Additive manufacturing printing equipment for machining lattice structure parts
By designing additive manufacturing printing equipment for processing dot matrix structure parts, using laser selection melting and double powder feeding laser technology, the problem of difficulty in simultaneously improving the node and connecting rod strength of dot matrix structure parts in the prior art is solved, and the problem of achieving the problem of the difficulty of simultaneously increasing the strength of dot matrix structure parts is achieved. It has efficient and energy-saving intensity improvement effect.
Patent Information
- Application Number
- CN202420996120.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-09
- Publication Date
- 2025-02-25
- Estimated Expiration
- 2034-05-09
Smart Images

Figure CN222519989U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of laser additive manufacturing, in particular to additive manufacturing printing equipment for processing lattice structure parts. Background Art
[0002] The lattice structure is composed of nodes and connecting rods between nodes that expand according to a certain spatial periodic law. The metal lattice structure has excellent mechanical properties such as ultra-lightness, high porosity, high specific strength, high specific rigidity, high strength and toughness, high energy absorption, as well as special properties such as sound absorption, shock absorption, heat dissipation, electromagnetic shielding, and excellent permeability, making it a dual function of structure and function. It is a multifunctional engineering structural material with excellent performance and has very optimistic application prospects in various industries such as aerospace, national defense and military, transportation and energy.
[0003] Lattice structure parts have the advantage of being lightweight, but they also face strength issues. To solve this problem, the dangerous sections in the lattice structure can be set with a higher-strength material. For example, as shown in Patent Document 1, the lattice structure is printed and formed by two types of powder materials, in which high-strength metal powder is laid at the height layer where the node position of the lattice structure is located, and low-strength metal powder is sintered layer by layer at the height layer where the non-node is located. The formed lattice structure parts have high strength at the nodes, but this processing method uses a large amount of high-strength powder, and cannot process lattice structure parts with connecting rods and connecting nodes on the same horizontal plane. Therefore, how to process a high-strength lattice structure is an urgent problem to be solved.
[0004] Prior art literature
[0005] Patent Document 1 CN112676577A A lattice structure of a nickel-based alloy composite material and a preparation method thereof. Summary of the invention
[0006] In view of the technical problems existing in the lattice structure processing device in the prior art, the first aspect of the utility model proposes a technical solution, an additive manufacturing printing device for processing lattice structure parts, comprising:
[0007] A gantry, wherein two inner side walls of the gantry are respectively provided with first guide rails arranged along the Y direction, a base plate is provided at the bottom of the gantry, the base plate is connected to the gantry via a fourth guide rail arranged along the Z direction, and can move between a first height and a second height along the Z direction relative to the gantry;
[0008] A cross frame connected to the first guide rail and capable of being driven by the first guide rail to move along the Y direction;
[0009] A powder feeding laser, comprising a first powder feeding laser and a second powder feeding laser, wherein the first powder feeding laser and the second powder feeding laser are connected to the cross frame via a dual-axis driving component, and the dual-axis driving component is used to drive the first powder feeding laser or the second powder feeding laser to move along the X direction and the Z direction;
[0010] A powder scraping component connected to the horizontal frame;
[0011] A laser galvanometer, connected to the gantry;
[0012] Wherein, when the substrate is at a first height, the plane where the upper end surface of the substrate is located is defined as a reference plane, the substrate can be driven by the fourth guide rail to move downward layer by layer according to a predetermined spacing, the first powder feeding laser and the second powder feeding laser are used to respectively lay the first powder and the second powder on different areas of the surface of the substrate, and the powder scraping component is used to scrape the powder flat, so that the upper end surface of the powder is flush with the reference plane;
[0013] The laser galvanometer is used to sinter the laid powder according to a predetermined path alone or in cooperation with the first powder feeding laser and / or the second powder feeding laser.
[0014] Preferably, the laser galvanometer is arranged on the top surface of the gantry, and the laser galvanometer includes a first laser galvanometer and a second laser galvanometer, and the first laser galvanometer and the second laser galvanometer are distributed diagonally on the top surface of the gantry.
