Suction nozzle feeding structure for semiconductor processing

Abstract

The utility model discloses a suction nozzle feeding structure for semiconductor processing, which relates to the technical field of suction nozzle feeding and comprises a suction nozzle assembly. The suction nozzle assembly comprises a plurality of rubber nozzles; a mounting head is fixedly mounted at the top of the rubber nozzle; an air pipe penetrates through the mounting head; the mounting head is movably mounted on one side of the torque conversion assembly through the L-shaped mounting frame and the matching column; the torque conversion assembly comprises a supporting plate; a plurality of inclined sliding grooves are formed in the supporting plate; during feeding and adsorption, a second electric push cylinder drives a sliding frame to move, the sliding frame drives a sliding block to move, and a matching column is installed in a sliding groove, so that when the sliding block transversely moves, it can be guaranteed that the matching column effectively slides in the direction of the sliding groove, and the matching column and an L-shaped installation frame are fixedly installed; the distance between every two adjacent rubber nozzles can be effectively adjusted, and therefore when semiconductors are fed, the situation that the adjacent semiconductors are affected in the machining process is prevented.

Description

Technical Field

[0001] The utility model specifically relates to the technical field of suction nozzle feeding, in particular to a suction nozzle feeding structure for semiconductor processing. Background Art

[0002] When semiconductors are being processed, they are effectively loaded through a loading device, which can effectively and quickly place the semiconductors to be processed in the processing position. Through automated operations, production efficiency can be effectively improved and losses caused by human operations can be reduced.

[0003] When processing traditional semiconductors, the loading device can only achieve the effect of transfer. In order to ensure the processing quality between semiconductors, there is a certain distance between two adjacent semiconductors. In this way, the traditional loading device cannot effectively adjust the distance between the semiconductors, which will cause the distance between the two adjacent semiconductors to be smaller, which may cause an impact during processing.

[0004] After searching, Chinese patent publication number CN202110437527.0 discloses a multi-nozzle feeding fixture; comprising a base; a plurality of clamps are arranged on the base; each clamp is provided with a vacuum suction part; a limit block is arranged between two adjacent clamps; two adjacent clamps are movably connected through the limit block; the base is provided with a driving part for adjusting the distance between two adjacent clamps; the vacuum suction part comprises a suction rod arranged on the clamp, a vacuum interface arranged at one end of the suction rod and a suction nozzle arranged at the other end of the suction rod;

[0005] Although the structure in the above patent is provided with multiple nozzles, the structure in the above patent cannot effectively adjust the distance between two adjacent nozzles when loading materials. Thus, when the distance between two adjacent semiconductors needs to be adjusted during loading, the above patent cannot complete the operation, which will affect the processing of semiconductors;

[0006] In view of the above situation, we provide a suction nozzle loading structure for semiconductor processing. In this device, the suction nozzle assembly is movably installed on the torque converter assembly, wherein the slider in the suction nozzle assembly is installed in coordination with the slide. Thus, when loading, the slide is driven to move by the second electric push cylinder, and the slide drives the slider to move. At the same time, the matching column is installed in coordination with the slide groove. Thus, when the suction nozzle assembly is loaded, the rubber nozzle can be effectively moved along the direction of the slide groove, and the spacing between two adjacent rubber nozzles can be effectively achieved. Utility Model Content

[0007] The purpose of the utility model is to provide a suction nozzle feeding structure for semiconductor processing. In this device, the slider in the suction nozzle assembly is installed in conjunction with the slide frame, so that when loading, the slide frame is driven to move by the second electric push cylinder, and the slide frame drives the slider to move. At the same time, the matching column and the slide groove are installed in conjunction, so that when the suction nozzle assembly is loaded, the rubber nozzle can be effectively moved along the direction of the slide groove; so as to solve the problems of the above-mentioned background technology.

[0008] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0009] A suction nozzle feeding structure for semiconductor processing includes a suction nozzle assembly; the suction nozzle assembly includes a plurality of rubber nozzles; the rubber nozzles are arranged in a trumpet shape; a mounting head is fixedly installed on the top of the rubber nozzle; the interior of the mounting head is hollow; an air pipe runs through the interior of the mounting head; the mounting head is movably installed on one side of a torque converter assembly through an L-shaped mounting frame and a matching column; the torque converter assembly includes a support plate; a plurality of inclined sliding grooves are opened on the support plate.

[0010] As a further technical solution of the utility model, a limiting plate is fixedly mounted on one end of the matching column away from the L-shaped mounting frame; and a sliding block is integrally provided on one end of the limiting plate away from the matching column.

[0011] As a further technical solution of the utility model, the slider is movably installed inside the slide; the top of the slide is fixedly installed with the push rod of the second electric push cylinder; the second electric push cylinder is installed in cooperation with the support frame; the support frame includes an L-shaped support plate; the second electric push cylinder is fixedly installed on the top of the L-shaped support plate; the support frame also includes a plurality of triangular support blocks; the triangular support blocks are installed in cooperation with the support plate.

