Bearing device
By designing a bearing device including a bearing body, a limiting ring body and a sheet retrieval component, the problems of difficulty in picking up the sheet, low efficiency and high damage risk in the prior art are solved, and the simplicity and efficiency of the sheet retrieval are achieved.
Patent Information
- Application Number
- CN202420285897.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-06
- Publication Date
- 2025-02-25
- Estimated Expiration
- 2034-02-06
AI Technical Summary
In the existing silicon carbide epitaxial chambers, the sheet removal process is relatively difficult, the efficiency is low, and there is a risk of damage.
A load bearing device is designed, including a bearing body, a limit ring body and a sheet retrieval component. The carrier body has a bearing surface and a receiving structure. The sheet retrieval member includes a first sheet retrieval part and a second sheet retrieval part. The first sheet retrieval part is driven to move upward through the downward movement of the second sheet retrieval part, pry up the wafer, and pass through Take the sheet from the bottom of the wafer.
The simplicity of chip picking is achieved, the chip picking efficiency is improved, and the risk of damage to the carrier device and wafer is reduced.
Smart Images
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Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductors, and in particular to a carrying device. Background Art
[0002] In the silicon carbide epitaxial process, the silicon carbide epitaxial wafer is usually carried by a carrying device and is transported along with the carrying device into a silicon carbide epitaxial chamber for the silicon carbide epitaxial process.
[0003] like Figure 1 As shown, an existing silicon carbide epitaxial chamber includes a carrier 100, a heating cavity 200 and a rotating base 300 disposed in the heating cavity 200. In the silicon carbide epitaxial process, the silicon carbide epitaxial wafer is carried by the carrier 100, and the carrier 100 is carried by the rotating base 300. The rotating base 300 is used to drive the carrier 100 and the silicon carbide epitaxial wafer to rotate, and the heating cavity 200 is used to heat the silicon carbide epitaxial wafer. Figure 2 As shown, the carrying device 100 may include a tray 101 and a ring body 102, wherein the tray 101 is used to carry the silicon carbide epitaxial wafer, the ring body 102 is arranged in cooperation with the tray 101, and the top surface of the ring body 102 is protruding relative to the carrying surface of the tray 101 for carrying the silicon carbide epitaxial wafer, the ring body 102 and the tray 101 form a groove for accommodating the silicon carbide epitaxial wafer, and the ring body 102 can surround the silicon carbide epitaxial wafer carried on the tray 101. The edge of the silicon carbide epitaxial wafer usually has a positioning flat edge, and in the semiconductor process, the orientation of the silicon carbide epitaxial wafer can be determined by means of the positioning flat edge. Therefore, the inner edge of the ring body 102 has a matching flat edge 1021, and when the silicon carbide epitaxial wafer is placed in the groove formed by the ring body 102 and the tray 101, the positioning flat edge of the silicon carbide epitaxial wafer is opposite to the matching flat edge 1021 of the ring body 102.
[0004] However, in the prior art, when it is necessary to remove the wafer (i.e., to remove the silicon carbide epitaxial wafer from the groove formed by the ring body 102 and the tray 101), it is necessary to first insert the tip of the suction pen or tweezers into the gap between the silicon carbide epitaxial wafer and the ring body 102, pry up the silicon carbide epitaxial wafer from the edge of the silicon carbide epitaxial wafer to create a gap between the silicon carbide epitaxial wafer and the tray 101, and then insert the suction pen into the gap between the silicon carbide epitaxial wafer and the tray 101, and remove the wafer by sucking the bottom surface of the silicon carbide epitaxial wafer with the suction pen. However, since the gap between the silicon carbide epitaxial wafer and the ring body 102 and the driving gap between the silicon carbide epitaxial wafer and the tray 101 are relatively small, it is difficult to remove the wafer, which not only results in low efficiency in removing the wafer, but also causes a greater risk of damage to the tray 101, the ring body 102 and the silicon carbide epitaxial wafer. Utility Model Content
[0005] The utility model aims to solve at least one of the technical problems existing in the prior art, and proposes a carrying device, which can make it easier to take out the wafer, thereby improving the efficiency of taking out the wafer and reducing the risk of damage to the carrying device and the wafer.
