PCBA heat dissipation assembly

Abstract

The utility model discloses a PCBA (Printed Circuit Board Assembly) heat dissipation assembly, which comprises a PCBA board, and a heat dissipation mechanism is fixedly arranged on the PCBA board. The heat dissipation mechanism comprises a first heat dissipation copper sheet, a supporting frame and a second heat dissipation copper sheet, a first graphite heat dissipation sheet, a second graphite heat dissipation sheet and an ultra-thin heat pipe are arranged between the first heat dissipation copper sheet and the second heat dissipation copper sheet, and an air cooling mechanism is fixedly installed on the upper surface of the second heat dissipation copper sheet; the heat dissipation mechanism absorbs and conducts heat generated on the PCBA board, the first heat dissipation copper sheet and the second heat dissipation copper sheet which are good in heat conductivity are adopted, heat absorption and conduction are achieved, the first graphite heat dissipation sheet, the second graphite heat dissipation sheet and the ultra-thin heat pipe are arranged in the first heat dissipation copper sheet and the second heat dissipation copper sheet, and heat dissipation efficiency is improved. The heat dissipation mechanism is arranged on the first heat dissipation copper sheet to disperse and conduct heat, the heat is prevented from being concentrated in the heat dissipation mechanism, and the air cooling mechanism is arranged on the second heat dissipation copper sheet to dissipate the heat.

Description

Technical Field

[0001] The utility model relates to the field of PCBA, in particular to a PCBA heat dissipation component. Background Art

[0002] PCBA is the most important component of all electronic product components, similar to the human neural network. The brain of electronic products: CPU is installed on PCBA. The life, running speed, reliability and stability of general consumer electronic products are most directly related to PCBA. Therefore, the quality of PCBA is also the most direct determinant of the overall quality of electronic products. When PCBA is in use, electronic components will generate heat, which needs to be dissipated to maintain the stable operation of PCBA.

[0003] Referring to the existing Chinese patent with publication number CN213818695U, which discloses a PCBA heat dissipation assembly, the utility model adopts a clamping block to fix the heat-conducting metal plate, so that the heat-conducting metal plate and the circuit board are attached to each other, so that the heat-conducting metal plate can absorb the heat generated by the circuit board. At the same time, a circular hole is provided inside the heat-conducting metal plate, which is connected to the circulating water pump and the refrigeration device pipeline. Cooling liquid is injected into the circular hole channel to accelerate the heat dissipation rate.

[0004] However, the above-mentioned device still has some disadvantages, such as: first, it cannot quickly absorb and conduct the heat generated by electronic components; second, it cannot dissipate the absorbed and conducted heat, which easily causes heat collection in the heat dissipation equipment. Utility Model Content

[0005] In view of the problems mentioned in the background technology, the purpose of the utility model is to provide a PCBA heat dissipation assembly to solve the problems mentioned in the background technology.

[0006] The above technical objectives of the utility model are achieved through the following technical solutions:

[0007] A PCBA heat dissipation assembly comprises a PCBA board, on which a heat dissipation mechanism is fixedly mounted;

[0008] The heat dissipation mechanism includes a first heat dissipation copper plate, a support frame and a second heat dissipation copper plate. A first graphite heat dissipation plate, a second graphite heat dissipation plate and an ultra-thin heat pipe are arranged between the first heat dissipation copper plate and the second heat dissipation copper plate. The ultra-thin heat pipe is arranged in an elliptical shape, and the farthest two ends of the ellipse are connected. An air cooling mechanism is fixedly installed on the upper surface of the second heat dissipation copper plate.

[0009] By adopting the above technical solution, when in use, the heat dissipation mechanism is installed on the PCBA board, and the bottom of the heat dissipation mechanism is fitted with the components on the PCBA board, so as to facilitate the absorption and conduction of heat and effectively achieve cooling and heat dissipation treatment. In addition, a first heat dissipation copper sheet and a second heat dissipation copper sheet with good thermal conductivity are used in the heat dissipation mechanism to absorb and conduct heat, and a first graphite heat dissipation sheet, a second graphite heat dissipation sheet and an ultra-thin heat pipe are arranged inside the first heat dissipation copper sheet and the second heat dissipation copper sheet to disperse and conduct heat and prevent heat from being concentrated in a certain part of the heat dissipation mechanism, causing the temperature in the concentrated area to be too high and affecting the use. In addition, an air cooling mechanism is arranged on the second heat dissipation copper sheet to dissipate the heat on the heat dissipation mechanism and effectively achieve cooling treatment.

[0010] Preferably, the ultra-thin heat pipe is arranged in the middle between the first graphite heat sink and the second graphite heat sink, and the gaps between the first graphite heat sink, the second graphite heat sink and the ultra-thin heat pipe are filled with thermal grease.

