Wafer heating table facilitating film tearing

Abstract

The utility model relates to the technical field of wafer processing detection, in particular to a wafer heating table convenient for film tearing, which comprises a processing table, a bearing assembly and an auxiliary film tearing assembly, a moving assembly is embedded in the inner side of the processing table, the bearing assembly is embedded in the moving assembly, a heating box is arranged on one side of the outer part of the processing table, and the auxiliary film tearing assembly is arranged on the other side of the outer part of the processing table. A heating box is arranged on the machining table, a heating plate is installed at the bottom of the heating box, the size of the open end of the heating box is matched with that of the moving assembly, an auxiliary film tearing assembly is arranged at the upper end of the joint of the heating box and the machining table, and a horizontal push rod is arranged at the joint of the machining table and one end of the moving assembly. According to the device, the problems that in the prior art, when an existing device cleans a surface blue film, a heating and manual combined mode is mostly adopted, but when the blue film is cleaned manually, an opening needs to be torn in advance, tearing can be facilitated, in the process, scratches are likely to occur, tearing is not convenient, and the whole tearing efficiency is low are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a wafer heating platform which is convenient for film tearing. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its original material is silicon. High-purity polysilicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod forms a silicon wafer, that is, a wafer. Before processing, the wafer has a layer of blue film on the surface. The surface blue film needs to be torn off before subsequent processing. Usually, a heating table is used to heat the wafer to make it easier to remove the blue film.

[0003] When existing devices clean the blue film on the surface, most of them adopt a combination of heating and manual methods. However, when manually cleaning the blue film, an opening needs to be torn out in advance to facilitate tearing. However, scratches are easily generated during the process, and it is not convenient to tear, resulting in low tearing efficiency.

[0004] Therefore, in view of this, the existing structure and defects are studied and improved, and a wafer heating table that is convenient for film tearing is proposed, in order to achieve a more practical purpose. Utility Model Content

[0005] The utility model aims to provide a wafer heating platform which is convenient for film tearing, so as to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer heating table for facilitating film tearing, comprising a processing table, a bearing assembly and an auxiliary film tearing assembly, a moving assembly is embedded in the inner side of the processing table, and a bearing assembly is embedded and installed inside the moving assembly, a heating box is arranged on one side of the outer side of the processing table, and a heating plate is installed at the bottom of the heating box, the opening end of the heating box and the moving assembly are matched in size, an auxiliary film tearing assembly is arranged on the upper end of the connection between the heating box and the processing table, and a horizontal push rod is arranged at the connection between the processing table and one end of the moving assembly;

[0007] The auxiliary film tearing assembly includes a fixed plastic roller, an axle, a connecting arc plate, a movable plastic roller and a limit rod. The fixed plastic roller is penetrated by the axle in the middle, and the axle is movably installed on the inner wall of the heating box. The outer wall of the axle is sleeved with a connecting arc plate, and movable plastic rollers are installed inside the two groups of connecting arc plates. A limit rod is arranged below the connecting arc plate, and the limit rod is installed on the inner wall of the heating box.

[0008] Furthermore, the moving component includes a moving platform, an inner slider and an outer slide rail, the inner sliders are arranged on both sides of the moving platform, and the outer sides of the inner sliders are embedded with outer slide rails, the bearing component includes a bearing frame, a bearing platform and an anti-slip pad, the bearing platform is installed in the middle of the bearing frame, and the surface of the bearing platform is provided with an anti-slip pad.

[0009] Furthermore, a ventilation groove is provided inside the supporting frame.

[0010] Furthermore, the support frame and the moving platform are interlocked with each other, and the support frame is arranged in a cross shape.

[0011] Furthermore, the moving platform forms a horizontal sliding structure between the inner sliding block and the outer sliding rail.

[0012] Furthermore, a ventilation groove is provided on one side of the top of the heating box.

[0013] Furthermore, the fixed plastic roller and the movable plastic roller are distributed in parallel, and the horizontal heights of the fixed plastic roller and the supporting frame match each other.

[0014] Furthermore, the horizontal position of the movable plastic roller is lower than that of the fixed plastic roller.

[0015] The utility model provides a wafer heating platform that is convenient for film tearing, and has the following beneficial effects:

[0016] 1. The utility model adopts a mosaic method to limit the position of the wafer, ensure the accurate position of the wafer during processing, avoid the change of the wafer position due to external force when tearing the film, and reduce the damage to the wafer.

