Heat dissipation device

Abstract

The utility model discloses a heat dissipation device, and belongs to the technical field of auxiliary heat dissipation of electronic equipment. Comprising a shell, a control circuit board, a heat dissipation assembly, a connecting piece and a power supply interface. The control circuit board and the heat dissipation assembly are arranged in the shell, and the heat dissipation assembly is connected with the control circuit board; the power supply interface is electrically connected to the control circuit board and is arranged and exposed out of the shell, and the connecting piece is installed on one side of the shell. Compared with the prior art, the heat dissipation device has the advantages that the heat dissipation device can be used for assisting heat dissipation of the electronic equipment, and normal use of the electronic equipment is prevented from being affected by heating.

Description

Technical Field

[0001] The utility model belongs to the technical field of auxiliary heat dissipation of electronic equipment, and particularly relates to a heat dissipation device. Background Art

[0002] As photography and videography are widely used in people's lives, more and more people take photos in their daily lives. People have higher and higher requirements for the photography and videography functions of electronic devices. The shooting functions of mobile phones on the market are also becoming more and more optimized, so that more and more photographers are starting to use mobile phones, tablets and other electronic devices for shooting. However, most electronic devices are prone to heat up during use, which affects the user's shooting work. Utility Model Content

[0003] In order to solve the above problems, the purpose of the present invention is to provide a heat dissipation device, which can assist electronic equipment in dissipating heat and avoid the heating problem affecting the normal use of the electronic equipment.

[0004] To achieve the above purpose, the technical solution of the utility model is as follows:

[0005] The utility model provides a heat dissipation device, comprising:

[0006] case;

[0007] Control circuit board;

[0008] Heat dissipation components;

[0009] Connectors;

[0010] Power supply interface;

[0011] The control circuit board and the heat dissipation component are arranged in the shell, and the heat dissipation component is connected to the control circuit board; the power supply interface is electrically connected to the control circuit board, and is arranged and exposed on the shell, and the connecting member is installed on one side of the shell.

[0012] In the present application, the heat dissipation device can be connected to the electronic device or the electronic device expansion frame through a connector; the heat dissipation component is used to assist the electronic device in dissipating heat; and the power supply interface can be used to supply power to the heat dissipation device.

[0013] Furthermore, the heat dissipation component includes a refrigeration component and a fan module. The refrigeration component and the fan module are arranged in the shell and are both electrically connected to the control circuit board. The refrigeration component is close to the fan module.

[0014] Furthermore, the heat dissipation component also includes a conductive member, the cooling member adopts a semiconductor cooling sheet, the hot end of the semiconductor cooling sheet faces the fan module, and the cold end of the semiconductor cooling sheet faces the conductive member. The cold energy generated by the cold end of the semiconductor cooling sheet is conducted to the electronic device by the conductive member to dissipate the heat of the electronic device, and the heat generated by the hot end is dissipated by the fan module, and the cooling member and the electronic device are cooled by the fan module.

[0015] Furthermore, the conductive member includes a first conductive member and a second conductive member, the first conductive member is attached to the middle of the refrigerating member, and more than one second conductive member is provided, and the second conductive member is arranged around the circumference of the refrigerating member.

[0016] Furthermore, the conducting member is made of a thermally conductive silicone material, and the thermally conductive silicone absorbs the cold energy generated by the semiconductor refrigeration sheet and conducts the cold energy to the electronic device.

[0017] Furthermore, the fan module includes a fan and a fan support frame, the fan is electrically connected to the control circuit board, the fan support frame is fixedly connected to the shell, a mounting position is provided on one side of the fan support frame, the fan is fixed at the mounting position, and the fan is close to the refrigeration component.

[0018] Furthermore, the control circuit board is fixed to the mounting position, and a through hole is provided in the middle of the control circuit board, and the fan is located in the through hole, so that the control circuit board surrounds the fan. In the present application, the fan support frame can support and fix the fan and the control circuit board, and the fan is provided in the middle of the control circuit board, which can facilitate heat dissipation of the entire control circuit board.

[0019] Furthermore, the shell includes a cover body and a bottom shell, the cover body and the bottom shell are fixedly connected, the connecting piece is arranged on the inner side of the bottom shell, and the fan support frame is fixedly connected to the cover body.

