Bidirectional resonant converter and mobile power supply
By setting the power unit and the magnetic unit on both sides of the substrate in a bidirectional resonant converter, and using a hollow structure heat dissipation module, the problems of large volume, high manufacturing cost and poor maintenance in the prior art are solved. , achieving smaller size, lower cost and higher maintainability.
Patent Information
- Application Number
- CN202420495805.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-14
- Publication Date
- 2025-02-18
- Estimated Expiration
- 2034-03-14
AI Technical Summary
The existing bidirectional resonant DC-DC converters are large in size, resulting in high production, installation and manufacturing costs and poor maintenance.
By fixing the multiple power units on the first side of the substrate, the multiple magnetic units on the second side of the substrate, and setting the control module, the driving module and the auxiliary power module on the first side of the substrate, reducing the bidirectional direction The volume of the resonant converter is used and a heat dissipation module with a hollow structure is used to improve the heat dissipation performance.
The volume of the bidirectional resonant converter is reduced, thereby reducing production, installation and manufacturing costs, improving maintenance, and improving heat dissipation performance through the heat dissipation module of the hollow structure.
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Figure CN222509087U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of bidirectional power supplies, and in particular to a bidirectional resonant converter and a mobile power supply. Background Art
[0002] A resonant converter is a circuit that uses a resonant circuit to achieve energy conversion. It can be widely used in fields such as radio communications, power electronics, industrial automation, and household appliances. It has the advantages of high efficiency, high power density, and soft switching. When designing a resonant converter, factors such as volume and weight should be considered comprehensively, and appropriate components, circuit topology, and control strategies should be selected to improve its performance and reduce volume and weight. At the same time, attention should also be paid to issues such as heat dissipation design and the degree of integration to ensure the reliability and performance of the resonant converter.
[0003] The bidirectional resonant DC-DC converter in the prior art is mainly composed of four parts: a main power module, a control module, a drive module and an auxiliary power module. Among them, the main power module is provided with a plurality of magnetic devices and a plurality of power devices, and these magnetic devices and power devices are arranged on one side of the substrate. At the same time, the control module, the drive module and the auxiliary power module are respectively connected to the main power module through leads to realize energy conversion.
[0004] However, this bidirectional resonant DC-DC converter is relatively large in size and uses a large number of structural parts and cables, resulting in high production and installation costs and poor maintainability. Utility Model Content
[0005] The utility model aims to provide a bidirectional resonant converter and a mobile power source, so as to solve the problem that the bidirectional resonant converter in the prior art has a large volume, resulting in high production and installation costs and poor maintainability.
[0006] In a first aspect, the utility model provides a bidirectional resonant converter, comprising: a substrate, a main power module, a control module, a drive module and an auxiliary power module;
[0007] The main power module includes: a plurality of magnetic units and a plurality of power units;
[0008] The plurality of power units are fixedly arranged on a first surface of the substrate, the plurality of magnetic units are fixedly arranged on a second surface of the substrate, and the first surface is opposite to the second surface;
[0009] The control module and the driving module are respectively fixedly arranged on the first surface of the substrate, and the control module and the driving module are both connected to at least one of the magnetic units and at least one of the power units;
[0010] The auxiliary power supply module is connected to the control module and the drive module respectively.
[0011] As a possible implementation, the bidirectional resonant converter further includes: a heat dissipation module having a hollow structure;
[0012] The heat dissipation module is fixedly connected to the base plate via a connecting piece, and a cavity is provided between the heat dissipation module and the base plate.
[0013] As a possible implementation, the plurality of magnetic units include: a transformer, a plurality of resonant inductors, a plurality of high-voltage metal oxide semiconductor field effect transistors, a plurality of low-voltage metal oxide semiconductor field effect transistors, a conversion inductor, and a plurality of resonant capacitors;
[0014] The multiple transformers, the resonant inductors, the resonant capacitors and the conversion inductor are located in the hollow structure of the heat dissipation module, and the space in the hollow structure except the space where the multiple magnetic units are located is filled with heat dissipation material;
[0015] The high-voltage metal oxide semiconductor field effect transistors and the low-voltage metal oxide semiconductor field effect transistors are located in the cavity and are attached to the second surface of the substrate. As a possible implementation, a ceramic plate is fixedly attached to one end of each high-voltage metal oxide semiconductor field effect transistor away from the second surface, and an insulating thermal pad and an aluminum plate are fixedly attached to one end of each low-voltage metal oxide semiconductor field effect transistor away from the second surface.