[0015] Preferably, the dual-axis driving component includes a second guide rail and a third guide rail, the side wall of the horizontal frame is provided with a second guide rail arranged along the X-axis, two connecting plates are provided on the second guide rail, and the connecting plate is provided with a third guide rail arranged along the Z direction, and the first powder feeding laser and the second powder feeding laser are respectively connected to the third guide rail on a connecting plate.
[0016] Preferably, the first powder feeding laser comprises a broadband powder feeding laser, and the second powder feeding laser comprises a coaxial powder feeding laser. The broadband powder feeding laser feeds the first powder, and the coaxial powder feeding laser feeds the second powder.
[0017] Preferably, it is defined that when the laser focus of the first powder feeding laser or the second powder feeding laser is at a reference plane, the lower end surface of the first powder feeding laser or the second powder feeding laser is at a focal plane, and when the convergence point of the powder fed by the first powder feeding laser or the second powder feeding laser is at the reference plane, the lower end surface of the first powder feeding laser or the second powder feeding laser is at a powder spreading plane, and the focal plane is higher than the powder spreading plane or the focal plane coincides with the powder spreading plane.
[0018] Preferably, the powder scraping component is connected to the bottom of the cross frame through a telescopic structure, so that the powder scraping component has a retracted position and an extended position. When the powder scraping component is in the extended position, the lower end surface of the powder scraping component is flush with the reference plane, and when the powder scraping component is in the retracted position, the lower end surface of the powder scraping component is higher than the focal plane.
[0019] The second aspect of the utility model provides a technical solution, a method for processing a lattice structure part, defining that the lattice structure to be processed includes reinforced thickness layers and non-reinforced thickness layers arranged alternately along the height direction, wherein the reinforced thickness layer includes a non-reinforced area and a reinforced area, and the reinforced area is located at the intersection of at least two reinforced areas;
[0020] The lattice structure to be processed is processed layer by layer using the above-mentioned additive manufacturing printing device for processing lattice structure parts until a predetermined thickness is reached;
[0021] The processing of the reinforced thickness layer comprises the following steps:
[0022] Step a1, define the thickness of a single layer of powder as h, control the substrate to move downward, and the movement amount is h, and the distance between the upper end surface of the substrate and the reference plane after the movement is h;
[0023] Step a2, the first powder feeding laser and the second powder feeding laser are driven by the horizontal frame to move row by row from the first end along the positive direction of the Y direction until they reach the second end, and in each row, according to the positions of the non-reinforced area and the reinforced area, the first powder is laid in the non-reinforced area by the first powder feeding laser, and the second powder is laid in the reinforced area by the second powder feeding laser, and the powder scraping component moves synchronously with the horizontal frame and scrapes the laid powder flat;
[0024] Step a3, sintering the first powder in the non-reinforced area after being scraped flat by a laser galvanometer;
[0025] Step a4, the horizontal frame drives the first powder feeding laser and the second powder feeding laser to move row by row from the second end in the opposite direction of the Y direction until reaching the first end. In each row, the laser galvanometer cooperates with the first powder feeding laser and / or the second powder feeding laser to sinter the second powder laid in the reinforcement area;
[0026] Step a5, repeat steps a1-a4 until the thickness of the reinforcement layer is reached;
[0027] The processing of the non-reinforced thickness layer comprises the following steps:
[0028] Step b1, define the thickness of a single layer of powder as h, control the substrate to move downward, and the movement amount is h, and the distance between the upper end surface of the substrate and the reference plane after the movement is h;
[0029] Step b2, the first powder feeding laser and the second powder feeding laser are driven by the horizontal frame to move row by row from the first end along the positive direction of the Y direction until they reach the second end, and in each row, according to the position of the non-reinforced area, the first powder is laid in the non-reinforced area by the first powder feeding laser, and the powder scraping component moves synchronously with the horizontal frame to scrape the laid powder;
[0030] Step b3, sintering the first powder in the non-reinforced area after being scraped flat by a laser galvanometer;
[0031] Step b4, the first powder feeding laser and the second powder feeding laser are driven by the horizontal frame to move from the second end in the opposite direction of the Y direction until they reach the first end;
[0032] Step b5, repeat steps b1-b4 until the thickness of the non-reinforced thickness layer is reached.