[0020] Furthermore, the cover body includes a first cover body and a second cover body, the first cover body and the second cover body are detachably connected, the second cover body and the bottom shell are fixedly connected, a first mounting groove is formed between the first cover body, the fan support frame, and the second cover body, the control circuit board and the fan module are arranged in the first mounting groove, a second mounting groove is formed between the second cover body, the fan support frame, and the bottom shell, and the refrigeration component, the conductive component, and the connecting component are all arranged in the second mounting groove. The first mounting groove and the second mounting groove can separate the shell into two cavities, realize the separate installation of each accessory, avoid mutual interference between the accessories, and improve the stability of the product structure.

[0021] Furthermore, the connecting member includes a plurality of magnets, the conductive member includes a plurality of conductive members, the plurality of magnets and the conductive members are arranged in the shell at intervals, and the plurality of magnets are arranged in a ring shape on the inner side of the bottom shell. In the present application, the heat dissipation device is adsorbed on the electronic device or the electronic device expansion frame by the magnet, and the bottom shell is fitted with one side of the electronic device or the electronic device expansion frame, which can facilitate wireless charging of the electronic device and has the advantage of easy disassembly.

[0022] Furthermore, the wireless charging module is fitted on the inner side of the bottom shell, so that it can be close to the electronic device for convenient wireless charging of the electronic device.

[0023] Furthermore, the second cover body, the fan support frame, the control circuit board and the first cover body are provided with corresponding positioning holes, and positioning columns are provided in the positioning holes, so that the second cover body, the fan support frame, the control circuit board and the first cover body are positioned relative to each other, thereby improving the stability of the structure.

[0024] Furthermore, the bottom surface of the first cover body is provided with an air inlet, and the peripheral side surface of the first cover body is provided with an air inlet, and the air inlet and the air outlet are both connected to the first mounting groove. When the fan module is working, the air fluid enters the first mounting groove where the fan module is located from the side peripheral surface of the first cover body, and then blows out from the bottom surface of the first cover body, bringing the heat generated by the semiconductor cooling sheet out of the heat dissipation device.

[0025] Furthermore, a switch button is also provided on the first cover, and the switch button is correspondingly provided above the control circuit board, and the switch button is connected to the control circuit board. When the heat dissipation device is fixed to the electronic device and the electronic device expansion frame for use, the switch button located on the first cover is just facing the user, which is convenient for pressing and controlling.

[0026] Furthermore, a wireless charging module is also provided in the second installation slot, the wireless charging module is electrically connected to the control circuit board, the conductive member is adjacent to the wireless power supply module, and the wireless charging module is provided at the cold end of the semiconductor refrigeration member.

[0027] Furthermore, the wireless charging module adopts a wireless charging coil.

[0028] Furthermore, an electronic contact pin is provided on the control circuit board, and the end of the electronic contact pin protrudes out of the shell. In the prior art, in order to improve the shooting effect, it is necessary to match the electronic device with external photographic accessories such as filters, sunshades, lights, microphones, power supply handles, etc. to assist in shooting during the shooting process. These external photographic accessories are usually assembled on an electronic device expansion frame for use, and the power supply handle supplies power to each accessory through the electronic device expansion frame. The present application provides an electronic contact pin so that the heat dissipation device can be electrically connected to the electronic device expansion frame, and can supply power to the electronic device expansion accessories through the electronic device expansion frame, and can also supply power to the heat dissipation device through the electronic device expansion frame.

[0029] Furthermore, a positioning protrusion is also provided on the housing. When the heat dissipation device is used in conjunction with an electronic device expansion frame, the positioning protrusion can cooperate with a positioning groove on the electronic device expansion frame to facilitate positioning of the two.

[0030] The advantage of the present invention is that, compared with the prior art, the heat dissipation device can be used to assist electronic equipment in dissipating heat, thereby preventing heating problems from affecting normal use of the electronic equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic structural diagram of the heat dissipation device from a first-person perspective.

[0032] Figure 2 It is a structural schematic diagram of the heat dissipation device from a second perspective.

[0033] Figure 3 This is an exploded view of the heat sink.