[0011] By adopting the above technical solution, the setting of the thermal grease is convenient for supporting the ultra-thin heat pipe, maintaining the stability of the ultra-thin heat pipe, and the thermal grease can also achieve heat conduction.

[0012] Preferably, the first graphite heat sink, the second graphite heat sink, the ultra-thin heat pipe and the thermal grease are located between the first heat sink copper sheet, the support frame and the second heat sink copper sheet.

[0013] By adopting the above technical solution, the first graphite heat sink, the second graphite heat sink, the ultra-thin heat pipe and the thermal grease are placed between the first heat sink copper sheet and the second heat sink copper sheet to facilitate heat conduction, thereby achieving heat dissipation treatment for the PCBA board.

[0014] Preferably, thermal conductive silicone is applied between the first graphite heat sink and the first heat sink copper sheet, and between the second graphite heat sink and the second heat sink copper sheet, and the first heat sink copper sheet, the support frame and the second heat sink copper sheet are connected by welding.

[0015] By adopting the above technical solution, the setting of the thermal conductive silicone can achieve the functions of heat dissipation and heat conduction, and can also achieve adhesion, thereby maintaining the stability of the connection between the first graphite heat sink, the second graphite heat sink and the first heat sink copper sheet, and the second heat sink copper sheet, and the first heat sink copper sheet, the support frame and the second heat sink copper sheet are welded and connected to improve the integrity.

[0016] Preferably, a plurality of fins are fixedly provided on the second heat dissipation copper sheet, and the air cooling mechanism is fixedly installed on the second heat dissipation copper sheet and is located inside the plurality of fins.

[0017] By adopting the above technical solution, the setting of the fins is convenient for improving the air flow of the heat dissipation mechanism and improving the heat dissipation performance.

[0018] Preferably, the air cooling mechanism includes a fixed mounting plate, an outer shell is fixedly provided on the fixed mounting plate, a mesh cover is fixedly provided at the end of the outer shell, a first mounting column is welded on the second heat dissipating copper plate, and the fixed mounting plate is mounted on the first mounting column via a first locking nut.

[0019] By adopting the above technical solution, the setting of the fixed installation piece is convenient for fixing and installing the air cooling mechanism, and is convenient for inducing the flow of air flow, thereby improving the efficiency of heat dissipation.

[0020] Preferably, a four-claw fixing frame is welded inside the outer shell, a servo motor is fixedly installed inside the four-claw fixing frame, and a fan blade is installed on the output shaft of the servo motor.

[0021] By adopting the above technical solution, the setting of the four-claw fixing frame facilitates the fixed installation of the servo motor, and the servo motor drives the fan blades to rotate to complete the heat dissipation process.

[0022] Preferably, second mounting columns are welded at the four corners of the bottom of the first heat dissipation copper sheet, respectively, the second mounting columns penetrate the PCBA board, and the second mounting columns are threadedly connected with second locking nuts that fit on both sides of the PCBA board.

[0023] By adopting the above technical solution, the setting of the second mounting column facilitates the installation and connection of the heat dissipation mechanism, maintains the integrity and fit with the PCBA board, and facilitates the absorption and conduction of heat on the PCBA board.

[0024] In summary, the utility model mainly has the following beneficial effects:

[0025] The utility model installs the heat dissipation mechanism on the PCBA board, and makes the bottom of the heat dissipation mechanism fit with the components on the PCBA board, so as to realize the absorption and conduction of heat, and effectively realize the cooling and heat dissipation treatment, and adopts the first heat dissipation copper sheet and the second heat dissipation copper sheet with good thermal conductivity in the heat dissipation mechanism to realize the absorption and conduction of heat, and the first heat dissipation copper sheet and the second heat dissipation copper sheet are provided with the first graphite heat dissipation sheet, the second graphite heat dissipation sheet and the ultra-thin heat pipe inside, so as to realize the dispersion and conduction of heat, and prevent the heat from being concentrated in a certain part of the heat dissipation mechanism, causing the temperature of the concentrated area to be too high, and affecting the use, and the second heat dissipation copper sheet is provided with an air cooling mechanism to realize the heat on the heat dissipation mechanism to be dissipated, and effectively realize the cooling treatment. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a structural schematic diagram of the utility model;

[0027] Figure 2 It is a partial structural schematic diagram of the utility model;

[0028] Figure 3 It is an internal schematic diagram of the heat dissipation mechanism of the utility model;

[0029] Figure 4 It is a schematic diagram of the ultra-thin heat pipe of the utility model.