[0016] As a possible implementation manner, the transformer includes a plurality of secondary resonant inductors, and the plurality of secondary resonant inductors are connected in parallel.
[0017] As a possible implementation manner, the control module and the driving module are respectively inserted vertically into the female socket on the first surface of the substrate through pins.
[0018] As a possible implementation manner, the control module is vertically attached to the driving module.
[0019] As a possible implementation manner, the auxiliary power module is arranged in parallel with the substrate, and the auxiliary power module is attached to the top of the control module and the top of the driving module.
[0020] As a possible implementation, the bidirectional resonant converter further includes: at least one vertical connection member;
[0021] One end of each of the vertical connecting members is fixedly connected to the auxiliary power module, and the other end of each of the vertical connecting members is fixedly connected to the heat dissipation module.
[0022] In a second aspect, the utility model further provides a mobile power source, comprising a battery and the bidirectional resonant converter described in the first aspect above;
[0023] The battery is connected to a substrate in the bidirectional resonant converter.
[0024] The beneficial effect of the protection circuit provided by the utility model is that by fixing multiple power units on the first surface of the substrate, fixing multiple magnetic units on the second surface of the substrate, and setting the control module, the drive module and the auxiliary power supply module on the first surface of the substrate, the volume of the bidirectional resonant converter can be reduced, thereby reducing the production and installation manufacturing costs and improving maintainability. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.
[0026] Figure 1 A schematic diagram of a three-dimensional structure of a bidirectional resonant converter provided in an embodiment of the present application;
[0027] Figure 2 A schematic diagram of a three-dimensional structure of a heat dissipation module in a bidirectional resonant converter provided in an embodiment of the present application;
[0028] Figure 3 Another three-dimensional schematic diagram of the bidirectional resonant converter provided in an embodiment of the present application;
[0029] Figure 4 A partial schematic diagram of a plurality of magnetic units in a bidirectional resonant converter provided in an embodiment of the present application;
[0030] Figure 5 A cross-sectional schematic diagram of a bidirectional resonant converter provided in an embodiment of the present application;
[0031] Figure 6 Another cross-sectional schematic diagram of a bidirectional resonant converter provided in an embodiment of the present application;
[0032] Figure 7 A schematic diagram of a circuit principle of a bidirectional resonant converter provided in an embodiment of the present application;
[0033] Figure 8 A schematic diagram of another three-dimensional structure of a bidirectional resonant converter provided in an embodiment of the present application;
[0034] Fig. 9 A schematic diagram of another three-dimensional structure of a bidirectional resonant converter provided in an embodiment of the present application;
[0035] Fig.10 A schematic diagram of the structure of a mobile power supply provided in an embodiment of the present application.
[0036] Icons: 10-bidirectional resonant converter, 100-substrate, 200-main power module, 300-control module, 400-drive module, 500-auxiliary power module, 201-magnetic unit, 202-power unit, 600-heat dissipation module, 601-heat dissipation material, 602-ceramic plate, 603-insulating thermal pad, 604-aluminum plate, 700-connector, 800-vertical connector, 20-mobile power supply, 30-battery. DETAILED DESCRIPTION
[0037] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.
[0038] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0039] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0040] In the description of the present utility model, it should be understood that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the utility model product is conventionally placed when in use, or are the orientations or positional relationships conventionally understood by those skilled in the art. They are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present utility model.
[0041] Furthermore, the terms “first”, “second”, “third”, etc. are merely used for distinguishing descriptions and are not to be understood as indicating or implying relative importance.
[0042] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0043] The bidirectional resonant DC-DC converter in the prior art is mainly composed of four parts: a main power module, a control module, a drive module and an auxiliary power module. Among them, the main power module is provided with a plurality of magnetic devices and a plurality of power devices, and these magnetic devices and power devices are arranged on one side of the substrate. At the same time, the control module, the drive module and the auxiliary power module are respectively connected to the main power module through leads to realize energy conversion.