[0006] In order to achieve the purpose of the utility model, a carrying device is provided, comprising a carrying body, a limiting ring body and a wafer taking component, wherein the carrying body has a carrying surface and is provided with a receiving structure which is concave relative to the carrying surface, the carrying surface has a carrying area and a wafer taking area, the carrying area is used to carry a wafer, the wafer taking area is located outside the carrying area, the receiving structure comprises a first receiving groove and a second receiving groove which are interconnected, the first receiving groove is located in the carrying area, and the second receiving groove is located in the wafer taking area;
[0007] The film picking component includes a first film picking portion and a second film picking portion which are connected to each other, wherein the first film picking portion is accommodated in the first accommodating groove, and the second film picking portion is arranged corresponding to the second accommodating groove, and the limiting ring body is arranged in cooperation with the supporting body, and at least partially surrounds the supporting area and the film picking area.
[0008] Optionally, the bottom of the second accommodating groove is recessed relative to the bottom of the first accommodating groove, and the second chip picking part has a preset gap with the bottom of the second accommodating groove in a natural state, and the preset gap is used to provide space for the second chip picking part to move downward when the second chip picking part is subjected to a downward force, so as to drive the first chip picking part to move upward and pry up the chip through the downward movement of the second chip picking part.
[0009] Optionally, the film picking component also includes a supporting portion, and the accommodating structure also includes a supporting accommodating groove, the supporting accommodating groove is arranged corresponding to the first accommodating groove and is recessed relative to the bottom of the first accommodating groove, the supporting portion is arranged at the bottom of the first film picking portion and can be rotatably accommodated in the supporting accommodating groove.
[0010] Optionally, at least a portion of the second sheet-taking portion is convex relative to the supporting surface.
[0011] Optionally, the inner edge of the convex portion of the second wafer taking portion relative to the supporting surface has a matching flat edge, and the matching flat edge is used to be opposite to the positioning flat edge of the wafer edge.
[0012] Optionally, the width of the supporting portion is greater than the width of the first sheet taking portion.
[0013] Optionally, a portion of the bottom of the first accommodating groove close to the second accommodating groove is inclined, and in a direction from a side of the inclined surface close to the second accommodating groove to a side away from the second accommodating groove, a height of the inclined surface gradually increases relative to the bottom of the second accommodating groove.
[0014] Optionally, an end surface of the first sheet-taking portion away from the second sheet-taking portion is an arc surface.
[0015] Optionally, a surface of the second sheet-taking portion facing away from the carrier body has a first coating, and the first coating is capable of enabling the growth of semiconductor process products to grow densely;
[0016] And / or, except for a surface of the second sheet-taking portion facing away from the supporting body, the material of the remaining portion of the sheet-taking component is the same as that of the supporting body.
[0017] Optionally, the top surface of the first sheet taking portion is lower than the carrying surface, or the top surface of the first sheet taking portion is flush with the carrying surface.
[0018] The utility model has the following beneficial effects:
[0019] The carrying device provided by the utility model can first control the second taking part located outside the edge of the wafer to drive the first taking part located below the bottom surface of the wafer to lift the wafer from below the bottom surface of the wafer, so that there is enough space below the bottom surface of the wafer for the suction pen to extend into, and then the suction pen is extended to below the bottom surface of the wafer, and the wafer is taken out by sucking the bottom surface of the wafer by the suction pen. Compared with the taking method of the prior art, the taking method of the utility model in the utility model lifts the wafer from below the bottom surface of the wafer instead of prying the wafer from the edge of the wafer, and on the other hand, Since the wafer is lifted from below the bottom surface, there is enough space below the bottom surface of the wafer for the suction pen to extend into, so that the suction pen can be easily extended to below the bottom surface of the wafer. On the other hand, since the carrying surface has a film picking area corresponding to the second film picking part, and the film picking area is located outside the carrying area for carrying the wafer, and the limiting ring surrounds the carrying area and the film picking area, there is enough space to control the second film picking part, so that it is convenient to control the film picking component, and then it can make film picking easier, thereby improving the efficiency of film picking and reducing the risk of damage to the carrying device and the wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 It is a schematic diagram of the three-dimensional structure of an existing silicon carbide epitaxial chamber;
[0021] Figure 2 for Figure 1A schematic diagram of a top view of the structure of the carrying device in FIG.