[0033] Preferably, in the step, when spreading powder in each row, the first powder feeding laser spreads powder along the X-axis direction before the second powder feeding laser, and the first powder feeding laser skips the reinforcement area, and the second powder feeding laser spreads powder in the reinforcement area skipped by the first powder feeding laser.
[0034] Preferably, the length of the reinforced area is less than one sixth of the length of the non-reinforced area at an adjacent position.
[0035] Preferably, the thickness of each layer of powder is less than 60 um.
[0036] Compared with the prior art, the advantages of the utility model are:
[0037] The processing device designed in the utility model adopts the method of laser selective melting to form lattice structure parts. Two powder feeding lasers are used to lay different types of powder in specific areas of each layer of powder laying structure layer. After sintering, a lattice structure with two different properties in the same thickness section can be formed, especially to improve the structural strength of the high stress area in the lattice structure, so as to make the lattice structure parts have the advantage of lightweight and improve the strength of the lattice structure.
[0038] In this way, powder laying and powder sintering can be carried out at the same time, which can efficiently complete the printing task;
[0039] Compared with the laser selective melting equipment in the prior art, it does not require a powder feeding cylinder, which can reduce the lateral space of the equipment, and can lay high-strength metal powder in a targeted manner, which can save the use of powder. BRIEF DESCRIPTION OF THE DRAWINGS
[0040] The accompanying drawings are not intended to be drawn to scale. In the accompanying drawings, each identical or nearly identical component shown in various figures may be represented by the same reference numeral. For the sake of clarity, not every component is labeled in each figure. Now, embodiments of various aspects of the utility model will be described by way of example and with reference to the accompanying drawings, in which:
[0041] Figure 1 It is a structural schematic diagram of an additive manufacturing printing device for processing lattice structure parts shown in the utility model;
[0042] Figure 2 It is a front view of the additive manufacturing printing device for processing lattice structure parts shown in the utility model;
[0043] Figure 3 It is a structural schematic diagram of the powder scraping component shown in the utility model;
[0044] Figure 4 It is a schematic diagram of a lattice structure reinforced thickness layer and a non-reinforced thickness layer shown in the utility model;
[0045] Figure 5 It is a schematic diagram of the positions of the non-reinforced area and the reinforced area in the reinforced thickness layer shown in the utility model;
[0046] Figure 6a It is a schematic diagram of the powder feeding laser and the laser galvanometer shown in the utility model cooperating to perform laser sintering on the strengthening area;
[0047] Figure 6b It is a schematic diagram of the laser galvanometer shown in the utility model performing laser sintering on the non-reinforced area;
[0048] Figure 7 It is a schematic diagram of the shape of the lattice structure parts processed by the utility model. DETAILED DESCRIPTION
[0049] In order to better understand the technical content of the present invention, specific embodiments are described below in conjunction with the accompanying drawings.
[0050] The crystal structure of the lattice structure to be processed by the utility model is a face-centered cubic structure, such as Figure 7 As shown, the lattice structure includes nodes and connecting rods connecting the nodes, wherein the connection points are stress concentration sites. Therefore, setting the connection points to a stronger material can make the formed lattice structure parts have higher strength while being lightweight.
[0051]
Additive manufacturing printing equipment for processing lattice structure parts
[0052] For the above-mentioned lattice structure, the first aspect of the present invention proposes a technical solution, an additive manufacturing printing device for processing lattice structure parts, such as Figure 1 As shown, the processing device mainly includes a gantry 10 , a horizontal frame 20 , a powder feeding laser 40 , a powder scraping component 30 and a laser galvanometer 50 .
[0053] like Figure 1 As shown, the gantry 10 is configured as a roughly n-shaped frame body, and the two inner side walls of the gantry 10 are respectively provided with first guide rails 11 arranged along the Y direction, and the bottom of the gantry 10 is provided with a base plate 12, which is connected to the gantry 10 via a fourth guide rail 13 arranged along the Z direction, and can move between a first height and a second height along the Z direction relative to the gantry 10.
