Semiconductor dehumidifier
By designing a semiconductor dehumidifier using a bellows and heat dissipation shell, the semiconductor sheet and special structures improve dehumidification and heat dissipation efficiency, the existing dehumidifier has solved the problems of large volume, high power consumption and low dehumidification efficiency, and achieved high efficiency and low efficiency Dehumidification effect of power consumption.
Patent Information
- Application Number
- CN202421579342.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-05
- Publication Date
- 2025-02-21
- Estimated Expiration
- 2034-07-05
AI Technical Summary
While meeting sufficient dehumidifiers, the existing semiconductor dehumidifiers have large power consumption and large volume, and cannot operate in crowded and narrow environments. At the same time, the dehumidification efficiency of small dehumidifiers is too low.
A semiconductor dehumidifier is designed, adopting a bellows structure, with a heat dissipation shell and an exhaust mechanism inside, and dehumidification is used to use a semiconductor sheet uniformly distributed in the circumference to improve air flow and heat exchange efficiency through the windshield and extension plate, and through the Air hoods and drains allow for more efficient heat dissipation and dehumidification.
It achieves efficient dehumidification in a smaller volume, reduces power consumption, can work in narrow environments, and improves heat dissipation effect, ensuring effective heat dissipation of semiconductor chips and heat dissipation shells.
Smart Images
Figure CN222510817U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor dehumidification, in particular to a semiconductor dehumidifier. Background Art
[0002] At present, there are many ways for electrical control cabinets to use air cooling systems to cool the electronic components inside them, and most of them are closed air cooling systems with air ducts. If the air humidity of the air cooling system is high, it will have a negative impact on the reliable operation of electronic components, reduce the reliability of electronic components, and even cause short circuit and burnout of electronic components. Therefore, there must be dehumidification equipment inside the electrical control cabinet to ensure the humidity inside the cabinet. At present, the dehumidification equipment on the market mainly includes compression dehumidifiers, dehumidifiers with membrane osmosis technology, and dehumidifiers composed of semiconductor chips, air ducts and fans. While meeting the requirements of sufficient dehumidification capacity, this type of dehumidifier often consumes a lot of power and is large in size, and cannot work in crowded and narrow environments. The dehumidification capacity of smaller volumes is often too low in dehumidification efficiency. Utility Model Content
[0003] The purpose of the utility model is to provide a semiconductor dehumidifier to overcome the above-mentioned defects in the prior art.
[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0005] According to a semiconductor dehumidifier of the utility model, it comprises a bellows, a heat dissipation shell is connected to the bellows via a fixing rod, an exhaust mechanism is arranged in the heat dissipation shell, a cavity is opened in the bellows, semiconductor sheets uniformly distributed in the circumferential direction are embedded in the cavity, the inner end surface of the semiconductor sheet is a heat release end, the outer end surface of the semiconductor sheet is a heat absorption end, the inner end surface of the semiconductor sheet passes through the inner end surface of the bellows, the lower end part of the bellows is connected and fixed with an air inlet pipe, the bellows is connected and fixed with an air supply pipe at the upper end part of the exhaust mechanism, a wind shield plate spirally arranged upward is arranged in the bellows, each An extension plate is fixedly provided on the outer end surface of each semiconductor chip, and the semiconductor chips on the same side are distributed up and down. The wind shield passes through the extension plate and abuts against the extension plate. A drainage groove is opened on the upper end surface of the wind shield, and the drainage groove extends downward in the spiral direction of the wind shield. A drainage pipe is fixedly provided on the lower end part of the bellows, and an exhaust port is fixedly provided on the lower end surface of the heat dissipation shell. The radius of the exhaust port is narrow at the top and wide at the bottom. A return air hood is fixedly provided on the lower end surface of the bellows, and the return air hood is recessed downward. The inner and outer ends of the extension plate abut against the inner and outer side walls of the cavity.
[0006] The beneficial effects of the utility model are:
[0007] The air in the surrounding environment is drawn into the bellows through the air inlet pipe, cooled by the outer heat dissipation end of the semiconductor chip and turned into low-temperature dry air, which enters the air supply pipe, exhaust mechanism, and exhaust port. The air is discharged downward to drive the upper air flow, thereby taking away the temperature of the semiconductor chip and the heat dissipation shell, thereby achieving better heat dissipation effect.
