Hyper-spectrum millimeter wave antenna

Abstract

The utility model discloses a hyper-spectrum millimeter wave antenna which comprises a heat dissipation element, the bottom end of the heat dissipation element is fixedly connected with a magnetic element placing plate, the lower end of the magnetic element placing plate is fixedly connected with an acceleration processor, and the lower end of the acceleration processor is fixedly provided with a Lienji modem. A fixed connecting column is fixedly connected among the heat dissipation element, the magnetic element placement plate, the acceleration processor and the modem; and the outer end protection ring is of a metal tin structure, side end heat dissipation holes are formed in the outer end of the outer end protection ring, and the outer end protection ring is fixedly connected to the outer end of the machine body. The outer end protection rings are arranged among the elements, so that the elements form a whole, and the protection of the inner side structure of the millimeter wave antenna is realized. The unit heat dissipation holes and the side end heat dissipation holes are formed in the top end of the millimeter wave antenna and the side end of the outer end protection ring, so that heat generated by operation of the hyper-spectrum millimeter wave antenna is dissipated.

Description

Technical Field

[0001] The utility model relates to the technical field of millimeter wave antenna improvement, in particular to a hyper-spectrum millimeter wave antenna. Background Art

[0002] Millimeter waves have a wide frequency band, high tracking accuracy, high velocity measurement accuracy, good low-altitude tracking performance, and are sensitive to details of target shapes. Millimeter waves are widely used in communications, radar, remote sensing, and radio astronomy. In order to transmit millimeter waves, a millimeter wave antenna is required.

[0003] A general millimeter wave antenna realizes the transmission of millimeter waves by combining magnetic elements, an acceleration processor and a modem, but the frequency spectrum of the millimeter wave antenna generated by this structure is low. When the millimeter wave is overclocked, a large amount of heat is generated inside the millimeter wave antenna, which is easy to damage the device itself. A Chinese patent discloses a millimeter wave antenna with an application number of "CN202210927939.7", including: a parasitic coupling component, the parasitic coupling component includes a first conductive layer, a first dielectric layer and a second conductive layer; the first dielectric layer has a first surface and a second surface relative to each other, the first conductive layer is arranged on the first surface, and the second conductive layer is arranged on the second surface; a third conductive layer, the third conductive layer is located on the side of the second conductive layer away from the first dielectric layer. The first conductive layer, the first dielectric layer and the second conductive layer of the millimeter wave antenna of the present application form a parasitic coupling component coupled with the third conductive layer, the first conductive layer and the second conductive layer are respectively located on the two surfaces of the first dielectric layer, which can expand the resonant bandwidth of the parasitic coupling component itself, and arranging the outermost conductive ring on the other side can reduce the coupling without affecting the coupling between the parasitic coupling component and the third conductive layer. However, this structure does not solve the problem of heat dissipation for overclocking millimeter wave antennas. Utility Model Content

[0004] The purpose of the utility model is to solve at least one of the technical problems existing in the prior art and provide a hyperspectral millimeter wave antenna. By arranging an outer end protection ring between various components, the various components are integrated to achieve protection of the inner structure of the millimeter wave antenna. By arranging unit heat dissipation holes and side heat dissipation holes at the top of the millimeter wave antenna and the side end of the outer end protection ring, the heat generated by the operation of the hyperspectral millimeter wave antenna is dissipated.

[0005] The utility model also provides an ultra-spectrum millimeter wave antenna as described above, including: a heat dissipation element, wherein the bottom end of the heat dissipation element is fixedly connected to a magnetic element placement plate, the lower end of the magnetic element placement plate is fixedly connected to an acceleration processor, the lower end of the acceleration processor is fixed with a modem, and a fixed connection column is fixedly connected between the heat dissipation element, the magnetic element placement plate, the acceleration processor and the modem; an outer end protection ring, wherein the outer end protection ring is a metal tin structure, the outer end of the outer end protection ring is provided with a side end heat dissipation hole, and the outer end protection ring is fixedly connected to the outer end of the body. By providing an outer end protection ring between various components, the various components form a whole, thereby realizing protection of the inner structure of the millimeter wave antenna. By providing unit heat dissipation holes and side end heat dissipation holes at the top of the millimeter wave antenna and the side end of the outer end protection ring, the heat generated by the operation of the ultra-spectrum millimeter wave antenna is dissipated.