[0017] 2. The utility model adopts a horizontal sliding method to stably translate the wafer into the heating area, and melts the sticky layer of the blue film by heating the wafer;

[0018] When the wafer is pulled out after being heated, it will be blocked by the arc surface of the movable plastic roller. When it is gradually pushed, the movable plastic roller will fit the blue film of the wafer and move relatively, so that the blue film is lifted up and collected on the movable plastic roller, realizing automatic film tearing processing and improving the heating film tearing effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The disclosure of the present invention will become easier to understand with reference to the accompanying drawings. It is easy for those skilled in the art to understand that these drawings are only used to illustrate the technical solution of the present invention and are not intended to limit the scope of protection of the present invention. In the drawings:

[0020] Figure 1 It is a top view of a three-dimensional structure schematic diagram of a wafer heating platform for easy film tearing according to the utility model;

[0021] Figure 2 This is a schematic diagram of a three-dimensional structure of a wafer heating platform for facilitating film tearing according to the utility model when viewed from above;

[0022] Figure 3 This is a schematic diagram of the three-dimensional structure of a moving component of a wafer heating platform that is convenient for film tearing according to the utility model;

[0023] Figure 4 It is a schematic diagram of the three-dimensional structure of an auxiliary film-tearing component of a wafer heating table for facilitating film tearing according to the utility model.

[0024] In the figure: 1. Processing table; 2. Moving assembly; 201. Moving table; 202. Inner slide block; 203. Outer slide rail; 3. Carrying assembly; 301. Carrying frame; 302. Carrying table; 303. Anti-skid pad surface; 304. Breathable strip groove; 4. Heating box; 5. Heating plate; 6. Breathable groove; 7. Auxiliary film tearing assembly; 701. Fixed plastic roller; 702. Shaft rod; 703. Connecting arc plate; 704. Movable plastic roller; 705. Limit rod; 8. Horizontal push rod. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] See also Figure 1-4 The utility model provides a technical solution: a wafer heating table for easy film tearing, comprising a processing table 1, a bearing assembly 3 and an auxiliary film tearing assembly 7, a moving assembly 2 is embedded in the inner side of the processing table 1, and the bearing assembly 3 is embedded and installed inside the moving assembly 2, a heating box 4 is arranged on the outer side of the processing table 1, and a heating plate 5 is installed at the bottom of the heating box 4, the opening end of the heating box 4 and the moving assembly 2 are matched in size, an auxiliary film tearing assembly 7 is arranged at the upper end of the connection between the heating box 4 and the processing table 1, and a horizontal push rod 8 is arranged at the connection between the processing table 1 and one end of the moving assembly 2;

[0027] The auxiliary film tearing assembly 7 includes a fixed plastic roller 701, an axle 702, a connecting arc plate 703, a movable plastic roller 704 and a limiting rod 705. The fixed plastic roller 701 is penetrated by the axle 702 in the middle, and the axle 702 is movably installed on the inner wall of the heating box 4. The outer wall of the axle 702 is sleeved with a connecting arc plate 703, and the movable plastic roller 704 is installed inside the two groups of connecting arc plates 703. A limiting rod 705 is arranged below the connecting arc plate 703, and the limiting rod 705 is installed on the inner wall of the heating box 4.

[0028] The moving assembly 2 includes a moving platform 201, an inner slider 202 and an outer slide rail 203. The inner sliders 202 are arranged on both sides of the moving platform 201, and the outer side of the inner slider 202 is embedded with the outer slide rail 203. The bearing assembly 3 includes a bearing frame 301, a bearing platform 302 and an anti-skid pad surface 303. The bearing platform 302 is installed in the middle of the bearing frame 301, and the surface of the bearing platform 302 is provided with an anti-skid pad surface 303.

[0029] A ventilation groove 304 is provided inside the carrier 301;

[0030] The carrier 301 and the moving platform 201 are interlocked, and the carrier 301 is arranged in a cross shape;

[0031] The moving platform 201 forms a horizontal sliding structure through the inner sliding block 202 and the outer sliding rail 203;

[0032] A ventilation groove 6 is provided on one side of the top of the heating box 4;

[0033] The fixed plastic roller 701 and the movable plastic roller 704 are arranged in parallel, and the horizontal heights of the fixed plastic roller 701 and the carrier frame 301 are matched with each other;

[0034] The horizontal position of the movable plastic roller 704 is lower than that of the fixed plastic roller 701;

[0035] The interlocking method is used to limit the position of the wafer, ensuring the accurate position of the wafer during processing, avoiding changes in the wafer position due to external force when tearing the film, and reducing damage to the wafer.

[0036] The opening size of the moving platform 201 matches the size of the wafer, and the wafer is embedded and installed in the inner opening of the moving platform 201 to ensure the stability of the wafer position;

[0037] By means of horizontal sliding, the inner slider 202 and the outer slide rail 203 on the outer side of the movable platform 201 can stably translate the movable platform 201 carrying the wafer into the heating area and enter the interior of the heating box 4. The heating box 4 heats the wafer to melt the sticky layer of the blue film.

