Wafer cleaning device

Abstract

The utility model discloses a wafer cleaning device, and relates to the technical field of semiconductor manufacturing. The first bases are arranged at four corners of the wafer; a first groove is formed in the upper end of the first driving part; a second base; a second groove is formed in the upper end of the second driving part; a driving device; the positioning pieces are arranged on the two sides of the second driving piece, the periphery of the wafer is clamped by arranging the first driving piece and the first groove, the two sides of the wafer are clamped by arranging the second driving piece and the second groove, and when the flat edge of the wafer rotates to the position between the first driving piece and the second driving piece, the positioning pieces are arranged; the positioning part replaces the first driving part and the second driving part for positioning, so that the wafer is prevented from deviating, the problem that the position of the wafer deviates during cleaning is solved, and the position of the wafer cannot deviate during cleaning.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a wafer cleaning device. Background Art

[0002] The wafer manufacturing process usually includes many steps such as photolithography, ion implantation, etching, and vapor deposition. After the relevant steps, the wafer usually needs to be cleaned to remove impurities on the wafer surface. If the wafer is not cleaned sufficiently, impurities will remain on the wafer surface, and the wafer may be damaged in the next step, resulting in scrap. Therefore, the wafer cleaning process is very important.

[0003] During the rotation of the existing wafer, since the distance between the two wheels of the cleaning device is greater than or equal to the flat edge of the wafer, when the flat edge of the wafer rotates between the two wheels, there will be a moving gap of 1-3mm in the movement of the wafer, causing the positioning of the two wheels to fail at the same time. The wafer shifts under the force of the brush, causing the wafer to be hit when it is taken out, causing the wafer to break.

[0004] Therefore, we need a wafer cleaning device to solve the problem that the wafer position will shift during the cleaning process, causing the wafer to be broken, and to keep the wafer position from shifting during the cleaning process. Utility Model Content

[0005] The purpose of the present application is to solve the problem that the position of the wafer will shift during cleaning. In order to solve the above problem, the present application provides a wafer cleaning device that can prevent the position of the wafer from shifting during cleaning.

[0006] To achieve the above-mentioned purpose, the embodiment of the present application adopts the following technical scheme: a wafer; a first base, the first base is arranged at the four corners of the wafer; a first driving member, the first driving member is arranged above the first base, the first driving member is movably connected to the first base, the first driving member is arranged in a cylindrical shape, and a first groove is arranged on the upper end of the first driving member; a second base, the second base is arranged on both sides of the wafer, the second base is connected to the first base, and the second base is located outside the center point of the first base; a second driving member, the second driving member is arranged at the upper end of the middle part of the second base, and a second groove is arranged on the upper end of the second driving member; a driving device, the driving device connects the first driving member and the second driving member; a positioning member, the positioning member is arranged on both sides of the second driving member, the upper end of the positioning member is cylindrical, the height of the positioning member is the same as that of the first base and the second base, the positioning member is located inside the center point of the second base, and the positioning member is located outside the center point of the first base; the first groove on the first driving member clamps the four corners of the wafer, and the second groove on the second driving member clamps the two sides of the wafer, the driving device is started, the first driving member and the second driving member rotate in the same direction to drive the wafer to rotate, and the positioning member rotates when the wafer rotates to the first position.

[0007] In the above technical scheme, the embodiment of the present application is as follows: a first driving member and a first groove are set to clamp the wafer on all sides, a second driving member and a second groove are set to clamp the wafer on both sides, and a positioning member is set. When the flat edge of the wafer is transferred between the first driving member and the second driving member, the positioning member replaces the first driving member and the second driving member to perform positioning, thereby preventing the wafer from shifting, solving the problem of the wafer shifting during cleaning, and preventing the wafer from shifting during cleaning.

[0008] Further, according to an embodiment of the present application, the positioning member includes:

[0009] A positioning pin, which is arranged at the upper end of the second base and is connected to the second base;

[0010] The positioning column is arranged at the upper end of the positioning pin, and the upper end of the positioning column is arranged in a cylindrical shape.

[0011] Further, according to an embodiment of the present application, a bearing is arranged at the upper end of the positioning pin, and the bearing connects the positioning pin and the positioning column.