[0022] Figure 3 A schematic diagram of the top view of the structure of the carrying device provided in the embodiment of the utility model;
[0023] Figure 4 A schematic diagram of a top view of the structure of the carrier body and the limiting ring body provided in an embodiment of the utility model;
[0024] Figure 5 A schematic diagram of a partial front view of the structure of the carrier device provided by an embodiment of the utility model when the wafer is not pried up;
[0025] Figure 6 A schematic diagram of a partial front view of the structure of a carrier device provided by an embodiment of the utility model when prying up a wafer;
[0026] Figure 7 A partially enlarged front structural schematic diagram of a carrying device provided in an embodiment of the utility model;
[0027] Description of reference numerals:
[0028] 100-carrying device; 101-tray; 102-ring body; 1021-matching flat edge; 200-heating cavity; 300-rotating base; 1-carrying device; 11-carrying body; 111-carrying surface; 112-accommodating structure; 1121-second accommodating groove; 1122-first accommodating groove; 1123-supporting accommodating groove; 1124-inclined surface; 12-limiting ring body; 13-chip picking component; 131-second chip picking part; 1311-matching flat edge; 132-first chip picking part; 1321-arc surface; 133-supporting part; 14-preset gap; 400-chip. DETAILED DESCRIPTION
[0029] In order to enable those skilled in the art to better understand the technical solution of the present invention, the carrying device provided by the present invention is described in detail below in conjunction with the accompanying drawings.
[0030] like Figure 3 , Figure 5 and Figure 6As shown, an embodiment of the utility model provides a carrying device 1, including a carrying body 11, a limiting ring body 12 and a film picking component 13, the carrying body 11 has a carrying surface 111, and is provided with a containing structure 112 which is concave relative to the carrying surface 111, the carrying surface 111 has a carrying area and a film picking area, the carrying area is used to carry the wafer 400, and the film picking area is located outside the carrying area, the containing structure 112 includes a first containing groove 1122 and a second containing groove 1121 which are interconnected, the first containing groove 1122 is located in the carrying area, and the second containing groove 1121 is located in the film picking area; the film picking component 13 includes a first film picking portion 132 and a second film picking portion 131 which are interconnected, the first film picking portion 132 is accommodated in the first containing groove 1122, the second film picking portion 131 is correspondingly arranged with the second containing groove 1121, the limiting ring body 12 is arranged in cooperation with the carrying body 11, and at least partially surrounds the carrying area and the film picking area.
[0031] In practical applications, when the wafer 400 is placed on the carrier 1, the wafer 400 is located on the carrier surface 111 of the carrier body 11 and in the carrier area of the carrier surface 111. Since the containing structure 112 is concave relative to the carrier surface 111 and the first containing groove 1122 of the containing structure 112 is located in the carrier area, when the wafer 400 is placed on the carrier 1, the first wafer taking portion 132 of the wafer taking component 13 contained in the first containing groove 1122 can be located below the bottom surface of the wafer 400, and since the second containing groove 1121 of the containing structure 112 is located in the wafer taking area, and the wafer taking area is located outside the carrier area, when the wafer 400 is placed on the carrier 1, the second wafer taking portion 131 of the wafer taking component 13 corresponding to the second containing groove 1121 can be located outside the edge of the wafer 400. Since at least a portion of the limiting ring 12 surrounds the carrying area and the wafer taking area, when the wafer 400 is placed on the carrying device 1 , at least a portion of the limiting ring 12 can surround the wafer 400 and the second wafer taking portion 131 .
[0032] The carrier device 1 provided by the embodiment of the utility model can first control the second chip taking part 131 located outside the edge of the chip 400 to drive the first chip taking part 132 located below the bottom surface of the chip 400 to lift the chip 400 from below the bottom surface of the chip 400, so that there is enough space under the bottom surface of the chip 400 for the suction pen to extend into, and then the suction pen is extended to below the bottom surface of the chip 400, and the bottom surface of the chip 400 is sucked by the suction pen to take the chip. Compared with the chip taking technology of the prior art, on the one hand, the chip 400 is lifted from below the bottom surface of the chip 400 instead of prying the chip 400 from the edge of the chip 400, and on the other hand, the chip 400 is lifted from below the bottom surface of the chip 400 instead of prying the chip 400 from the edge of the chip 400. On the one hand, since the chip 400 is lifted from below the bottom surface, there is enough space below the bottom surface of the chip 400 for the suction pen to extend into, so that the suction pen can be easily extended to below the bottom surface of the chip 400. On the other hand, since the supporting surface 111 has a film picking area corresponding to the second film picking part 131, and the film picking area is located outside the supporting area for supporting the chip 400, and the limiting ring body 12 surrounds the supporting area and the film picking area, there is enough space to control the second film picking part 131, so that it is convenient to control the film picking part 13, and then it can make film picking easier, thereby improving the efficiency of film picking and reducing the risk of damage to the supporting device 1 and the chip 400.