[0012] As a further technical solution of the utility model, the bottom of the L-shaped support plate is installed in cooperation with the frame; the frame includes a workbench; symmetrical slide rails are provided at both ends of the workbench; the slide rails are slidably installed with the L-shaped support plate; a first electric push cylinder is fixedly installed on one side of the workbench through a mounting frame; the push rod of the first electric push cylinder is fixedly installed with the L-shaped support plate.

[0013] As a further technical solution of the utility model, the thickness of the support plate is the same as the length of the matching column; the diameter of the matching column is the same as the width of the slide groove.

[0014] As a further technical solution of the utility model, a guide column is also installed between the slide and the top of the L-shaped support plate.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] 1. When the utility model is used, the rubber nozzle is installed at the bottom of the mounting head and connected to the air pipe, so that the semiconductor to be processed can be effectively adsorbed and loaded by means of negative pressure;

[0017] 2. The utility model, when loading and adsorbing, drives the carriage to move through the second electric push cylinder, drives the slider to move through the carriage, and the slider is connected to the matching column through the limit plate, and the matching column is installed in the slide groove, so that when the slider moves horizontally, it can also ensure that the matching column slides effectively along the direction of the slide groove, and the matching column is fixedly installed with the L-shaped mounting frame, so that when loading, the distance between two adjacent rubber nozzles can be effectively adjusted, so that when loading semiconductors, the distance between two adjacent semiconductors can be effectively controlled to prevent the situation of affecting the adjacent semiconductors during processing;

[0018] 3. In the utility model, after the rubber nozzle sucks the semiconductor, the push rod of the first electric push cylinder drives the L-shaped support plate to move along the slide rail to move the rubber nozzle forward or backward, so that the semiconductor on the rubber nozzle can be placed in the position to be processed. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.

[0020] Figure 2 This utility model Figure 1 main view.

[0021] Figure 3 This utility model Figure 1 Side view of.

[0022] Figure 4 This utility model Figure 1 Schematic diagram of the splitting.

[0023] Figure 5 This utility model Figure 4 Schematic diagram of the rear structure.

[0024] Figure 6 This utility model Figure 5 A magnified view of the local structure at A.

[0025] In the figure: 1-frame, 10-workbench, 11-slide rail, 12-first electric push cylinder, 2-support frame, 20-L-type support plate, 21-triangular support block, 3-second electric push cylinder, 4-slide frame, 5-nozzle assembly, 50-rubber nozzle, 51-mounting head, 52-air pipe, 53-L-type mounting frame, 54-matching column, 55-limiting plate, 56-slider, 6-torque conversion assembly, 60-support plate, 61-slide groove. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] See also Figure 1-6 In an embodiment of the utility model, a suction nozzle feeding structure for semiconductor processing includes a suction nozzle assembly 5; the suction nozzle assembly 5 includes a plurality of rubber nozzles 50; the rubber nozzles 50 are arranged in a trumpet shape; a mounting head 51 is fixedly installed on the top of the rubber nozzle 50; the interior of the mounting head 51 is hollow; an air pipe 52 runs through the interior of the mounting head 51; the mounting head 51 is movably mounted on one side of a torque converter assembly 6 through an L-shaped mounting frame 53 and a matching column 54; the torque converter assembly 6 includes a support plate 60; a plurality of inclined slide grooves 61 are provided on the support plate 60.

[0028] Specifically, a limiting plate 55 is fixedly mounted on one end of the matching column 54 away from the L-shaped mounting frame 53 ; and a sliding block 56 is integrally provided on one end of the limiting plate 55 away from the matching column 54 .

[0029] By adopting the above technical solution, when in use, the rubber nozzle 50 is installed at the bottom of the mounting head 51 and is connected to the air pipe 52, so that the semiconductor to be processed can be effectively adsorbed and loaded by means of negative pressure;

[0030] The slider 56 is movably installed inside the slide 4; the top of the slide 4 is fixedly installed with the push rod of the second electric push cylinder 3; the second electric push cylinder 3 is installed in cooperation with the support frame 2; the support frame 2 includes an L-shaped support plate 20; the second electric push cylinder 3 is fixedly installed on the top of the L-shaped support plate 20; the support frame 2 also includes a plurality of triangular support blocks 21; the triangular support blocks 21 are installed in cooperation with the support plate 60.

[0031] In this embodiment, the bottom of the L-shaped support plate 20 is installed in cooperation with the frame 1; the frame 1 includes a workbench 10; symmetrical slide rails 11 are provided at both ends of the workbench 10; the slide rails 11 are slidably installed with the L-shaped support plate 20; a first electric push cylinder 12 is fixedly installed on one side of the workbench 10 through a mounting frame; the push rod of the first electric push cylinder 12 is fixedly installed with the L-shaped support plate 20.

