Antifouling structure for wafer cleaning machine

Abstract

The utility model belongs to the technical field of wafer cleaning, and particularly discloses an antifouling structure for a wafer cleaning machine, which is used for solving the technical problem that sprayed liquid medicine flies out of a wafer along with impurities and is splashed to a spraying arm to cause secondary pollution in subsequent wafer treatment. Comprising a spraying assembly which is arranged above a bearing disc and connected with the tail end of a mechanical arm, the spraying assembly comprises a spraying base, and a linear gap and an arc gap which are perpendicularly distributed are formed in the inner bottom end of the spraying base; therefore, splashing water generated after the wafer is sprayed and cleaned can be blocked and collected through the water blocking assembly which is arranged in a surrounding mode, and the situation that liquid medicine is splashed to the spraying arm to cause secondary pollution of follow-up wafer treatment is prevented; the wafer cleaning machine has the advantages that the wafer cleaning efficiency is improved, radial full-coverage spraying of the wafer can be realized by the aid of the spraying assembly capable of uniformly spraying water, the spraying cleaning efficiency is improved, the spraying efficiency of the wafer cleaning machine during spraying of the wafer is realized by the aid of matching of the spraying assembly and the spraying assembly, and the secondary pollution probability of spraying liquid medicine is reduced fundamentally.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cleaning, in particular to an anti-fouling structure used for a wafer cleaning machine. Background Art

[0002] A wafer refers to a silicon chip used to make silicon semiconductor circuits. Its raw material is silicon; high-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon; silicon crystal rods are formed into silicon wafers, or wafers, after grinding, polishing, and slicing; wafer cleaning machines are usually composed of main parts such as a cleaning tank, a spray system, a brushing system, a drying system, and a control system. The cleaning tank is used to hold cleaning fluid and wafers. The spray system evenly sprays cleaning fluid through high-pressure nozzles. The brushing system is equipped with special brushes to physically brush the wafers. The drying system quickly dries the wafers through hot air, infrared rays, etc., and the control system is responsible for the automated control of the entire cleaning process.

[0003] Spraying wafer cleaning uses a horizontally moving spray arm to spray chemicals onto the high-speed rotating wafer. The high-speed rotating centrifugal force evenly distributes the chemicals to the wafer surface. Compared with immersion cleaning, spraying requires less chemicals, and the used chemicals fly out of the wafer along with impurities. However, it still ignores the situation where the chemicals splash onto the spray arm, which can easily cause secondary pollution and affect the cleaning efficiency.

[0004] In view of the above technical defects, a solution is now proposed. Utility Model Content

[0005] The utility model aims to provide an anti-fouling structure for a wafer cleaning machine to solve the problem that the sprayed solution flies out of the wafer along with impurities and splashes onto the spray arm, causing secondary contamination in subsequent wafer processing.

[0006] The purpose of the utility model can be achieved through the following technical solutions: an anti-fouling structure for a wafer cleaning machine, comprising a spray assembly arranged above a carrying plate and connected to the end of a robot arm, the spray assembly comprising a spray seat, the upper end of the spray seat is successively equipped with a heightening cylinder and a liquid inlet box, the inner bottom end of the spray seat is provided with a straight line gap and an arc gap distributed vertically, and a plurality of liquid inlet pipes aligned with the intersection of the straight line gap and the arc gap are installed in the liquid inlet box; a water retaining assembly is arranged on the outside of the outer ring side of the carrying plate, the water retaining assembly comprises a water retaining plate horizontally aligned with the carrying plate and with the concave side facing inward, a guide cavity is arranged on the concave side of the water retaining plate, the inner top of the guide cavity is an arc segment and the bottom is a straight segment, and the outer side of the straight segment at the bottom of the water retaining plate and the outer side of the carrying plate have a drainage gap.

[0007] Preferably, the spray seat is fan-shaped and has a gap between the bottom and the supporting plate. A cover is installed above the spray seat and is sleeved onto the outside of the bottom end of the liquid inlet pipe. The liquid inlet pipe passes through the liquid inlet box, the heightening tube and is connected to the cover.