[0012] Further, according to an embodiment of the present application, the outer diameter of the positioning column is arranged tangent to the outer diameter of the wafer.

[0013] Further, according to an embodiment of the present application, the outer diameter of the first groove is set tangent to the outer diameter of the wafer, and the outer diameter of the second groove is set tangent to the outer diameter of the wafer.

[0014] Further, according to an embodiment of the present application, the width of the middle portion of the first groove is greater than the thickness of the wafer, and the width of the middle portion of the second groove is greater than the thickness of the wafer.

[0015] Further, according to an embodiment of the present application, two sides of the first groove are arranged to be inclined outward, and the second groove is arranged to be inclined outward.

[0016] Further, according to an embodiment of the present application, the first base, the second base, the first driving member, the second driving member, and the positioning member are all configured as a symmetrical structure, and the center of symmetry is the center axis of the wafer.

[0017] Further, according to an embodiment of the present application, the third groove is arranged on both sides of the second base.

[0018] Further, according to an embodiment of the present application, the first base is disposed in the third groove.

[0019] Compared with the prior art, the present application has the following beneficial effects: the present application arranges a first drive member and a first groove to clamp the wafer on all sides, arranges a second drive member and a second groove to clamp the wafer on both sides, and arranges a positioning member. When the flat edge of the wafer is transferred between the first drive member and the second drive member, the positioning member replaces the first drive member and the second drive member to perform positioning, thereby preventing the wafer from shifting, solving the problem of the wafer shifting during cleaning, and preventing the wafer from shifting during cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present application is further described below in conjunction with the accompanying drawings and embodiments.

[0021] Figure 1 An axonometric view of a wafer cleaning apparatus.

[0022] Figure 2 A top view of a wafer cleaning device.

[0023] Figure 3 yes Figure 2 "AA" section view of the.

[0024] Figure 4 yes Figure 2 "BB" section view of the.

[0025] Figure 5 It is a front view of the improved first base and the first driving member.

[0026] Figure 6 yes Figure 5 "CC" section view of the .

[0027] Figure 7 yes Figure 6 "DD" section view.

[0028] Figure 8 This is a front view of the improved second base and the second driving member.

[0029] Fig. 9 yes Figure 8 "EE" section view of the device.

[0030] Fig.10 yes Fig. 9 "FF" cross-sectional view.

[0031] Fig.11 It is a top view of the improved second base.

[0032] In the attached figure

[0033] 1. Wafer 2. First base 3. First driving member

[0034] 31, first valve body 311, fourth groove 32, first groove

[0035] 33, first valve cover 4, second base 41, third groove

[0036] 42, ratchet part 42, pawl part 5, second driving member

[0037] 51, second groove 52, second valve body 521, fifth groove

[0038] 53. Second valve cover 6. Driving device 7. Positioning member

[0039] 71, positioning pin 72, positioning column 8, bearing DETAILED DESCRIPTION

[0040] In order to make the purpose and technical solution of the utility model clearly and completely described, and the advantages more clearly understood, the embodiments of the utility model are further described in detail in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are part of the embodiments of the utility model, not all of the embodiments, and are only used to explain the embodiments of the utility model, and are not used to limit the embodiments of the utility model. All other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0041] In the description of the present utility model, it should be noted that the terms "center", "middle", "upper", "lower", "left", "right", "inner", "outer", "top", "bottom", "side", "vertical", "horizontal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "one", "first", "second", "third", "fourth", "fifth", "sixth" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0042] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] For the purpose of simplicity and illustration, the principles of the embodiments are described primarily by reference to examples. In the following description, many specific details are presented to provide a thorough understanding of the embodiments. However, it is apparent that, for those of ordinary skill in the art, these embodiments may not be limited to these specific details in practice. In some instances, known methods and apparatus are not described in detail to avoid making these embodiments unnecessarily difficult to understand. In addition, all embodiments may be used in combination with each other.