[0032] By adopting the above technical solution, during loading and adsorption, the second electric push cylinder 3 drives the slide 4 to move, and the slide 4 drives the slider 56 to move. The slider 56 is connected to the matching column 54 through the limit plate 55, and the matching column 54 is installed in the slide groove 61. In this way, while the slider 56 moves laterally, it can also ensure that the matching column 54 can effectively slide along the direction of the slide groove 61. The matching column 54 is fixedly installed with the L-shaped mounting frame 53. In this way, when loading, the distance between two adjacent rubber nozzles 50 can be effectively adjusted. In this way, when loading semiconductors, the distance between two adjacent semiconductors can be effectively controlled to prevent the situation where it affects the adjacent semiconductors during processing.

[0033] In this embodiment, the thickness of the support plate 60 is the same as the length of the matching column 54 ; the diameter of the matching column 54 is the same as the width of the sliding groove 61 .

[0034] A guide column is also installed between the slide 4 and the top of the L-shaped support plate 20.

[0035] By adopting the above technical solution, after the rubber nozzle 50 sucks the semiconductor, the push rod of the first electric push cylinder 12 drives the L-shaped support plate 20 to move along the slide rail 11, so as to move the rubber nozzle 50 forward or backward, so that the semiconductor on the rubber nozzle 50 can be placed in the position to be processed.

[0036] The working principle of the utility model is: when in use, the rubber nozzle 50 is installed at the bottom of the mounting head 51 and is connected to the air pipe 52, so that the semiconductor to be processed can be effectively adsorbed and loaded by means of negative pressure.

[0037] During material loading and adsorption, the second electric push cylinder 3 drives the slide 4 to move, and the slide 4 drives the slider 56 to move. The slider 56 is connected to the matching column 54 through the limit plate 55. The matching column 54 is installed in the slide groove 61. In this way, when the slider 56 moves horizontally, the matching column 54 can also be guaranteed to slide effectively along the direction of the slide groove 61. The matching column 54 is fixedly installed with the L-shaped mounting frame 53. In this way, when loading, the distance between two adjacent rubber nozzles 50 can be effectively adjusted. In this way, when loading semiconductors, the distance between two adjacent semiconductors can be effectively controlled to prevent the situation where the adjacent semiconductors are affected during processing;

[0038] After the rubber nozzle 50 sucks the semiconductor, the push rod of the first electric push cylinder 12 drives the L-shaped support plate 20 to move along the slide rail 11 to move the rubber nozzle 50 forward or backward, so that the semiconductor on the rubber nozzle 50 can be placed in the position to be processed.

[0039] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0040] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A nozzle loading structure for semiconductor processing, characterized in that: The invention comprises a suction nozzle assembly (5); the suction nozzle assembly (5) comprises a plurality of rubber nozzles (50); the rubber nozzles (50) are arranged in a trumpet shape; a mounting head (51) is fixedly mounted on the top of the rubber nozzle (50); the interior of the mounting head (51) is hollow; an air pipe (52) runs through the interior of the mounting head (51); the mounting head (51) is movably mounted on one side of a torque converter assembly (6) through an L-shaped mounting frame (53) and a matching column (54); the torque converter assembly (6) comprises a support plate (60); a plurality of inclined sliding grooves (61) are provided on the support plate (60).

2. The nozzle loading structure for semiconductor processing according to claim 1, characterized in that: A limiting plate (55) is fixedly mounted on one end of the matching column (54) away from the L-shaped mounting frame (53); and a sliding block (56) is integrally provided on one end of the limiting plate (55) away from the matching column (54).

3. The nozzle loading structure for semiconductor processing according to claim 2, characterized in that: The slider (56) is movably installed inside the slide (4); the top of the slide (4) is fixedly installed with the push rod of the second electric push cylinder (3); the second electric push cylinder (3) is installed in cooperation with the support frame (2); the support frame (2) includes an L-shaped support plate (20); the second electric push cylinder (3) is fixedly installed on the top of the L-shaped support plate (20); the support frame (2) also includes a plurality of triangular support blocks (21); the triangular support blocks (21) are installed in cooperation with the support plate (60).

4. The nozzle loading structure for semiconductor processing according to claim 3, characterized in that: The bottom of the L-shaped support plate (20) is installed in cooperation with the frame (1); the frame (1) includes a workbench (10); symmetrical slide rails (11) are provided at both ends of the workbench (10); the slide rails (11) and the L-shaped support plate (20) are slidably installed; a first electric push cylinder (12) is fixedly installed on one side of the workbench (10) through a mounting frame; the push rod of the first electric push cylinder (12) is fixedly installed on the L-shaped support plate (20).

5. The nozzle loading structure for semiconductor processing according to claim 4, characterized in that: The thickness of the support plate (60) is the same as the length of the matching column (54); the diameter of the matching column (54) is the same as the width of the sliding groove (61).

6. The nozzle loading structure for semiconductor processing according to claim 3, characterized in that: A guide column is also installed between the slide (4) and the top of the L-shaped support plate (20).

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