[0044] However, this bidirectional resonant DC-DC converter is relatively large in size and uses a large number of structural parts and cables, resulting in high production and installation costs and poor maintainability.
[0045] Based on the above problems, the present application proposes a bidirectional resonant converter, including a substrate, a main power module having multiple magnetic units and multiple power units, a control module, a drive module and an auxiliary power module. By fixing the multiple power units on the first surface of the substrate and fixing the multiple magnetic units on the second surface of the substrate, the volume of the bidirectional resonant converter can be reduced, thereby reducing the production and installation manufacturing costs and improving maintainability.
[0046] The bidirectional resonant converter provided in the present application is described below in combination with multiple embodiments.
[0047] Figure 1 A three-dimensional schematic diagram of the bidirectional resonant converter provided in the embodiment of the present application, referring to Figure 1 As shown, the bidirectional resonant converter 10 includes: a substrate 100 , a main power module 200 , a control module 300 , a drive module 400 and an auxiliary power module 500 .
[0048] Among them, the substrate 100 can be a printed circuit board (PCB), which provides mechanical support and electrical connection for the main power module 200, the control module 300, the drive module 400 and the auxiliary power module 500, so as to ensure the normal operation of the bidirectional resonant converter 10 provided in this application.
[0049] The main power module 200 includes: a plurality of magnetic units 201 and a plurality of power units 202 .
[0050] Optionally, the main power module 200 includes: a plurality of magnetic units 201 and a plurality of power units 202. The main power module 200 is used to realize bidirectional transmission of energy and provide electrical isolation and voltage conversion.
[0051] The magnetic unit 201 includes but is not limited to a unit that generates heat when the bidirectional resonant converter 10 is running, and the power unit 202 includes but is not limited to a unit related to the operating power of the bidirectional resonant converter when the bidirectional resonant converter 10 is running.
[0052] The plurality of power units 202 are fixedly disposed on a first surface of the substrate 100 , and the plurality of magnetic units 201 are fixedly disposed on a second surface of the substrate 100 , wherein the first surface is opposite to the second surface.
[0053] It can be understood that the first side and the second side of the substrate 100 are the front and back sides of the printed circuit board, that is, the first side of the substrate 100 is the top layer (Top Layer) of the printed circuit board, and the second side of the substrate 100 is the bottom layer (BottomLayer) of the printed circuit board. The top layer and the bottom layer of the substrate 100 are both wiring surfaces, including various wires, component pads, and through holes or vias, etc., so as to provide mechanical support and electrical connection for multiple magnetic units 201 and multiple power units 202, control modules 300, drive modules 400 and auxiliary power modules 500, so as to ensure that the bidirectional resonant converter 10 provided in the present application realizes bidirectional transmission of energy.
[0054] Optionally, the multiple power units 202 may be the same electronic devices or different electronic devices, and each power unit 202 may be fixedly disposed on the first surface of the substrate 100, so that each power unit 202 can be electrically connected in the bidirectional resonant converter 10 through the substrate 100. It is understood that the number and specific positions of the multiple power units 202 may be adjusted according to actual application conditions. Figure 1 Only one possible implementation is shown, and the present invention does not elaborate on it.
[0055] Optionally, the plurality of magnetic units 201 may be the same electronic device or different electronic devices, and each magnetic unit 201 may be fixedly arranged on the first surface of the substrate 100 through a copper nose lead and a stud, so that each magnetic unit 201 can be electrically connected in the bidirectional resonant converter 10 through the substrate 100. It is understood that the number and specific positions of the plurality of magnetic units 201 may be adjusted according to actual application conditions. Figure 1 Only one possible implementation is shown, and the present invention does not elaborate on it.
[0056] The control module 300 and the driving module 400 are respectively fixedly disposed on the first surface of the substrate 100, and the control module 300 and the driving module 400 are both connected to at least one magnetic unit 201 and at least one power unit 202, and the auxiliary power module 500 is respectively connected to the control module 300 and the driving module 400.
[0057] Optionally, the control module 300 is used to realize automatic control and regulation of the bidirectional resonant converter 10 , specifically including: voltage control, current control, power control and protection control, so that the operation of the bidirectional resonant converter 10 is stable and reliable.
