Annealing device for temperature control disc of semiconductor coating equipment

Abstract

The utility model provides an annealing device for a temperature control disc of semiconductor coating equipment, which comprises an annealing structure and a refrigeration assembly wound on the cylindrical outer surface of the annealing structure, a heating assembly is arranged at the bottom of the annealing structure, a furnace cover is arranged at the top of the annealing structure, and a connecting rod is connected to the bottom of the furnace cover. A bearing disc is connected to the end, away from the furnace cover, of the connecting rod, an air suction assembly is arranged at the top of the furnace cover, a first air suction structure is arranged on the cylindrical inner surface of the annealing structure, first dust suction holes are formed in the cylindrical inner surface of the first air suction structure, and a second air suction structure is connected to the bottom of the first air suction structure. A second dust suction hole is formed in one side of the second air suction structure, a telescopic hose is connected to the top of the first air suction structure and penetrates through the furnace cover to be connected with the air suction assembly, and the first dust suction hole, the second dust suction hole and an inner hole of the telescopic hose are communicated with one another. And the air suction assembly sucks out pollutants such as dust and impurities generated in the annealing structure.

Description

Technical Field

[0001] The utility model relates to the technical field of annealing, in particular to an annealing device for a temperature control disk of semiconductor coating equipment. Background Art

[0002] In the semiconductor industry, heat treatment of semiconductor materials is essential. Its main purpose is to release internal stress, increase the ductility of the material, reduce deformation and crack tendency, and also change the crystal phase structure on the surface or inside of the semiconductor material, eliminate defects, etc., to obtain the required specific properties.

[0003] In actual production, annealing is one of the most commonly used methods in the heat treatment process of semiconductor materials.

[0004] Existing annealing devices are prone to produce pollutants such as dust and impurities inside, which will affect the annealing effect during the annealing process. Therefore, the inside of the mechanism needs to be manually cleaned before annealing. However, the labor cost is high, and it wastes time, while also leading to reduced work efficiency. Utility Model Content

[0005] Based on this, the purpose of the utility model is to provide an annealing device for a temperature control disk of a semiconductor coating equipment, which can effectively solve the problem that pollutants such as dust and impurities are easily generated inside the existing annealing device, which affects the annealing effect during the annealing process, and the need to manually clean the inside of the annealing device before annealing, resulting in high labor costs, waste of time and reduced work efficiency.

[0006] An annealing device for a temperature control disk of a semiconductor coating equipment comprises a cylindrical annealing structure and a refrigeration component wound on the outer surface of the annealing structure, a heating component is arranged at the bottom of the annealing structure, a furnace cover is arranged at the top of the annealing structure, a plurality of connecting rods are connected to the bottom of the furnace cover, a carrying plate for placing the temperature control disk is connected to the end of the connecting rod away from the furnace cover, the carrying plate is arranged inside the annealing structure, a suction component is arranged on the top of the furnace cover, a first suction structure is arranged on the cylindrical inner surface of the annealing structure, a plurality of first ash suction holes are opened on the cylindrical inner surface of the first suction structure, a plurality of second suction structures are connected to the bottom of the first suction structure, a plurality of second ash suction holes are opened on the side of the second suction structure facing the center of the annealing structure, a telescopic hose is connected to the top of the first suction structure, the telescopic hose passes through the furnace cover and is connected to the suction component, the first ash suction hole and the second ash suction hole and the inner hole of the telescopic hose are mutually connected, so that the suction component can suck out pollutants such as dust and impurities generated inside the annealing structure.

[0007] Furthermore, the air suction assembly includes an ash storage box arranged on the top of the furnace cover, a fan is arranged on the top of the ash storage box, and a filter is arranged between the ash storage box and the fan.

[0008] Furthermore, the telescopic hose is connected to one side of the ash storage box, and a slide groove is symmetrically arranged on a side of the ash storage box away from the telescopic hose, and a side plate is slidably arranged in the slide groove.

[0009] Furthermore, a heat-insulating shell adapted to the furnace cover is arranged on the outer side of the annealing structure, and the refrigeration component and the heating component are arranged between the heat-insulating shell and the annealing structure.

[0010] Furthermore, the refrigeration assembly includes a condenser tube wound on the outer surface of the annealing structure and a refrigeration structure arranged on the outer surface of the insulation shell, and both ends of the condenser tube pass through the insulation shell and are connected to the refrigeration structure.

[0011] Furthermore, cylinders are symmetrically arranged on the outer surface of the heat-insulating shell, and the cylinders are arranged on both sides of the refrigeration structure.

[0012] Furthermore, a telescopic rod is connected to the top of the cylinder.

[0013] Furthermore, one end of the telescopic rod away from the cylinder is connected to a fixing block, and the fixing block is connected to the outer surface of the furnace cover cylinder.