[0033] like Figure 3-Figure 6 As shown, in one embodiment of the utility model, the bottom of the second accommodating groove 1121 can be recessed relative to the bottom of the first accommodating groove 1122, and the second chip picking portion 131 can have a preset gap 14 with the bottom of the second accommodating groove 1121 in a natural state. The preset gap 14 is used to provide space for the second chip picking portion 131 to move downward when the second chip picking portion 131 is subjected to a downward force, so as to drive the first chip picking portion 132 to move upward to pry up the chip 400 through the downward movement of the second chip picking portion 131.
[0034] In practical applications, when no wafer 400 is placed on the carrier 1, the wafer taking component 13 can be in a natural state under the action of its own gravity, the first wafer taking portion 132 can be accommodated in the first receiving groove 1122, and the second wafer taking portion 131 can have a preset gap 14 with the bottom of the second receiving groove 1121. When a wafer 400 is placed on the carrier 1, but the second wafer taking portion 131 is not subjected to a downward force, the wafer taking component 13 can be in a natural state under the action of its own gravity.
[0035] When it is necessary to take out the wafer, the second wafer taking part 131 can be pressed downward to make the second wafer taking part 131 subject to a downward force. Since there is a preset gap 14 between the second wafer taking part 131 and the bottom of the second receiving groove 1121, when the second wafer taking part 131 is subjected to a downward force, the second wafer taking part 131 has space to move downward, so that the second wafer taking part 131 can move downward to be received in the second receiving groove 1121. During the downward movement of the second wafer taking part 131, the second wafer taking part 131 can drive the first wafer taking part 132 to move upward, so that the wafer 400 can be pried up from the bottom surface of the wafer 400 by the first wafer taking part 132. After the wafer 400 is pried up, there can be enough space between the bottom surface of the wafer 400 and the first wafer taking part 132 for the suction pen to extend into. After that, the suction pen can be extended between the bottom surface of the wafer 400 and the first wafer taking part 132, and the bottom surface of the wafer 400 can be sucked by the suction pen to take out the wafer.
[0036] When the film is taken, the second film taking part 131 can be released. Under the action of the first film taking part 132's own gravity, the first film taking part 132 can move downward to be accommodated in the first accommodating groove 1122. During the downward movement of the first film taking part 132, the first film taking part 132 can drive the second film taking part 131 to move upward to a preset gap 14 between the first film taking part 131 and the bottom of the second accommodating groove 1121, thereby restoring the film taking part 13 to its natural state, which can facilitate the placement of the chip 400 on the supporting device 1 again.
[0037] When the film taking component 13 needs to be replaced or maintained, the old film taking component 13 can be directly removed from the carrying body 11, and a new film taking component 13 can be directly placed on the carrying body 11, making the replacement or maintenance of the film taking component 13 more convenient.
[0038] like Figure 3-Figure 6 As shown, in one embodiment of the utility model, the film picking component 13 may also include a support portion 133, and the accommodating structure 112 may also include a support accommodating groove 1123, the support accommodating groove 1123 is arranged corresponding to the first accommodating groove 1122, and is recessed relative to the bottom of the first accommodating groove 1122, the support portion 133 is arranged at the bottom of the first film picking portion 132, and can be rotatably accommodated in the support accommodating groove 1123.
[0039] In actual application, when the second sheet-taking part 131 moves downward, the support part 133 can rotate in the support receiving groove 1123, so that the first sheet-taking part 132 can move upward. When the first sheet-taking part 132 moves downward, the support part 133 can rotate in the support receiving groove 1123, so that the second sheet-taking part 131 can move upward. With the rotation of the support part 133 in the support receiving groove 1123, the second sheet-taking part 131 and the first sheet-taking part 132 can move upward or downward more easily.