[0054] The substrate 12 can be used as a substrate for forming parts, and the lower part of the gantry 10 and the space above the substrate 12 constitute a part forming area. It should be understood that the bottom of the gantry 10 is a structure surrounded by four sides, and the left and right sides are surrounded in the figure, and the front and rear surrounding structures are not shown. Whenever the substrate 12 moves downward, the space above the substrate 12 increases, and the lattice structure parts are sintered layer by layer on the surface of the substrate 12.
[0055] A three-axis driving component is connected to the gantry 10; a powder feeding laser 40 includes a first powder feeding laser 41 and a second powder feeding laser 42 connected to the three-axis driving component, and the first powder feeding laser 41 and the second powder feeding laser 42 can be driven by the three-axis driving component to move along the X direction, the Y direction and the Z direction; a powder scraping component 30 is connected to the three-axis driving component and can be driven by the three-axis driving component to move along the X direction, the Y direction and the Z direction.
[0056] The three-axis driving component includes a Y-axis driving component and a dual-axis driving component; the Y-axis driving component includes a first guide rail 11 and a cross frame 20, the two inner side walls of the gantry 10 are respectively provided with first guide rails 11 arranged along the Y direction, the cross frame 20 is connected to the first guide rail 11, and can be driven by the first guide rail 11 to move along the Y direction; the dual-axis driving component includes a second guide rail 21 and a third guide rail 23, the side wall of the cross frame 20 is provided with a second guide rail 21 arranged along the X axis, two connecting plates 22 are provided on the second guide rail 21, and the connecting plate 22 is provided with a third guide rail 23 arranged along the Z direction, and the first powder feeding laser 41 and the second powder feeding laser 42 are respectively connected to the third guide rail 23 on a connecting plate 22.
[0057] The horizontal frame 20 is connected to the first guide rail 11 and can be driven by the first guide rail 11 to move along the Y direction. A powder feeding laser 40 is installed on the horizontal frame 20. The powder feeding laser 40 plays the role of powder feeding and sintering, spreading powder on the surface of the substrate 12 and then forming a predetermined part structure through laser sintering.
[0058] Furthermore, the powder scraping component 30 is also connected to the horizontal frame 20, and can scrape the powder after the powder feeding laser 40 spreads the powder, so that the thickness of the powder layer is uniform.
[0059] Furthermore, in order to increase processing efficiency, the laser galvanometer 50 is connected to the gantry 10, so that when the powder feeding laser 40 on the horizontal frame 20 spreads powder and the powder scraping component 30 scrapes powder, the laser galvanometer 50 can laser sinter the scraped area.
[0060] In order to form structures of different strengths by using powders of different materials at different positions of the lattice structure, the powder feeding laser 40 includes a first powder feeding laser 41 and a second powder feeding laser 42. The first powder feeding laser 41 and the second powder feeding laser 42 are connected to the cross frame 20 through a dual-axis driving component, and the dual-axis driving component is used to drive the first powder feeding laser 41 or the second powder feeding laser 42 to move along the X direction and the Z direction.
[0061] The first powder feeding laser 41 and the second powder feeding laser 42 are used to lay the first powder and the second powder on different areas of the surface of the substrate 12 respectively, and the powder scraping component 30 is used to scrape the powders so that the upper end surface of the powders is flush with the reference surface.
[0062] Optionally, the strength of the structure formed by the first powder after sintering is less than the strength of the structure formed by the second powder after sintering.
[0063] In an optional embodiment, the first powder feeding laser 41 includes a broadband powder feeding laser, and the second powder feeding laser 42 includes a coaxial powder feeding laser.
[0064] It should be understood that since the powder with lower strength is used in large quantities, a broadband powder feeding laser is used to convey the first powder and a coaxial powder feeding laser is used to convey the second powder, which can increase the powder spreading speed.