[0008] The air at the exhaust port flows upward through the return air hood, so that the low-temperature dry air contacts the heat dissipation housing and the semiconductor chip for heat dissipation, thereby further improving the heat dissipation effect on the heat dissipation housing and the semiconductor chip, thereby ensuring the working effect of the exhaust mechanism and the semiconductor chip.
[0009] The wind box is divided into upper and lower layers through the wind shield, so that the air flows upward along the wind shield in the wind box, achieving the same or similar dehumidification effect as the existing large-size air duct products, reducing the size of the semiconductor dehumidifier and enabling it to be used in a wider range of occasions. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] Figure 1 It is a schematic diagram of the appearance of the utility model;
[0011] Figure 2 This is a schematic diagram of the appearance of the utility model after the bellows is removed;
[0012] Figure 3 This utility model Figure 1 A schematic diagram of a top view structure;
[0013] Figure 4 This utility model Figure 1 A schematic diagram of the front view structure of
[0014] Figure 5 This utility model Figure 1 Schematic diagram of the structure viewed from above;
[0015] Figure 6 This utility model Figure 2 Schematic cross-sectional view of AA in the figure;
[0016] Figure 7 This utility model Figure 2 A partial enlarged schematic diagram of the middle extension plate;
[0017] In the figure:
[0018] 10. Bellows; 11. Heat dissipation housing; 12. Air inlet duct; 13. Air supply duct; 14. Semiconductor chip; 15. Drain pipe; 16. Return air hood; 17. Air exhaust mechanism; 18. Exhaust port; 19. Extension plate; 20. Wind shield; 21. Drain trough; 22. Cavity. DETAILED DESCRIPTION
[0019] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0020] It should be noted that when an element is said to be "fixed to" another element, it can be directly on the other element or there can be an intermediate element. When an element is said to be "connected to" another element, it can be directly connected to the other element or there can be an intermediate element at the same time:
[0021] Embodiment 1:
[0022] Reference Figure 1-Figure 7 According to an embodiment of the utility model, a semiconductor dehumidifier includes a bellows 10, a heat dissipation housing 11 is connected to the bellows 10 through a fixing rod, an exhaust mechanism 17 is arranged in the heat dissipation housing 11, a cavity 22 is opened in the bellows 10, semiconductor sheets 14 uniformly distributed in the circumferential direction are embedded in the cavity 22, the inner end surface of the semiconductor sheet 14 is a heat release end, the outer end surface of the semiconductor sheet 14 is a heat absorption end, the inner end surface of the semiconductor sheet 14 passes through the inner end surface of the bellows 10, the lower end portion of the bellows 10 is connected and fixedly provided with an air inlet pipe 12, the upper end portion of the bellows 10 and the exhaust mechanism 17 is connected and fixedly provided with an air supply pipe 13, and a wind shield arranged spirally upward is arranged in the bellows 10 Plate 20, an extension plate 19 is fixedly provided on the outer end surface of each semiconductor chip 14, and the semiconductor chips 14 on the same side are distributed up and down, the wind shield 20 passes through the extension plate 19 and abuts against the extension plate 19, a drainage groove 21 is opened on the upper end surface of the wind shield 20, and the drainage groove 21 extends downward in the spiral reverse direction of the wind shield 20, the lower end part of the bellows 10 is connected and fixed with a drainage pipe 15, and the lower end surface of the heat dissipation shell 11 is connected and fixed with an exhaust port 18, the radius of the exhaust port 18 is narrow at the top and wide at the bottom, and a return air cover 16 is fixedly provided on the lower end surface of the bellows 10, and the return air cover 16 is recessed downward, and the inner and outer ends of the extension plate 19 abut against the inner and outer side walls of the cavity 22.