[0034] Figure 4 It is a top view of the heat sink.

[0035] Figure 5 yes Figure 4 Schematic diagram of the cross-sectional structure of AA.

[0036] Figure 6 It is a structural diagram of the combination of the heat dissipation device and the electronic equipment expansion frame.

[0037] In the figure:

[0038] 100. Heat dissipation device, 200. Electronic device expansion frame, 300. Filter, 400. Power supply handle.

[0039] 1. Shell, 10. Cover, 11. Bottom shell, 12. First cover, 13. Second cover, 14. First mounting groove, 15. Second mounting groove, 16. Positioning hole, 17. Positioning column, 18. Air inlet, 19. Air outlet.

[0040] 2. Control circuit board, 21. Avoid through holes.

[0041] 3. Heat dissipation component, 31. Refrigeration component, 311. Semiconductor refrigeration plate, 32. Conducting component, 321. First conducting component, 322. Second conducting component, 33. Fan module, 331. Fan, 332. Fan support frame, 333. Installation position.

[0042] 4. Connector, 41. Magnet.

[0043] 5. Power supply interface, 6. Wireless charging module, 61. Wireless charging coil, 7. Switch button, 8. Electronic contact pin, 9. Positioning protrusion. DETAILED DESCRIPTION

[0044] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0045] To achieve the above purpose, the technical solution of this embodiment is as follows:

[0046] See also Figure 1-5 As shown, this embodiment provides a heat dissipation device 100, including a housing 1, a control circuit board 2, a heat dissipation component 3, a connector 4 and a power supply interface 5.

[0047] The control circuit board 2 and the heat dissipation component 3 are arranged in the shell 1, and the heat dissipation component 3 is connected to the control circuit board 2; the power supply interface 5 is electrically connected to the control circuit board 2, and is arranged and exposed in the shell 1, and the connector 4 is installed on one side of the shell 1.

[0048] In the present application, the heat dissipation device 100 can be connected to the electronic device or the electronic device expansion frame 200 through the connector 4; the heat dissipation component 3 is used to assist the electronic device in dissipating heat; and the power supply interface 5 can be used to supply power to the heat dissipation device 100.

[0049] Furthermore, the heat dissipation assembly 3 includes a refrigeration element 31, a conductive element 32, and a fan module 33. The refrigeration element 31 and the fan module 33 are arranged in the housing 1 and are both electrically connected to the control circuit board 2, and the refrigeration element 31 is arranged between the fan module 33 and the conductive element 32. In the present application, the refrigeration element 31 can generate cold energy after being powered on, and conduct the cold energy to the electronic device to dissipate the heat of the electronic device; the fan module 33 can be used to dissipate the heat and cool the refrigeration element 31 and the electronic device.

[0050] Furthermore, the cooling element 31 is a semiconductor cooling sheet, the hot end of the semiconductor cooling sheet 311 faces the fan module 33, and the cold end of the semiconductor cooling sheet 311 faces the conductive element 32. The cold energy generated by the cold end of the semiconductor cooling sheet 311 is transferred to the electronic device, and the heat generated by the hot end is dissipated by the fan module 33.

[0051] Furthermore, the conductive member 32 includes a first conductive member 321 and a second conductive member 322 . The first conductive member 321 is attached to the bottom of the wireless charging coil 61 , and more than one second conductive member 322 is provided, and the second conductive member 322 is arranged around the circumference of the cooling element.

[0052] Furthermore, the conductive member 32 is made of a thermally conductive silicone material, and the thermally conductive silicone is close to the electronic device and the semiconductor cooling sheet 311 to promote heat exchange, thereby accelerating the process of lowering the temperature of the electronic device.

[0053] Furthermore, the fan module 33 includes a fan 331 and a fan support frame 332. The fan 331 is electrically connected to the control circuit board 2. The fan support frame 332 is fixedly connected to the shell 1. A mounting position 333 is provided on one side of the fan support frame 332. The fan 331 is fixed at the mounting position 333, and the fan 331 is oriented close to the refrigeration component.