[0044] Embodiment 1: Figure 1-4 As shown, a wafer 1 cleaning device includes: a wafer 1; a first base 2, the first base 2 is arranged at the four corners of the wafer 1, a first driving member 3, the first driving member 3 is arranged above the first base 2, the first driving member 3 is movably connected to the first base 2, the first driving member 3 is arranged in a cylindrical shape, and a first groove 32 is arranged on the upper end of the first driving member 3; a second base 4, the second base 4 is arranged on both sides of the wafer 1, the second base 4 is connected to the first base 2, and the second base 4 is located outside the center point of the first base 2; a second driving member 5, the second driving member 5 is arranged at the upper end of the middle part of the second base 4, and a second groove 51 is arranged on the upper end of the second driving member 5, the first groove 32 on the first driving member 3 and the second groove 51 on the second driving member 5 respectively clamp the four corners and both sides of the wafer 1 to ensure the stability and safety of the wafer 1 during the cleaning process.

[0045] The driving device 6 connects the first driving member 3 and the second driving member 5 .

[0046] The positioning member 7 is arranged on both sides of the second driving member 5. The upper end of the positioning member 7 is cylindrical. The height of the positioning member 7 is the same as that of the first base 2 and the second base 4. The positioning member 7 is located on the inner side of the center point of the second base 4, and the positioning member 7 is located on the outer side of the center point of the first base 2. The positioning member 7 is arranged so that when the flat edge of the wafer 1 is transferred to between the first driving member 3 and the second driving member 5, the positioning member 7 replaces the first driving member 3 and the second driving member 5 for positioning, thereby preventing the wafer 1 from shifting, solving the problem that the position of the wafer 1 will shift during cleaning, and preventing the position of the wafer 1 from shifting during cleaning.

[0047] The first groove 32 on the first driving member 3 clamps the four corners of the wafer 1, and the second groove 51 on the second driving member 5 clamps the two sides of the wafer 1. The driving device 6 is started, and the first driving member 3 and the second driving member 5 rotate in the same direction to drive the wafer 1 to rotate. When the wafer 1 rotates to the first position, the positioning member 7 rotates.

[0048] The positioning member 7 includes: a positioning pin 71, which is arranged at the upper end of the second base 4 and connected to the second base 4; a positioning column 72, which is arranged at the upper end of the positioning pin 71 and is arranged in a cylindrical shape; a bearing 8, which is arranged at the upper end of the positioning pin 71 and connects the positioning pin 71 and the positioning column 72. By arranging the positioning member 7 in multiple modules and connecting the positioning pin 71 and the positioning column 72 by arranging the bearing 8, it is ensured that the positioning column 72 can rotate smoothly on the positioning pin 71. The purpose of doing so is that when the device is running, when the flat edge of the wafer 1 is transferred between the first drive member 3 and the second drive member 5, the positioning member 7 replaces the first drive member 3 and the second drive member 5 for positioning, preventing the wafer 1 from shifting, and can rotate smoothly without uneven cleaning or damage to the wafer 1 due to the poor movement of the positioning member 7.

[0049] The outer diameter of the positioning post 72 is tangent to the outer diameter of the wafer 1, the outer diameter of the first groove 32 is tangent to the outer diameter of the wafer 1, and the outer diameter of the second groove 51 is tangent to the outer diameter of the wafer 1. The outer diameters of the positioning post 72, the first groove 32, and the second groove 51 are designed to be tangent to the outer diameter of the wafer 1, which can ensure that the wafer 1 is accurately and firmly positioned in the device. When the positioning post 72 is tangent to the outer diameter of the wafer 1, the wafer 1 can be rotated along the axis without generating additional offset or swing, thereby ensuring the stability of the wafer 1 during the cleaning process.

[0050] The middle width of the first groove 32 is greater than the thickness of the wafer 1, the middle width of the second groove 51 is greater than the thickness of the wafer 1, the two sides of the first groove 32 are set to be inclined outward, and the second groove 51 is set to be inclined outward. The setting of the first groove 32 and the second groove 51 takes into account the thickness of the wafer 1. The middle width is greater than the thickness of the wafer 1, and the two sides are inclined outward, so that the contact between the wafer 1 and the groove is closer. When the wafer 1 rotates, if it shakes up and down, the inclined setting can make the wafer 1 return to the middle of the first groove 32 and the second groove 51, so that the cleaning of the wafer 1 is more stable, and the clamping effect and cleaning efficiency are improved.