[0008] Preferably, a plurality of mounting ears are arranged on the outer side of the carrier plate, and a movable hole is formed in the carrier plate and the mounting ears, and a fixing bolt abutting against the wafer is arranged on the movable hole.

[0009] Preferably, the water baffles are arranged between two adjacent mounting ears, and a fixing rod connected to the lower bottom surface of the carrying plate is installed at the bottom of the water baffle.

[0010] Preferably, the linear gap is arranged in the radial direction of the carrier plate and is perpendicular to the arc gap, and both ends of the arc gap extend to both sides of the inner bottom end of the spray seat.

[0011] Preferably, a connecting rod connected to the end of the robot arm is installed in the middle position of the top of the liquid inlet box, and a coupling connected to the output end of the drive motor is installed in the middle position of the bottom of the supporting plate.

[0012] Preferably, a tube plate horizontally aligned with the top of the cover is installed on the top of one side of the spray seat, and a plurality of insertion holes are opened on the tube plate.

[0013] Beneficial effects of the utility model:

[0014] (1) The utility model arranges a water retaining assembly on the outside of the carrier plate during the spraying process. When the liquid medicine on the surface of the wafer flies outward, it is directly guided by the guide cavity in the water retaining plate. The arc section on the guide cavity "presses" the liquid medicine downward and does not splash onto the carrier plate, that is, it does not come into contact with the spray assembly, but is discharged through the bottom straight section and drainage gap. Thus, the liquid medicine splash prevention is completed during the entire wafer cleaning process, preventing the liquid medicine from splashing onto the spray arm after cleaning and causing secondary contamination of the subsequent wafer processing.

[0015] (2) A plurality of cross-shaped spray holes formed by a straight line gap and a plurality of arc line gaps are used to achieve radial coverage of the carrier plate, and combined with the rotation of the carrier plate, the wafer can be sprayed uniformly in the whole area. The amount of liquid inlet can also be adjusted by setting the number of liquid inlet pipes, and the impact force of the liquid spray can be increased by setting the maximum number of high-pressure liquid inlets, thereby further improving the rinsing efficiency of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The utility model is further described below in conjunction with the accompanying drawings;

[0017] Figure 1 It is a structural stereogram of the entire utility model;

[0018] Figure 2It is a schematic diagram of the structure of the utility model when viewed from above;

[0019] Figure 3 It is a structural schematic diagram of the spray assembly of the utility model;

[0020] Figure 4 It is a partial structural cutaway schematic diagram of the spray assembly of the utility model;

[0021] Figure 5 It is a cross-sectional schematic diagram of the water retaining assembly of the utility model.

[0022] Legend: 1. Spray seat; 2. Carrying plate; 3. Cover; 4. Heightening cylinder; 5. Liquid inlet box; 6. Connecting rod; 7. Water baffle; 8. Mounting ear; 9. Coupling; 10. Fixing rod; 11. Moving hole; 12. Fixing bolt; 13. Guide cavity; 14. Tube plate; 15. Socket; 16. Linear gap; 17. Arc gap; 18. Liquid inlet pipe. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Embodiment 1: This embodiment is used to solve the problem that the sprayed solution flies out of the wafer along with impurities and splashes onto the spray arm, causing secondary contamination in subsequent wafer processing.