[0058] Optionally, the driving module 400 is used to provide necessary driving signals for the operation of the bidirectional resonant converter 10, so that the devices in the main power module 200 can operate according to the set control strategy, specifically including: switch tube driving, protection driving and buffer driving.
[0059] Optionally, the auxiliary power supply module 500 is used to provide power and reference voltage required for operation of other modules in the bidirectional resonant converter 10 to ensure normal and stable operation of the bidirectional resonant converter 10. Specifically, it includes: power supply, reference voltage and power management.
[0060] Optionally, the control module 300 and the driving module 400 are respectively fixed on the top layer of the substrate 100, and the control module 300 and the driving module 400 are connected to at least one magnetic unit 201 and at least one power unit 202 through the substrate 100, so that the control and driving functions of the control module 300 and the driving module 400 in the bidirectional resonant converter 10 can be realized through the substrate 100.
[0061] Optionally, the auxiliary power module 500 is electrically connected to the control module 300 and the drive module 400 respectively. It can be understood that Figure 1 Only one exemplary connection method is given.
[0062] In this embodiment, by fixing multiple power units on the first surface of the substrate, fixing multiple magnetic units on the second surface of the substrate, and setting the control module, the drive module and the auxiliary power supply module on the first surface of the substrate, the volume of the bidirectional resonant converter can be reduced, thereby reducing the production and installation manufacturing costs and improving maintainability.
[0063] Figure 2 A schematic diagram of a partial three-dimensional structure of a heat dissipation module in a bidirectional resonant converter provided in an embodiment of the present application.
[0064] As a possible implementation, refer to Figure 2 As shown, the bidirectional resonant converter 10 further includes a heat dissipation module 600 having a hollow structure.
[0065] Optionally, the heat dissipation module 600 is used to dissipate the heat generated during the normal operation of the bidirectional resonant converter 10 to prevent overheating from causing damage to the bidirectional resonant converter 10 or performance degradation.
[0066] It can be understood that the heat dissipation module 600 has an internal cavity, which is surrounded by the external heat dissipation module 600, which can reduce weight, facilitate transportation and installation, and save a lot of materials and reduce costs. At the same time, the heat dissipation module 600 can also be encapsulated by filling the internal cavity with glue to form a closed space to dissipate heat from the devices in the space.
[0067] Optionally, the hollow structure in the heat dissipation module 600 can be adjusted according to application conditions, and the present utility model only provides an example.
[0068] The heat dissipation module 600 is fixedly connected to the substrate 100 via a connecting member 700 , and a cavity is provided between the heat dissipation module 600 and the substrate 100 .
[0069] Optionally, Figure 3 Another three-dimensional schematic diagram of the bidirectional resonant converter provided in the embodiment of the present application is shown in FIG. Figure 3 As shown, the heat dissipation module 600 is fixedly connected to the substrate 100 via a connector 700 to fix the heat dissipation module 600 , and a cavity is provided between the heat dissipation module 600 and the substrate 100 to ensure the heat dissipation performance of the heat dissipation module 600 .
[0070] Optionally, the connector 700 may be a bolt connector, a rivet connector, a welding connector, a fastener connector, etc. The number of the connector 700 may be multiple, and the present invention does not limit this.
[0071] By fixing the heat dissipation module with a hollow structure to the second surface of the substrate, the internal cavity in the heat dissipation module can place and package multiple magnetic units, so as to improve the heat dissipation performance of the bidirectional resonator.
[0072] As a possible implementation method, multiple magnetic units 201 include: a transformer, multiple resonant inductors, multiple high-voltage metal oxide semiconductor field effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, referred to as MOS tube), multiple low-voltage metal oxide semiconductor field effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, referred to as MOS tube), a conversion inductor and multiple resonant capacitors.
[0073] Optionally, the number of resonant inductors, high-voltage MOS transistors, low-voltage MOS transistors, and resonant capacitors may be adjusted according to actual conditions, and this application does not impose any restrictions on this.
[0074] By way of example, for ease of explanation, the drawings of the present application all illustrate the number of the resonant inductor, the high-voltage MOS tube, the low-voltage MOS tube, and the resonant capacitor as one each.