[0051] The first base 2, the second base 4, the first driving member 3, the second driving member 5, and the positioning member 7 are all arranged as a symmetrical structure, with the center of symmetry being the central axis of the wafer 1. The symmetrical structure can keep the entire device balanced during rotation, avoiding the breakage of the wafer 1 caused by unbalanced force and swinging due to uneven distribution of components, thereby ensuring the stability and reliability of the device operation.

[0052] The third groove 41 is arranged on both sides of the second base 4 , and the first base 2 is arranged in the third groove 41 .

[0053] The wafer 1 is clamped on all sides by setting the first driving member 3 and the first groove 32, and the wafer 1 is clamped on both sides by setting the second driving member 5 and the second groove 51. When the flat edge of the wafer 1 is transferred between the first driving member 3 and the second driving member 5, the positioning member 7 replaces the first driving member 3 and the second driving member 5 for positioning, thereby preventing the wafer 1 from shifting, solving the problem of the wafer 1 shifting during cleaning, and preventing the wafer 1 from shifting during cleaning.

[0054] Embodiment 2: Figure 5-10 As shown, based on the first embodiment, this embodiment further improves the first driving member 3 and the second driving member 5. The first driving member 3 also includes: a first valve body 31, and a fourth groove 311 is arranged on the upper end of the first valve body 31. The fourth groove 311 is arranged in a "convex" shape, and both ends of the fourth groove 311 are arranged to be hollow.

[0055] The first valve cover 33 is disposed at the upper end of the first valve body 31 , and two protrusions are disposed at the lower end of the first valve cover 33 , and the two protrusions correspond to the hollow parts of the fourth groove 311 of the first valve cover 33 .

[0056] The second driving member 5 further includes: a second valve body 52 , a fifth groove 521 is arranged at the upper end of the valve body, the fifth groove 521 is arranged to be convex, and both ends of the fifth groove 521 are arranged to be hollow.

[0057] The second valve cover 53 is disposed at the upper end of the second valve body 52 . Two protrusions are disposed at the lower end of the second valve cover 53 . The two protrusions correspond to the hollow parts of the fifth groove 521 of the second valve cover 53 .

[0058] The first valve body 31 and the first valve cover 33 are provided so that the first valve cover 33 can be removed. The convex block of the first valve cover 33 is placed in the hollow of the fourth groove 311, and the first valve body 31 and the first valve cover 33 are rotated along the "convex" lower end of the fourth groove 311 to lock the first valve body 31 and prevent the first valve cover 33 from loosening during the rotation of the wafer 1 and causing the wafer 1 to fall off. The second driving member 5 is configured in the same way as the first driving member 3. When a wafer 1 is cleaned, the first valve cover 33 and the second valve cover 53 can be reset to remove the first valve cover 33 and the second valve cover 53, and the wafer 1 can be smoothly taken out from above, ensuring that the wafer 1 is not fragmented due to the clamping of the first groove 32 and the second groove 51 during the removal process after cleaning.

[0059] Embodiment 3: Figure 8-10 As shown, based on the first embodiment, the second base 4 is further improved in this embodiment, and the second base 4 further includes:

[0060] Ratchet parts 42, which are arranged at two ends of the second base 4;

[0061] A pawl portion 42, the pawl portion 42 is connected with the ratchet portion 42, and the pawl portion 42 is a bidirectional pawl;

[0062] When the wafer 1 needs to be placed in the device, the pawl portion 42 rotates outward through the ratchet portion 42, and the first base 2 can move outward through the fourth groove 311, providing more space for placing the wafer 1 in the device. The first base 2 is placed too close, resulting in the wafer 1 being stuck by the first bases 2 on both sides when it is placed, causing fragments. After the placement is completed, the pawl portion 42 resets to clamp the wafer 1, which can make the placement position more precise and make the wafer 1 more stable when rotating.

