Vertical calibration device

Abstract

The utility model provides a vertical calibration device, and the device at least comprises a carrier disc, the diameter of which is smaller than the inner diameter of a working cavity and larger than the diameter of a wafer; the calibration line is located on the carrier disc, and the orthographic projection of the calibration line on the surface of the wafer is the same as the outline of the outer edge of the wafer; and the connecting part is arranged at the edge of the carrier disc, and when the carrier disc is arranged in the working cavity, the connecting part can be in lap joint with the side wall of the working cavity, so that the carrier disc is suspended in the working cavity. By using the device, the conveying position of the equipment can be checked regularly, the maintenance reference of the equipment state is provided for engineers, the vertical calibration device is suitable for position detection of wafers in a working cavity and position detection of wafers on a cooling disc at the same time, and good structural adaptability can be achieved even in working areas of different sizes.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a vertical calibration device. Background Art

[0002] The degumming machine is a device used to remove the adhesive layer on the surface of the wafer. At present, most of the degumming machines that transfer wafers in the atmospheric state are old or refurbished equipment with simple mechanical structures, crude transmission pedometers or inaccurate transfer positions. The re-introduction of this part of equipment into industrial production can not only save a lot of costs for purchasing new machines, but also make the equipment recyclable, reduce environmental pollution and industrial waste. To ensure that this type of equipment can operate well, the transfer position of the equipment needs to be checked regularly and adjusted.

[0003] However, there is currently no technical solution to improve or optimize the process for the above practical problems to help engineers check the device's transfer position. Currently, the wafer transfer position is mostly determined and adjusted based on experience, which results in large errors and increases the workload of engineers.

[0004] Therefore, it is necessary to provide an improved technical solution for the above-mentioned technical problems, so as to facilitate the calibration and adjustment of the conveying position of the degumming machine to ensure the process quality of wafer degumming. Utility Model Content

[0005] In view of the defects and shortcomings of the above-mentioned prior art degumming machine, the purpose of the present application is to provide a vertical calibration device to more accurately and efficiently check and adjust the transmission position of the degumming machine equipment.

[0006] The present application provides a vertical calibration device, comprising at least:

[0007] A carrier plate, wherein the diameter of the carrier plate is smaller than the inner diameter of the working chamber and larger than the diameter of the wafer;

[0008] A calibration line is located on the carrier plate, and the orthographic projection of the calibration line on the wafer surface is the same as the outer edge contour of the wafer;

[0009] The connecting portion is arranged on the edge of the carrier plate. When the carrier plate is placed inside the working chamber, the connecting portion can overlap the side wall of the working chamber so that the carrier plate is suspended inside the working chamber.

[0010] In some embodiments, the number of the connecting parts is greater than or equal to two.

[0011] In some embodiments, the number of the connecting portions is three, and the three connecting portions are arranged at equal angles and intervals on the edge of the carrier plate.

[0012] In some embodiments, the inner diameter of the working chamber is defined as L1, and the diameter of the carrier disk is defined as L2, then 1 mm ≤ L1 - L2 ≤ 2 mm.

[0013] In some embodiments, the light transmittance of the carrier disc is greater than or equal to 90%.

[0014] In some embodiments, the connecting portion includes a clamping end overlapped on the side wall of the working chamber, and the clamping end is connected to the carrier disk by a support body; one end of the support body is installed on the clamping end by a first bolt, and the other end of the support body is installed on the carrier disk by a second bolt.

[0015] In some embodiments, a notch groove is formed at the clamping end, and the notch groove is located at a corner away from the carrier plate and close to the center of the circle. When the vertical calibration device is inverted on the cooling plate, the notch groove abuts against the edge of the cooling plate.

[0016] In some embodiments, the shape of the notch groove is attached to the edge structure of the cooling plate and is in close contact with the side wall and the upper surface of the cooling plate.

[0017] In some embodiments, the clamping end further has an adjustment hole, which has a long strip-shaped opening and passes through the clamping end, so as to adjust the overlapping or clamping distance of the clamping end.

[0018] In some embodiments, the support body is an integrated structure or a multi-section spliced ​​structure.