[0065] In this way, powders of corresponding strength can be laid in corresponding areas within a powder laying plane according to the distribution positions of nodes and connecting rods in the lattice structure parts. In this way, a structural layer containing both high-strength and low-strength structures can be processed within any height plane of the lattice structure.
[0066] like Figure 1-2 As shown, when the substrate 12 is at the first height, the plane where the upper end surface of the substrate 12 is located is defined as the reference plane, and the substrate 12 can be driven by the fourth guide rail 13 to move downward layer by layer according to a predetermined interval, wherein the substrate 12 is at the second height when it moves to the lowermost end, and the substrate 12 can move between the first height and the second height.
[0067] Furthermore, the laser galvanometer 50 is used to sinter the laid powder according to a predetermined path alone or in cooperation with the first powder feeding laser 41 and / or the second powder feeding laser 42 .
[0068] Among them, when sintering to form a low-strength first powder, the laser galvanometer 50 can be used alone for sintering, and when sintering to form a high-strength second powder, the laser galvanometer 50 can be used in conjunction with the first powder feeding laser 41 and / or the second powder feeding laser 42 for sintering. By reasonably controlling the power of the laser galvanometer 50 and the powder feeding laser 40, it can be achieved that the laser galvanometer 50 does not need to adjust the laser power during the entire processing process.
[0069] In an optional embodiment, the laser galvanometer 50 is disposed on the top surface of the gantry 10 , and the laser galvanometer 50 includes a first laser galvanometer and a second laser galvanometer, and the first laser galvanometer and the second laser galvanometer are diagonally distributed on the top surface of the gantry 10 .
[0070] In this way, when the horizontal frame 20 is located under one of the laser galvanometers and causes interference therewith, the other laser galvanometer can emit a laser beam to cooperate with the laser beam of the powder feeding laser to perform laser sintering on the same area. The horizontal frame 20 will not cause interference to the two laser galvanometers at the same time, so as to improve the continuity and processing speed of laser sintering.
[0071] In an optional embodiment, in combination with Figure 1-2 As shown, the dual-axis driving component includes a second guide rail 21 and a third guide rail 23. The side wall of the cross frame 20 is provided with a second guide rail 21 arranged along the X-axis, two connecting plates 22 are provided on the second guide rail 21, and the connecting plate 22 is provided with a third guide rail 23 arranged along the Z direction. The first powder feeding laser 41 and the second powder feeding laser 42 are respectively connected to the third guide rail 23 on a connecting plate 22.
[0072] Specifically, the two connecting plates 22 can independently move along the X-axis direction on the second guide rail 21, so that the first powder feeding laser 41 can spread powder and laser sinter at a suitable position in the X-axis direction, and the second powder feeding laser 42 can spread powder and laser sinter at a suitable position in the X-axis direction.
[0073] Furthermore, the first powder feeding laser 41 and the second powder feeding laser 42 can be moved in the Z direction via the third guide rail 23 to adjust their corresponding height positions.
[0074] Specifically, it is defined that when the laser focus of the first powder feeding laser 41 or the second powder feeding laser 42 is in the reference plane, the lower end surface of the first powder feeding laser 41 or the second powder feeding laser 42 is in the focal plane; when the convergence point of the powder fed by the first powder feeding laser 41 or the second powder feeding laser 42 is in the reference plane, the lower end surface of the first powder feeding laser 41 or the second powder feeding laser 42 is in the powder spreading plane.
[0075] Optionally, the focal plane coincides with the powder spreading plane.
[0076] In a preferred embodiment, the focal plane is above the powder spreading plane.
[0077] In this way, the first powder feeding laser 41 and the second powder feeding laser 42 can be at different heights during powder spreading and laser sintering. Taking the first powder feeding laser 41 as an example, when the first powder feeding laser 41 is at a lower height during powder spreading, the convergence of the powder can be increased and the powder spreading position can be accurate. When the first powder feeding laser 41 is at a higher height during laser sintering, a larger laser injection angle can be provided for the laser galvanometer 50 working in coordination, thereby avoiding interference of the laser light path caused by the powder feeding head.