[0054] Furthermore, the control circuit board 2 is fixed to the mounting position 333, and a avoidance through hole 21 is provided in the middle of the control circuit board 2, and the fan 331 is located in the avoidance through hole 21, so that the control circuit board 2 surrounds the peripheral side of the fan 331. In the present application, the fan support frame 332 can support and fix the fan 331 and the control circuit board 2, and the fan 331 is provided in the middle of the control circuit board 2, which can facilitate heat dissipation of the entire control circuit board 2.

[0055] Furthermore, the shell 1 includes a cover body 10 and a bottom shell 11 , the cover body 10 and the bottom shell 11 are fixedly connected, the connecting member 4 is arranged on the inner side of the bottom shell 11 , and the fan support frame 332 is fixedly connected to the cover body 10 .

[0056] Further, the cover body 10 includes a first cover body 12 and a second cover body 13, the first cover body 12 and the second cover body 13 are detachably connected, the second cover body 13 and the bottom shell are fixedly connected, a first mounting groove 14 is formed between the first cover body 12, the fan support frame 332, and the second cover body 13, the control circuit board 2 and the fan module 33 are arranged in the first mounting groove 14, a second mounting groove 15 is formed between the second cover body 13, the fan support frame 332, and the bottom shell 11, and the refrigeration component 31, the conductive component 32, and the connecting component 4 are all arranged in the second mounting groove 15. The first mounting groove 14 and the second mounting groove 15 can separate the shell 1 into two cavities, realize the separate installation of each accessory, avoid mutual interference between each accessory, and improve the stability of the product structure. It can be understood that the first cover body 12 and the second cover body 13 can be detachably connected by a buckle, or can be directly detachably connected by screws.

[0057] Furthermore, the heat dissipation device 100 also includes a wireless charging module 6, which is electrically connected to the control circuit board 2. The wireless charging module 2 is arranged on the side of the refrigeration element 31 away from the fan module 33, and is arranged at the cold end of the semiconductor refrigeration sheet 311. The wireless charging module 6 uses a wireless charging coil 61. In this embodiment, when the wireless charging module 2 supplies power to the electronic device, when the temperature of the electronic device or the wireless charging module 6 rises, the cold end of the refrigeration element 31 can dissipate heat and cool down the electronic device and the wireless charging module 6, thereby reaching a temperature equilibrium state.

[0058] Furthermore, the connector 4 uses a magnet 41, and a plurality of magnets 41 are provided, and the plurality of magnets 41 are arranged in a ring shape on the inner side of the bottom shell 11, and the plurality of magnets 41 and the second conductive member 322 are arranged in the shell 1 at intervals. In the present application, the heat dissipation device 100 is adsorbed on the electronic device or the electronic device expansion frame 200 by the magnet 41, and the bottom shell 11 is fitted with one side of the electronic device or the electronic device expansion frame 200, which can facilitate wireless charging of the electronic device and has the advantage of convenient disassembly.

[0059] Furthermore, the wireless charging module 6 is arranged on the inner side of the bottom shell 11. When used, it can be close to the electronic device to facilitate wireless charging of the electronic device.

[0060] Furthermore, corresponding positioning holes 16 are provided on the second cover body 13, the fan support frame 332, the control circuit board 2 and the first cover body 12, and positioning columns 17 are provided in the positioning holes 16, so that the second cover body 13, the fan support frame 332, the control circuit board 2 and the first cover body 12 are positioned relative to each other, thereby improving the stability of the structure.

[0061] Furthermore, the bottom surface of the first cover body 12 is provided with an air inlet 18, and the peripheral side surface of the first cover body 12 is provided with an air inlet 19, and the air inlet 18 and the air outlet 19 are both connected to the first mounting groove 14. When the fan module 33 is working, the air fluid enters the first mounting groove 14 where the fan module 33 is located from the side peripheral surface of the first cover body 12, and then blows out from the bottom surface of the first cover body 12, bringing the heat generated by the semiconductor cooling sheet 311 out of the heat dissipation device 100.

[0062] Furthermore, a switch button 7 is also provided on the first cover 12, and the switch button 7 is correspondingly provided above the control circuit board 2, and the switch button 7 is connected to the control circuit board 2. When the heat dissipation device 100 is fixed to the electronic device and the electronic device expansion frame 200 for use, the switch button 7 located on the first cover 12 is just facing the user, which is convenient for pressing and controlling.

