Device suitable for conversion operation after metallization of back surface of ultrathin silicon wafer
By designing a post-metalization conversion operation device suitable for the back of ultra-thin silicon wafers, using the cooperation of scissor-type brackets and limit sets, the operation difficulties and fragmentation problems caused by warping and deformation of ultra-thin silicon wafers are solved, and a person has achieved one person Individually operated and efficiently removed silicon wafers.
Patent Information
- Application Number
- CN202420736406.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-11
- Publication Date
- 2025-02-18
- Estimated Expiration
- 2034-04-11
AI Technical Summary
After the ultra-thin silicon wafer is metallized on the back, it is difficult to achieve automatic sheet rack conversion due to the large warping deformation, and requires manual operation. It is easy to fragment when removing the silicon wafer, which is difficult to operate and low efficiency.
A device suitable for metallization and conversion of ultra-thin silicon wafer back is designed, including a base, vertically arranged bracket, scissor type bracket, limit set and plate frame limit slot, through scissor type bracket and limit slot The combination of the group enables one person to operate alone and easily remove the silicon wafer.
It realizes that one person operates alone, improves work efficiency, reduces operation difficulty, avoids silicon wafer fragments, and significantly improves the convenience and safety of handling ultra-thin silicon wafers.
Smart Images
Figure CN222507602U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a conversion operation device suitable for metallization of the back side of an ultra-thin silicon slice, belonging to the technical field of semiconductor manufacturing. Background Art
[0002] With the development of device miniaturization technology, the thickness of silicon chips has become a key issue in the development of ultra-thin packaging. When the wafer is thinned to a thickness below 100um, the morphology of the edge of the silicon wafer (arc or trapezoid) is severely damaged, and the remaining part presents a "sharp" acute angle, which seriously reduces the mechanical strength and is easy to break. After the mechanical thinning process, the silicon wafer will warp and deform due to stress. The thinner the silicon wafer, the greater the deformation.
[0003] The ultra-thin wafers also need to be metallized on the back to prepare electrodes in subsequent operations. After the back is metallized, the warping of the silicon wafer will increase. During the circulation process, it is difficult to switch between wafer racks due to the large deformation and warping, and manual operation using tweezers is required.
[0004] During manual operation, when loading into a conventional PVC or TFL material turnover rack, the warped silicon wafer is difficult to remove directly. When removing, it is also necessary to avoid hard contact between the edge of the silicon wafer and the rack, otherwise it will cause fragments. In this case, one person cannot operate alone, and two people must cooperate with each other. First, put the rack on the operating table, one person uses both hands to slightly open the rack, and the other person uses tweezers to carefully clamp the wafer out. The handling is very difficult, and the slightest carelessness will cause the silicon wafer to directly break and scrap, and the efficiency is low and the operation is difficult. Utility Model Content
[0005] The technical problem to be solved by the utility model is to provide a conversion operation device suitable for ultra-thin silicon wafer back metallization after the above-mentioned prior art, which is easy to operate, can be operated by one person alone, improves work efficiency, reduces operation difficulty, and avoids silicon wafer fragments.
[0006] The technical solution adopted by the utility model to solve the above-mentioned problems is: a device suitable for conversion operation after metallization of the back side of ultra-thin silicon wafers, including a base, a vertically arranged bracket is arranged on the base, and a scissor-type support frame is provided on the top of the bracket; a limit group is symmetrically provided on an opening side of the scissor-type support frame; a wafer rack limit groove is provided on the base, and a wafer rack is provided in the wafer rack limit groove, and the four corners of the top of the wafer rack are fixed to two limit groups, and the opening side of the scissor-type support frame is driven to open outward, driving the limit group and the wafer rack to open outward, so that the wafer in the wafer rack is separated from the wafer rack, and the wafer is taken out; then the opening side of the scissor-type support frame is driven to reset.
[0007] The scissor-type support frame includes two symmetrically arranged support rods, and the two support rods are arranged in an X shape; the intersection of the two support rods is hinged on the bracket, so that the two support rods can rotate around the hinge point.
[0008] An adjusting screw is horizontally passed through the other open side of the scissor-type support frame. The adjusting screw has two sections of threads, and the two threads rotate in opposite directions. One support rod corresponds to one section of thread, and the two support rods are threadedly connected to the adjusting screw.
[0009] The position limiting group includes two symmetrically arranged position limiting hole buckle points, and the positions of the position limiting hole buckle points are arranged corresponding to the four corners of the sheet frame.