[0040] like Figure 5 and Figure 6 As shown, optionally, the radial cross section of the support portion 133 may be semicircular, and the radial cross section of the support receiving groove 1123 may be semicircular matching the radial cross section of the support portion 133. However, the radial cross section of the support portion 133 and the radial cross section of the support receiving groove 1123 are not limited thereto.
[0041] like Figure 5 As shown, in one embodiment of the present invention, at least a portion of the second sheet-taking portion 131 may be convex relative to the carrying surface 111 .
[0042] On the one hand, such a design can limit the chip 400 with the help of the second chip picking part 131 and the limiting ring body 12, and on the other hand, it can make it easier for the chip picking personnel to press the second chip picking part 131, thereby making the chip picking easier, and further improving the efficiency of chip picking, and further reducing the risk of damage to the supporting device 1 and the chip 400.
[0043] like Figure 3 As shown, in one embodiment of the present invention, the inner edge of the convex portion of the second chip-taking portion 131 relative to the carrying surface 111 may have a matching flat edge 1311, and the matching flat edge 1311 is used to be opposite to the positioning flat edge of the edge of the wafer 400.
[0044] In the semiconductor process, the orientation of the wafer 400 can be detected by detecting the positioning flat edge of the wafer 400. By making the inner edge of the convex part of the second wafer picking portion 131 relative to the carrying surface 111 have a matching flat edge 1311, when the wafer 400 is placed on the carrying body 11, the positioning flat edge can be positioned opposite to the matching flat edge 1311, and the positioning flat edge can be limited by the matching flat edge 1311, so that the position of the wafer 400 on the carrying body 11 can be limited.
[0045] like Figure 3 As shown, in one embodiment of the present invention, the width of the support portion 133 may be greater than the width of the first sheet taking portion 132 .
[0046] Specifically, the direction from one end of the first sheet-taking portion 132 close to the edge of the carrier body 11 to one end of the first sheet-taking portion 132 close to the center of the carrier body 11 may be the length direction of the first sheet-taking portion 132, the direction from one side of the first sheet-taking portion 132 facing the bearing surface 111 of the carrier body 11 to one side of the first sheet-taking portion 132 away from the bearing surface 111 of the carrier body 11 may be the thickness direction of the first sheet-taking portion 132, the width direction of the first sheet-taking portion 132 may be perpendicular to the length direction of the first sheet-taking portion 132 and the thickness direction of the first sheet-taking portion 132, respectively, and the width direction of the support portion 133 may be parallel to the width direction of the first sheet-taking portion 132. By making the width of the support portion 133 greater than the width of the first sheet-taking portion 132, the stability of the support portion 133 accommodated in the support accommodation groove 1123 may be improved.
[0047] like Figure 3 As shown, optionally, the width of the second film taking portion 131 may be greater than the width of the support portion 133 and the width of the first film taking portion 132. This makes it easier for the film taking personnel to press the second film taking portion 131.
[0048] like Figure 5 and Figure 6 As shown, in one embodiment of the utility model, the portion of the bottom of the first receiving groove 1122 close to the second receiving groove 1121 may be a slope 1124, and in the direction from the side of the slope 1124 close to the second receiving groove 1121 to the side away from the second receiving groove 1121, the height of the slope 1124 gradually increases relative to the bottom of the second receiving groove 1121.
[0049] Such a design can reduce the interference of the bottom of the first accommodating groove 1122 close to the second accommodating groove 1121 on the second film picking portion 131 during the downward movement of the second film picking portion 131, so that the second film picking portion 131 can move downward more smoothly, thereby enabling the first film picking portion 132 to move upward more easily.
[0050] like Figure 7 As shown, in one embodiment of the present invention, an end surface of the first sheet-taking portion 132 away from the second sheet-taking portion 131 may be a curved surface 1321 .
