Wafer bearing mechanism

Abstract

The utility model provides a wafer bearing mechanism. The wafer bearing mechanism comprises a supporting assembly; the two mounting plates are symmetrically arranged on the supporting assembly, and the two mounting plates are rotationally arranged on the supporting assembly; the two bearing plates are symmetrically arranged on one side of the mounting plate, the two ends of the bearing plates are rotationally connected to the mounting plate through rotating shafts, and grooves used for bearing wafers are formed in the bearing plates; and the locking assemblies are used for locking the two bearing plates and are uniformly arranged at four corners of the two mounting plates. According to the utility model, the mounting plate is rotated to drive the bearing plate, so that the wafer on the bearing plate rotates, the rotating shaft is rotated to drive the bearing plate, so that the wafer can rotate, and the rotating shaft can control the bearing plate on one side to rotate, so that the front surface and the back surface of the wafer can be exchanged; and therefore, scratches on the surface of the wafer when the front surface and the back surface of the wafer are grabbed and exchanged can be effectively avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer containers, in particular to a wafer bearing mechanism. Background Art

[0002] Wafer refers to the round wafer used in the initial stage of manufacturing semiconductor devices and integrated circuits. Its raw materials include silicon, silicon carbide, gallium arsenide, silicon nitride, aluminum nitride, etc. Taking silicon wafer as an example, high-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single crystal silicon rod. The single crystal silicon rod is then processed by outer diameter grinding, slicing, rounding, surface polishing, etc. to form a silicon wafer. In the process of processing wafers into semiconductor devices and integrated circuits, a container for holding wafers, namely a wafer carrier box (also called a carrier box, wafer box, etc.), is required for temporary storage and transfer of wafers.

[0003] When processing a wafer, sometimes the front side of the wafer needs to be used as the processing surface, and sometimes the back side of the wafer needs to be used as the processing surface, so the front side and the back side of the wafer need to be swapped.

[0004] In the prior art, in order to swap the front and back sides of a wafer, a robot is usually used to grab the wafer to swap the front and back sides of the wafer. However, the robot may damage the surface of the wafer during the grabbing process, thus affecting the processing efficiency of the wafer. Utility Model Content

[0005] Based on this, the purpose of the present invention is to provide a wafer carrying mechanism to at least solve the above-mentioned deficiencies in the prior art.

[0006] The utility model provides a wafer carrying mechanism, comprising:

[0007] Support components;

[0008] Two mounting plates are symmetrically arranged on the support assembly, and both mounting plates are rotatably arranged on the support assembly;

[0009] Two supporting plates are symmetrically arranged on one side of the mounting plate, and the two ends of the supporting plates are rotatably connected to the mounting plate through a rotating shaft, and the supporting plates are provided with grooves for carrying wafers;

[0010] A plurality of locking components for locking the two bearing plates, evenly arranged at the four corners of the two mounting plates;

[0011] The two mounting plates are rotated so that the two mounting plates drive the wafer to rotate via the rotating shaft and the supporting plate.

[0012] Compared with the prior art, the beneficial effects of the utility model are: the carrier plate is driven by rotating the mounting plate, so that the wafer on the carrier plate is rotated, and the carrier plate is driven by rotating the rotating shaft so that the wafer can be rotated, and the rotating shaft can control the carrier plate on one side to rotate, so that the front and back sides of the wafer can be swapped, thereby effectively avoiding scratches on the wafer surface when grabbing and swapping the front and back sides of the wafer.

[0013] Furthermore, the support assembly includes a support plate, two support rods and two connecting shafts. The two support rods are symmetrically arranged on both sides of the upper surface of the support plate, the two connecting shafts are respectively arranged on the top of the two support rods, and the two mounting plates are respectively connected to the two rotating shafts.

[0014] Furthermore, one end of the two connecting shafts away from the mounting plate is connected with an auxiliary handle.

[0015] Furthermore, the carrying plate has a U-shaped structure, and the groove is arranged on the inner wall of the carrying plate.

[0016] Furthermore, one end of the rotating shaft connected to the supporting plate on one side is connected with a transmission member.

[0017] Furthermore, the locking assembly includes an installation box and a locking plate, the installation box is connected to the side wall of the installation plate away from the supporting plate, the locking plate is slidably arranged on the installation box and passes through the installation box and the installation plate, and the supporting plate is provided with a locking hole that cooperates with the locking plate.