[0078] Furthermore, the powder scraping component 30 is connected to the bottom of the cross frame 20 through the telescopic structure 24, so that the powder scraping component 30 has a retracted position and an extended position. When the powder scraping component 30 is in the extended position, the lower end surface of the powder scraping component 30 is flush with the reference plane, and when the powder scraping component 30 is in the retracted position, the lower end surface of the powder scraping component 30 is higher than the focal plane.
[0079] In this way, when the powder scraping component 30 is in the extended position, the powder laid by the powder feeding laser can be compacted and flattened to make the thickness of the laid powder layer uniform. When the powder scraping component is in the retracted position, the powder scraping component 30 can be retracted upward as much as possible to provide a larger incident angle for the laser beam of the laser galvanometer 50 to avoid optical path interference.
[0080] In an optional embodiment, if Figure 3 As shown, the powder scraping component 30 includes a scraper frame, a scraper 31 connected to the scraper frame, and a pressure roller 32. The scraper 31 is arranged on both sides of the pressure roller 32 to perform bidirectional powder scraping.
[0081] In the above embodiment, the telescopic structure 24 can be controlled by an electric telescopic rod or a telescopic cylinder. The first guide rail 11, the second guide rail 21, the third guide rail 23 and the fourth guide rail 13 can be ball screws.
[0082]
Processing method of lattice structure parts
[0083] The second aspect of the utility model proposes a technical solution, a method for processing a lattice structure part, such as Figure 4 and Figure 5 As shown, the lattice structure to be processed is defined to include reinforced thickness layers 1C and non-reinforced thickness layers 1D arranged alternately along the height direction, wherein the reinforced thickness layer 1C contains non-reinforced areas 1A and reinforced areas 1B, and the reinforced area 1B is located at the intersection of at least two reinforced areas 1A.
[0084] In a specific crystal structure, the bottom, middle and top are all reinforced thickness layers 1C, while the connection areas at the bottom and middle are non-reinforced thickness layers 1D, and the connection areas at the middle and top are non-reinforced thickness layers 1D. Therefore, the reinforced thickness layers 1C and non-reinforced thickness layers 1D are alternately distributed, and the thickness ratio of the non-reinforced thickness layers 1D and the reinforced thickness layers 1C can be determined according to the proportion of the structure at the node.
[0085] In this way, the lattice structure to be processed is processed layer by layer using the above-mentioned additive manufacturing printing device for processing lattice structure parts until a predetermined thickness is reached.
[0086] The above processing includes processing of the non-reinforced thickness layer 1D and the reinforced thickness layer 1C. Since the non-reinforced thickness layer 1D and the reinforced thickness layer 1C have different structures, the processing methods are different.
[0087] The processing of the reinforcement thickness layer 1C includes the following steps:
[0088] Step a1, defining the thickness of a single layer of powder as h, controlling the substrate 12 to move downward, and the movement amount is h, and the distance between the upper end surface of the substrate 12 and the reference plane after the movement is h;
[0089] In an optional embodiment, in order to ensure the effect of laser sintering, the thickness h of each layer of powder is less than 60 um.
[0090] Step a2, the first powder feeding laser 41 and the second powder feeding laser 42 are driven by the horizontal frame 20 to move row by row from the first end along the positive direction of the Y direction until they reach the second end, and in each row, according to the positions of the non-reinforced area 1A and the reinforced area 1B, the first powder is laid in the non-reinforced area 1A by the first powder feeding laser 41, and the second powder is laid in the reinforced area 1B by the second powder feeding laser 42, and the powder scraping component 30 moves synchronously with the horizontal frame 20 and scrapes the laid powder;
[0091] Step a3, sintering the first powder in the non-reinforced area 1A after being scraped flat by the laser galvanometer 50;
[0092] Step a4: The horizontal frame 20 drives the first powder feeding laser 41 and the second powder feeding laser 42 to move row by row from the second end in the opposite direction of the Y direction until reaching the first end. In each row, the laser galvanometer 50 cooperates with the first powder feeding laser 41 and / or the second powder feeding laser 42 to sinter the second powder laid in the reinforcement area 1B;
[0093] Step a5, repeat steps a1-a4 until the thickness of the reinforced thickness layer 1C is reached.