[0019] Compared with the prior art, the technical solution provided by this application has the following beneficial effects:

[0020] In the technical solution of the present application, an auxiliary tooling suitable for the degumming machine, namely a vertical calibration device, is designed to regularly check the transmission position of the equipment, providing engineers with a maintenance reference for the equipment status, and the vertical calibration device is also suitable for wafer position detection in the working chamber and wafer position inspection on the cooling plate, and can achieve good structural adaptability even in working areas of different sizes. The vertical calibration device verifies the transmission position by engraving a calibration line on the carrier plate that corresponds vertically to the working position of the wafer. A connecting portion is provided on the edge of the carrier plate, which allows the carrier plate to be firmly overlapped on the upper side wall of the working chamber or clamped on the surface of the cooling plate, which is convenient for engineers to align and observe the position and make timely equipment adjustments. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of a path for conveying a wafer in a debonding machine in the prior art;

[0022] Figure 2 A schematic diagram of the use status of the vertical calibration device provided in Example 1;

[0023] Figure 3 A top view of the vertical calibration device provided in Example 1;

[0024] Figures 4-5 A schematic diagram of the structure of the connection part provided in this application;

[0025] Figure 6 This is a schematic diagram of the use status of the vertical calibration device provided in Example 2.

[0026] Description of reference numerals:

[0027] 10. Carrier plate;

[0028] 20. Calibration line;

[0029] 30. Connecting part;

[0030] 310, card connection terminal;

[0031] 320, adjustment hole;

[0032] 330, notched slot;

[0033] 340, support body;

[0034] 350, first bolt;

[0035] 360. Second bolt. DETAILED DESCRIPTION

[0036] like Figure 1 As shown in the figure, in the structure of the degumming machine, the working chamber and the cooling plate are two important components. The wafer to be processed is sent into the chamber for degumming through SMIF (standard mechanical interface). After the degumming process is completed, the wafer is still at a relatively high temperature state. In order to ensure the stability of the wafer and prevent further thermal damage, it needs to be cooled by the cooling plate.

[0037] In order to enable engineers to more conveniently and accurately adjust the transfer position of wafers in different chambers, the present application provides a vertical calibration device, which at least includes:

[0038] A carrier plate, wherein the diameter of the carrier plate is smaller than the inner diameter of the working chamber and larger than the diameter of the wafer;

[0039] A calibration line is located on the carrier plate, and the orthographic projection of the calibration line on the wafer surface is the same as the outer edge contour of the wafer;

[0040] The connecting portion is arranged on the edge of the carrier plate. When the carrier plate is placed inside the working chamber, the connecting portion can overlap the side wall of the working chamber so that the carrier plate is suspended inside the working chamber.

[0041] The following describes the implementation of the present application through Example 1 and Example 2, and those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification. The present application can also be implemented or applied through other different specific implementations, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application.

[0042] Embodiment 1:

[0043] See also Figures 2 to 5 , this embodiment provides a vertical calibration device, the device at least comprising:

[0044] A carrier plate 10, wherein the diameter of the carrier plate 10 is smaller than the inner diameter of the working chamber and larger than the diameter of the wafer;

[0045] A calibration line 20 is located on the carrier plate 10, and the orthographic projection of the calibration line 20 on the wafer surface is the same as the outer edge contour of the wafer;

[0046] The connection portion 30 is disposed on the edge of the carrier plate 10 . When the carrier plate 10 is placed inside the working chamber, the connection portion 30 can overlap the side wall of the working chamber so that the carrier plate 10 is suspended inside the working chamber.

[0047] By adopting the above technical solution: see Figure 2 When it is necessary to regularly check the operating accuracy of the equipment (working chamber), place the carrier plate 10 into the working chamber so that the connecting portion 30 at the edge of the carrier plate 10 overlaps the top side wall of the working chamber, and the carrier plate 10 is located in the exact center of the working chamber. At this time, there is a certain vertical distance between the carrier plate 10 and the wafer. When using the device to check the transfer position of the wafer in the working chamber, it is only necessary to confirm whether the actual position of the wafer in the transfer chamber coincides with the mark on the carrier plate 10, that is, the calibration line 20. If position adjustment is required, remove the vertical calibration device and manually adjust the equipment, and then repeatedly use the device to detect and calibrate until the position is accurate.

[0048] Need to explain, Figure 2 The structure of the connecting portion 30 shown is only used to illustrate the simple principle of the overlapping method during the use of the device, and its illustrated structure is not intended to be a specific limitation on the structural features of the connecting portion 30.