[0010] Compared with the prior art, the utility model has the advantages of being suitable for a conversion operation device after metallization of the back side of an ultra-thin silicon wafer, being easy to operate, enabling one person to operate alone, improving work efficiency, reducing operating difficulty, and avoiding silicon wafer fragments. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 This is a schematic diagram of a device for converting ultra-thin silicon wafers after back metallization according to an embodiment of the utility model;
[0012] Figure 2 for Figure 1 A top view of
[0013] In the figure, 1 is the base, 2 is the bracket, 3 is the adjusting screw, 4 is the limit hole buckle point, 5 is the shelf limit slot, 6 is the scissor-type support frame, and 6.1 is the support rod. DETAILED DESCRIPTION
[0014] The present invention will be described in further detail below in conjunction with the accompanying drawings.
[0015] like Figure 1 , 2As shown, a device for converting ultra-thin silicon wafers after back metallization in this embodiment includes a base 1, a vertically arranged bracket 2 is provided on the base 1, and two symmetrically arranged struts 6.1 are provided on the top of the bracket 2, and the two struts 6.1 are arranged in an X shape to form a scissor-type bracket 6; the intersection of the two struts 6.1 is hinged to the bracket 2, so that the two struts 6.1 can rotate around the hinge point. A limit group is symmetrically provided on one opening side of the scissor-type bracket 6, that is, the limit group is symmetrically arranged on the opposite side of the strut 6.16. An adjusting screw 3 is horizontally passed through the other opening side of the scissor-type bracket 6, and the adjusting screw 3 has two sections of thread, and the two sections of thread rotate in opposite directions, and one strut 6.1 corresponds to one section of thread; the two struts 6.1 are threadedly connected to the adjusting screw. A sheet rack limit groove 5 is provided on the base 1, and the sheet rack is arranged in the sheet rack limit groove 5, and the four corners of the top of the sheet rack are fixed to the two symmetrically arranged limit groups. Rotate the adjusting screw 3 clockwise to bring the support rod 6.1 on the threaded connection side of the adjusting screw closer to each other (the other opening side of the scissor-type support frame gathers inward), so that one opening side of the scissor-type support frame opens outward, driving the limit group and the film frame to open outward, so that the wafer in the film frame is separated from the film frame, and then the wafer is taken out; then rotate the adjusting screw in the opposite direction to reset the scissor-type support frame.
[0016] The above-mentioned limiting groups respectively include two symmetrically arranged limiting hole buckle points 4, and the positions of the limiting hole buckle points 4 are arranged corresponding to the four corners of the sheet frame.
[0017] In the initial state, the adjustment screw is not connected to the support rod, and the two support rods can rotate around the hinge point; when in use, first place the film frame in the limit slot of the film frame, and fix the limit holes at the four corners of the film frame. Screw the adjustment screw clockwise, and the scissor-type support frame opens, so that the film frame is slightly stretched. At this time, the wafer stuck in the film frame is separated from the film frame, and then the wafer is taken out normally with tweezers. Rotate the adjustment screw in the opposite direction to reset the scissor-type support frame (the adjustment screw is not connected to the support rod), loosen the connection between the limit hole of the film frame and the limit hole buckle point, take out the film frame, and complete the entire operation. The operation can be specifically quantified and controlled, and the same state can be maintained for a long time.
[0018] The application is easy to operate, enables one person to operate alone, improves work efficiency, reduces operating difficulty, and avoids silicon wafer fragments.
[0019] In addition to the above embodiments, the present invention also includes other implementation modes. Any technical solutions formed by equivalent transformation or equivalent replacement should fall within the protection scope of the claims of the present invention.
Claims
1. A device suitable for conversion operation after back metallization of ultra-thin silicon wafers, characterized in that: It comprises a base, on which a vertically arranged bracket is arranged, and a scissor-type support frame is arranged on the top of the bracket; a limit group is symmetrically arranged on an opening side of the scissor-type support frame; a sheet rack limit groove is arranged on the base, and a sheet rack is arranged in the sheet rack limit groove, and the four corners of the top of the sheet rack are fixed to two limit groups, and the opening side of the scissor-type support frame is driven to open outward, driving the limit group and the sheet rack to open outward, so that the wafer in the sheet rack is separated from the sheet rack, and the wafer is taken out; then the opening side of the scissor-type support frame is driven to reset.
2. The device for converting ultra-thin silicon wafers after back metallization according to claim 1, characterized in that: The scissor-type support frame includes two symmetrically arranged support rods, and the two support rods are arranged in an X shape; the intersection of the two support rods is hinged on the bracket, so that the two support rods can rotate around the hinge point.
3. The device for converting ultra-thin silicon wafers after back metallization according to claim 2, characterized in that: An adjusting screw is horizontally passed through the other open side of the scissor-type support frame. The adjusting screw has two sections of threads, and the two threads rotate in opposite directions. One support rod corresponds to one section of thread, and the two support rods are threadedly connected to the adjusting screw.
4. The device for converting ultra-thin silicon wafers after back metallization according to claim 1, characterized in that: The limiting groups respectively include two symmetrically arranged limiting hole buckle points, and the positions of the limiting hole buckle points are arranged corresponding to the four corners of the sheet frame.