[0014] Compared with the prior art, the beneficial effects of the utility model are as follows: by arranging an air suction component, the air suction component can suck out pollutants such as dust and impurities inside the annealing structure during annealing; specifically, by placing the temperature control plate that needs annealing on the supporting plate, suction is generated by the air suction component, and the first ash suction hole and the second ash suction hole suck out pollutants such as dust and impurities inside the annealing structure through the telescopic hose, and the temperature control plate inside the annealing structure is evenly heated by the heating component. The air suction component prevents impurities and dust from adhering to the surface of the temperature control plate during annealing, ensures the cleanliness of the temperature control plate during processing, and improves the annealing effect. After the temperature control plate is heated, the temperature control plate inside the annealing structure is quickly cooled by the refrigeration component. Compared with the traditional manual cleaning method, the cleaning work is completed more quickly and thoroughly, which greatly improves the annealing work efficiency and production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the three-dimensional structure of the annealing device used for the temperature control disk of semiconductor coating equipment in the embodiment of the utility model;

[0016] Figure 2This is a schematic diagram of the exploded structure of an annealing device for a temperature control disk of a semiconductor coating device in an embodiment of the utility model;

[0017] Figure 3 This is a schematic diagram of the expanded structure of the annealing device used for the temperature control disk of semiconductor coating equipment in the embodiment of the utility model;

[0018] Figure 4 This is a schematic diagram of the internal structure of an annealing device for a temperature control disk of a semiconductor coating device in an embodiment of the utility model;

[0019] Figure 5 It is a partial cross-sectional structural schematic diagram of an annealing device for a temperature control disk of a semiconductor coating equipment in an embodiment of the utility model;

[0020] Description of main component symbols:

[0021]

[0022]

[0023] The following specific implementation manner will further illustrate the present utility model in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0024] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0025] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0027] See also Figures 1 to 5, shown is an annealing device for a temperature control disk of a semiconductor coating device in an embodiment of the utility model, comprising a cylindrical annealing structure 10 and a condenser 31 wound on the outer surface of the annealing structure 10, a heating assembly 20 is arranged at the bottom of the annealing structure 10, a furnace cover 50 is arranged on the top of the annealing structure 10, two connecting rods 56 are connected to the bottom of the furnace cover 50, a carrying plate 57 for placing the temperature control disk is connected to the end of the connecting rod 56 away from the furnace cover 50, the carrying plate 57 is arranged inside the annealing structure 10, a suction assembly is arranged on the top of the furnace cover 50, and a heating assembly 20 is arranged on the bottom of the annealing structure 10. A first air suction structure 11 is provided on the cylindrical inner surface of the annealing structure 10, eight first ash suction holes 12 are opened on the cylindrical inner surface of the first air suction structure 11, four second air suction structures 13 are connected to the bottom of the first air suction structure 11, six second ash suction holes 14 are opened on the side of the second air suction structure 13 facing the center of the annealing structure 10, and a telescopic hose 15 is connected to the top of the first air suction structure 11, the telescopic hose 15 passes through the furnace cover 50 and is connected to the air suction assembly, and the first ash suction hole 12 is connected to the second ash suction hole 14 and the inner hole of the telescopic hose 15 are mutually connected.

[0028] Furthermore, the air suction assembly includes an ash storage box 51 disposed on the top of the furnace cover 50 , a fan 55 is disposed on the top of the ash storage box 51 , and a filter 54 is disposed between the ash storage box 51 and the fan 55 .

[0029] Furthermore, the telescopic hose 15 is connected to one side of the ash storage box 51 , and a slide groove 52 is symmetrically arranged on the side of the ash storage box 51 away from the telescopic hose 15 , and a side plate 53 is slidably arranged in the slide groove 52 .

[0030] It can be understood that the suction force is generated by the fan 55, and the first ash suction hole 12 and the second ash suction hole 14 are used to absorb the internal impurities of the annealing structure 10 through the telescopic hose 15, which is beneficial to remove dust and impurities, and helps to keep the inside of the annealing structure 10 clean, avoiding impurities and dust from adhering to the surface of the temperature control disk during the annealing process, ensuring the cleanliness of the temperature control disk during the processing process, and compared with the traditional manual cleaning method, it is beneficial to complete the cleaning work more quickly and thoroughly, thereby improving the working efficiency and production efficiency of the mechanism.

[0031] It can be understood that by setting the filter 54, the sucked impurities and dust are prevented from entering the fan 55. By symmetrically setting the slide groove 52 on the side of the ash box 51 away from the telescopic hose 15, and sliding the side panel 53 in the slide groove 52, the ash box 51 is convenient to open, which is beneficial to the processing of the sucked impurities and dust, and further improves the cleaning efficiency.

[0032] Furthermore, a heat-insulating shell 40 adapted to the furnace cover 50 is provided on the outer side of the annealing structure 10 , and the refrigeration component and the heating component 20 are provided between the heat-insulating shell 40 and the annealing structure 10 .

[0033] Furthermore, the refrigeration assembly includes a condenser tube 31 wound on the outer surface of the annealing structure 10 and a refrigeration structure 30 arranged on the outer surface of the insulation shell 40 , and both ends of the condenser tube 31 pass through the insulation shell 40 and are connected to the refrigeration structure 30 .

[0034] It can be understood that by arranging the refrigeration component and the heating component 20 between the heat preservation shell 40 and the annealing structure 10 , the heating and cooling efficiency of the present invention can be improved through the heat preservation shell 40 .