[0063] Furthermore, an electronic contact pin 8 is provided on the control circuit board 2, and the end of the electronic contact pin 8 protrudes out of the housing 1. Figure 6 In the prior art, in order to improve the shooting effect, it is necessary to match the electronic device with external photographic accessories such as filters 300, sunshades, lights, microphones, and power supply handles 400 to assist in shooting. These external photographic accessories are usually mounted on the electronic device expansion frame 200 for use, and the power supply handle supplies power to each accessory through the electronic device expansion frame 200. The present application provides an electronic contact pin 8 so that the heat dissipation device 100 can be electrically connected to the electronic device expansion frame 200, and can supply power to the electronic device expansion accessories through the electronic device expansion frame 200, and can also supply power to the heat dissipation device 100 through the electronic device expansion frame 200.

[0064] Furthermore, a positioning protrusion 9 is also provided on the housing 1. When the heat dissipation device 100 is used in conjunction with an electronic device expansion frame, the positioning protrusion 9 can cooperate with the positioning groove on the electronic device expansion frame to facilitate positioning of the two.

[0065] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A heat dissipation device, characterized in that: include: A shell, a control circuit board, a heat dissipation component, a connector and a power supply interface; the control circuit board and the heat dissipation component are arranged in the shell, and the heat dissipation component is connected to the control circuit board; the power supply interface is electrically connected to the control circuit board, and is arranged and exposed on the shell, and the connector is installed on one side of the shell.

2. A heat dissipation device according to claim 1, characterized in that: The heat dissipation component includes a refrigeration component and a fan module. The refrigeration component and the fan module are arranged in the shell and are both electrically connected to the control circuit board. The refrigeration component is close to the fan module.

3. A heat dissipation device as claimed in claim 2, characterized in that: The heat dissipation component also includes a conductive member. The cooling member is a semiconductor cooling sheet. The hot end of the semiconductor cooling sheet faces the fan module, and the cold end of the semiconductor cooling sheet faces the conductive member.

4. A heat dissipation device according to claim 3, characterized in that: The connecting member includes a plurality of magnets, and the conductive member includes a plurality of conductive members, and the plurality of magnets and the conductive members are arranged in the shell at intervals.

5. A heat dissipation device as claimed in claim 2, characterized in that: The fan module includes a fan and a fan support frame. The fan is electrically connected to the control circuit board. The fan support frame is fixedly connected to the shell. A mounting position is provided on one side of the fan support frame. The fan is fixed at the mounting position and is close to the refrigeration component.

6. A heat dissipation device as claimed in claim 5, characterized in that: The control circuit board is fixed at the installation position, and a avoidance through hole is arranged in the middle of the control circuit board. The fan is located in the avoidance through hole, so that the control circuit board surrounds the peripheral side of the fan.

7. A heat dissipation device as claimed in claim 5, characterized in that: The shell comprises a cover body and a bottom shell body, the cover body and the bottom shell body are fixedly connected, the connecting piece is arranged on the inner side of the bottom shell body, and the fan supporting frame is fixedly connected to the cover body.

8. A heat dissipation device as claimed in claim 7, characterized in that: The cover body includes a first cover body and a second cover body, the first cover body and the second cover body are detachably connected, the second cover body and the bottom shell are fixedly connected, a first mounting groove is formed between the first cover body, the fan support frame and the second cover body, the control circuit board and the fan module are arranged in the first mounting groove, a second mounting groove is formed between the second cover body, the fan support frame and the bottom shell, and the refrigeration component, the conductive component and the connecting component are all arranged in the second mounting groove.

9. A heat dissipation device as claimed in claim 8, characterized in that: A wireless charging module is also arranged in the second installation groove, the conductive member is adjacent to the wireless charging module, the wireless charging module is electrically connected to the control circuit board, and the wireless charging module is arranged at the cold end of the refrigeration member.

10. A heat dissipation device according to any one of claims 1 to 9, characterized in that: The control circuit board is provided with an electronic contact pin, and the end of the electronic contact pin protrudes out of the shell.

11. A heat dissipation device according to claim 10, characterized in that: A positioning protrusion is also arranged on the shell.

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