Microscope observation device for wafer defect detection

Abstract

The utility model relates to a microscope observation device for wafer defect detection, which comprises a base and a microscope body, the upper surface of the base is rotatably connected with a supporting rod, the upper end of the supporting rod is fixedly provided with a mounting seat, the upper surface of the mounting seat is provided with a moving groove, the inner walls of the two sides of the moving groove are provided with mounting grooves, and the moving groove is internally provided with a moving seat; control grooves are formed in the side walls of the two sides of the movable seat, sliding grooves are formed in the inner walls of the control grooves, sliding blocks are slidably connected to the inner walls of the sliding grooves, electric push rods are fixed in the mounting grooves, the ends of output shafts of the two electric push rods are fixed to the side walls of the two sliding blocks correspondingly, and a rotating assembly used for driving the supporting rod to rotate is mounted on the base. The supporting rod is rotated through the rotating assembly, the rotating angle of the wafer is adjusted, and then the two electric push rods are started to control the output shafts of the electric push rods to stretch out and draw back, so that the moving seat moves in the moving groove in the transverse direction or the longitudinal direction, the tedious operation of manually moving the wafer is omitted, and the wafer detection convenience and accuracy are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer detection, in particular to a microscope observation device for wafer defect detection. Background Art

[0002] Wafer inspection is a crucial link in the semiconductor manufacturing process. Its main purpose is to ensure the quality of the produced chips, improve production efficiency and reduce costs. The wafer inspection process includes a variety of different tests, such as surface defect detection, size and shape measurement, electrical performance testing, performance testing (including optical performance testing), chemical composition analysis and environmental testing. These tests ensure that the quality of the wafer meets the manufacturing requirements and quality standards. Through advanced microscopy techniques such as optical microscopes and scanning electron microscopes, as well as electronic testing equipment and instruments, tiny defects on the wafer are discovered and located, size and shape are measured, electrical performance parameters are obtained, and the optical properties and chemical composition of the product are ensured to meet the specifications.

[0003] With respect to the above-mentioned related technologies, the inventors believe that the following defects exist: in the prior art, different positions of the wafer are usually detected by manually adjusting the position of the wafer or the position of the microscope, but the manual method is difficult to adjust to the specified position of the wafer, which causes inconvenience to wafer detection. Utility Model Content

[0004] In order to solve the above problems, the utility model provides a microscope observation device for wafer defect detection.

[0005] The above-mentioned technical purpose of the utility model is achieved through the following technical scheme: a microscope observation device for wafer defect detection, comprising a base and a microscope body arranged on the base, the upper surface of the base is rotatably connected to a support rod, the upper end of the support rod is fixed with a mounting seat, the upper surface of the mounting seat is provided with a movable groove, the inner walls on both sides adjacent to the movable groove are provided with mounting grooves, the movable groove is provided with a movable seat slidably connected to the bottom wall of the movable groove, the side walls on both sides adjacent to the movable seat are provided with a control groove, each of the inner walls of the control groove is provided with a slide groove, each of the inner walls of the slide groove is slidably connected with a slider, an electric push rod is fixed in each of the mounting grooves, the output shafts of the two electric push rods are respectively slidably connected to the two inner walls of the control grooves, the output shaft ends of the two electric push rods are respectively fixed to the side walls of the two sliders, and a rotating component for driving the support rod to rotate is installed on the base.

[0006] By adopting the above technical solution, the wafer is placed on the moving seat and the wafer is inspected through the microscope body. When it is necessary to inspect different positions of the wafer, the staff rotates the support rod through the rotating assembly to adjust the rotation angle of the wafer, and then starts the two electric push rods to control the extension and retraction of the output shafts of the electric push rods. Since the output shaft ends of the electric push rods are fixed to the side walls of the sliders, and the sliders are slidably connected in the slide grooves, the moving seat can move horizontally or vertically in the moving grooves, eliminating the tedious operation of manually moving the wafers, thereby improving the convenience and accuracy of wafer inspection.

[0007] Furthermore, the rotating assembly includes a driven gear fixedly sleeved on the support rod, a motor fixed to the upper surface of the base, and a driving gear fixed to the end of the output shaft of the motor and meshing with the driven gear.