[0025] See also Figure 1 - Figure 5 As shown, this embodiment is an anti-fouling structure for a wafer cleaning machine, including a spray assembly connected to the end of a robot arm and arranged above a carrier plate 2, the spray assembly including a spray seat 1, an upper end of the spray seat 1 is sequentially mounted with a heightening cylinder 4 and a liquid inlet box 5, an inner bottom end of the spray seat 1 is provided with a straight line gap 16 and an arc line gap 17 which are vertically distributed, and a plurality of liquid inlet pipes 18 aligned with the intersection of the straight line gap 16 and the arc line gap 17 are installed in the liquid inlet box 5; a water retaining assembly is arranged outside the outer ring side of the carrier plate 2, the water retaining assembly includes a water retaining plate 7 which is horizontally aligned with the carrier plate 2 and has its concave side facing inward, a guide cavity 13 is arranged on the concave side of the water retaining plate 7, the inner top of the guide cavity 13 is an arc section and the bottom is a straight section, and the outer side of the straight section at the bottom of the water retaining plate 7 and the outer side of the carrier plate 2 have a drainage gap;

[0026] A plurality of mounting ears 8 are provided on the outer side of the carrier plate 2, and a movable hole 11 is provided on the carrier plate 2 and the mounting ears 8. A fixing bolt 12 abutting against the wafer is provided on the movable hole 11, and the water baffle plate 7 is provided between two adjacent mounting ears 8. A fixing rod 10 connected to the lower bottom surface of the carrier plate 2 is installed at the bottom of the water baffle plate 7, so that wafers of various specifications can be clamped and fixed by the fixing bolt 10;

[0027] A connecting rod 6 connected to the end of the robot arm is installed at the middle position of the top of the liquid inlet box 5, a coupling 9 connected to the output end of the drive motor is installed at the middle position of the bottom of the carrier plate 2, and a tube plate 14 horizontally aligned with the top of the cover 3 is installed on the top of one side of the spray seat 1. A plurality of plug holes 15 are opened on the tube plate 14, and a replenishing liquid medicine pipe is arranged through the tube plate 14 and the plug holes 15, so as to pre-wet the wafer with the replenishing liquid medicine pipe;

[0028] See also Figure 1 - Figure 5 As shown, when performing the wafer cleaning operation, the connecting rod 6 is pre-connected with the robot arm, and the robot arm controls the spray assembly to realize uniform liquid spraying on the wafer. The specific operation is: after the liquid is pumped into the spray seat 1 through the liquid inlet pipe 18, it fills the inner cavity of the spray seat 1 and is sprayed out through the spray hole composed of the straight gap 16 and the arc gap 17;

[0029] During the spraying process, due to the centrifugal effect of the continuously rotating carrier plate 2, the medicine on the surface of the wafer flies outward and is directly guided by the guide cavity 13 in the water baffle plate 7. The arc segment on the guide cavity 13 "presses" the medicine downward and does not splash onto the top of the carrier plate 2, that is, it does not come into contact with the spray component, but is discharged through the straight section at the bottom and the drainage gap. At this point, the medicine splash prevention in the entire wafer cleaning process is completed, preventing the medicine from splashing onto the spray arm after cleaning and causing secondary contamination in subsequent wafer processing.

[0030] Embodiment 2: This embodiment is based on embodiment 1, and a plurality of arc gaps 17 and a single straight gap 16 are provided to form a cross-type spray hole, so as to achieve uniform spraying of the wafers on the carrier plate 2.

[0031] See also Figure 1 , Figure 3 - Figure 4 As shown, the anti-fouling structure for a wafer cleaning machine of this embodiment includes a spray seat 1 in a fan shape and a gap between the bottom and the carrier plate 2, a cover 3 sleeved to the outside of the bottom end of a liquid inlet pipe 18 is installed above the spray seat 1, the liquid inlet pipe 18 passes through a liquid inlet box 5, a heightening tube 4 and is connected to the cover 3, a straight line gap 16 is arranged in the radial direction of the carrier plate 2 and is perpendicular to the arc gap 17, and both ends of the arc gap 17 extend to both sides of the inner bottom end of the spray seat 1;

[0032] See also Figure 3 - Figure 4 As shown, specifically: a plurality of groups of cross-shaped spray holes consisting of a straight gap 16 and a plurality of arc gaps 17 are used to achieve radial coverage of the carrier plate 2, and combined with the rotation of the carrier plate 2, the wafer is sprayed uniformly in the whole way; the amount of liquid medicine inlet can be adjusted by setting the number of liquid inlet pipes 18, and the impact force of the liquid medicine spraying can be increased by setting the maximum number of high-pressure liquid inlets, thereby further improving the rinsing efficiency of the wafer.