[0094] In an optional embodiment, in step a2, when spreading powder in each row, the first powder feeding laser 41 spreads powder along the X-axis direction before the second powder feeding laser 42, and the first powder feeding laser 41 skips the reinforcement area 1B, and the second powder feeding laser 42 spreads powder in the reinforcement area 1B skipped by the first powder feeding laser 41.
[0095] like Figure 5 As shown, when spreading powder on a row shown in the dotted box, it should be understood that the width of each row is the powder spreading width of the first powder feeding laser 41. The first powder feeding laser 41 moves along the X direction, and its powder spreading width is the same as the width of the broadband powder spreading head. When moving along the X direction, when reaching the reinforced area 1B, the powder feeding is suspended, the reinforced area 1B is skipped, and the non-reinforced area 1A outside the reinforced area 1B is powdered. When the first powder feeding laser 41 completes spreading powder on the non-reinforced area 1A, the second powder feeding laser 42 spreads powder in the reinforced area 1B. Since the second powder feeding laser 42 is an ordinary powder feeder with a narrow powder spreading width, it can be moved along the Y direction through the cross frame 20 to spread powder on the reinforced area 1B.
[0096] Optionally, the powder spreading efficiency may be improved by adjusting the powder feeding amount of the second powder feeding laser 42 .
[0097] Furthermore, after the powder spreading of the row is completed, the horizontal frame 20 continues to move along the Y direction, and the powder scraping component 30 located behind the powder feeding laser head scrapes and compacts the powder to ensure that the thickness of the powder spreading area is uniform.
[0098] Further, such as Figure 6a-6b As shown, when the second powder of the reinforced region 1B is laser sintered, the laser spot power required for sintering is higher than that of the first powder. Therefore, in order not to change the power of the laser galvanometer 50 and the laser, the second powder of the reinforced region 1B is sintered by the laser galvanometer 50 and the laser in a coordinated sintering manner to form a node position structure of a lattice structure. For the non-reinforced region 1A, the first powder of the non-reinforced region 1A is sintered by the laser galvanometer 50.
[0099] The processing of the non-reinforced thickness layer 1D includes the following steps:
[0100] Step b1, defining the thickness of a single layer of powder as h, controlling the substrate 12 to move downward, and the movement amount is h, and the distance between the upper end surface of the substrate 12 and the reference plane after the movement is h;
[0101] Step b2, the first powder feeding laser 41 and the second powder feeding laser 42 are driven by the horizontal frame 20 to move row by row from the first end along the positive direction of the Y direction until they reach the second end. In each row, according to the position of the non-reinforced area 1A, the first powder is laid in the non-reinforced area 1A by the first powder feeding laser 41, and the powder scraping component 30 moves synchronously with the horizontal frame 20 to scrape the laid powder;
[0102] Step b3, sintering the first powder in the non-reinforced area 1A after being scraped flat by the laser galvanometer 50;
[0103] Step b4, the first powder feeding laser 41 and the second powder feeding laser 42 are driven by the horizontal frame 20 to move from the second end in the opposite direction of the Y direction until they reach the first end;
[0104] Step b5, repeat steps a1-a4 until the thickness of the non-reinforced thickness layer 1D is reached.
[0105] In the above embodiment, optionally, on the basis of satisfying the structural strength at the node, in order to reduce the usage of the second powder, the length of the reinforced region 1B is less than one sixth of the length of the adjacent non-reinforced region 1A.
[0106] Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. A person with ordinary knowledge in the technical field to which the present invention belongs may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the definition of the claims.