[0063] Embodiment 4: Figure 1-11 As shown, based on embodiments 1-3, this embodiment further provides a method for using a wafer 1 cleaning device, including:

[0064] The pawl portion 42 rotates outward along the third groove 41 through the ratchet portion 42;

[0065] The convex block of the first valve cover 33 is rotated to correspond to the hollow portion of the fourth groove 311 of the first valve body 31, and the first valve cover 33 is removed;

[0066] The protrusion of the second valve cover 53 is rotated to correspond to the hollow part of the fifth groove 521 of the second valve body 52, and the second valve cover 53 is removed;

[0067] Place the wafer 1 on the first groove 32 and the second groove 51, and reset the pawl portion 42, the first valve cover 33, and the second valve cover 53 to complete the clamping of the wafer 1;

[0068] The driving device 6 is started, and the driving device 6 drives the first driving member 3 and the second driving member 5 to rotate;

[0069] When the flat edge of the wafer 1 turns to between the first driving member 3 and the second driving member 5, the positioning member 7 replaces the first driving member 3 and the second driving member 5 for positioning, preventing the wafer 1 from shifting, solving the problem of the wafer 1 shifting during cleaning, and preventing the wafer 1 from shifting during cleaning.

[0070] Although the above describes the illustrative specific implementation methods of the present application so that technicians in this technical field can understand the present application, the present application is not limited to the scope of the specific implementation methods. For ordinary technicians in this technical field, as long as various changes are within the spirit and scope of the present application defined and determined by the attached claims, all application creations using the concept of the present application are protected.

Claims

1. A wafer cleaning device, characterized in that: include: Wafer; A first base, wherein the first base is arranged at four corners of the wafer; A first driving member, the first driving member is arranged above the first base, the first driving member is movably connected to the first base, the first driving member is arranged in a cylindrical shape, and a first groove is arranged at an upper end of the first driving member; A second base, the second base is arranged on both sides of the wafer, the second base is connected to the first base, and the second base is located outside the center point of the first base; A second driving member, the second driving member is arranged at the upper end of the middle part of the second base, and a second groove is arranged at the upper end of the second driving member; a driving device, the driving device connecting the first driving member and the second driving member; A positioning member, the positioning member is arranged on both sides of the second driving member, the upper end of the positioning member is cylindrical, the height of the positioning member is the same as that of the first base and the second base, the positioning member is located on the inner side of the center point of the second base, and the positioning member is located on the outer side of the center point of the first base; The first groove on the first driving member clamps the four corners of the wafer, and the second groove on the second driving member clamps the two sides of the wafer. The driving device is started, and the first driving member and the second driving member rotate in the same direction to drive the wafer to rotate. The positioning member rotates when the wafer rotates to the first position.

2. A wafer cleaning device according to claim 1, characterized in that: The positioning member comprises: A positioning pin, the positioning pin is arranged at the upper end of the second base, and the positioning pin is connected to the second base; A positioning column is arranged at the upper end of the positioning pin, and the upper end of the positioning column is arranged in a cylindrical shape.

3. A wafer cleaning device according to claim 2, characterized in that: A bearing is arranged at the upper end of the positioning pin, and the bearing connects the positioning pin and the positioning column.

4. A wafer cleaning device according to claim 2, characterized in that: The outer diameter of the positioning column is arranged tangent to the outer diameter of the wafer.

5. The wafer cleaning device according to claim 1, characterized in that: The outer diameter of the first groove is tangent to the outer diameter of the wafer, and the outer diameter of the second groove is tangent to the outer diameter of the wafer.

6. The wafer cleaning device according to claim 1, characterized in that: The width of the first groove in the middle is greater than the thickness of the wafer, and the width of the second groove in the middle is greater than the thickness of the wafer.

7. The wafer cleaning device according to claim 1, characterized in that: Both sides of the first groove are arranged to be inclined outwards, and the second groove is arranged to be inclined outwards.

8. The wafer cleaning device according to claim 1, characterized in that: The first base, the second base, the first driving member, the second driving member, and the positioning member are all configured as symmetrical structures, and the center of symmetry is the central axis of the wafer.

9. The wafer cleaning device according to claim 1, characterized in that: A third groove is provided on both sides of the second base.

10. The wafer cleaning device according to claim 9, characterized in that: The first base is disposed in the third groove.

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