[0030] Figure numerals: 1, PCBA board; 2, heat dissipation mechanism; 201, first heat dissipation copper plate; 202, support frame; 203, second heat dissipation copper plate; 204, air cooling mechanism; 2041, fixed mounting plate; 2042, first mounting column; 2043, first locking nut; 2044, outer shell; 2045, mesh cover; 2046, four-claw fixing frame; 2047, servo motor; 2048, fan blade; 205, first graphite heat sink; 206, second graphite heat sink; 207, thermal grease; 208, ultra-thin heat pipe; 209, second mounting column; 210, second locking nut; 211, fin. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] Example

[0033] refer to Figure 1-4 , a PCBA heat dissipation assembly, comprising a PCBA board 1, on which a heat dissipation mechanism 2 is fixedly mounted;

[0034] The heat dissipation mechanism 2 includes a first heat dissipation copper plate 201, a support frame 202 and a second heat dissipation copper plate 203. A first graphite heat dissipation plate 205, a second graphite heat dissipation plate 206 and an ultra-thin heat pipe 208 are provided between the first heat dissipation copper plate 201 and the second heat dissipation copper plate 203. The ultra-thin heat pipe 208 is arranged in an elliptical shape, and the farthest two ends of the ellipse are connected. An air cooling mechanism 204 is fixedly installed on the upper surface of the second heat dissipation copper plate 203.

[0035] In this embodiment, preferably, the ultra-thin heat pipe 208 is arranged in the middle between the first graphite heat sink 205 and the second graphite heat sink 206, and the gap between the first graphite heat sink 205, the second graphite heat sink 206 and the ultra-thin heat pipe 208 is filled with thermal grease 207. The setting of the thermal grease 207 is convenient for supporting the ultra-thin heat pipe 208 and maintaining the stability of the ultra-thin heat pipe 208, and the thermal grease 207 can also achieve heat conduction.

[0036] In this embodiment, preferably, the first graphite heat sink 205, the second graphite heat sink 206, the ultra-thin heat pipe 208 and the thermal grease 207 are located between the first heat dissipating copper sheet 201, the support frame 202 and the second heat dissipating copper sheet 203, and the first graphite heat sink 205, the second graphite heat sink 206, the ultra-thin heat pipe 208 and the thermal grease 207 are located between the first heat dissipating copper sheet 201 and the second heat dissipating copper sheet 203 to facilitate heat conduction, thereby achieving heat dissipation treatment of the PCBA board 1.

[0037] In the present embodiment, preferably, thermal conductive silicone is applied between the first graphite heat sink 205 and the first heat sink copper sheet 201, and between the second graphite heat sink 206 and the second heat sink copper sheet 203. The first heat sink copper sheet 201, the support frame 202 and the second heat sink copper sheet 203 are welded and connected. The provision of the thermal conductive silicone can achieve the effects of heat dissipation and heat conduction, and can also achieve adhesion, thereby maintaining the stability of the connection between the first graphite heat sink 205, the second graphite heat sink 206 and the first heat sink copper sheet 201, the second heat sink copper sheet 203. The first heat sink copper sheet 201, the support frame 202 and the second heat sink copper sheet 203 are welded and connected, thereby improving the integrity.

[0038] In this embodiment, preferably, a plurality of fins 211 are fixedly provided on the second heat dissipating copper plate 203, and the air cooling mechanism 204 is fixedly installed on the second heat dissipating copper plate 203 and is located inside the plurality of fins 211. The setting of the fins 211 facilitates improving the air flow of the heat dissipating mechanism 2 and improving the heat dissipation performance.

[0039] In this embodiment, preferably, the air cooling mechanism 204 includes a fixed mounting plate 2041, an outer shell 2044 is fixedly provided on the fixed mounting plate 2041, a mesh cover 2045 is fixedly provided on the end of the outer shell 2044, a first mounting column 2042 is welded on the second heat dissipating copper plate 203, and the fixed mounting plate 2041 is installed on the first mounting column 2042 through a first locking nut 2043. The setting of the fixed mounting plate 2041 is convenient for fixing the air cooling mechanism 204 and for inducing airflow to improve the efficiency of heat dissipation.

[0040] In this embodiment, preferably, a four-claw fixing frame 2046 is welded inside the outer shell 2044, a servo motor 2047 is fixedly installed inside the four-claw fixing frame 2046, and a fan blade 2048 is installed on the output shaft of the servo motor 2047. The setting of the four-claw fixing frame 2046 facilitates the fixed installation of the servo motor 2047, and the servo motor 2047 drives the fan blade 2048 to rotate to complete the heat dissipation process.