[0023] This program has the following working process:
[0024] The air pipe is connected to the left end of the air inlet pipe 12, and the air pipe sends the air in the surrounding environment into the bellows 10 through the air inlet pipe 12. The exhaust mechanism 17 works, and the exhaust mechanism 17 extracts the air in the upper end of the bellows 10 through the air supply pipe 13. The air flow causes the air in the lower end of the bellows 10 to flow upward, and pass through the extension plate 19 at the semiconductor chip 14. The extension plate 19 increases the contact area with the air, and the air temperature is reduced by the extension plate 19, so that the moisture in the air is condensed into water droplets. The water droplets adhere to the surface of the extension plate 19, and the air flows upward along the wind shield plate 20 to form low-temperature dry gas and send it into the air supply pipe 13. The exhaust mechanism 17 works to spray the air downward through the exhaust port 18. The air flows downward to form a low-pressure environment at the lower end of the heat dissipation shell 11, so that the air at the upper end of the heat dissipation shell 11 flows from top to bottom, and then contacts the inner end surface of the semiconductor chip 14 and the outer end surface of the heat dissipation shell 11, absorbs heat, and thus reduces the temperature of the semiconductor chip 14 and the heat dissipation shell 11.
[0025] The gas ejected from the exhaust port 18 flows upward under the guidance of the return air cover 16 through the return air cover 16, so that the low-temperature dry gas abuts against the inner end surface of the semiconductor chip 14 and the outer end surface of the heat dissipation shell 11, absorbs the heat of the heat dissipation shell 11 and the semiconductor chip 14, and is discharged from the upper end area of the heat dissipation shell 11, thereby reducing the temperature of the heat dissipation shell 11 and the semiconductor chip 14. The heat dissipation shell 11 absorbs the temperature of the exhaust mechanism 17 and dissipates the heat, and the working effect of the exhaust mechanism 17 and the semiconductor chip 14 is maintained;
[0026] The water droplets condensed on the extension plate 19 drip downward onto the wind shield 20 , and flow downward along the drainage groove 21 provided on the wind shield 20 , and are discharged to the outside through the drainage pipe 15 .
[0027] It is clear to those skilled in the art that various modifications to the above embodiments can be made without departing from the overall spirit and concept of the present invention. All of them fall within the protection scope of the present invention. The protection scheme of the present invention shall be subject to the claims attached to the present invention.
Claims
1. A semiconductor dehumidifier, comprising a bellows (10), characterized in that: A heat dissipation shell (11) is connected to the bellows (10) via a fixing rod, an exhaust mechanism (17) is provided in the heat dissipation shell (11), a cavity (22) is provided in the bellows (10), semiconductor chips (14) uniformly distributed in the circumferential direction are embedded in the cavity (22), an air inlet pipe (12) is connected and fixedly provided at the lower end of the bellows (10), an air supply pipe (13) is connected and fixedly provided at the upper end of the bellows (10) and the exhaust mechanism (17), a wind shield plate (20) spirally arranged upward is provided in the bellows (10), an extension plate (19) is fixedly provided on the outer end surface of each semiconductor chip (14), and an air outlet (18) is connected and fixedly provided on the lower end surface of the heat dissipation shell (11).
2. A semiconductor dehumidifier according to claim 1, characterized in that: The inner end surface of the semiconductor chip (14) is a heat release end, the outer end surface of the semiconductor chip (14) is a heat absorption end, and the inner end surface of the semiconductor chip (14) penetrates the inner end surface of the wind box (10).
3. A semiconductor dehumidifier according to claim 2, characterized in that: The wind shield (20) passes through the extension plate (19) and abuts against the extension plate (19). A drainage groove (21) is provided on the upper end surface of the wind shield (20). The drainage groove (21) extends downward in the reverse direction of the spiral of the wind shield (20). The lower end portion of the bellows (10) is connected to and fixed with a drainage pipe (15).
4. A semiconductor dehumidifier according to claim 3, characterized in that: An air return cover (16) is fixedly arranged on the lower end surface of the wind box (10), and the air return cover (16) is arranged to be recessed downwards.
5. A semiconductor dehumidifier according to claim 4, characterized in that: The radius of the air outlet (18) is narrow at the top and wide at the bottom, and both inner and outer ends of the extension plate (19) abut against the inner and outer side walls of the cavity (22).
6. A semiconductor dehumidifier according to claim 5, characterized in that: The semiconductor chips (14) on the same side are distributed up and down.