[0006] According to the hyperspectral millimeter wave antenna of the utility model, the number of the heat dissipation elements is four, and the heat dissipation elements are provided with unit heat dissipation holes inside to achieve heat dissipation of the upper end of the millimeter wave antenna structure.

[0007] According to the hyperspectral millimeter wave antenna of the utility model, bonding strips are bonded between the heat dissipation elements, and the heat dissipation elements are copper structures. The whole heat dissipation elements are combined.

[0008] According to the hyperspectral millimeter wave antenna of the utility model, the magnetic element placement board is provided with an interface inside, and the magnetic element placement boards are bonded with bonding tapes to place and fix each magnetic element.

[0009] According to the hyperspectral millimeter wave antenna of the utility model, the upper end of the interface of the magnetic element placement board is connected to a unit transmission line, and the middle section of the unit transmission line is connected to a unit magnetic element. The millimeter wave antenna is transmitted.

[0010] According to the hyperspectral millimeter wave antenna of the utility model, the middle section of the acceleration processor is connected to a processing main core, and the side end of the processing main core is connected to a processing sub-core. The frequency of the overall component is adjusted.

[0011] According to the hyperspectral millimeter wave antenna of the utility model, a deserializer is connected between the acceleration processor and the modem, and the modem is connected to a corresponding device to convert various signals into analog signals.

[0012] According to the hyper-spectrum millimeter wave antenna described in the utility model, the modem is adapted to the hyper-spectrum millimeter wave.

[0013] Beneficial Effects

[0014] 1. Compared with the prior art, this hyperspectral millimeter wave antenna provides an outer end protection ring between various components so that the various components form a whole, thereby protecting the inner structure of the millimeter wave antenna.

[0015] 2. Compared with the prior art, this hyper-spectrum millimeter wave antenna dissipates the heat generated by the operation of the hyper-spectrum millimeter wave antenna by setting unit heat dissipation holes and side heat dissipation holes at the top of the millimeter wave antenna and the side end of the outer end protection ring. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The utility model is further described below in conjunction with the accompanying drawings and embodiments;

[0017] Figure 1 A structural diagram assembled for the utility model;

[0018] Figure 2 for Figure 1 The enlarged structural diagram at A in the middle;

[0019] Figure 3 It is a structural diagram of the entire utility model.

[0020] Legend:

[0021] 1. Heat dissipation element; 2. Unit heat dissipation hole; 3. Adhesive connection belt; 4. External end protection ring; 5. Side heat dissipation hole; 6. Magnetic element placement board; 7. Acceleration processor; 8. Modem; 9. Fixed connection column; 10. Unit transmission line; 11. Unit magnetic element; 12. Processing main core; 13. Processing sub-core; 14. Deserializer. DETAILED DESCRIPTION

[0022] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.