[0041] In this embodiment, preferably, second mounting columns 209 are respectively welded at the four corners of the bottom of the first heat dissipation copper sheet 201, and the second mounting columns 209 penetrate the PCBA board 1. The second mounting columns 209 are threadedly connected with second locking nuts 210 that fit on both sides of the PCBA board 1. The setting of the second mounting columns 209 facilitates the installation and connection of the heat dissipation mechanism 2, maintains the integrity and fit with the PCBA board 1, and facilitates the absorption and conduction of heat on the PCBA board 1.

[0042] Principle and advantages of use:

[0043] When in use, the heat dissipation mechanism 2 is installed on the PCBA board 1 through the second mounting column 209 and the second locking nut 210, and the bottom of the heat dissipation mechanism 2 is fitted with the components on the PCBA board 1, so that when the PCBA board 1 is running, it is easy to absorb and conduct heat, and effectively achieve cooling and heat dissipation treatment. In addition, the first heat dissipation copper sheet 201 and the second heat dissipation copper sheet 203 with good thermal conductivity are used in the heat dissipation mechanism 2 to absorb and conduct heat, and the first heat dissipation copper sheet 201 and the second heat dissipation copper sheet 203 are provided with a first graphite heat dissipation sheet 205, a second graphite heat dissipation sheet 206 and an ultra-thin heat pipe 208 to disperse and conduct heat, prevent heat from being concentrated in a certain part of the heat dissipation mechanism 2, causing the temperature of the concentrated area to be too high, affecting use, and the second heat dissipation copper sheet 203 is provided with an air cooling mechanism 204 to dissipate the heat on the heat dissipation mechanism 2 and effectively achieve cooling treatment.

[0044] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A PCBA heat dissipation assembly, comprising a PCBA board (1), characterized in that: A heat dissipation mechanism (2) is fixedly mounted on the PCBA board (1); The heat dissipation mechanism (2) comprises a first heat dissipation copper sheet (201), a support frame (202) and a second heat dissipation copper sheet (203); a first graphite heat dissipation sheet (205), a second graphite heat dissipation sheet (206) and an ultra-thin heat pipe (208) are arranged between the first heat dissipation copper sheet (201) and the second heat dissipation copper sheet (203); the ultra-thin heat pipe (208) is arranged in an elliptical shape, and the farthest two ends of the ellipse are connected; an air cooling mechanism (204) is fixedly mounted on the upper surface of the second heat dissipation copper sheet (203).

2. A PCBA heat dissipation assembly according to claim 1, characterized in that: The ultra-thin heat pipe (208) is arranged in the middle between the first graphite heat sink (205) and the second graphite heat sink (206), and the gaps between the first graphite heat sink (205), the second graphite heat sink (206) and the ultra-thin heat pipe (208) are filled with thermal conductive silicone grease (207).

3. A PCBA heat dissipation assembly according to claim 2, characterized in that: The first graphite heat sink (205), the second graphite heat sink (206), the ultra-thin heat pipe (208) and the thermal conductive silicone grease (207) are located between the first heat sink copper sheet (201), the support frame (202) and the second heat sink copper sheet (203).

4. A PCBA heat dissipation assembly according to claim 1, characterized in that: Thermally conductive silicone is applied between the first graphite heat sink (205) and the first heat sink copper sheet (201), and between the second graphite heat sink (206) and the second heat sink copper sheet (203), and the first heat sink copper sheet (201), the support frame (202) and the second heat sink copper sheet (203) are connected by welding.

5. The PCBA heat dissipation assembly according to claim 1, characterized in that: A plurality of fins (211) are fixedly arranged on the second heat dissipation copper sheet (203), and the air cooling mechanism (204) is fixedly mounted on the second heat dissipation copper sheet (203) and is located inside the plurality of fins (211).

6. A PCBA heat dissipation assembly according to claim 1, characterized in that: The air cooling mechanism (204) comprises a fixed mounting plate (2041), an outer shell (2044) is fixedly provided on the fixed mounting plate (2041), a mesh cover (2045) is fixedly provided at the end of the outer shell (2044), a first mounting column (2042) is welded on the second heat dissipating copper plate (203), and the fixed mounting plate (2041) is mounted on the first mounting column (2042) via a first locking nut (2043).

7. A PCBA heat dissipation assembly according to claim 6, characterized in that: A four-claw fixing frame (2046) is welded inside the outer shell (2044), a servo motor (2047) is fixedly installed inside the four-claw fixing frame (2046), and a fan blade (2048) is installed on the output shaft of the servo motor (2047).

8. The PCBA heat dissipation assembly according to claim 1, characterized in that: Second mounting columns (209) are respectively welded at the four corners of the bottom of the first heat dissipation copper sheet (201); the second mounting columns (209) penetrate the PCBA board (1); and the second mounting columns (209) are threadedly connected with second locking nuts (210) that are attached to both sides of the PCBA board (1).

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