[0075] Figure 4 A partial schematic diagram of multiple magnetic units in a bidirectional resonant converter provided in an embodiment of the present application.
[0076] Optionally, refer to Figure 4 As shown, the transformer, each resonant capacitor and each resonant inductor are electrically connected.
[0077] Optionally, the transformer is used to change the size of the AC voltage and current, including the primary side and the secondary side, where the primary side refers to the part of the transformer input voltage. In the primary side of the transformer, the size and direction of the current change over time, and the phasor representation is usually used to describe the relationship between its voltage and current. The primary side is mainly responsible for receiving the input electric energy and transmitting it to the secondary side. The secondary side refers to the part of the transformer output voltage. The secondary side transmits and distributes the electric energy of the primary side through the principle of electromagnetic induction. The voltage, current and other parameters of the secondary side are determined by the turns ratio of the transformer, which is the ratio of the primary side voltage to the secondary side voltage. The electric energy of the primary side generates corresponding voltage and current on the secondary side through electromagnetic induction, thereby realizing the transmission and distribution of electric energy.
[0078] The transformer, each resonant inductor, each resonant capacitor and the conversion inductor are located in the hollow structure of the heat dissipation module 600, and the space in the hollow structure except the space where the transformer, each resonant inductor, each resonant capacitor and the conversion inductor are located is filled with heat dissipation material 601.
[0079] Each high-voltage MOS transistor and each low-voltage MOS transistor are located in the cavity and are attached to the second surface of the substrate 100 .
[0080] Optionally, Figure 5 A cross-sectional schematic diagram of a bidirectional resonant converter provided in an embodiment of the present application, referring to Figure 5 As shown, the transformer, each resonant inductor, each resonant capacitor and the conversion inductor are located in the hollow structure of the heat dissipation module 600, and the space in the hollow structure except the space where the transformer, each resonant inductor, each resonant capacitor and the conversion inductor are located is filled with heat dissipation material 601 by means of glue injection. Each high-voltage MOS tube and each low-voltage MOS tube are located in the cavity between the heat dissipation module 600 and the substrate 100, and are in contact with the second surface of the substrate 100.
[0081] It can be understood that after the transformer, each resonant inductor, each resonant capacitor, the conversion inductor, each high-voltage MOS tube and each low-voltage MOS tube are arranged in the above manner, the transformer, each resonant inductor, each resonant capacitor and the conversion inductor can be electrically connected to the substrate 100 through the terminal, and each high-voltage MOS tube and each low-voltage MOS tube can be directly electrically connected to the substrate 100 through the line on the second surface of the substrate 100, so that the function of the bidirectional resonant converter 10 is realized through the substrate 100.
[0082] The heat dissipation performance of the bidirectional resonator can be improved by packaging the transformer, each resonant inductor, each resonant capacitor and the conversion inductor into the internal cavity of the heat dissipation module and filling it with heat dissipation material, and locating each high-voltage MOS tube and each low-voltage MOS tube in the cavity between the heat dissipation module and the substrate.
[0083] Figure 6 Another cross-sectional schematic diagram of a bidirectional resonant converter provided in an embodiment of the present application.
[0084] As a possible implementation, Figure 5 Based on Figure 6 As shown, a ceramic plate 602 is fixedly attached to one end of each high-voltage MOS tube away from the second surface, and an insulating thermal pad 603 and an aluminum plate 604 are fixedly attached to one end of each low-voltage MOS tube away from the second surface.
[0085] Optionally, a ceramic plate 602 is fixedly attached to one end of each high-voltage MOS tube away from the second surface to insulate and dissipate heat for each high-voltage MOS tube.
[0086] Optionally, an insulating thermal pad 603 and an aluminum plate 604 are fixedly attached to one end of each low-voltage MOS tube away from the second surface to insulate and dissipate heat for each low-voltage MOS tube. At the same time, since the volume of the insulating thermal pad 603 and the aluminum plate 604 is smaller than that of the ceramic plate 602, after the insulating thermal pad 603 and the aluminum plate 604 are fixedly attached to one end of each low-voltage MOS tube away from the second surface, the volume occupied by each low-voltage MOS tube, the insulating thermal pad 603 and the aluminum plate 604 is small.