[0049] In one embodiment, the number of the connecting parts 30 is greater than or equal to two. It is understandable that if the carrier plate 10 is overlapped on the side wall of the working chamber, at least two connecting parts 30 are required, and in order to achieve a relatively stable overlap of the carrier plate 10, the two connecting parts 30 should be arranged as symmetrically as possible and located on the extended diameter line of the carrier plate 10.

[0050] Furthermore, the number of the connecting parts 30 is set to three, see Figure 3 The three connecting parts 30 can be arranged at equal angles on the edge of the carrier disk 10, or can be arranged at different angles on the edge of the carrier disk 10. For example, two of the connecting parts 30 are arranged on the diameter extension line of the carrier disk 10, and the third one is arranged between the first two connecting parts 30 and is spaced 45 degrees from the first two connecting parts 30, so that the carrier disk 10 has a sufficiently large operating space to avoid structural interference with other components of the working chamber.

[0051] It can be understood that, depending on the different inner diameters of the carrier plate 10 and the working chamber, in order to make the vertical calibration device overlap stably, the number of connecting parts 30 can also be four, five or even more, and the arrangement can also be set at equal angles or differentiated according to the working chamber structure.

[0052] In one embodiment, see Figures 1-2 , define the inner diameter of the working chamber as L1, and the diameter of the carrier plate 10 as L2, then 1mm≤L1-L2≤2mm, that is, the diameter of the carrier plate 10 is slightly smaller than the inner diameter of the working chamber by 1mm~2mm. On the one hand, this size limitation can ensure that after the carrier plate 10 is placed in the working chamber, it can be easily observed by the naked eye whether it is aligned. The gap between the carrier plate 10 and the side wall can enable engineers to have basic understanding and judgment. On the other hand, leaving a certain gap can prevent the carrier plate 10 and / or the connecting part 30 from scratching the inner wall of the working chamber when placed, thereby playing a role in protecting the equipment.

[0053] In one embodiment, the light transmittance of the carrier disk 10 is greater than or equal to 80%. Furthermore, the carrier disk 10 is made of a disk body made of a polymer material with good light transmittance, such as methyl methacrylate (PMMA, acrylic), polycarbonate (PC), polyethylene terephthalate (PET) or polystyrene (PS). In this embodiment, acrylic with a light transmittance of 92% is selected as the main material of the carrier disk 10. It can be understood that the carrier disk 10 can also be doped during the preparation process, sacrificing part of the light transmittance, but a disk body with a color with a higher contrast with the calibration line 20 can be formed, which is convenient for engineers to perform alignment checks. Furthermore, the carrier disk 10 is made of acrylic material and its light transmittance is greater than or equal to 90%.

[0054] In one embodiment, see Figure 4The connecting portion 30 includes a clamping end 310 overlapped with the side wall of the working chamber, and the clamping end 310 is connected to the carrier disc 10 by a support body 340; one end of the support body 340 is mounted on the clamping end 310 by a first bolt 350, and the other end is mounted on the edge of the carrier disc 10 by a second bolt 360. The first bolt 350 and the second bolt 360 are universal connectors that play a connecting role, so all connectors that can realize the connection between the clamping end 310 and the support body 340, and the support body 340 and the carrier disc 10 can be respectively applied to this embodiment, and no excessive restrictions are made here. With the support body 340 as the boundary, the clamping end 310 is located on the side of the support body 340 away from the carrier disc 10 and contacts the top edge of the side wall of the working chamber, playing an overlapping role; the clamping end 310 is located on the side of the support body 340 close to the carrier disc 10 to clamp the cooling disc, which will not be repeated here.

[0055] In one embodiment, see Figure 5 The clamping end 310 also has an adjustment hole 320, which has a long strip opening and runs through the clamping end 310, for adjusting the overlap distance of the clamping end 310. The overlap limit size of the clamping end 310 can be quickly adjusted by the first bolt 350, and the adjustable range is limited by the length of the adjustment hole.

[0056] In one embodiment, the support body 340 is an integrated structure or a multi-section spliced ​​structure. Figure 5 The support body 340 is shown as an integrated structure, and the height of the support body 340 ranges from 10 mm to 60 mm. As an example, the height of the support body 340 can be 10 mm, 20 mm, 40 mm or 60 mm, so that the distance between the carrier plate 10 and the wafer is not too large, which makes it difficult for engineers to align the calibration line 20 with the edge of the wafer with the naked eye, and the distance is not too small to cause the risk of scratching the wafer surface.

