Mechanical structure for supporting wafer

Abstract

The utility model discloses a mechanical structure for supporting a wafer, which comprises a device body, the device body comprises a base plate, a rotating device and a supporting and fixing device, the rotating device is arranged at the top of the base plate, and the supporting and fixing device is arranged at the top of the rotating device; the supporting and fixing device comprises an air suction disc and three adsorption heads, the three adsorption heads are annularly installed at the top of the air suction disc at equal intervals, the adsorption heads and the air suction disc are of a through structure, the adsorption heads are of a sucker-shaped structure, the air suction disc is of a circular structure, and the interior of the air suction disc is of a hollow structure. A pipeline connector is arranged on the side face of the air suction disc. According to the device, the wafer can be effectively supported and then adsorbed and fixed, so that the wafer is prevented from shifting and falling off during processing, and the wafer processing accuracy is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a mechanical structure for supporting a wafer. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, that is, a wafer. Domestic wafer production lines are mainly 8-inch and 12-inch.

[0003] Existing wafer processing has the following defects:

[0004] Existing wafer support equipment can only support the wafer, but cannot fix the wafer after supporting it, which leads to the risk of wafer displacement and falling, and also affects the accuracy of wafer processing. Therefore, a solution is needed. Utility Model Content

[0005] 1. Technical issues to be resolved

[0006] In view of the deficiencies in the prior art, the utility model provides a mechanical structure for supporting a wafer to solve the problems raised in the above background technology.

[0007] (II) Technical solution

[0008] To achieve the above objectives, the utility model is implemented through the following technical solutions: a mechanical structure for supporting wafers, including a device body, the device body including a base plate, a rotating device and a supporting and fixing device, the rotating device is installed on the top of the base plate, and the supporting and fixing device is installed on the top of the rotating device; the supporting and fixing device includes a suction disk and an adsorption head, and three adsorption heads are provided. The three adsorption heads are installed on the top of the suction disk in a ring-shaped and equidistant manner. The adsorption head and the suction disk are a through structure, the adsorption head is a suction cup-shaped structure, the suction disk is a circular structure and the interior is a hollow structure, and a pipe connector is provided on the side of the suction disk.

[0009] Preferably, the rotating device includes a rotating table, a rotating motor and a rotating column, the rotating table is in a circular structure, the rotating motor is fixed at the bottom of the rotating table, the rotating column is installed at the top driving end of the rotating motor, and the rotating column is located at the top of the rotating table, and a welding plate is provided on the top of the rotating column, and the welding plate is in a circular structure.

[0010] Preferably, the base plate is of a circular structure, and two groups of electric telescopic rods distributed in a circular and equidistant manner are provided on the top of the base plate, and the top driving ends of the two groups of electric telescopic rods are respectively connected to the bottom of the rotating platform.

[0011] Preferably, a connecting side ring is provided on the outer side of the bottom of the base plate, the connecting side ring and the base plate have a smooth transition and are welded as one piece, the connecting side ring is a circular ring structure, and a plurality of groups of fixing holes distributed in a circular and equidistant manner are opened on the surface of the connecting side ring.

[0012] (III) Beneficial effects

[0013] The utility model provides a mechanical structure for supporting a wafer, which has the following beneficial effects:

[0014] This type of supporting mechanical structure can effectively support the wafer and then adsorb and fix it, thereby preventing the wafer from shifting or falling during processing, greatly improving the accuracy of wafer processing. The device is also equipped with a rotating device that can rotate the fixed wafer, further facilitating the processing work of the staff. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the structure of the supporting and fixing device of the utility model;

[0017] Figure 3 It is a structural schematic diagram of the rotating device of the utility model.

[0018] In the figure, 1. device body; 2. base plate; 3. rotating device; 4. supporting and fixing device; 5. suction disk; 6. suction head; 7. pipe connecting head; 8. rotating table; 9. rotating motor; 10. rotating column; 11. welding plate; 12. electric telescopic rod; 13. connecting side ring; 14. fixing hole. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figure 1-3 , the embodiment of the utility model provides a technical solution: a mechanical structure for supporting a wafer, comprising a device body 1, the device body 1 comprising a base plate 2, a rotating device 3 and a supporting and fixing device 4, the rotating device 3 is mounted on the top of the base plate 2, and the supporting and fixing device 4 is mounted on the top of the rotating device 3;

[0021] The problem is solved. The supporting and fixing device 4 includes a suction disk 5 and a suction head 6. There are three suction heads 6. The three suction heads 6 are installed on the top of the suction disk 5 in a ring-shaped and equidistant manner. The suction head 6 and the suction disk 5 are a through structure. The suction head 6 is a suction cup-shaped structure. The suction disk 5 is a circular structure with a hollow structure inside. A pipe connector 7 is provided on the side of the suction disk 5. The staff puts the wafer into the top of the three suction heads 6, and the top of the three suction heads 6 can be attached to the wafer. Then the pipe connector 7 on the side of the suction disk 5 is connected to the vacuum pump pipe, and then the vacuum pump is used to evacuate air. Finally, the suction head 6 adsorbs and fixes the bottom of the wafer.