[0038] When the wafer is pulled out after being heated, it will be blocked by the arc surface of the movable plastic roller 704. When it is gradually pushed, the movable plastic roller 704 is pressed against the blue film of the wafer and moves relatively, so that the blue film is lifted and collected on the movable plastic roller 704, realizing automatic film tearing processing and improving the heating film tearing effect;

[0039] The movable plastic roller 704 itself is limited by the traction of the connecting arc plate 703, and the bottom of the connecting arc plate 703 is blocked by the limiting rod 705. In the static state, the movable plastic roller 704 is in a relatively stable state. When the wafer moves outward, it will contact the movable plastic roller 704 in advance. When the wafer continues to move outward, the movable plastic roller 704 will be gradually pushed to roll on the surface of the wafer to tear the blue film from the edge; and the movable plastic roller 704 made of plastic material has a large friction coefficient with the blue film, which makes it easier to tear the blue film, so as to achieve the effect of facilitating film tearing;

[0040] The lowest end of the stationary fixed plastic roller 701 is on the same horizontal plane as the blue film, so the blue film that has been torn open by the movable plastic roller 704 will be torn again by the fixed plastic roller 701, thereby ensuring the accuracy of the automated film tearing. In addition, the fixed plastic roller 701 supports an external transmission structure, which can utilize high rotation to directly tear the blue film, thereby automatically completing the entire film tearing operation.

[0041] Working principle: For this type of wafer heating table that is convenient for film tearing, first place the wafer that needs to be film-teared through the moving table 201, embed it in the inner groove of the moving table 201, and make the middle of the wafer contact with the anti-skid pad 303 at the bottom to ensure the relative stability of the wafer, and then use the external horizontal push rod 8 to provide power to move the moving table 201 into the heating box 4 along with the wafer. During this process, the inner slider 202 and the outer slide rail 203 on the outside provide a stable track to ensure the accuracy of sliding, and then the heating plate 5 inside the heating box 4 works to heat the wafer. The circular surface is preheated to melt the sticky layer of the blue film so that the blue film can be easily separated from the wafer. Then the horizontal push rod 8 drives the movable table 201 to move again. When the wafer moves outward, it will contact the movable plastic roller 704 in advance. When the wafer continues to move outward, the movable plastic roller 704 will be gradually pushed to roll on the surface of the wafer to tear the blue film from the edge. After the wafer contacts the movable plastic roller 704, it will continue to contact the fixed plastic roller 701, and the blue film will be torn by using plastic to complete the wafer film tearing operation.

[0042] The above description is only a specific implementation method of the utility model, but the protection scope of the utility model is not limited to this. Any changes or substitutions that can be thought of by any technician familiar with the field within the technical scope disclosed by the utility model without creative work should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope defined in the claims.

Claims

1. A wafer heating table for facilitating film tearing, comprising a processing table (1), a carrying component (3) and an auxiliary film tearing component (7), characterized in that: A moving component (2) is embedded inside the processing table (1), and a bearing component (3) is embedded inside the moving component (2). A heating box (4) is provided on the outer side of the processing table (1), and a heating plate (5) is installed at the bottom of the heating box (4). The opening end of the heating box (4) and the moving component (2) have sizes that match each other. An auxiliary film tearing component (7) is provided at the upper end of the connection between the heating box (4) and the processing table (1), and a horizontal push rod (8) is provided at the connection between the processing table (1) and one end of the moving component (2). The auxiliary film tearing assembly (7) comprises a fixed plastic roller (701), an axle (702), a connecting arc plate (703), a movable plastic roller (704) and a limiting rod (705); the fixed plastic roller (701) has an axle (702) running through the middle thereof, and the axle (702) is movably mounted on the inner wall of the heating box (4); the outer wall of the axle (702) is sleeved with a connecting arc plate (703), and movable plastic rollers (704) are mounted inside two groups of the connecting arc plates (703); a limiting rod (705) is arranged below the connecting arc plate (703), and the limiting rod (705) is mounted on the inner wall of the heating box (4).

2. A wafer heating platform for facilitating film tearing according to claim 1, characterized in that: The moving component (2) comprises a moving platform (201), an inner slider (202) and an outer slide rail (203); the inner sliders (202) are arranged on both sides of the moving platform (201), and the outer sides of the inner sliders (202) are engaged with the outer slide rails (203); the bearing component (3) comprises a bearing frame (301), a bearing platform (302) and an anti-slip pad surface (303); the bearing platform (302) is installed in the middle of the bearing frame (301), and the surface of the bearing platform (302) is provided with an anti-slip pad surface (303).

3. A wafer heating platform for facilitating film tearing according to claim 2, characterized in that: A ventilation groove (304) is provided inside the supporting frame (301).

4. The wafer heating platform for facilitating film tearing according to claim 2, characterized in that: The support frame (301) and the moving platform (201) are interlocked, and the support frame (301) is arranged in a cross shape.

5. The wafer heating platform for facilitating film tearing according to claim 2, characterized in that: The movable platform (201) forms a horizontal sliding structure through the inner sliding block (202) and the outer sliding rail (203).

6. The wafer heating platform for facilitating film tearing according to claim 1, characterized in that: A ventilation groove (6) is provided on one side of the top of the heating box (4).

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