Wafer bonding clamping device

Abstract

The utility model discloses a wafer bonding and clamping device, which belongs to the technical field of wafer processing, and comprises a mounting table board, the front end of the mounting table board is fixedly connected with a placement frame, the outer end of the placement frame is provided with a first through hole, the inner wall of the mounting table board is provided with an electric push rod, and the inner wall of the mounting table board is provided with a second through hole. The end portion of the electric push rod is fixedly connected with a first connecting rod, a wafer bonding piece can be horizontally placed on a table column for containing, the round edge of the wafer bonding piece is made to be located on the outer side of the table top, then a person starts the electric push rod to enable the telescopic rod to be lengthened or shortened, and under transmission of the transmission assembly and limiting of the guide assembly and the limiting assembly, the wafer bonding piece can be placed on the table column. The two second connecting rods are driven to move relative to each other, so that the two clamps can clamp the wafer bonding piece placed on the table column, staff can conveniently carry out refined machining work on the wafer bonding piece, meanwhile, instability caused by manual fixing in the prior art is avoided, and the machining efficiency and precision of the wafer bonding piece are greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, and more specifically to a wafer bonding clamping device. Background Art

[0002] A wafer refers to a silicon chip used in the manufacture of silicon semiconductor integrated circuits. Due to its round shape, it is called a wafer. Various circuit element structures can be processed on the silicon wafer to become an integrated circuit product with specific electrical functions. The original material of the wafer is silicon, and there is an inexhaustible supply of silicon dioxide on the surface of the earth's crust. Silicon dioxide ore is refined in an electric arc furnace, chlorinated with hydrochloric acid, and distilled to make high-purity polysilicon with a purity of up to 99.9%. However, when finely processing wafer bonding, there is currently no fixture dedicated to wafer fixing on the market, and the manual fixing effect is not good, resulting in uneven processing effects on the wafer, and its subsequent use cannot be guaranteed. How to solve the above technical problems has become a difficult problem to be solved urgently. For this reason, this scheme proposes a wafer bonding clamping device. Utility Model Content

[0003] 1. Technical problems to be solved:

[0004] In view of the problems existing in the prior art, the purpose of the utility model is to provide a wafer bonding clamping device, which can be performed by placing the wafer bonding horizontally on a loading table column with its round edge located on the outside of the table surface, and then a person starts an electric push rod to extend or shorten it, and under the transmission of the transmission component and the limitation of the guide component and the limit component, the two connecting rods are enabled to perform relative displacement, so that the two clamps can clamp the wafer bonding placed on the table column, which is beneficial for personnel to carry out refined processing of the wafer bonding, and at the same time avoids the instability of the existing manual fixation, greatly improving the processing efficiency and accuracy of the wafer bonding.

[0005] 2. Technical solution:

[0006] To solve the above problems, the utility model adopts the following technical solutions.

[0007] A wafer bonding clamping device comprises a mounting table, a front end of the mounting table is fixedly connected to a placement frame, an outer end of the placement frame is provided with a through hole 1, an electric push rod is installed on the inner wall of the mounting table, the end of the electric push rod is fixedly connected to a connecting rod 1, the connecting rod 1 passes through the through hole 1 and can move laterally along the through hole 1, a front end of the placement frame is fixedly connected to a flat plate 1 and two flat plates 2, the two flat plates 2 are symmetrically distributed about the flat plate 1, a transmission assembly is provided at the front end of the flat plate 1, two connecting rods 2 are correspondingly provided on both sides of the transmission assembly, the two connecting rods 2 can move synchronously toward or away from each other, and the side ends of the connecting rods 2 are fixedly connected to a clamp;

[0008] A plurality of guide components are arranged between the first plate and the second plate, and a limit component is sleeved between the upper and lower groups of the guide components;

[0009] Among them, a group of the limit assembly, the second connecting rod and the first connecting rod are in the same horizontal plane and are correspondingly connected.