[0087] Figure 7 A schematic diagram of a circuit principle of a bidirectional resonant converter provided in an embodiment of the present application.
[0088] As a possible implementation, refer to Figure 7 As shown, the transformer includes a plurality of secondary resonant inductors, and the secondary resonant inductors of the plurality of transformers are connected in parallel.
[0089] Understandable, continue to refer to Figure 7 The bidirectional resonant converter 10 in the utility model adopts an isolated CLLLC topology structure, that is, the input side and the output side are not grounded. Based on user requirements, in order to obtain a wide range of output voltages, in addition to the CLLLC topology, there is also a BUCK-BOOST topology.
[0090] Specifically, the working modes are divided into the following two types: charging mode and discharging mode.
[0091] Exemplarily, the charging mode is: when the output side is connected to a DC power supply, exemplarily, the default high-voltage side input voltage is 360V, the high-voltage side voltage range is 250V to 450V, which is converted into a set 400V DC high voltage by BUCK-BOOST, and then converted into the voltage required by the battery by CLLLC.
[0092] Exemplarily, the discharge mode is: the battery voltage is converted into a 400V DC high voltage through CLLLC, and then converted into a set output voltage through BUCK-BOOST, and the output voltage range is 250V to 450V.
[0093] Optionally, taking the two secondary resonant inductors of the transformer as an example, the two secondary resonant inductors are connected in series with capacitors C6 and C7 and then connected in parallel, which can improve the impedance and stability of the bidirectional resonant converter and reduce current and voltage fluctuations, thereby improving the response speed and stability of the bidirectional resonant converter.
[0094] As a possible implementation manner, the control module 300 and the driving module 400 are respectively vertically inserted into the female socket on the first surface of the substrate 100 through pins.
[0095] Optionally, since the substrate 100 is a printed circuit board, the substrate 100 includes various wires, component pads, through holes, vias and female sockets, etc. The control module 300 and the drive module 400 can be vertically inserted into the female sockets on the first side of the substrate 100 through pins, respectively, thereby reducing the number of structural parts and cables used, saving a lot of materials and reducing costs.
[0096] As a possible implementation, continue to refer to Figure 3 As shown, the control module 300 and the driving module 400 are vertically attached.
[0097] Optionally, the control module 300 is vertically fitted to the driving module 400 and is vertically inserted into the female socket on the first side of the substrate 100 through a pin, which not only saves a lot of space for other high devices on the substrate 100, but also shortens the wiring path of the signal line, optimizes the electrical performance of the substrate 100, and improves the stability of the bidirectional resonant converter 10.
[0098] Figure 8 A schematic diagram of another three-dimensional structure of a bidirectional resonant converter provided in an embodiment of the present application.
[0099] As a possible implementation, refer to Figure 8 As shown, the auxiliary power module 500 is arranged in parallel with the substrate 100 , and the auxiliary power module 500 is attached to the top of the control module 300 and the top of the driving module 400 .
[0100] Optionally, a female socket is provided on the top of the control module 300 and the top of the driving module 400, and a pin is provided on the auxiliary power module 500. The auxiliary power module 500 can be electrically connected to the top of the control module 300 and the top of the driving module 400 through the female socket and the pin.
[0101] The auxiliary power module is arranged in parallel with the substrate, and the auxiliary power module is fitted with the top of the control module and the top of the driving module, so as to improve the stability of the bidirectional resonant converter.
[0102] Fig. 9 A schematic diagram of another three-dimensional structure of a bidirectional resonant converter provided in an embodiment of the present application.
[0103] As a possible implementation, refer to Fig. 9 As shown, in Figure 8 On the basis of, the bidirectional resonant converter 10 further includes: at least one vertical connection member 800.
[0104] One end of each vertical connection member 800 is fixedly connected to the auxiliary power module 500 , and the other end of each vertical connection member 800 is fixedly connected to the heat dissipation module 600 .
[0105] Optionally, the other end of each vertical connector 800 may pass through the substrate 100 and be fixedly connected to the heat dissipation module 600. The vertical connector 800 may be a hexagonal prism, and the number of vertical connectors 800 is not unique. Fig. 9 Take one as an example for illustration. The substrate 100 may be provided with small holes for each vertical connector 800 to pass through, so that the other end of each vertical connector 800 can pass through the substrate 100 and be fixedly connected to the heat dissipation module 600 .