[0057] Embodiment 2:

[0058] See also Figures 4 to 6 , this embodiment provides a vertical calibration device, the device at least comprising:

[0059] A carrier plate 10, wherein the diameter of the carrier plate 10 is smaller than the inner diameter of the working chamber and larger than the diameter of the wafer;

[0060] A calibration line 20 is located on the carrier plate 10, and the orthographic projection of the calibration line 20 on the wafer surface is the same as the outer edge contour of the wafer;

[0061] The connection portion 30 is disposed on the edge of the carrier plate 10. When the carrier plate 10 is placed on the cooling plate, the connection portion 30 can be snapped onto the edge and side wall of the cooling plate, so that the carrier plate 10 is suspended above the cooling plate.

[0062] By adopting the above technical solution: see Figure 6 Since the size of the cooling plate is slightly smaller than the size of the working chamber, when it is necessary to regularly check the operating accuracy of the equipment (cooling plate), place the carrier plate 10 above the cooling plate so that the connecting portion 30 at the edge of the carrier plate 10 is snapped onto the edge side wall of the cooling plate, so that the carrier plate 10 is located in the exact center of the cooling plate. At this time, there is a certain vertical distance between the carrier plate 10 and the wafer. When using the device to check the transfer position of the wafer on the cooling plate, it is only necessary to confirm whether the actual position of the wafer above the cooling plate coincides with the mark on the carrier plate 10, that is, the calibration line 20. If position adjustment is required, remove the vertical calibration device and manually adjust the equipment, and then repeatedly use the device to detect and calibrate until the position is accurate.

[0063] Need to explain, Figure 6 The structure of the connecting portion 30 shown is only used to illustrate the simple principle of the engagement method during the use of the device, and the illustrated structure is not intended to be a specific limitation on the structural features of the connecting portion 30.

[0064] The technical solution provided in this embodiment is the same as that in the first embodiment and is not described in detail here. Figures 4-5 The clamping end 310 also has a notch groove 330, which is located at a corner away from the carrier plate 10 and close to the center of the circle. When the vertical calibration device is inverted on the cooling plate, the notch groove 330 abuts against the edge of the cooling plate, so that the vertical calibration device is firmly installed on the cooling plate.

[0065] It is understandable that the notch groove 330 can be formed by mechanical cutting, or by integrally forming a notch when manufacturing the clamping end 310. The manufacturing method of the notch groove 330 is not limited here.

[0066] In one embodiment, see Figure 5 The shape of the notch groove 330 is attached to the edge structure of the cooling plate and is in close contact with the side wall and the upper surface of the cooling plate. It can be understood that since the surface of the cooling plate is a circular structure, in order to firmly clamp, the side wall of the notch groove 330 should also have the same curvature, and this setting can also play a certain protective role on the edge structure of the cooling plate, and the contact surface is evenly stressed, preventing scratches on the edge of the cooling plate at the clamping point.

[0067] In one embodiment, the number of the connecting parts 30 applicable to the cooling plate should be relatively greater than the number of the connecting parts 30 applicable to the working chamber, and the number of the connecting parts 30 of the vertical calibration device provided in this embodiment is greater than or equal to three. It can be understood that if the carrier plate 10 is clamped on the upper side wall of the cooling plate, two connecting parts cannot achieve stable installation of the carrier plate 10, and at least three connecting parts 30 are required, and in order to achieve a relatively stable overlap of the carrier plate 10, the three connecting parts 30 can be arranged at equal angles on the edge of the carrier plate 10. It can be understood that the three connecting parts can also be arranged at different angles on the edge of the carrier plate 10, for example, two of the connecting parts 30 are arranged on the extension line of the diameter of the carrier plate 10, and the third one is arranged between the first two connecting parts 30 and is spaced 45 degrees from the first two, so that the carrier plate 10 has a large enough operating space to avoid structural interference with other parts of the cooling plate.

[0068] It can be understood that, depending on the diameters of the carrier plate 10 and the cooling plate, in order to make the vertical calibration device firmly clamped, the number of connecting parts 30 can also be four, five or even more, and the arrangement can also be set at equal angles or differentiated according to the structure of the cooling plate.

[0069] In one embodiment, see Figures 4-5 The clamping end 310 also has an adjustment hole 320, which has a long strip opening and runs through the clamping end 310, for adjusting the clamping distance of the clamping end 310. The clamping area diameter of the clamping end 310 can be quickly adjusted by the first bolt 350, and the adjustable range is limited by the length of the adjustment hole.