[0008] By adopting the above technical solution, when the support rod needs to be rotated, the staff starts the motor to drive the driving gear to rotate, thereby rotating the driven gear meshing with the driving gear and the support rod fixed to the driven gear, which is convenient for adjusting the rotation position of the wafer.

[0009] Furthermore, a controller electrically connected to the electric push rod is fixed on the upper surface of the base, and the controller is electrically connected to the motor.

[0010] By adopting the above technical solution, the two electric push rods and the motor are controlled by the controller, so that the staff can move the wafer through the controller while performing inspection.

[0011] Furthermore, a plurality of balls rollingly connected to the inner bottom wall of the moving groove are embedded in the lower surface of the moving seat, and the distance between the lower surface of the moving seat and the inner bottom wall of the moving groove is 0.2-0.4 cm.

[0012] By adopting the above technical solution, the ball is rollingly connected to the moving groove, which reduces the friction between the lower surface of the moving seat and the bottom wall of the moving groove, reduces the kinetic energy loss of the electric push rod, and reduces the wear between the lower surface of the moving seat and the bottom wall of the moving groove.

[0013] Furthermore, a protective shell for covering the rotating assembly is fixed on the upper surface of the base.

[0014] By adopting the above technical solution, the protective shell protects the rotating component and reduces the probability of damage to the rotating component under the action of external force.

[0015] Furthermore, a plurality of heat dissipation holes are provided on the side wall of the protective shell close to the motor.

[0016] By adopting the above technical solution, the setting of the heat dissipation holes can achieve a heat dissipation effect for the motor, reducing the probability of the motor shutting down or even being damaged due to overheating.

[0017] Furthermore, a flaring groove communicating with the mounting groove is formed on the upper surface of the mounting seat, and a baffle matching with the flaring groove is arranged in the flaring groove.

[0018] By adopting the above technical solution, the baffle protects the electric push rod in the installation groove, reduces the probability of damage to the electric push rod, and facilitates the installation and maintenance of the electric push rod.

[0019] In summary, the utility model has the following beneficial effects:

[0020] 1. In this application, a wafer is placed on a moving seat, and the wafer is inspected through a microscope body. When different positions of the wafer need to be inspected, the staff rotates the support rod through a rotating assembly to adjust the rotation angle of the wafer, and then starts two electric push rods to control the extension and retraction of the output shafts of the electric push rods. Since the output shaft ends of the electric push rods are fixed to the side walls of the sliders, and the sliders are slidably connected in the slide grooves, the moving seat is moved horizontally or vertically in the moving grooves, eliminating the tedious operation of manually moving the wafers, and improving the convenience and accuracy of wafer inspection.

[0021] 2. In this application, when the support rod needs to be rotated, the staff starts the motor to drive the driving gear to rotate, thereby rotating the driven gear meshing with the driving gear and the support rod fixed to the driven gear, so as to adjust the rotation position of the wafer;

[0022] 3. In this application, two electric push rods and a motor are controlled by a controller, so that the staff can move the wafer through the controller while inspecting. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the utility model;

[0024] Figure 2 It is a schematic cross-sectional structure diagram of an embodiment of the utility model;

[0025] Figure 3 It is a schematic diagram of the cross-sectional structure of an embodiment of the utility model for highlighting a slider.

[0026] In the figure: 1. base; 2. microscope body; 3. support rod; 4. mounting seat; 41. moving slot; 42. mounting slot; 43. expansion slot; 5. moving seat; 51. control slot; 52. slide slot; 6. slider; 7. electric push rod; 8. rotating assembly; 81. driven gear; 82. motor; 83. driving gear; 9. controller; 10. ball bearing; 11. protective shell; 111. heat dissipation hole; 12. baffle. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application; obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application without making creative work are within the scope of protection of the present application.

[0028] like Figure 1-3 As shown, an embodiment of the present application discloses a microscope observation device for wafer defect detection, including a base 1, a microscope body 2, a support rod 3, a mounting seat 4, a moving seat 5, a slider 6, an electric push rod 7 and a rotating assembly 8.