[0018] Furthermore, a through hole is provided on the mounting plate, a first connecting plate is provided in the through hole, and an outer wall of the first connecting plate is connected to an inner wall of the through hole via a second connecting plate.

[0019] Furthermore, the four corners of the mounting plate are rounded. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a three-dimensional structural schematic diagram of a wafer carrying mechanism in an embodiment of the utility model;

[0021] Figure 2 It is a three-dimensional structural schematic diagram of another viewing angle of the wafer carrying mechanism in the embodiment of the utility model;

[0022] Figure 3 It is a front view of the wafer carrying mechanism in the embodiment of the utility model;

[0023] Figure 4 It is a schematic diagram of the three-dimensional structure of the mounting plate and the bearing plate in the embodiment of the utility model.

[0024] Description of main component symbols:

[0025] 10. Support assembly; 11. Support plate; 12. Support rod; 120. Auxiliary handle; 13. Connecting shaft;

[0026] 20. Mounting plate; 21. Through hole; 22. First connecting plate; 23. Second connecting plate;

[0027] 30. Loading plate; 31. Groove; 32. Rotating shaft; 320. Transmission member; 33. Locking hole;

[0028] 40. Locking assembly; 41. Mounting box; 42. Locking plate.

[0029] The following specific implementation manner will further illustrate the present utility model in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0030] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0031] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0033] See also Figures 1 to 4 , shown is a wafer carrying mechanism in an embodiment of the utility model, including a supporting assembly 10, two mounting plates 20, two carrying plates 30 and a plurality of locking assemblies 40.

[0034] The two mounting plates 20 are symmetrically arranged on the supporting assembly 10, and the two mounting plates 20 are both rotatably arranged on the supporting assembly 10, the two carrying plates 30 are symmetrically arranged on one side of the mounting plate 20, and the two ends of the carrying plates 30 are rotatably connected to the mounting plate 20 through a rotating shaft 32, and a groove 31 for carrying a wafer is provided on the carrying plate 30, and a plurality of locking assemblies 40 are used to lock the two carrying plates 30, and a plurality of locking assemblies 40 are evenly arranged at the four corners of the two mounting plates 20, wherein the two mounting plates 20 are rotated so that the two mounting plates 20 drive the wafer to rotate via the rotating shaft 32 and the carrying plate 30.

[0035] It can be understood that the wafer is placed in the groove 31 of the carrier plate 30, and then the wafer is locked in the carrier plate 30 by the locking assembly 40. When the back and front sides need to be exchanged, it is only necessary to rotate the mounting plate 20 so that the mounting plate 20 can drive the carrier plate 30 to rotate via the rotating shaft, thereby completing the exchange of the back and front sides of the wafer. When the back and front sides of the wafer on one side need to be exchanged, it is only necessary to loosen the locking assembly 40, and then take the wafer out of the groove 31 of the carrier plate 30, and then the carrier plate 30 is rotated via the rotating shaft 3 2 is rotated. In order to facilitate the rotation of the turnover 32, a transmission member 320 is connected to one end of the rotating shaft 32. In this embodiment, the carrier plate 30 is a U-shaped structure, and the groove 31 is set on the inner wall of the carrier plate 30. At this time, the wafer is placed into the groove 31 from the bottom of the carrier plate 30, and then the wafer is locked by the locking assembly 40 at the bottom of the mounting plate 20 to complete the exchange of the front and back sides of the single-sided wafer, so that the front and back sides of the double-sided or single-sided wafers can be exchanged to avoid scratches on the wafer due to the gripping of the robot.

[0036] It should be explained that, in this embodiment, the four corners of the mounting plate 20 are chamfered, which can reduce the space required for the mounting plate 20 to rotate, so that the wafer supporting mechanism can have more space for rotation in the processing equipment.

[0037] Furthermore, in this embodiment, a through hole 21 is provided on the mounting plate 20 , a first connecting plate 22 is provided in the through hole 21 , and an outer wall of the first connecting plate 22 is connected to an inner wall of the through hole 21 via a second connecting plate 23 .

[0038] It is understandable that the processing condition of the other side of the wafer can be observed through the through hole 21 , and the connection between the mounting plate 20 and the supporting assembly 10 is made more stable through the first connecting plate 22 and the second connecting plate 23 .

