Wafer carrying transverse moving mechanism

By using gear transmission instead of belt transmission in wafer handling vans, the problems of reduced transmission accuracy, short life and dust pollution in the existing technology are solved, and higher transmission accuracy, longer life and larger loads are achieved Ability to avoid dust pollution.

CN222507571UActive Publication Date: 2025-02-18成川科技(苏州)有限公司
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202323319113.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-06
Publication Date
2025-02-18
Estimated Expiration
2033-12-06

AI Technical Summary

Technical Problem

The transverse components of the existing wafer handling van use belt transmission, resulting in reduced transmission accuracy, short life and dust pollution.

Method used

Gear transmission instead of belt transmission, and smooth lateral movement is achieved through the gear transmission system of fixed plate, primary lateral movement assembly and secondary lateral movement assembly.

Benefits of technology

It extends the life of the transmission system, improves the transmission accuracy and stability, can withstand greater loads, and avoids dust pollution.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN222507571U_ABST
    Figure CN222507571U_ABST
Patent Text Reader

Abstract

The utility model relates to a wafer carrying transverse moving mechanism which comprises at least two stages of transverse moving assemblies, namely a first-stage transverse moving assembly and a second-stage transverse moving assembly, and the first-stage transverse moving assembly is located on one side of the second-stage transverse moving assembly and connected with the second-stage transverse moving assembly; the gear transmission assembly comprises a first gear which is connected with the driving end; the first rack is connected with the second-stage transverse moving assembly; the first gear is meshed with the first rack, and the first gear converts rotation into movement of the first rack in the first direction or the second direction; the second gear is connected with the second-stage transverse moving assembly. The second rack is connected with the first-stage transverse moving assembly; the second gear is meshed with the second rack; the second gear converts rotation into movement of the second rack in the first direction or the second direction. According to the utility model, the three transverse moving assemblies are controlled to move horizontally at the same time through gear transmission, the service life is longer, replacement is almost not needed, transmission is accurate and stable, a larger effect can be borne, and no dust is generated in the translation process to pollute wafers, and no large noise is generated.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer transport, in particular to a wafer transport transverse movement mechanism. Background Art

[0002] In the semiconductor manufacturing process, wafers need to be transported between different workstations. Wafers are usually carried in wafer boxes and transferred by OHT (overhead hoist transfer). OHT generally includes overhead rails and a transport trolley, referred to as an overhead crane. The overhead crane is equipped with a retractable and lifting gripping device. The overhead crane moves along the rails, thereby driving the gripping device to transport the transferred wafers. Currently, all OHT overhead cranes have transverse movement components composed of a screw rod + synchronous pulley. Although the synchronous belt drive is lighter, the belt will wear and produce dust after long-term work (OHT working environment is a dust-free clean room), and the transmission accuracy will drop significantly after wear. Utility Model Content

[0003] To this end, the technical problem to be solved by the utility model is to overcome the problems existing in the storage and placement of wafer boxes in the prior art, and provide a wafer transport and transverse movement mechanism that utilizes gear transmission instead of belt transmission, has a longer service life and almost no need for replacement, has accurate and smooth transmission, can withstand greater loads, and the gear transmission will not generate dust to contaminate the wafers.

[0004] In order to solve the above technical problems, the utility model provides a wafer transport and lateral movement mechanism, comprising:

[0005] A fixed plate, a primary traverse assembly and a secondary traverse assembly are stacked in sequence from top to bottom;

[0006] a first transmission assembly for moving the primary traverse assembly and the secondary traverse assembly, the first transmission assembly comprising: a first rack located on the lower surface of the fixed plate, a second rack located on the upper surface of the secondary traverse assembly, and a first gear penetrating the primary traverse assembly and meshing with the first rack and the second rack;

[0007] A driver is connected to the first gear.

[0008] In one embodiment of the present invention, a three-stage transverse shift assembly is further included, and the three-stage transverse shift assembly is located below the two-stage transverse shift assembly.

[0009] In one embodiment of the utility model, it also includes a second transmission assembly for moving the three-stage transverse shift assembly, and the second transmission assembly includes: a third rack connected to the first-stage transverse shift assembly, a fourth rack connected to the third-stage transverse shift assembly, and a second gear connected to the second-stage transverse shift assembly and meshing with the third rack and the fourth rack.