[0051] Such a design is due to the fact that during the process of the first chip picking portion 132 prying up the chip 400 from below the bottom surface of the chip 400, the end of the first chip picking portion 132 away from the second chip picking portion 131 will slide relative to the bottom surface of the chip 400. By making the end surface of the first chip picking portion 132 away from the second chip picking portion 131 to be an arc surface 1321, the friction between the end of the first chip picking portion 132 away from the second chip picking portion 131 and the bottom surface of the chip 400 can be reduced during the process of the first chip picking portion 132 prying up the chip 400 from below the bottom surface of the chip 400, thereby improving the service life of the chip picking component 13, reducing the generation of particle contaminants, and reducing the risk of damage to the chip 400.
[0052] Optionally, an end surface of the first sheet-taking portion 132 away from the second sheet-taking portion 131 may be an arc surface.
[0053] In one embodiment of the utility model, the side of the second chip picking portion 131 facing away from the carrier body 11 may have a first coating, and the first coating is sufficient to enable the growth products of the semiconductor process to grow densely; and / or, except for the side of the second chip picking portion 131 facing away from the carrier body 11, the material of the rest of the chip picking component 13 may be the same as the material of the carrier body 11.
[0054] Such a design is due to the fact that in the semiconductor process, the side of the second chip picking portion 131 facing away from the carrier body 11 (i.e., the side facing away from the bottom of the second accommodating groove 1121) will be exposed to the semiconductor process environment, and the growths in the semiconductor process will not only grow on the wafer 400, but also grow on the side of the second chip picking portion 131 facing away from the carrier body 11. By providing the side of the second chip picking portion 131 facing away from the carrier body 11 with a first coating, since the first coating can enable the growths of the semiconductor process to grow densely, the semiconductor process growths grown on the side of the second chip picking portion 131 facing away from the carrier body 11 will not easily fall off from the side of the second chip picking portion 131 facing away from the carrier body 11 due to a small external force, thereby reducing the risk of contamination of the wafer 400.
[0055] By designing the material of the remaining parts of the film picking component 13 except the side of the second film picking portion 131 facing away from the carrying body 11 to be the same as the material of the carrying body 11, that is to say, for example, the material of the part of the second film picking portion 131 except the side facing away from the carrying body 11, the material of the first film picking portion 132 and the supporting portion 133 can all be the same as the material of the carrying body 11. In this way, the wear between the second film picking portion 131 and the carrying body 11, between the first film picking portion 132 and the carrying body 11, and between the supporting portion 133 and the carrying body 11 can be reduced, thereby improving the service life of the film picking component 13 and the carrying body 11.
[0056] Optionally, the first coating may be a silicon carbide coating or a tantalum carbide coating.
[0057] Optionally, except for one side of the second sheet-taking portion 131 facing away from the supporting body 11 , the material of the remaining part of the sheet-taking component 13 and the material of the supporting body 11 may be graphite.
[0058] Optionally, the outer surface of the limiting ring body 12 may have a second coating, and the second coating satisfies the requirement of enabling the growths of the semiconductor process to grow densely. Such a design is because in the semiconductor process, the outer surface of the limiting ring body 12 will be exposed to the semiconductor process environment, and the growths in the semiconductor process will not only grow on the wafer 400, but also on the outer surface of the limiting ring body 12. By providing the outer surface of the limiting ring body 12 with a second coating, since the second coating satisfies the requirement of enabling the growths of the semiconductor process to grow densely, the semiconductor process growths grown on the outer surface of the limiting ring body 12 are not easily detached from the outer surface of the limiting ring body 12 due to a small external force, thereby reducing the risk of contamination of the wafer 400.
[0059] Optionally, the second coating may be a silicon carbide coating or a tantalum carbide coating.
[0060] In an embodiment of the present invention, the top surface of the first sheet-taking portion 132 may be lower than the carrying surface 111 , or the top surface of the first sheet-taking portion 132 may be flush with the carrying surface 111 .
[0061] Such a design allows the first chip picking portion 132 to be completely accommodated in the first accommodating groove 1122 without protruding from the first accommodating groove 1122. That is to say, the side of the first chip picking portion 132 facing away from the supporting body 11 (i.e., the side facing away from the bottom of the first accommodating groove 1122) can be lower than the supporting surface 111, or, the side of the first chip picking portion 132 facing away from the supporting body 11 can be flush with the supporting surface 111 of the supporting body 11, thereby enabling the chip 400 to be carried relatively flat on the supporting surface 111.
[0062] Optionally, the wafer 400 may include a silicon carbide epitaxial wafer.