[0035] Furthermore, cylinders 41 are symmetrically arranged on the outer surface of the heat-insulating shell 40 , and the cylinders 41 are arranged on both sides of the refrigeration structure 30 .

[0036] Furthermore, a telescopic rod 42 is connected to the top of the cylinder 41 .

[0037] Furthermore, one end of the telescopic rod 42 away from the cylinder 41 is connected to a fixing block 43 , and the fixing block 43 is connected to the cylindrical outer surface of the furnace cover 50 .

[0038] It can be understood that the cylinder 41 controls the extension of the telescopic rod 42, so that the connecting block 43 drives the furnace cover 50 to lift upward, and the connecting rod 56 is arranged at the bottom of the furnace cover 50, and a supporting plate 57 for placing the temperature control disk is connected to the end of the connecting rod 56 away from the furnace cover 50, so that the supporting plate 57 for placing the temperature control disk can be synchronously driven by the furnace cover 50 to lift upward, which makes it easier for the operator to take or place the temperature control disk, avoids accidental injuries to the operator, and improves the convenience and safety of operation.

[0039] In summary, the annealing device for the temperature control disk of semiconductor coating equipment in the above-mentioned embodiments of the utility model is provided with an air suction component, so that the air suction component can suck out dust, impurities and other pollutants inside the annealing structure during annealing; specifically, by placing the temperature control disk that needs annealing on the supporting disk, the air suction component generates suction, and the first ash suction hole and the second ash suction hole suck out dust, impurities and other pollutants inside the annealing structure through the telescopic hose, and the temperature control disk inside the annealing structure is evenly heated by the heating component. The air suction component prevents impurities and dust from adhering to the surface of the temperature control disk during annealing, ensures the cleanliness of the temperature control disk during processing, and improves the annealing effect. After the temperature control disk is heated, the temperature control disk inside the annealing structure is quickly cooled by the refrigeration component. Compared with the traditional manual cleaning method, the cleaning work is completed more quickly and thoroughly, which greatly improves the annealing work efficiency and production efficiency.

[0040] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0041] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. An annealing device for a temperature control disk of a semiconductor coating equipment, characterized in that: The annealing device comprises an annealing structure and a refrigeration component wound on the cylindrical outer surface of the annealing structure, a heating component is arranged at the bottom of the annealing structure, a furnace cover is arranged at the top of the annealing structure, a plurality of connecting rods are connected to the bottom of the furnace cover, a carrying plate for placing a temperature control plate is connected to the end of the connecting rod away from the furnace cover, the carrying plate is arranged inside the annealing structure, a suction component is arranged on the top of the furnace cover, a first suction structure is arranged on the cylindrical inner surface of the annealing structure, a plurality of first ash suction holes are opened on the cylindrical inner surface of the first suction structure, a plurality of second suction structures are connected to the bottom of the first suction structure, a plurality of second ash suction holes are opened on the side of the second suction structure facing the center of the annealing structure, a telescopic hose is connected to the top of the first suction structure, the telescopic hose passes through the furnace cover and is connected to the suction component, the first ash suction hole, the second ash suction hole and the inner hole of the telescopic hose are interconnected, so that the suction component can suck out pollutants generated inside the annealing structure.

2. The annealing device for the temperature control disk of semiconductor coating equipment according to claim 1, characterized in that: The air suction assembly comprises an ash storage box arranged on the top of the furnace cover, a fan is arranged on the top of the ash storage box, and a filter is arranged between the ash storage box and the fan.

3. The annealing device for the temperature control disk of semiconductor coating equipment according to claim 2, characterized in that: The telescopic hose is connected to one side of the ash storage box, and a slide groove is symmetrically arranged on the side of the ash storage box away from the telescopic hose, and a side plate is slidably arranged in the slide groove.

4. The annealing device for the temperature control disk of semiconductor coating equipment according to claim 1, characterized in that: A heat-insulating shell matched with the furnace cover is arranged on the outer side of the annealing structure, and the refrigeration component and the heating component are arranged between the heat-insulating shell and the annealing structure.

5. The annealing device for the temperature control disk of semiconductor coating equipment according to claim 4, characterized in that: The refrigeration assembly includes a condenser tube wound on the outer surface of the annealing structure cylinder and a refrigeration structure arranged on the outer surface of the insulation shell. Both ends of the condenser tube penetrate the insulation shell and are connected to the refrigeration structure.

6. The annealing device for the temperature control disk of semiconductor coating equipment according to claim 5, characterized in that: Cylinders are symmetrically arranged on the outer surface of the heat-insulating shell, and the cylinders are arranged on both sides of the refrigeration structure.

7. The annealing device for the temperature control disk of semiconductor coating equipment according to claim 6, characterized in that: A telescopic rod is connected to the top of the cylinder.

8. The annealing device for the temperature control disk of semiconductor coating equipment according to claim 7, characterized in that: One end of the telescopic rod away from the cylinder is connected with a fixing block, and the fixing block is connected to the outer surface of the furnace cover cylinder.

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