[0029] The base 1 is a rectangular parallelepiped structure, and the base 1 is used to carry the detection device. The microscope body 2 is a microscope body 2 commonly used in the prior art and suitable for the present embodiment, and the microscope body 2 is arranged on the base 1. The support rod 3 is a vertically arranged round rod-shaped structure, and the support rod 3 is rotatably connected to the upper surface of the base 1. The mounting seat 4 is a rectangular parallelepiped structure, and a movable groove 41 is provided on the upper surface of the mounting seat 4, and mounting grooves 42 are provided on the inner walls on both sides adjacent to the movable groove 41. The movable seat 5 is a rectangular parallelepiped structure, and the movable seat 5 is arranged in the movable groove 41 and is slidably connected to the inner bottom wall of the movable groove 41, and the side walls on both sides adjacent to the movable seat 5 are provided with control grooves 51, and each control groove 51 inner wall is provided with a slide groove 52. The slider 6 is a rectangular parallelepiped structure, and two sliders 6 are provided, and the two sliders 6 are slidably connected to the inner walls of the two slide grooves 52 respectively. Two electric push rods 7 are provided, and the two electric push rods 7 are respectively fixed to the inner walls of the two mounting grooves 42 , and the output shafts of the two electric push rods 7 are respectively slidably connected to the inner walls of the two control grooves 51 , and the output shaft ends of the two electric push rods 7 are respectively fixed to the side walls of the two sliders 6 .

[0030] The driving assembly is mounted on the base 1 and is used to drive the support rod 3 to rotate. The driving assembly includes a driven gear 81, a motor 82 and a driving gear 83. The driven gear 81 is fixedly sleeved on the support rod 3, and the axis of the driven gear 81 coincides with the axis of the support rod 3. The motor 82 is fixed on the upper surface of the base 1, and the output shaft of the motor 82 extends vertically upward. The driving gear 83 is fixed to the end of the output shaft of the motor 82, the driving gear 83 is meshed with the driven gear 81, and the axis of the driving gear 83 coincides with the axis of the output shaft of the motor 82.

[0031] The wafer is placed on the moving seat 5 and inspected through the microscope body 2. When it is necessary to inspect different positions of the wafer, the staff drives the active gear 83 to rotate by starting the motor 82, so that the driven gear 81 meshing with the active gear 83 and the support rod 3 fixed to the driven gear 81 rotate, so as to adjust the rotation angle of the wafer, and then start the two electric push rods 7 to control the extension and retraction of the output shaft of the electric push rod 7. Since the output shaft end of the electric push rod 7 is fixed to the side wall of the slider 6, the slider 6 is slidably connected in the slide groove 52, so that the moving seat 5 can move horizontally or vertically in the moving groove 41, eliminating the tedious operation of manually moving the wafer, thereby improving the convenience and accuracy of wafer detection.

[0032] In order to facilitate the movement of the wafer while detecting, a controller 9 electrically connected to the electric push rod 7 is fixed on the upper surface of the base 1. The controller 9 is electrically connected to the motor 82. The two electric push rods 7 and the motor 82 are controlled by the controller 9, so that the staff can move the wafer through the controller 9 while detecting.

[0033] In order to reduce the wear between the lower surface of the moving seat 5 and the inner bottom wall of the moving groove 41, a plurality of balls 10 rollingly connected to the inner bottom wall of the moving groove 41 are embedded in the lower surface of the moving seat 5, and the distance between the lower surface of the moving seat 5 and the inner bottom wall of the moving groove 41 is 0.2-0.4 cm. The balls 10 are rollingly connected to the moving groove 41, which reduces the friction between the lower surface of the moving seat 5 and the inner bottom wall of the moving groove 41, reduces the kinetic energy loss of the electric push rod 7, and thereby reduces the wear between the lower surface of the moving seat 5 and the inner bottom wall of the moving groove 41.

[0034] In order to protect the rotating assembly 8 , a protective shell 11 for covering the rotating assembly 8 is fixed to the upper surface of the base 1 . The protective shell 11 protects the rotating assembly 8 and reduces the probability of damage to the rotating assembly 8 under the action of external force.