[0063] Optionally, the carrier device 1 provided in the embodiment of the utility model can be applicable to a silicon carbide epitaxial process.
[0064] Optionally, a preset expansion gap may be provided between the corresponding mating parts of the sheet taking component 13 and the accommodating structure 112 .
[0065] For example, an expansion gap may be provided between the first chip picking portion 132 and the first receiving groove 1122, and between the support portion 133 and the support receiving groove 1123. This design is because the first chip picking portion 132, the first receiving groove 1122, the support portion 133, and the support receiving groove 1123 may expand due to the high temperature heat of the semiconductor process. In order to prevent the first chip picking portion 132 and the first receiving groove 1122, and between the support portion 133 and the support receiving groove 1123 from being damaged due to thermal expansion and pressurization, it can be designed that an expansion gap may be provided between the first chip picking portion 132 and the first receiving groove 1122, and between the support portion 133 and the support receiving groove 1123.
[0066] In summary, the carrier device 1 provided in the embodiment of the utility model can make wafer retrieval easier, thereby improving the efficiency of wafer retrieval and reducing the risk of damage to the carrier device 1 and the wafer 400 .
[0067] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.
Claims
1. A carrying device, characterized in that: The invention comprises a bearing body, a limiting ring body and a wafer taking component, wherein the bearing body has a bearing surface and is provided with a receiving structure which is concave relative to the bearing surface, the bearing surface has a bearing area and a wafer taking area, the bearing area is used to bear the wafer, the wafer taking area is located outside the bearing area, the receiving structure comprises a first receiving groove and a second receiving groove which are interconnected, the first receiving groove is located in the bearing area, and the second receiving groove is located in the wafer taking area; The film picking component includes a first film picking portion and a second film picking portion which are connected to each other, wherein the first film picking portion is accommodated in the first accommodating groove, and the second film picking portion is arranged corresponding to the second accommodating groove, and the limiting ring body is arranged in cooperation with the supporting body, and at least partially surrounds the supporting area and the film picking area.
2. The carrying device according to claim 1, characterized in that: The bottom of the second accommodating groove is recessed relative to the bottom of the first accommodating groove, and the second chip picking part has a preset gap with the bottom of the second accommodating groove in a natural state. The preset gap is used to provide space for the second chip picking part to move downward when the second chip picking part is subjected to a downward force, so as to drive the first chip picking part to move upward and pry up the chip through the downward movement of the second chip picking part.
3. The carrying device according to claim 2, characterized in that: The film-taking component also includes a supporting portion, and the accommodating structure also includes a supporting accommodating groove, which is arranged corresponding to the first accommodating groove and is recessed relative to the groove bottom of the first accommodating groove. The supporting portion is arranged at the bottom of the first film-taking portion and can be rotatably accommodated in the supporting accommodating groove.
4. The carrying device according to claim 1, characterized in that: At least a portion of the second sheet-taking portion is convex relative to the supporting surface.
5. The carrying device according to claim 4, characterized in that: The inner edge of the convex portion of the second wafer taking portion relative to the carrying surface has a matching flat edge, and the matching flat edge is used to be opposite to the positioning flat edge of the wafer edge.
6. The carrying device according to claim 3, characterized in that: The width of the supporting portion is greater than the width of the first sheet taking portion.
7. The carrying device according to claim 2, characterized in that: The bottom of the first receiving groove is inclined at a portion close to the second receiving groove, and in the direction from the side of the inclined surface close to the second receiving groove to the side away from the second receiving groove, the height of the inclined surface gradually increases relative to the bottom of the second receiving groove.
8. The carrying device according to claim 1, characterized in that: An end surface of the first sheet-taking portion away from the second sheet-taking portion is in the form of an arc surface.
9. The carrying device according to claim 1, characterized in that: The second sheet-taking portion has a first coating on one side facing away from the carrier body, and the first coating is capable of enabling the growth of semiconductor process products to grow densely; And / or, except for a surface of the second sheet-taking portion facing away from the supporting body, the material of the remaining portion of the sheet-taking component is the same as that of the supporting body.
10. The carrying device according to claim 1, characterized in that: The top surface of the first sheet taking portion is lower than the carrying surface, or the top surface of the first sheet taking portion is flush with the carrying surface.