[0070] In one embodiment, the support body 340 is an integrated structure or a multi-section spliced ​​structure. Figure 5 It is shown that the support body 340 is an integrated structure, and the height of the support body 340 ranges from 10 mm to 60 mm. As an example, the height of the support body 340 can be 10 mm, 20 mm, 40 mm or 60 mm. Different from the height of the device suitable for the working chamber, when the device is suitable for the cooling plate, not only will there be a certain difference in the clamping size, but its overall height may also change. Furthermore, the support body 340 provided in this embodiment includes at least two sections, and the connection method between the support bodies 340 can be any connection method that realizes a detachable connection, such as a threaded connection, a snap connection or a hinge connection, and this embodiment does not limit this.

[0071] In summary, this application designs an auxiliary tooling suitable for the degumming machine, namely a vertical calibration device, which regularly checks the transmission position of the equipment, and provides engineers with a maintenance reference for the equipment status. The vertical calibration device is also suitable for wafer position detection in the working chamber and wafer position inspection on the cooling plate, and can achieve good structural adaptability even in working areas of different sizes. The vertical calibration device performs transmission position verification by engraving a calibration line on the carrier plate that corresponds vertically to the working position of the wafer. A connecting portion is provided on the edge of the carrier plate, which allows the carrier plate to be firmly overlapped on the upper side wall of the working chamber or clamped on the surface of the cooling plate, which is convenient for engineers to align and observe the position and make timely equipment adjustments.

[0072] The vertical calibration device provided by the present application has been theoretically verified and experimentally tested. The device has good applicability in the degumming machine for wafer transfer under atmospheric conditions and can effectively improve the accuracy and efficiency of engineers' inspection of transfer. The technical solution of the present application has high industrial utilization value because it effectively overcomes various shortcomings in the prior art.

[0073] The above embodiments are merely illustrative of the principles and effects of the present application and are not intended to limit the present application. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed in the present application shall still be covered by the claims of the present application.

Claims

1. A vertical calibration device, characterized in that: At least: A carrier plate, wherein the diameter of the carrier plate is smaller than the inner diameter of the working chamber and larger than the diameter of the wafer; A calibration line is located on the carrier plate, and the orthographic projection of the calibration line on the wafer surface is the same as the outer edge contour of the wafer; The connecting portion is arranged on the edge of the carrier plate. When the carrier plate is placed inside the working chamber, the connecting portion can overlap the side wall of the working chamber so that the carrier plate is suspended inside the working chamber.

2. The vertical calibration device according to claim 1, characterized in that: The number of the connecting parts is greater than or equal to two.

3. The vertical calibration device according to claim 1, characterized in that: The number of the connecting parts is three, and the three connecting parts are arranged at equal angles and intervals on the edge of the carrier plate.

4. The vertical calibration device according to claim 1, characterized in that: Define the inner diameter of the working chamber as L1, and the diameter of the carrier disc as L2, then 1mm≤L1-L2≤2mm.

5. The vertical calibration device according to claim 1, characterized in that: The light transmittance of the carrier disc is greater than or equal to 90%.

6. The vertical calibration device according to claim 1, characterized in that: The connecting portion includes a clamping end overlapped on the side wall of the working chamber, and the clamping end is connected to the carrier plate by a support body; one end of the support body is installed on the clamping end by a first bolt, and the other end of the support body is installed on the carrier plate by a second bolt.

7. The vertical calibration device according to claim 6, characterized in that: The clamping end is provided with a notch groove, and the notch groove is located at a corner far away from the carrier plate and close to the center of the circle. When the vertical calibration device is placed upside down on the cooling plate, the notch groove abuts against the edge of the cooling plate.

8. The vertical calibration device according to claim 7, characterized in that: The shape of the notch groove is attached to the edge structure of the cooling plate and is in close contact with the side wall and the upper surface of the cooling plate.

9. The vertical calibration device according to claim 6, characterized in that: The clamping end also has an adjustment hole, which has a long strip opening and passes through the clamping end, so as to adjust the overlapping or clamping distance of the clamping end.

10. The vertical calibration device according to any one of claims 6 to 9, characterized in that: The support body is an integrated structure or a multi-section spliced ​​structure.

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