[0022] Furthermore, the rotating device 3 includes a rotating table 8, a rotating motor 9 and a rotating column 10. The rotating table 8 is a circular structure. The rotating motor 9 is fixed at the bottom of the rotating table 8. The rotating column 10 is installed at the top driving end of the rotating motor 9, and the rotating column 10 is located at the top of the rotating table 8. A welding plate 11 is provided on the top of the rotating column 10. The welding plate 11 is a circular structure. When the wafer is rotated and adjusted, the staff can start the rotating motor 9, and the driving end of the rotating motor 9 drives the rotating column 10 to rotate. Further, the rotating column 10 can drive the wafer fixed above to rotate.

[0023] Specifically, the base plate 2 has a circular structure, and two groups of electric telescopic rods 12 are arranged on the top of the base plate 2 in a circular and equidistant manner. The top driving ends of the two groups of electric telescopic rods 12 are respectively connected to the bottom of the rotating table 8. When adjusting the height of the wafer, the staff starts the electric telescopic rod 12 on the base plate 2, and the electric telescopic rod 12 is lifted or lowered upward, thereby further raising or lowering the height of the fixed wafer.

[0024] Differently, a connecting side ring 13 is provided on the outer side of the bottom of the base plate 2. The connecting side ring 13 and the base plate 2 have a smooth transition and are welded as one piece. The connecting side ring 13 is a circular ring structure, and a plurality of fixing holes 14 distributed in a circular and equidistant manner are provided on the surface of the connecting side ring 13. When fixing the base plate 2, the staff fits the connecting side ring 13 of the base plate 2 to the installation point, and the staff inserts screws into the fixing holes 14 of the connecting side ring 13 to further fix the bottom of the base plate 2.

[0025] Working principle: During operation, the staff puts the wafer on the top of the three adsorption heads 6, and the top of the three adsorption heads 6 can be attached to the wafer, and then the pipe connector 7 on the side of the suction plate 5 is connected to the vacuum pump pipe, and then the vacuum pump is used to evacuate air, and finally the adsorption head 6 adsorbs and fixes the bottom of the wafer. When the wafer is rotated and adjusted, the staff can start the rotating motor 9, and the driving end of the rotating motor 9 drives the rotating column 10 to rotate, and the rotating column 10 can further drive the wafer fixed above to rotate. When adjusting the height of the wafer, the staff starts the electric telescopic rod 12 on the base plate 2, and the electric telescopic rod 12 is lifted or lowered upward, so as to further increase or lower the height of the fixed wafer.

[0026] The utility model comprises 1. device body; 2. base plate; 3. rotating device; 4. supporting and fixing device; 5. suction disk; 6. adsorption head; 7. pipe connecting head; 8. rotating table; 9. rotating motor; 10. rotating column; 11. welding plate; 12. electric telescopic rod; 13. connecting side ring; 14. fixing hole. All the components are universal standard parts or components known to technical personnel in this field, and their structures and principles can be known to technical personnel in this field through technical manuals or through conventional experimental methods. The utility model solves the problem that the existing wafer plus support equipment can only support the wafer, but cannot fix the wafer after supporting it, which leads to the risk of wafer displacement and falling, and also affects the accuracy of wafer processing. The utility model can effectively support the wafer and then adsorb and fix it through the combination of the above-mentioned components, thereby preventing the wafer from shifting and falling during processing, and greatly improving the accuracy of wafer processing.

[0027] The above shows and describes the basic principles and main features of the utility model and the advantages of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is limited by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims. Any figure mark in the claims should not be regarded as limiting the claims involved.

[0028] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A mechanical structure for supporting a wafer, characterized in that: The device comprises a device body (1), wherein the device body (1) comprises a base plate (2), a rotating device (3) and a supporting and fixing device (4), wherein the rotating device (3) is mounted on the top of the base plate (2), and the supporting and fixing device (4) is mounted on the top of the rotating device (3); The supporting and fixing device (4) comprises an air suction disc (5) and an adsorption head (6), wherein three adsorption heads (6) are provided, and the three adsorption heads (6) are installed in a circular and equidistant manner on the top of the air suction disc (5), the adsorption head (6) and the air suction disc (5) are of a through structure, the adsorption head (6) is a suction disc-shaped structure, the air suction disc (5) is of a circular structure and has a hollow structure inside, and a pipe connector (7) is provided on the side of the air suction disc (5).

2. A mechanical structure for supporting a wafer according to claim 1, characterized in that: The rotating device (3) comprises a rotating platform (8), a rotating motor (9) and a rotating column (10); the rotating platform (8) is of a circular structure; the rotating motor (9) is fixed at the bottom of the rotating platform (8); the rotating column (10) is installed at the top driving end of the rotating motor (9); and the rotating column (10) is located at the top of the rotating platform (8); a welding piece (11) is provided at the top of the rotating column (10); and the welding piece (11) is of a circular structure.

3. A mechanical structure for supporting a wafer according to claim 2, characterized in that: The base plate (2) has a circular structure, and two groups of electric telescopic rods (12) are arranged on the top of the base plate (2) and are distributed in a circular and equidistant manner. The top driving ends of the two groups of electric telescopic rods (12) are respectively connected to the bottom of the rotating platform (8).

4. The mechanical structure for supporting a wafer according to claim 1, characterized in that: A connecting side ring (13) is provided on the outer side of the bottom of the base plate (2); the connecting side ring (13) and the base plate (2) are smoothly transitioned and integrally welded; the connecting side ring (13) is in a circular ring structure; and a plurality of groups of fixing holes (14) are provided on the surface of the connecting side ring (13) and are distributed in an annular manner at equal intervals.

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