[0023] refer to Figure 1-3The hyperspectral millimeter wave antenna of this embodiment includes: a heat dissipation element 1, which performs heat dissipation work on the upper end of the millimeter wave antenna. The bottom end of the heat dissipation element 1 is fixedly connected to a magnetic element placement plate 6 to place various magnetic elements. The lower end of the magnetic element placement plate 6 is fixedly connected to an acceleration processor 7 to adjust the operating frequency of the element. A modem 8 is fixed to the lower end of the acceleration processor 7, and a fixed connection column 9 is fixedly connected between the heat dissipation element 1, the magnetic element placement plate 6, the acceleration processor 7 and the modem 8; the number of heat dissipation elements 1 is four, and a unit heat dissipation hole 2 is arranged inside the heat dissipation element 1. Improve the heat dissipation capacity of the entire element. An adhesive connection belt 3 is bonded between the heat dissipation elements 1 to combine the heat dissipation elements 1. The heat dissipation element 1 is a copper structure. An interface is arranged inside the magnetic element placement plate 6, and an adhesive connection belt 3 is bonded between the magnetic element placement plates 6. The upper end of the interface of the magnetic element placement plate 6 is connected to a unit transmission line 10, and the middle section of the unit transmission line 10 is connected to a unit magnetic element 11. Processing of millimeter waves is achieved. The middle section of the acceleration processor 7 is connected to a main processing core 12, and the side end of the main processing core 12 is connected to a sub-processing core 13. A deserializer 14 is connected between the acceleration processor 7 and the modem 8, and the modem 8 is connected to a corresponding device. The modem 8 is adapted to the hyperspectral millimeter wave.

[0024] The outer end protection ring 4 is used to protect the outer ends of the gaps between the components. The outer end protection ring 4 is a metal tin structure, and the outer end of the outer end protection ring 4 is provided with a side end heat dissipation hole 5 to dissipate heat from the side ends of the entire component to improve the heat dissipation effect. The outer end protection ring 4 is fixedly connected to the outer end of the body.

[0025] Working principle: When using the device, an outer end protection ring 4 is installed at the outer end of the millimeter wave antenna element, and a side end heat dissipation hole 5 is provided at the side end of the outer end protection ring 4 to transfer the heat inside the element to the outside of the element.

[0026] The millimeter wave antenna is then connected to the millimeter wave transmitting device to complete the millimeter wave transmission.

[0027] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A hyperspectral millimeter wave antenna, characterized in that: include: A heat dissipation element (1), wherein the bottom end of the heat dissipation element (1) is fixedly connected to a magnetic element placement plate (6), the lower end of the magnetic element placement plate (6) is fixedly connected to an acceleration processor (7), the lower end of the acceleration processor (7) is fixedly connected to a modem (8), and a fixed connection column (9) is fixedly connected between the heat dissipation element (1), the magnetic element placement plate (6), the acceleration processor (7) and the modem (8); An outer end protection ring (4), the outer end protection ring (4) is a metal tin structure, the outer end of the outer end protection ring (4) is provided with a side end heat dissipation hole (5), and the outer end protection ring (4) is fixedly connected to the outer end of the body.

2. The hyperspectral millimeter wave antenna according to claim 1, characterized in that: The number of the heat dissipation elements (1) is four, and a unit heat dissipation hole (2) is arranged inside the heat dissipation element (1).

3. The hyperspectral millimeter wave antenna according to claim 2, characterized in that: An adhesive connection tape (3) is bonded between the heat dissipation elements (1), and the heat dissipation elements (1) are of a copper structure.

4. The hyperspectral millimeter wave antenna according to claim 1, characterized in that: An interface is provided inside the magnetic element placement plate (6), and adhesive connection strips (3) are bonded between the magnetic element placement plates (6).

5. The hyperspectral millimeter wave antenna according to claim 4, characterized in that: The upper end of the interface of the magnetic element placement plate (6) is connected to a unit transmission line (10), and the middle section of the unit transmission line (10) is connected to a unit magnetic element (11).

6. The hyperspectral millimeter wave antenna according to claim 1, characterized in that: The middle section of the acceleration processor (7) is connected to a main processing core (12), and the side end of the main processing core (12) is connected to a sub-processing core (13).

7. The hyperspectral millimeter wave antenna according to claim 1, characterized in that: A deserializer (14) is connected between the acceleration processor (7) and the modem (8), and the modem (8) is connected to a corresponding device.

8. The hyperspectral millimeter wave antenna according to claim 1, characterized in that: The modem (8) is adapted to hyperspectral millimeter waves.

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