[0010] A further improvement is that the guide assembly includes a plurality of limit sleeves 1 which are respectively fixedly connected to the front ends of the flat plate 2 and the flat plate 1, and a guide shaft is installed between the limit sleeves 1 of each transverse axis.

[0011] A further improvement is that the limiting assembly includes a limiting sleeve 2 slidably provided on the outer end of the guide shaft, and the two upper and lower side ends of the limiting sleeve 2 are fixedly connected with a bracket, and one end of the bracket is fixedly connected to the connecting rod 2.

[0012] A further improvement is that the transmission assembly includes a rotating shaft installed at a lower end of the flat plate, the output end of the rotating shaft is fixedly connected to a transmission gear, the upper and lower sides of the transmission gear are meshed with racks, the two racks are arranged in a mirror-symmetrical manner, a transmission frame is provided on the side of the rack, the transmission frame is fixedly connected to the side end of the second connecting rod and is located below the limit assembly, a positioning groove and a through hole are opened on the side end of the transmission frame, and one end of the rack is fixedly connected to the inner wall of the positioning groove.

[0013] A further improvement is that a limiting groove is provided on the inner wall of the clamp, and a rubber pad is fixedly connected between the inner walls of the limiting groove.

[0014] 3. Beneficial effects:

[0015] Compared with the prior art, the advantages of the present invention are:

[0016] When the utility model is in use, the wafer adhesive sheet can first be placed horizontally on the loading column with its round edge located on the outer side of the table surface, and then a person starts the electric push rod to extend or shorten it, and under the transmission of the transmission component and the limitation of the guide component and the limit component, the two connecting rods can be relatively displaced, so that the two clamps can clamp the wafer adhesive sheet placed on the column, which is beneficial for personnel to carry out refined processing of the wafer adhesive sheet, and at the same time avoids the instability of the existing manual fixation, greatly improving the processing efficiency and precision of the wafer adhesive sheet.

[0017] During use, the utility model provides a limit groove on the inner wall of the clamp so that when clamping the wafer, both the upper and lower sides can be restricted, and it is not easy to separate. At the same time, under the action of the rubber pad arranged inside, it is not easy to cause damage to the wafer due to excessive clamping force, and it has a certain protective effect on the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 It is a partial structural diagram of the utility model;

[0020] Figure 3 It is a schematic diagram of the structure of the utility model after overall operation.

[0021] Description of the numbers in the figure:

[0022] 1. Installation table; 2. Placement frame; 3. Through hole 1; 4. Electric push rod; 7. Connecting rod 2; 8. Clamp; 9. Plate 1; 91. Plate 2; 10. Guide assembly; 101. Limit sleeve 1; 102. Guide shaft; 11. Limit assembly; 111. Bracket; 112. Limit sleeve 2; 12. Transmission assembly; 121. Rotating shaft; 122. Transmission gear; 123. Transmission frame; 124. Positioning slot; 125. Through hole 2; 126. Rack; 13. Limit slot; 14. Connecting rod 1. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model; it is obvious that the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments of the utility model without making creative work are within the scope of protection of the utility model.

[0024] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top / bottom" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0025] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "set / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances. Example

[0026] See also Figure 1-3 A wafer bonding clamping device comprises a mounting table 1, a mounting frame 2 is fixedly connected to the front end of the mounting table 1, a through hole 3 is opened at the outer end of the mounting frame 2, an electric push rod 4 is installed on the inner wall of the mounting table 1, a connecting rod 14 is fixedly connected to the end of the electric push rod 4, the connecting rod 14 passes through the through hole 3 and can move laterally along the through hole 3, a flat plate 9 and two flat plates 91 are fixedly connected to the front end of the mounting frame 2, the two flat plates 91 are symmetrically distributed about the flat plate 9, a transmission component 12 is provided at the front end of the flat plate 9, and connecting rods 7 are correspondingly provided on both sides of the transmission component 12, the two connecting rods 7 can move synchronously toward or away from each other, and the side ends of the connecting rods 7 are fixedly connected to a clamp 8;

[0027] A plurality of guide components 10 are provided between the plate 1 9 and the plate 2 91, and a limit component 11 is sleeved between the upper and lower groups of the guide components 10;

[0028] Among them, a group of the limit assembly 11, the second connecting rod 7 and the first connecting rod 14 are in the same horizontal plane and are correspondingly connected.