Claims
1. An additive manufacturing printing device for processing lattice structure parts, characterized in that: include: A gantry (10), wherein a base plate (12) is provided at the bottom of the gantry (10), and the base plate (12) is connected to the gantry (10) via a fourth guide rail (13) arranged along the Z direction, and can move relative to the gantry (10) along the Z direction between a first height and a second height; A three-axis driving component connected to the gantry (10); A powder feeding laser (40), comprising a first powder feeding laser (41) and a second powder feeding laser (42) connected to the three-axis driving component, wherein the first powder feeding laser (41) and the second powder feeding laser (42) can be driven by the three-axis driving component to move along the X direction, the Y direction and the Z direction; A powder scraping component (30) connected to the three-axis driving component and capable of being driven by the three-axis driving component to move along the X direction, the Y direction and the Z direction; A laser galvanometer (50) connected to the gantry (10); Wherein, when the substrate (12) is at a first height, the plane where the upper end surface of the substrate (12) is located is defined as a reference plane, the substrate (12) can be driven by the fourth guide rail (13) to move downward layer by layer according to a predetermined spacing, the first powder feeding laser (41) and the second powder feeding laser (42) are used to respectively lay the first powder and the second powder on different areas of the surface of the substrate (12), and the powder scraping component (30) scrapes the powder so that the upper end surface of the powder is flush with the reference plane; The laser galvanometer (50) is used to sinter the laid powder into a shape according to a predetermined path, either alone or in cooperation with the first powder feeding laser (41) and / or the second powder feeding laser (42).
2. The additive manufacturing printing device for processing lattice structure parts according to claim 1, characterized in that: The laser galvanometer (50) is arranged on the top surface of the gantry (10), and the laser galvanometer (50) comprises a first laser galvanometer and a second laser galvanometer, and the first laser galvanometer and the second laser galvanometer are distributed diagonally on the top surface of the gantry (10).
3. The additive manufacturing printing device for processing lattice structure parts according to claim 1, characterized in that: The first powder feeding laser (41) comprises a broadband powder feeding laser, and the second powder feeding laser (42) comprises a coaxial powder feeding laser. The broadband powder feeding laser is used to transport the first powder.
4. The additive manufacturing printing device for processing lattice structure parts according to claim 1, characterized in that: It is defined that when the laser focus of the first powder feeding laser (41) or the second powder feeding laser (42) is at a reference plane, the lower end surface of the first powder feeding laser (41) or the second powder feeding laser (42) is at a focal plane; when the convergence point of powder fed by the first powder feeding laser (41) or the second powder feeding laser (42) is at the reference plane, the lower end surface of the first powder feeding laser (41) or the second powder feeding laser (42) is at a powder spreading plane, and the focal plane is higher than the powder spreading plane or the focal plane coincides with the powder spreading plane.
5. The additive manufacturing printing device for processing lattice structure parts according to claim 4, characterized in that: The powder scraping component (30) has a retracted position and an extended position. When the powder scraping component (30) is in the extended position, the lower end surface of the powder scraping component (30) is flush with the reference plane. When the powder scraping component (30) is in the retracted position, the lower end surface of the powder scraping component (30) is higher than the focal plane.
6. The additive manufacturing printing device for processing lattice structure parts according to claim 3, characterized in that: The coaxial powder feeding laser feeds the second powder, and the three-axis driving component includes a Y-axis driving component and a biaxial driving component; The Y-axis driving component comprises a first guide rail (11) and a cross frame (20); the two inner side walls of the gantry (10) are respectively provided with the first guide rail (11) arranged along the Y direction; the cross frame (20) is connected to the first guide rail (11) and can be driven by the first guide rail (11) to move along the Y direction; The dual-axis driving component comprises a second guide rail (21) and a third guide rail (23); a side wall of the cross frame (20) is provided with a second guide rail (21) arranged along the X-axis; two connecting plates (22) are provided on the second guide rail (21); a third guide rail (23) arranged along the Z-direction is provided on the connecting plate (22); and the first powder feeding laser (41) and the second powder feeding laser (42) are respectively connected to the third guide rail (23) on one connecting plate (22).
7. The additive manufacturing printing device for processing lattice structure parts according to claim 6, characterized in that: The powder scraping component (30) is connected to the bottom of the cross frame (20) via a telescopic structure (24).
8. The additive manufacturing printing device for processing lattice structure parts according to claim 6, characterized in that: The powder scraping component (30) comprises a scraper (31) connected to a scraper frame and a pressure roller (32).
Citation Information
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