[0033] In combination with Example 1 and Example 2, the surrounding water retaining assembly can be used to block and collect the splashing water after spray cleaning of the wafer, thereby preventing the liquid medicine from splashing onto the spray arm and causing secondary contamination in the subsequent wafer processing; and the spray assembly that sprays water evenly can be used to achieve radial full coverage spraying of the wafer, thereby improving the spray cleaning efficiency. The two are used in conjunction with each other to achieve: the spray efficiency when spraying wafers in the wafer cleaning machine, and fundamentally reduce the probability of secondary contamination of the spray liquid.

[0034] The above contents are merely examples and explanations of the structure of the present invention. The technicians in this technical field may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the structure of the invention or exceed the scope defined by the claims, they should all fall within the protection scope of the present invention.

Claims

1. An anti-fouling structure for a wafer cleaning machine, comprising a spray assembly arranged above a carrier plate (2) and connected to the end of a robot arm, characterized in that: The spray assembly comprises a spray seat (1), the upper end of which is sequentially provided with a heightening cylinder (4) and a liquid inlet box (5), the inner bottom end of the spray seat (1) is provided with a straight line gap (16) and an arc gap (17) which are vertically distributed, and the liquid inlet box (5) is provided with a plurality of liquid inlet pipes (18) which are aligned with the intersection of the straight line gap (16) and the arc gap (17); the outer side of the outer ring side of the support plate (2) is provided with a water retaining assembly, the water retaining assembly comprises a water retaining plate (7) which is horizontally aligned with the support plate (2) and has its inner concave side facing inward, the inner concave side of the water retaining plate (7) is provided with a guide cavity (13), the inner top of the guide cavity (13) is an arc segment and the bottom is a straight segment, and the outer side of the straight segment at the bottom of the water retaining plate (7) and the outer side of the support plate (2) have a drainage gap.

2. The anti-fouling structure for a wafer cleaning machine according to claim 1, characterized in that: The spray seat (1) is fan-shaped and has a gap between its bottom and the carrier plate (2). A cover (3) is mounted above the spray seat (1) and is sleeved onto the outside of the bottom end of a liquid inlet pipe (18). The liquid inlet pipe (18) passes through the liquid inlet box (5), the heightening tube (4) and is connected to the cover (3).

3. The anti-fouling structure for a wafer cleaning machine according to claim 1, characterized in that: A plurality of mounting ears (8) are arranged on the outer side of the carrier plate (2), a movable hole (11) is formed in the carrier plate (2) and the mounting ears (8), and a fixing bolt (12) abutting against a wafer is arranged on the movable hole (11).

4. The anti-fouling structure for a wafer cleaning machine according to claim 3, characterized in that: Each of the water baffles (7) is arranged between two adjacent mounting ears (8), and a fixing rod (10) connected to the lower bottom surface of the carrying plate (2) is installed at the bottom of the water baffle (7).

5. The anti-fouling structure for a wafer cleaning machine according to claim 1, characterized in that: The straight line gap (16) is arranged in the radial direction of the carrier plate (2) and is perpendicular to the arc line gap (17), and the two ends of the arc line gap (17) extend to the two sides of the inner bottom end of the spray seat (1).

6. The anti-fouling structure for a wafer cleaning machine according to claim 1, characterized in that: A connecting rod (6) connected to the end of the mechanical arm is installed at the middle position of the top of the liquid inlet box (5), and a coupling (9) connected to the output end of the drive motor is installed at the middle position of the bottom of the carrier plate (2).

7. The anti-fouling structure for a wafer cleaning machine according to claim 2, characterized in that: A tube sheet (14) is installed on the top of one side of the spray seat (1) and is horizontally aligned with the top of the cover (3). A plurality of insertion holes (15) are provided on the tube sheet (14).

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