[0029] During use of this scheme, in order to make the fixing effect more stable when the existing personnel perform fine processing on the wafer adhesive, facilitate their subsequent processing, and not easily damage the wafer adhesive during clamping, in this embodiment, a column is provided between the two clamps 8, and the column is used for placing the daily wafer adhesive. When in use, the wafer adhesive is first placed horizontally on the column with its round edge located on the outside of the table surface, and then the personnel starts the electric push rod 4 to extend or shorten it, and under the transmission of the transmission component 12 and the limitation of the guide component 10 and the limit component 11, the two connecting rods 7 are enabled to move relative to each other, so that the two clamps 8 can clamp the wafer adhesive placed on the column, which is beneficial for personnel to perform fine processing on the wafer adhesive, and at the same time avoids the instability of the existing manual fixation, greatly improving the processing efficiency and accuracy of the wafer adhesive.

[0030] See also Figure 1-3The guide assembly 10 includes a plurality of limit sleeves 101 respectively fixedly connected to the front end of the flat plate 91 and the flat plate 19, and a guide shaft 102 is installed between the limit sleeves 101 of each transverse axis.

[0031] A further improvement is that the limiting assembly 11 includes a limiting sleeve 112 slidably provided on the outer end of the guide shaft 102, and the side ends of the two limiting sleeves 112 arranged up and down are fixedly connected with a bracket 111, and one end of the bracket 111 is fixedly connected to the connecting rod 7.

[0032] During use, in order to make the transmission assembly 12 more stable when the connecting rod 14 is displaced left and right, in this embodiment, by setting the limit of the guide assembly 10 and the limit assembly 11, the transmission assembly 12 can be made to operate more stably during transmission. During use, two limit sleeves 112 are first fixed on the upper and lower sides of the connecting rod 7, and the two limit sleeves 112 are respectively sleeved on the outside of the guide shaft 102, so that when the connecting rod 7 is displaced left and right, the upper and lower sides can be supported, and the sliding can be smoother and more stable, which greatly avoids the occurrence of derailment.

[0033] See also Figure 2-3 The transmission assembly 12 includes a rotating shaft 121 installed at the lower end of the flat plate 19, and the output end of the rotating shaft 121 is fixedly connected to a transmission gear 122. The upper and lower sides of the transmission gear 122 are meshed with racks 126. The two racks 126 are arranged in a mirror-symmetrical manner. A transmission frame 123 is provided on the side of the rack 126. The transmission frame 123 is fixedly connected to the side end of the connecting rod 27 and is located below the limit assembly 11. A positioning groove 124 and a through hole 2 125 are opened on the side end of the transmission frame 123, and one end of the rack 126 is fixedly connected to the inner wall of the positioning groove 124.

[0034] During the use of this solution, when the electric push rod 4 drives the connecting rod 2 7 to move left and right after extension, since the racks 126 on the upper and lower sides of the transmission assembly 12 are mirror-imaged, and the left and right sides of the two racks 126 are respectively installed with the transmission frames 123, the positioning groove 124 on the surface of the left transmission frame 123 is fixedly connected with the upper rack 126, and the lower rack 126 penetrates between the inner walls of the second through hole 125, and the right transmission frame 123 is also mirror-imaged, and the second through hole 125 on its surface is sleeved on the outer side of the upper rack 126, and the positioning groove 124 is fixedly connected with the lower rack 126 is fixedly connected, and the inner sides of the upper and lower racks 126 are meshed with the transmission gear 122, that is, when the connecting rod 14 is displaced to the right, the connecting rod 2 7 on the left side drives the upper rack 126 to move to the right synchronously, and the rack 126 is meshed with the transmission gear 122 during the rightward movement, driving the transmission gear 122 to perform rotational transmission, and at this time, the transmission gear 122 synchronously drives the lower rack 126 to move to the left, thereby prompting the right clamp 8 and the left clamp 8 to be relatively positioned until the wafer adhesive sheet on the table is clamped;

[0035] In this embodiment, the two limit assemblies 11 are both sleeved on the outside of the guide assembly 10, and one of them is fixedly connected to the upper connecting rod 14.