[0039] Specifically, in this embodiment, the support assembly 10 includes a support plate 11, two support rods 12 and two connecting shafts 13. The two support rods 12 are symmetrically arranged on both sides of the upper surface of the support plate 11, and the two connecting shafts 13 are respectively arranged on the top of the two support rods 12. The two mounting plates 20 are respectively connected to the two rotating shafts 13, and the ends of the two connecting shafts 13 away from the mounting plates are connected with auxiliary handles 130.

[0040] It should be explained that in this embodiment, the friction force of the rotation of the connecting shaft 13 is relatively large. Therefore, after rotating the mounting plate 20, there is no need to lock the mounting plate. In order to rotate the connecting shaft 13 more conveniently, it can be rotated through the auxiliary handle 130. Therefore, the manipulator only needs to rotate the auxiliary handle 130.

[0041] Specifically, in this embodiment, the locking assembly 40 includes an installation box 41 and a locking plate 42. The installation box 41 is connected to the side wall of the installation plate 20 away from the supporting plate 30. The locking plate 42 is slidably set on the installation box 41 and passes through the installation box 41 and the installation plate 20. The supporting plate 30 is provided with a locking hole 33 that cooperates with the locking plate 42.

[0042] It can be understood that after the wafer is placed in the groove 31 of the carrier plate 30, the locking plate 42 in the sliding mounting box 41 is inserted into the locking hole 33, thereby not only locking the wafer in the groove 31 to prevent the wafer from falling out, but also preventing the carrier plate 30 from rotating on its own.

[0043] In summary, the wafer carrying mechanism in the above-mentioned embodiment of the utility model drives the carrying plate 30 by rotating the mounting plate 20, so that the wafer on the carrying plate 30 rotates, and drives the carrying plate 30 by rotating the rotating shaft 32, so that the wafer can rotate, and the rotating shaft 32 can control the rotation of the carrying plate 30 on one side, so that the front and back sides of the wafer can be swapped, thereby effectively avoiding scratches on the wafer surface when grabbing and swapping the front and back sides of the wafer.

[0044] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0045] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A wafer carrying mechanism, characterized in that: include: Support components; Two mounting plates are symmetrically arranged on the support assembly, and both mounting plates are rotatably arranged on the support assembly; Two supporting plates are symmetrically arranged on one side of the mounting plate, and the two ends of the supporting plates are rotatably connected to the mounting plate through a rotating shaft, and the supporting plates are provided with grooves for carrying wafers; A plurality of locking components for locking the two bearing plates, evenly arranged at the four corners of the two mounting plates; The two mounting plates are rotated so that the two mounting plates drive the wafer to rotate via the rotating shaft and the supporting plate.

2. The wafer carrying mechanism according to claim 1, characterized in that: The support assembly includes a support plate, two support rods and two connecting shafts. The two support rods are symmetrically arranged on both sides of the upper surface of the support plate, the two connecting shafts are respectively arranged on the top of the two support rods, and the two mounting plates are respectively connected to the two rotating shafts.

3. The wafer carrying mechanism according to claim 2, characterized in that: One end of the two connecting shafts away from the mounting plate is connected with an auxiliary handle.

4. The wafer carrying mechanism according to claim 1, characterized in that: The carrying plate is in a U-shaped structure, and the groove is arranged on the inner wall of the carrying plate.

5. The wafer carrying mechanism according to claim 1, characterized in that: One end of the rotating shaft connected to the bearing plate on one side is connected with a transmission member.

6. The wafer carrying mechanism according to claim 1, characterized in that: The locking assembly includes a mounting box and a locking plate. The mounting box is connected to a side wall of the mounting plate away from the supporting plate. The locking plate is slidably disposed on the mounting box and passes through the mounting box and the mounting plate. A locking hole cooperating with the locking plate is provided on the supporting plate.

7. The wafer carrying mechanism according to claim 1, characterized in that: A through hole is provided on the mounting plate, a first connecting plate is provided in the through hole, and an outer wall of the first connecting plate is connected to an inner wall of the through hole through a second connecting plate.

8. The wafer carrying mechanism according to claim 1, characterized in that: The four corners of the mounting plate are rounded structures.

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