is, the stopper 220 covers the opening of the first through hole 110. Therefore, when a solid blocking needle 200 is used, the airflow is blocked by the stopper 220 at the insertion position of the blocking needle 200 and cannot pass through the mounting base 100; when a hollow blocking needle 200 is used, the airflow passes through the mounting base 100 and is rectified by the second through hole 230 and / or the third through hole 240, so that the sprinkler head structure 10 rectifies the airflow passing through it.

[0055] Of course, it is understandable that in some embodiments, the blocking needle 200 does not include the stopper 220. Specifically, the blocking needle 200 and the first through hole 110 are interference fit. When a solid blocking needle 200 is used, the airflow is blocked by the blocking needle 200 at the insertion position of the blocking needle 200 and cannot pass through the mounting seat 100; when a hollow blocking needle 200 is used, the airflow passes through the mounting seat 100 and is rectified by the second through hole 230 and / or the third through hole 240, so that the shower head structure 10 rectifies the airflow passing through it.

[0056] Reference Figure 2 , Figure 4 and Figure 6 In some embodiments, the surface of the stopper 220 close to the connecting portion 210 is perpendicular to the axis of the second through hole 230. This configuration allows the stopper 220 to fit the surface of the mounting seat 100 on the airflow inlet side, so that the blocking needle 200 can be installed on the mounting seat 100 more stably.

[0057] Reference Figure 3 In some embodiments, the shape of the first through hole 110 includes but is not limited to a circle, a polygon and an ellipse. The first through hole 110 can be used for airflow to pass through and for the plugging needle 200 to be installed. The first through hole 110 configured for airflow to pass through is configured in this way to shape the airflow passing through it.

[0058] In some embodiments, the material of the blocking needle 200 is the same as that of the mounting base 100 to prevent the introduction of impurities during the use of the showerhead structure 10 .

[0059] Reference Figure 3In some embodiments, a plurality of first through holes 110 are arrayed on the mounting base 100 to optimize the rectifying effect of the showerhead structure 10 .

[0060] Of course, it is understandable that the apertures of the first through holes 110 can be uniform or different in size. The first through holes 110 can be evenly spaced on the mounting base 100 , or unevenly spaced on the mounting base 100 .

[0061] In some embodiments, the size of the mounting base 100 is larger along the first direction Y. This configuration extends the length of the first through hole 110, and extends the lengths of the second through hole 230 and the third through hole 240 of the plugging needle 200 installed at the first through hole 110. The first through hole 110, the second through hole 230, and the third through hole 240 have a better shaping effect on the airflow, thereby optimizing the rectifying effect of the shower head structure 10.

[0062] Reference Figure 1 , Figure 6 and Figure 7 In some embodiments, the shape of the second through hole 230 includes but is not limited to a circle, a polygon and an ellipse. The flow rate of the airflow through the second through hole 230 is different from the flow rate through the first through hole 110 and the flow rate through the third through hole 240.

[0063] Reference Fig. 9 The embodiment of the second aspect of the utility model provides a plasma etching system, which includes a gas supply system, the above-mentioned shower head structure 10 and a semiconductor reaction chamber. The gas supply system is used to introduce a mixed gas 30 into the semiconductor reaction chamber, and the shower head structure 10 is used to rectify the mixed gas 30. The mixed gas 30 flows into the semiconductor reaction chamber after being rectified by the shower head structure 10. The semiconductor reaction chamber is used to input the mixed gas 30 to etch the target material.

[0064] In some embodiments, the plasma etching system of the utility model is used for vacuum plasma etching. Vacuum plasma etching is a process that uses ions and high-energy particles in plasma to physically and chemically etch the surface of a material. Under vacuum conditions, active particles in the plasma (such as ions, excited molecules, free radicals, etc.) react with the surface of the material, resulting in the removal of atoms or molecules on the surface of the material, thereby forming micro pits and grooves, increasing the specific surface area, and improving the wetting performance.

[0065] In the preparation stage of vacuum plasma etching, a suitable etching process is selected, a substrate 20 is prepared, and the substrate 20 is loaded. According to the properties and requirements of the material to be etched, a suitable plasma etching process is selected, such as deep reactive ion etching (DRIE), high-density plasma etching (HDP), etc. Preparation of the substrate 20 requires pretreatment work such as cleaning and removing the oxide layer of the substrate 20 to be etched to ensure the cleanliness and flatness of the surface of the substrate 20. At the same time, according to the process requirements, a mask layer is made on the substrate 20 to define the etching pattern. When loading the substrate 20, the prepared substrate 20 is placed on the substrate 20 holder of the vacuum plasma etching system and fixed. Ensure that the substrate 20 does not move or rotate during the etching process.

[0066] Then the plasma etching system starts to evacuate the vacuum chamber. Specifically, the vacuum chamber is closed first, and the vacuum pump is started to evacuate the chamber. The vacuum pump extracts the gas molecules in the vacuum chamber through a mechanical pump or a molecular pump to achieve a certain vacuum degree inside the chamber. At the same time, the vacuum degree in the vacuum chamber is monitored in real time through sensors such as vacuum gauges to ensure that it is within the range required by the process.