[0010] In one embodiment of the present invention, the third rack is located on two opposite sides of the primary transverse movement assembly, and the fourth rack is located on two opposite sides of the third transverse movement assembly.

[0011] In one embodiment of the utility model, the secondary transverse shift assembly is provided with an ear shaft, and the second gear is passed through the ear shaft and is rotatably connected thereto.

[0012] In one embodiment of the utility model, the primary transverse shift assembly is provided with a groove for accommodating the first gear, and the groove is located at the center of the primary transverse shift assembly of the first gear.

[0013] In one embodiment of the utility model, the primary transverse movement assembly includes a first linear guide rail and a first transverse movement plate, wherein the first linear guide rail is located on the first transverse movement plate and is connected to the fixed plate, so that the first transverse movement plate can move relative to the fixed plate.

[0014] In one embodiment of the utility model, the secondary transverse movement assembly includes a second transverse movement plate and a second linear guide rail, wherein the second linear guide rail is embedded in the second transverse movement plate and partially protrudes out of the upper surface of the second transverse movement plate and is connected to the primary transverse movement assembly.

[0015] In one embodiment of the utility model, the three-stage transverse shift assembly includes a third transverse shift plate and a third linear guide rail, wherein the third linear guide rail is embedded in the third transverse shift plate and partially protrudes from the upper surface of the third transverse shift plate to be connected to the two-stage transverse shift assembly.

[0016] In one embodiment of the present invention, the driver is located on the upper surface of the primary lateral movement assembly.

[0017] The above technical solution of the utility model has the following advantages compared with the prior art:

[0018] The wafer transport transverse movement mechanism described in the utility model utilizes a gear transmission mechanism to control the transverse movement component to move smoothly transversely, which can not only meet the transverse movement distance requirements of the wafer transport overhead crane, but also has a longer service life and almost no need for replacement through gear transmission. The transmission is accurate and smooth, and can withstand greater loads. In addition, during the translation process, no dust will be generated to contaminate the wafer, and no loud noise will be generated. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to make the content of the utility model easier to understand, the utility model is further described in detail according to the specific embodiments of the utility model in combination with the accompanying drawings, wherein

[0020] Figure 1 It is a structural schematic diagram of the original position state of the wafer transport and transverse shifting mechanism in the preferred embodiment of the utility model;

[0021] Figure 2 yes Figure 1 The schematic diagram of the structure of the wafer transport and transverse movement mechanism after the primary transverse movement assembly, the secondary transverse movement assembly and the tertiary transverse movement assembly are transversely moved out;

[0022] Figure 3 yes Figure 2 A schematic diagram of a top view structure;

[0023] Figure 4 yes Figure 1 The schematic diagram of the structure of the drive end, gear transmission assembly, primary lateral movement assembly, secondary lateral movement assembly and tertiary lateral movement assembly of the wafer transport lateral movement mechanism shown;

[0024] Figure 5 yes Figure 1 The schematic diagram of the structure of the wafer transport and lateral movement mechanism installed on the transport crane;

[0025] Explanation of the reference numerals in the specification: 1. fixing member; 2. primary transverse shift assembly; 20. through hole; 21. U-shaped groove; 3. secondary transverse shift assembly; 31. ear shaft; 4. tertiary transverse shift assembly; 5. driver; 6. first gear; 7. first rack; 8. second gear; 9. second rack; 10. third rack; 11. fourth rack; 12. first linear guide; 13. second linear guide; 14. third linear guide; 15. rotating assembly; X1. first direction; X2. movement in second direction; 100. frame assembly; 101. weight-reducing hole. DETAILED DESCRIPTION

[0026] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0027] Reference Figure 1-5The wafer transport transverse movement mechanism shown in the figure comprises: a fixed plate 1, a primary transverse movement assembly 2 and a secondary transverse movement assembly 3 stacked in sequence from top to bottom; a first transmission assembly for moving the primary transverse movement assembly 2 and the secondary transverse movement assembly 3, the first transmission assembly comprising: a first rack 11 located on the lower surface of the fixed plate 2, a second rack 7 located on the upper surface of the secondary transverse movement assembly 3, a first gear 6 penetrating the primary transverse movement assembly 2 and meshing with the first rack 11 and the second rack 7; and a driver 5 connected to the first gear. When the first gear 6 is controlled to rotate by the driver 5, since the first gear 6 is meshed with the first rack 11 and the second rack 7 at the same time, the driver 5 controls the first gear 6 to rotate forward, and the rotation of the first gear 6 acts on the first rack 11 on the fixed member 1, which will push the primary transverse movement assembly 2 to move out transversely in the reverse direction, and at the same time, the rotation of the first gear 6 acts on the second rack 7 of the secondary transverse movement assembly 3, so that the secondary transverse movement assembly 3 moves out transversely, and the two transverse movement processes occur simultaneously.