[0035] In order to dissipate heat for the motor 82, a plurality of heat dissipation holes 111 are provided on the side wall of the protective shell 11 close to the motor 82. The setting of the heat dissipation holes 111 has a heat dissipation effect for the motor 82, reducing the probability of the motor 82 shutting down or even being damaged due to overheating.

[0036] In order to facilitate the installation and maintenance of the electric push rod 7, a flared groove 43 connected to the mounting groove 42 is provided on the upper surface of the mounting seat 4, and a baffle plate cooperating with the flared groove 43 is provided in the flared groove 43. The baffle plate protects the electric push rod 7 in the mounting groove 42, reduces the probability of damage to the electric push rod 7, and facilitates the installation and maintenance of the electric push rod 7.

[0037] The operating principle of a microscope observation device for wafer defect detection in the present embodiment is as follows: the wafer is placed on the moving seat 5, and the wafer is inspected through the microscope body 2. When it is necessary to inspect different positions of the wafer, the staff drives the active gear 83 to rotate by starting the motor 82, so that the driven gear 81 meshing with the active gear 83 and the support rod 3 fixed to the driven gear 81 rotate, so as to adjust the rotation angle of the wafer, and then start the two electric push rods 7 to control the extension and retraction of the output shaft of the electric push rod 7. Since the end of the output shaft of the electric push rod 7 is fixed to the side wall of the slider 6, and the slider 6 is slidably connected in the slide groove 52, the moving seat 5 is moved horizontally or vertically in the moving groove 41, eliminating the tedious operation of manually moving the wafer, thereby improving the convenience and accuracy of wafer detection.

[0038] The above is only a preferred embodiment of the present invention. The protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A wafer defect detection microscope observation device, comprising a base (1) and a microscope body (2) arranged on the base (1), characterized in that: The upper surface of the base (1) is rotatably connected to a support rod (3), the upper end of the support rod (3) is fixed with a mounting seat (4), the upper surface of the mounting seat (4) is provided with a moving groove (41), the inner walls on both sides adjacent to the moving groove (41) are provided with mounting grooves (42), a moving seat (5) is provided in the moving groove (41) and is slidably connected to the inner bottom wall of the moving groove (41), the side walls on both sides adjacent to the moving seat (5) are provided with control grooves (51), each of the control grooves The inner wall of each control groove (51) is provided with a slide groove (52), and the inner wall of each slide groove (52) is slidably connected to a slider (6), and an electric push rod (7) is fixed in each mounting groove (42). The output shafts of the two electric push rods (7) are slidably connected to the inner walls of the two control grooves (51), and the ends of the output shafts of the two electric push rods (7) are respectively fixed to the side walls of the two sliders (6), and a rotating component (8) for driving the support rod (3) to rotate is installed on the base (1).

2. The wafer defect detection microscope observation device according to claim 1, characterized in that: The rotating assembly (8) comprises a driven gear (81) fixedly sleeved on the support rod (3), a motor (82) fixed to the upper surface of the base (1), and a driving gear (83) fixed to the end of the output shaft of the motor (82) and meshing with the driven gear (81).

3. The wafer defect detection microscope observation device according to claim 2, characterized in that: A controller (9) electrically connected to the electric push rod (7) is fixed on the upper surface of the base (1), and the controller (9) is electrically connected to the motor (82).

4. The wafer defect detection microscope observation device according to claim 3, characterized in that: The lower surface of the movable seat (5) is embedded with a plurality of balls (10) which are rollingly connected to the inner bottom wall of the movable groove (41), and the distance between the lower surface of the movable seat (5) and the inner bottom wall of the movable groove (41) is 0.2-0.4 cm.

5. The wafer defect detection microscope observation device according to claim 2, characterized in that: A protective shell (11) for covering the rotating assembly (8) is fixed on the upper surface of the base (1).

6. The wafer defect detection microscope observation device according to claim 5, characterized in that: A plurality of heat dissipation holes (111) are provided on the side wall of the protective shell (11) close to the motor (82).

7. The wafer defect detection microscope observation device according to claim 6, characterized in that: The upper surface of the mounting seat (4) is provided with an expansion groove (43) which is in communication with the mounting groove (42), and a baffle which cooperates with the expansion groove (43) is arranged in the expansion groove (43).

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