[0036] See also Figure 1-2 A limiting groove 13 is provided on the inner wall of the clamp 8 , and a rubber pad is fixedly connected between the inner walls of the limiting groove 13 .

[0037] During use of the present invention, by providing a limit groove 13 on the inner wall of the clamp 8, the upper and lower sides of the wafer can be restricted when clamping the wafer, making it less likely for the wafer to come out of contact. At the same time, with the action of the rubber pad arranged inside, it is less likely for the wafer to be damaged due to excessive clamping force, thus providing a certain degree of protection for the wafer.

[0038] The above is only a preferred specific implementation of the utility model; however, the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solution and improved ideas of the utility model within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model.

Claims

1. A wafer bonding clamping device, comprising a mounting table (1), characterized in that: The front end of the mounting table (1) is fixedly connected to a mounting frame (2), the outer end of the mounting frame (2) is provided with a through hole 1 (3), an electric push rod (4) is installed on the inner wall of the mounting table (1), the end of the electric push rod (4) is fixedly connected to a connecting rod 1 (14), the connecting rod 1 (14) passes through the through hole 1 (3) and can move laterally along the through hole 1 (3), the front end of the mounting frame (2) is fixedly connected to a plate 1 (9) and two plate 2s (91), the two plate 2s (91) are symmetrically distributed with respect to the plate 1 (9), the front end of the plate 1 (9) is provided with a transmission assembly (12), the two sides of the transmission assembly (12) are correspondingly provided with connecting rods 2 (7), the two connecting rods 2 (7) can move synchronously towards or away from each other, and the side ends of the connecting rods 2 (7) are fixedly connected to a clamp (8); A plurality of guide components (10) are provided between the first plate (9) and the second plate (91), and a limit component (11) is sleeved between the upper and lower groups of the guide components (10); Wherein, a group of the limit assembly (11), the second connecting rod (7) and the first connecting rod (14) are in the same horizontal plane and are correspondingly connected.

2. A wafer bonding clamping device according to claim 1, characterized in that: The guide assembly (10) comprises a plurality of limit sleeves (101) respectively fixedly connected to the front ends of the second plate (91) and the first plate (9), and a guide shaft (102) is installed between the limit sleeves (101) of each transverse axis.

3. The wafer bonding clamping device according to claim 2, characterized in that: The limiting assembly (11) comprises a limiting sleeve (112) slidably disposed on the outer end of the guide shaft (102), and two upper and lower side ends of the limiting sleeves (112) are fixedly connected to a bracket (111), and one end of the bracket (111) is fixedly connected to the connecting rod (7).

4. The wafer bonding clamping device according to claim 1, characterized in that: The transmission assembly (12) comprises a rotating shaft (121) mounted at the lower end of the first plate (9); the output end of the rotating shaft (121) is fixedly connected to a transmission gear (122); the upper and lower sides of the transmission gear (122) are meshingly connected to racks (126); the two racks (126) are arranged in a mirror-symmetrical manner; a transmission frame (123) is provided on the side of the rack (126); the transmission frame (123) is fixedly connected to the side end of the second connecting rod (7) and is located below the limit assembly (11); a positioning groove (124) and a second through hole (125) are provided on the side end of the transmission frame (123); one end of the rack (126) is fixedly connected to the inner wall of the positioning groove (124).

5. The wafer bonding clamping device according to claim 1, characterized in that: A limiting groove (13) is provided on the inner wall of the clamp (8), and a rubber pad is fixedly connected between the inner walls of the limiting groove (13).

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