[0028] As a further improvement of the utility model, it also includes a three-stage transverse component 4, which is located below the two-stage transverse component 3. It also includes a second transmission component for moving the three-stage transverse component 4, which includes: a third rack 9 connected to the one-stage transverse component 2, a fourth rack 10 connected to the three-stage transverse component 4, and a second gear 8 connected to the two-stage transverse component 3 and meshed with the third rack 9 and the fourth rack 10. The three-stage transverse component 4 can move along the first direction X1 and the second direction X2 under the control of the second transmission component. Specifically, when the one-stage transverse component 2 is translated, the third rack 9 is driven to be translated, and the meshing of the third rack 9 with the first gear 6 drives the rotation of the second gear 8. The rotation of the second gear 8 drives the fourth rack 10 and the third rack 9 to move synchronously in horizontal position, thereby realizing the synchronous transverse movement of the three-stage transverse component 4. When resetting, the driving end 5 controls the first gear 6 to reverse, and the one-stage transverse component 2, the two-stage transverse component 3 and the three-stage transverse component 4 are retracted synchronously to achieve resetting.

[0029] Preferably, the third rack 9 is located on two opposite sides of the primary transverse movement assembly 2 , and the fourth rack 10 is located on two opposite sides of the tertiary transverse movement assembly 4 .

[0030] Preferably, the secondary transverse shift assembly 3 is provided with an ear shaft 31, and the second gear 8 is passed through the ear shaft 31 and is rotatably connected thereto.

[0031] In this embodiment, the primary transverse shift assembly 2 is provided with a groove 20 for accommodating the first gear 6, and the groove 20 is located at the center of the primary transverse shift assembly 3. The depth of the groove 20 is smaller than the outer diameter of the first gear 6, so that the upper and lower parts of the first gear 6 can pass through the through hole 20, and the first gear 6 can mesh with the first rack 7 above the secondary transverse shift assembly 3 below the fixing member 1, so as to realize the transmission control of the secondary transverse shift assembly 3.

[0032] Preferably, the first-stage transverse movement assembly 2 includes a first linear guide 21 and a first transverse movement plate 22, wherein the first linear guide 21 is located on the first transverse movement plate 22 and is connected to the fixed plate 1, so that the first transverse movement plate 22 can move relative to the fixed plate 1. The second-stage transverse movement assembly 3 includes a second transverse movement plate 31 and a second linear guide 32, wherein the second linear guide 32 is embedded in the second transverse movement plate 31 and partially protrudes from the upper surface of the second transverse movement plate 31 and is connected to the first-stage transverse movement assembly 2. The third-stage transverse movement assembly 4 includes a third transverse movement plate 41 and a third linear guide 42, wherein the third linear guide 42 is embedded in the third transverse movement plate 41 and partially protrudes from the upper surface of the third transverse movement plate 41 and is connected to the second-stage transverse movement assembly 3. Through the design of the above three groups of linear guides, the three groups of transverse movement assemblies can remain stable and smooth during the transverse movement without deviation.

[0033] In this embodiment, the driver 5 is located on the upper surface of the primary transverse moving assembly 2. Preferably, a U-shaped groove 21 for installing the driver 5 is provided on one side of the primary transverse moving assembly 2. In addition, the carrier plate of the tertiary transverse moving assembly 4 is an H-shaped structure, and the design of the H-shaped structure can play a role in weight reduction. The fourth rack 10 is fixed to both sides of the H-shaped structure by fasteners.

[0034] As a further improvement of the present invention, a rotating assembly 15 is further provided on the three-stage lateral shift assembly 4. The rotating assembly 15 plays the role of rotating and connecting the lifting and placing device below, which is used to clamp the wafer box and then realize horizontal lateral shift through the three lateral shift assemblies in this embodiment.

