Small PCB with strong heat dissipation performance

Abstract

The utility model discloses a strong heat dissipation PCB small board, which comprises a small board module, a heat dissipation bottom frame and a heat dissipation module, the small board module is provided with a small board framework, a PCB small board arranged on the framework and components arranged on the PCB small board, the heat dissipation bottom frame is fixed on the lower side of the small board module, the heat dissipation bottom frame is flush with the outer edge of the small board framework, and the small board framework is fixed on the heat dissipation bottom frame. A heat dissipation module is arranged in the heat dissipation bottom frame; the heat dissipation module comprises a plurality of heat dissipation columns, a plurality of connecting columns, a plurality of connecting sheets and a heat dissipation film, the heat dissipation columns and the connecting columns are made of metal materials with good heat conductivity, the front ends and the rear ends of the heat dissipation columns are connected with the heat dissipation bottom frame through the connecting columns, and the connecting sheets are arranged outside the heat dissipation columns. The heat dissipation bottom frame is integrated on the lower side of the small plate module, heat at the bottom of the small plate module can be transferred to the heat dissipation module through the heat dissipation bottom frame, heat dissipation is conducted through the heat dissipation module, the whole heat dissipation structure is simple and elegant, and meanwhile the heat conduction efficiency and the heat dissipation efficiency are high.

Description

Technical Field

[0001] The utility model relates to the field of PCB circuit boards, in particular to a PCB board with strong heat dissipation. Background Art

[0002] At present, in order to meet the needs of miniaturization of circuit structure and cost saving, most electronic and electrical equipment will integrate certain functions into corresponding small boards and then connect them to the main PCB through cables, so as to reduce the volume of the main PCB without affecting the functions.

[0003] Due to the small size and volume of the small board, conventional radiators are not customized for the small board, so the heat dissipation of most small board modules is carried out through copper sheets. The conventional copper sheets have limited heat dissipation area, and the heat conduction and heat dissipation efficiency are low. Based on this, the utility model proposes a PCB small board with strong heat dissipation. Utility Model Content

[0004] The purpose of the utility model is to provide a PCB small board with strong heat dissipation to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a small PCB board with strong heat dissipation, including a small board module, a heat dissipation bottom frame and a heat dissipation module, the small board module has a small board frame, a PCB small board arranged on the frame, and components arranged on the PCB small board, wherein the heat dissipation bottom frame is fixed on the lower side of the small board module, the heat dissipation bottom frame is flush with the outer edge of the small board frame, and the heat dissipation module is arranged in the heat dissipation bottom frame; the heat dissipation module includes heat dissipation columns, connecting columns, connecting sheets and heat dissipation films, wherein the heat dissipation columns and connecting columns are provided in plurality and are all made of metal materials with good thermal conductivity, the front and rear ends of the plurality of heat dissipation columns are connected to the heat dissipation bottom frame through connecting columns, and connecting sheets are arranged outside the plurality of heat dissipation columns.

[0006] Preferably, the connecting piece includes an upper piece body and a lower piece body which are buckled together, wherein the upper piece body and the lower piece body are both made of copper material, and the upper piece body and the lower piece body both include an integrally formed arc-shaped heat dissipation part and a sheet-shaped heat dissipation part.

[0007] Preferably, the arc-shaped heat dissipation part and the sheet-shaped heat dissipation part are both covered with heat dissipation films, the arc-shaped heat dissipation part is wrapped around the heat dissipation column, and the front and rear ends of the plurality of arc-shaped heat dissipation parts are connected to the side wall of the heat dissipation bottom frame through the sheet-shaped heat dissipation part.

[0008] Preferably, the plurality of heat dissipation columns are all cylindrical in shape, and each heat dissipation column has a heat dissipation protrusion on its outer wall, and the heat dissipation protrusion can contact with the arc-shaped heat dissipation portion of the connecting piece, and a gap is provided between the heat dissipation protrusion and the arc-shaped heat dissipation portion.

[0009] Preferably, the heat dissipation film is a phase change heat dissipation film.

[0010] Compared with the prior art, the beneficial effects of the utility model are:

[0011] The heat dissipation bottom frame of the utility model is integrated at the lower side of the small board module. The heat dissipation bottom frame can transfer the heat at the bottom of the small board module to the heat dissipation module. The heat dissipation module adopts the cooperation of heat dissipation columns, connecting columns and connecting plates. Most of the heat is transferred to the heat dissipation columns through the connecting columns, and the heat dissipation is assisted by the heat dissipation columns themselves and the connecting plates on their outside. At the same time, in order to further improve the heat dissipation efficiency of the connecting plates, the phase change heat dissipation film can quickly absorb and dissipate the heat. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0013] Figure 2 It is a schematic diagram of the bottom structure of the heat dissipation bottom frame of the utility model.