[0106] Exemplarily, the size of the small hole through which the vertical connector 800 passes may match the size of the vertical connector, or may be slightly larger than the size of the vertical connector.
[0107] The auxiliary power module and the heat dissipation module are fixed by vertical connectors, so that the stability of the bidirectional resonant converter can be improved.
[0108] Fig.10 A schematic diagram of the structure of a mobile power supply provided in an embodiment of the present application.
[0109] Based on the same inventive concept, the utility model also provides a mobile power supply 20, referring to Fig.10 As shown, it includes a battery 30 and the above-mentioned bidirectional resonant converter 10 .
[0110] Optionally, the bidirectional resonant converter 10 is connected to a battery for charging and discharging.
[0111] Specifically, the substrate 100 in the bidirectional resonant converter 10 is connected to the battery 30 .
[0112] Exemplarily, the bidirectional resonant converter 10 may also be connected to an output interface for discharging output, or the bidirectional resonant converter 10 may also be connected to a power source for charging.
[0113] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.
Claims
1. A bidirectional resonant converter, characterized in that: include: Baseboard, main power module, control module, drive module and auxiliary power module; The main power module includes: a plurality of magnetic units and a plurality of power units; The plurality of power units are fixedly arranged on a first surface of the substrate, the plurality of magnetic units are fixedly arranged on a second surface of the substrate, and the first surface is opposite to the second surface; The control module and the driving module are respectively fixedly arranged on the first surface of the substrate, and the control module and the driving module are both connected to at least one of the magnetic units and at least one of the power units; The auxiliary power supply module is connected to the control module and the drive module respectively.
2. The bidirectional resonant converter according to claim 1, characterized in that: The bidirectional resonant converter further includes: a heat dissipation module having a hollow structure; The heat dissipation module is fixedly connected to the base plate via a connecting piece, and a cavity is provided between the heat dissipation module and the base plate.
3. The bidirectional resonant converter according to claim 2, characterized in that: The plurality of magnetic units include: a transformer, a plurality of resonant inductors, a plurality of high-voltage metal oxide semiconductor field effect transistors, a plurality of low-voltage metal oxide semiconductor field effect transistors, a switching inductor and a plurality of resonant capacitors; The transformer, the resonant inductors, the resonant capacitors and the conversion inductor are located in the hollow structure of the heat dissipation module, and the space in the hollow structure except the space where the multiple magnetic units are located is filled with heat dissipation material; The high-voltage metal oxide semiconductor field effect transistors and the low-voltage metal oxide semiconductor field effect transistors are located in the cavity and are attached to the second surface of the substrate.
4. The bidirectional resonant converter according to claim 3, characterized in that: A ceramic plate is fixedly attached to one end of each high-voltage MOSFET away from the second surface, and an insulating thermal pad and an aluminum plate are fixedly attached to one end of each low-voltage MOSFET away from the second surface.
5. The bidirectional resonant converter according to claim 3, characterized in that: The transformer comprises a plurality of secondary-side resonant inductors, and the plurality of secondary-side resonant inductors are connected in parallel.
6. The bidirectional resonant converter according to any one of claims 2 to 5, characterized in that: The control module and the driving module are respectively inserted vertically into the female socket on the first surface of the substrate through pins.
7. The bidirectional resonant converter according to claim 6, characterized in that: The control module is vertically attached to the driving module.
8. The bidirectional resonant converter according to claim 7, characterized in that: The auxiliary power module is arranged in parallel with the substrate, and the auxiliary power module is attached to the top of the control module and the top of the driving module.
9. The bidirectional resonant converter according to claim 8, characterized in that: The bidirectional resonant converter further comprises: at least one vertical connection member; One end of each of the vertical connecting members is fixedly connected to the auxiliary power module, and the other end of each of the vertical connecting members is fixedly connected to the heat dissipation module.
10. A mobile power source, characterized in that: A bidirectional resonant converter and a battery comprising any one of claims 1 to 9; The battery is connected to a substrate in the bidirectional resonant converter.