[0035] Preferably, rack mounting grooves 1 for mounting and fixing the first rack 11 are provided on both sides of the bottom of the fixing member 1. The first rack 11 is fixedly installed in the rack mounting groove 1 and is kept flush with the lower surface of the fixing member 1 to ensure the tightness of the fit between the primary lateral movement component 2 and the fixing member 1. The fixing member 1 is also provided with two weight-reducing holes 101. The design of the weight-reducing holes 101 can reduce the overall weight of the fixing member 1, making the entire lateral movement mechanism lightweight.

[0036] Preferably, the secondary transverse moving assembly 3 is provided with a rack mounting groove 2 for mounting the second rack 7. After the second rack 7 is fixedly mounted on the rack mounting groove 2, it is kept flush with the surface of the secondary transverse moving assembly 3, ensuring the tightness of the fit between the primary transverse moving assembly 2 and the secondary transverse moving assembly 3.

[0037] The wafer transport and transverse movement mechanism based on the above structure also has the following beneficial effects:

[0038] The lateral movement of the multi-stage lateral movement assembly can be achieved through a single power source, which helps to reduce production costs and reduce the size of the lateral movement mechanism. It can effectively avoid the lateral movement arm being too long and breaking in the prior art. In addition, the coordination between adjacent components is continuous and stable during the translation process, and the extension and reset speeds are fast, which greatly improves work efficiency.

[0039] Obviously, the above embodiments are merely examples for the purpose of clear explanation and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from these are still within the scope of protection of the invention of the utility model.

Claims

1. A wafer transport and lateral movement mechanism, characterized in that: include: A fixed plate, a primary traverse assembly and a secondary traverse assembly are stacked in sequence from top to bottom; a first transmission assembly for moving the primary traverse assembly and the secondary traverse assembly, the first transmission assembly comprising: a first rack located on the lower surface of the fixed plate, a second rack located on the upper surface of the secondary traverse assembly, and a first gear penetrating the primary traverse assembly and meshing with the first rack and the second rack; A driver is connected to the first gear.

2. A wafer transport and lateral movement mechanism according to claim 1, characterized in that: It also includes a three-stage transverse movement assembly, which is located below the two-stage transverse movement assembly.

3. The wafer transport and lateral movement mechanism according to claim 2, characterized in that: It also includes a second transmission assembly that moves the three-stage transverse shift assembly, and the second transmission assembly includes: a third rack connected to the first-stage transverse shift assembly, a fourth rack connected to the third-stage transverse shift assembly, and a second gear connected to the second-stage transverse shift assembly and meshing with the third rack and the fourth rack.

4. The wafer transport and transverse movement mechanism according to claim 3, characterized in that: The third rack is located on two opposite sides of the primary transverse shifting assembly, and the fourth rack is located on two opposite sides of the tertiary transverse shifting assembly.

5. The wafer transport and lateral movement mechanism according to claim 4, characterized in that: The secondary transverse shifting assembly is provided with an ear shaft, and the second gear is passed through the ear shaft and is rotationally connected thereto.

6. The wafer transport and transverse movement mechanism according to claim 1, characterized in that: The first-stage transverse shifting assembly is provided with a groove for accommodating the first gear, and the groove is located at the center of the first-stage transverse shifting assembly.

7. The wafer transport and lateral movement mechanism according to claim 1, characterized in that: The primary transverse movement assembly includes a first linear guide rail and a first transverse movement plate. The first linear guide rail is located on the first transverse movement plate and is connected to the fixed plate, so that the first transverse movement plate can move relative to the fixed plate.

8. The wafer transport and transverse movement mechanism according to claim 1, characterized in that: The secondary transverse movement assembly includes a second transverse movement plate and a second linear guide rail, wherein the second linear guide rail is embedded in the second transverse movement plate and partially protrudes out of the upper surface of the second transverse movement plate to be connected to the primary transverse movement assembly.

9. The wafer transport and transverse movement mechanism according to claim 2, characterized in that: The three-stage transverse shift assembly includes a third transverse shift plate and a third linear guide rail. The third linear guide rail is embedded in the third transverse shift plate and partially protrudes from the upper surface of the third transverse shift plate to be connected to the two-stage transverse shift assembly.

10. The wafer transport and transverse movement mechanism according to claim 1, characterized in that: The driver is located on the upper surface of the primary traverse assembly.