[0014] In the figure: 1, small board module; 2, heat dissipation bottom frame; 3, heat dissipation column; 4, connecting column; 5, connecting plate; 501, arc-shaped heat dissipation part; 502, sheet-shaped heat dissipation part. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0016] In the description of the present invention, it should be noted that the terms "vertical", "up", "down", "horizontal", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0017] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0018] See also Figure 1-2The utility model provides a technical solution: a PCB small board with strong heat dissipation, comprising a small board module 1, a heat dissipation bottom frame 2 and a heat dissipation module, wherein the small board module 1 has a small board skeleton, a PCB small board arranged on the skeleton, and components arranged on the PCB small board, wherein the heat dissipation bottom frame 2 is fixed on the lower side of the small board module 1, the heat dissipation bottom frame 2 is flush with the outer edge of the small board skeleton, and the heat dissipation module is arranged in the heat dissipation bottom frame 2; the heat dissipation module comprises heat dissipation columns 3, connecting columns 4, connecting sheets 5 and heat dissipation films, wherein the heat dissipation columns 3 and the connecting columns 4 are provided in plurality and are all made of metal materials with good thermal conductivity, the front and rear ends of the plurality of heat dissipation columns 3 are connected to the heat dissipation bottom frame 2 through the connecting columns 4, and connecting sheets 5 are arranged outside the plurality of heat dissipation columns 3.

[0019] In this embodiment, the connecting plate 5 includes an upper plate body and a lower plate body that are buckled together, wherein the upper plate body and the lower plate body are both made of copper material, and both the upper plate body and the lower plate body include an integrally formed arc-shaped heat dissipation portion 501 and a sheet-shaped heat dissipation portion 502.

[0020] In this embodiment, the arc-shaped heat dissipation part 501 and the sheet-shaped heat dissipation part 502 are both covered with heat dissipation films. The arc-shaped heat dissipation part 501 is wrapped around the heat dissipation column 3 , and the front and rear ends of the plurality of arc-shaped heat dissipation parts 501 are connected to the side wall of the heat dissipation bottom frame 2 through the sheet-shaped heat dissipation part 502 .

[0021] In this embodiment, the plurality of heat dissipation columns 3 are all cylindrical in shape, and each heat dissipation column 3 is provided with a heat dissipation protrusion on its outer wall, and the heat dissipation protrusion can contact with the arc-shaped heat dissipation portion 501 of the connecting plate, and a gap is provided between the heat dissipation protrusion and the arc-shaped heat dissipation portion 501.

[0022] In this embodiment, the heat dissipation film is a phase change heat dissipation film.

[0023] In this embodiment, the above-mentioned heat dissipation base frame 2 is integrated on the lower side of the small board module 1. The heat dissipation base frame 2 can transfer the heat at the bottom of the small board module 1 to the heat dissipation module. The heat dissipation module adopts the cooperation of heat dissipation column 3, connecting column 4 and connecting plate 5. Most of the heat is conducted to the heat dissipation column 3 through the connecting column 4, and the heat dissipation is assisted by the heat dissipation column 3 itself and the connecting plate 5 on its outside. At the same time, in order to further improve the heat dissipation efficiency of the connecting plate 5, the phase change heat dissipation film can quickly absorb and dissipate the heat.

[0024] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A PCB small board with strong heat dissipation, characterized in that: The invention comprises a small board module (1), a heat dissipation bottom frame (2) and a heat dissipation module, wherein the small board module (1) comprises a small board frame, a PCB small board arranged on the frame, and components arranged on the PCB small board, wherein the heat dissipation bottom frame (2) is fixed on the lower side of the small board module (1), the heat dissipation bottom frame (2) is flush with the outer edge of the small board frame, and the heat dissipation module is arranged inside the heat dissipation bottom frame (2); the heat dissipation module comprises a heat dissipation column (3), a connecting column (4), a connecting sheet (5) and a heat dissipation film, wherein a plurality of heat dissipation columns (3) and a connecting column (4) are provided and are all made of metal materials with good thermal conductivity, the front and rear ends of the plurality of heat dissipation columns (3) are connected to the heat dissipation bottom frame (2) through the connecting column (4), and the connecting sheet (5) is arranged outside the plurality of heat dissipation columns (3).

2. The PCB board with strong heat dissipation according to claim 1, characterized in that: The connecting sheet (5) comprises an upper sheet body and a lower sheet body which are buckled together, wherein the upper sheet body and the lower sheet body are both made of copper material, and both the upper sheet body and the lower sheet body comprise an integrally formed arc-shaped heat dissipation portion (501) and a sheet-shaped heat dissipation portion (502).

3. The PCB small board with strong heat dissipation according to claim 2, characterized in that: The arc-shaped heat dissipation part (501) and the sheet-shaped heat dissipation part (502) are both covered with heat dissipation films, the arc-shaped heat dissipation part (501) is wrapped around the outside of the heat dissipation column (3), and the front and rear ends of the plurality of arc-shaped heat dissipation parts (501) are connected to the side wall of the heat dissipation bottom frame (2) through the sheet-shaped heat dissipation part (502).

4. The PCB small board with strong heat dissipation according to claim 1, characterized in that: The plurality of heat dissipation columns (3) are all cylindrical in shape, and each heat dissipation column (3) is provided with a heat dissipation convex point on its outer wall, and the heat dissipation convex point can abut against the arc-shaped heat dissipation portion (501) of the connecting sheet, and a gap is provided between the heat dissipation convex point and the arc-shaped heat dissipation portion (501).

5. The PCB small board with strong heat dissipation according to claim 1, characterized in that: The heat dissipation film is a phase change heat dissipation film.

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