[0067] Then, according to the requirements of the etching process, the corresponding gas is introduced into the vacuum chamber through the gas supply system. Commonly used gases include argon, oxygen, fluorine, etc., which play different roles in plasma, such as generating ions, promoting chemical reactions, etc. Start the plasma generator, the RF power supply outputs RF energy, and couples the energy into the gas through the electrode. Under the action of RF energy, the gas molecules are excited and ionized to form a plasma containing high-energy ions and active particles. Near the surface of the substrate 20, due to the mass difference between electrons and ions, a plasma sheath is formed. The electric field in the sheath accelerates the movement of ions to the surface of the substrate 20, while shielding the bombardment of the substrate 20 by electrons. Under the action of the electric field, the high-energy ions bombard the surface of the substrate 20 at a certain angle, causing physical sputtering. In addition, the active particles react chemically with the surface material of the substrate 20 to generate volatile substances, thereby realizing chemical etching. These two effects work together to achieve effective removal of materials.

[0068] It is understandable that the novel plasma etching system uses the shower head structure 10 to adjust the flow of the mixed gas 30 to obtain a uniform plasma 40 to optimize key indicators such as etching rate, selectivity (ie, etching rate ratio between different materials) and cross-sectional morphology.

[0069] Specifically, refer to Figure 1 , Figure 2 , Figure 4 , Figure 6 and Fig. 9In some embodiments, the shower head structure 10 includes a mounting hole and a blocking needle 200. The mounting hole is provided with a plurality of first through holes 110 for airflow to pass through, and the blocking needle 200 is inserted into at least part of the first through holes 110. Part of the blocking needle 200 is solid, and part of the blocking needle 200 is provided with a second through hole 230. The direction in which the blocking needle 200 is inserted into the first through hole 110 is the first direction Y, and the direction in which the airflow passes through the first through hole 110 is the same as the first direction Y, and the second through hole 230 passes through the blocking needle 200 along the first direction Y.

[0070] The blocking needle 200 is inserted into the first through hole 110, and can change the position of the mounting base 100 for airflow to pass through, thereby affecting the airflow passing through the mounting base 100 to achieve airflow rectification. Specifically, when the blocking needle 200 is a solid structure, the blocking needle 200 will block the first through hole 110 matched therewith, so that the airflow cannot pass therethrough, so the blocking needle 200 is inserted into the first through hole 110 at different positions to rectify the airflow passing through the mounting base 100. When the blocking needle 200 is a hollow structure, the blocking needle 200 has a second through hole 230 penetrating along the first direction Y, and the aperture of the second through hole 230 is smaller than the aperture of the first through hole 110, so when the hollow blocking needle 200 is inserted into the first mounting hole, the flow rate of the airflow passing therethrough is smaller than the flow rate directly passing through the first through hole 110, so the second through hole 230 has a rectifying effect on the airflow passing through it. Therefore, the hollow blocking needle 200 and the solid blocking needle 200 cooperate with each other to finely rectify the airflow passing through the mounting seat 100, thereby finely adjusting the stability of the airflow to better improve the etching uniformity. In addition, in the shower head structure 10 of the utility model, the blocking needle 200 is pluggable and installed in the first through hole 110, which is convenient for replacing and assembling the blocking needle 200, thereby facilitating the adjustment of the shower head mechanism, so as to shape the shower head structure 10 according to different requirements to meet different working requirements.

[0071] The above are only preferred embodiments of the present invention, and do not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the utility model concept, or directly / indirectly used in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A shower head structure for an ion etching system, characterized in that: The shower head structure comprises: A mounting seat, wherein the mounting seat has a plurality of first through holes; At least one blocking needle, wherein at least one of the first through holes is provided with the blocking needle; Wherein, at least part of the blocking needles have a second through hole, the direction in which the blocking needles are inserted into the first through holes is a first direction, and the second through holes penetrate the blocking needles along the first direction.

2. The shower head structure according to claim 1, characterized in that: At least part of the blocking needles has a third through hole, the third through hole penetrates the blocking needles along the first direction, and the aperture of the third through hole is different from that of the second through hole.

3. The shower head structure according to claim 2, characterized in that: The opening shape of the third through hole includes a circle, a polygon and an ellipse.

4. The shower head structure according to claim 1, characterized in that: The blocking needle includes a connecting portion and a stopping portion, one end of the connecting portion is connected to the stopping portion, the connecting portion is arranged in the first through hole to connect the mounting seat and the blocking needle, and when viewed along the first direction, the opening of the first through hole is located inside the outer contour of the stopping portion.

5. The shower head structure according to claim 4, characterized in that: A surface of the stopper portion close to the connecting portion is perpendicular to an axis of the second through hole.

6. The shower head structure according to claim 1, characterized in that: The opening shape of the first through hole includes a circle, a polygon and an ellipse.

7. The shower head structure according to claim 1, characterized in that: The material of the blocking needle is the same as that of the mounting seat.

8. The shower head structure according to claim 1, characterized in that: A plurality of the first through holes are arrayed on the mounting base.

9. The shower head structure according to claim 1, characterized in that: The opening shape of the second through hole includes a circle, a polygon and an ellipse.

10. A plasma etching system, using the shower head structure according to any one of claims 1 to 9, characterized in that: The plasma etching system comprises: A gas supply system, used for introducing a mixed gas into a semiconductor reaction chamber; The shower head structure is used to rectify the mixed gas and guide the mixed gas to the semiconductor reaction chamber; The semiconductor reaction chamber is used to input the mixed gas to etch the target material.

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