Electric displacement point changing device for temperature control crystal

Abstract

The utility model relates to the technical field of laser equipment, in particular to a temperature control crystal electric displacement point changing device which comprises an X-axis displacement table and a Z-axis displacement table which are both of high-precision lead screw sliding table structures driven by a motor, the X-axis displacement table is horizontally arranged, the platform face of the X-axis displacement table is kept horizontal, the Z-axis displacement table is installed on the platform face of the X-axis displacement table, and the Z-axis displacement table is installed on the platform face of the Z-axis displacement table. The platform surface of the Z-axis displacement table is vertically placed, a heat sink assembly is installed on the platform surface of the Z-axis displacement table, a through hole is formed in the heat sink assembly, and the axis direction of the through hole is parallel to the platform surface of the Z-axis displacement table; according to the scheme, the precise X-axis displacement table and the Z-axis displacement table are spliced, so that the heat sink assembly with the through hole can perform high-precision displacement in two directions, meanwhile, crystal displacement in the through hole is precisely controlled to be in butt joint with point locations of light rays, the structure is simple, a heat insulation plate structure is designed to block heat dissipation, temperature control is more stable, and the heat dissipation efficiency is improved. And the damage of heat dissipation to high-precision equipment can be avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of laser equipment, in particular to a temperature-controlled crystal electric displacement point-changing device. Background Art

[0002] The optical crystal (hereinafter referred to as the crystal) is the core optical device inside the laser. The laser spot has high energy and the energy is focused on one point. Inside the laser, if the high-energy spot irradiates the same point of the crystal for a long time, it will damage the crystal and cause poor light output. The crystal needs to be replaced to solve this problem.

[0003] In order to reduce the number of crystal replacements, extend the service life of optical crystals, save maintenance costs, and improve user experience, there are several common practices: manual pull-rod crystal point change. When the laser has been working for a certain period of time, the crystal position is manually adjusted by pushing the railing so that the light spot can illuminate different parts of the crystal. The disadvantage of this method is that the manual adjustment is not precise and the deviation is large. The push-pull rod moves in a straight line, and the light spot can only be switched at points on the straight line, and other areas on the crystal cannot be used;

[0004] Motor-driven crystal point changing uses a stepper motor to drive the crystal movement to achieve the purpose of switching the light spot irradiation point. This method can ensure that the crystal movement position is more precise and the deviation is smaller, but the current equipment has many parts and a complex structure. Utility Model Content

[0005] Based on the above description, the utility model provides a temperature-controlled crystal electric displacement point-changing device to solve the deficiencies of the prior art and proposes a displacement point-changing device with a simple structure.

[0006] The technical solution of the utility model to solve the above technical problems is as follows:

[0007] A temperature-controlled crystal electric displacement point changing device, comprising:

[0008] X-axis translation stage;

[0009] A Z-axis translation stage, slidably connected above the X-axis translation stage;

[0010] A heat sink assembly is connected to the Z-axis displacement stage and has a through hole formed along the Y-axis direction;

[0011] A crystal, inserted into the through hole;

[0012] The heating plate is connected to the heat sink assembly.

[0013] On the basis of the above technical solution, the present invention can also be improved as follows.

[0014] Furthermore, a heat insulation board is connected to the Z-axis translation platform, the heat insulation board is an L-shaped structure, and the heat sink assembly is placed on the heat insulation board.

[0015] Furthermore, the heat insulation plate includes a seat plate and a bottom plate. The seat plate is vertically fixedly connected to the table top of the Z-axis translation table. The bottom plate is arranged at the bottom of the seat plate and remains horizontally fixedly connected to the seat plate. A fixing plate is arranged on the bottom plate, and the fixing plate forms a slot for clamping the heat sink assembly.

[0016] Furthermore, a horizontally arranged top plate is connected to the top of the seat plate, a side plate is connected between the edges of the top plate and the bottom plate, and a notch is provided on the side plate for the transistor line to project out.

[0017] Furthermore, the heat sink assembly includes a heat sink upper cover and a heat sink base, and the heat sink upper cover and the heat sink base together form a through hole.

[0018] Furthermore, the heat sink upper cover and the heat sink base are both L-shaped structures, and are spliced ​​in a mirror-symmetrical manner to form a through hole.

[0019] Furthermore, an indium foil layer wrapping the crystal is arranged on the inner wall of the through hole.

[0020] Furthermore, a screw hole with a depth reaching the inside of the heat sink base is opened on the top surface of the heat sink upper cover, a screw is threadedly connected to the screw hole, a spring is sleeved on the screw, and the spring applies an upward elastic force to the screw.

[0021] Compared with the prior art, the technical solution of this application has the following beneficial technical effects:

[0022] This solution connects a precise X-axis translation stage and a Z-axis translation stage, so that the heat sink assembly with a through hole can be displaced with high precision in two directions, while precisely controlling the displacement of the crystal in the through hole to align the point of the light, and has a simple structure. In some embodiments, a heat insulation board structure is designed to block the dissipation of heat, which not only makes the temperature control more stable, but also avoids damage to high-precision equipment caused by heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of the structure of a temperature-controlled crystal electric displacement point-changing device provided in an embodiment of the utility model;

[0024] Figure 2 for Figure 1 A structural diagram from another perspective;

[0025] Figure 3 for Figure 2 A partial enlarged schematic diagram of the middle A area;

[0026] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0027] 1. X-axis translation stage; 2. Z-axis translation stage; 3. Crystal; 4. Heating plate; 5. Heat sink cover; 6. Heat sink base; 7. Seat plate; 8. Bottom plate; 9. Fixing plate; 10. Top plate; 11. Side plate; 12. Screws; 13. Spring. DETAILED DESCRIPTION

[0028] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0030] It will be appreciated that spatial relationship terms such as "under," "beneath," "below," "under," "above," "above," etc., may be used herein to describe the relationship of an element or feature shown in the figures to other elements or features. It will be appreciated that, in addition to the orientations shown in the figures, spatial relationship terms also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is flipped, an element or feature described as "under other elements" or "under it" or "under it" will be oriented as being "above" the other elements or features. Thus, the exemplary terms "under" and "under" may include both upper and lower orientations. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.

[0031] It should be noted that when an element is considered to be "connected" to another element, it can be directly connected to the other element, or connected to the other element through an intermediate element. The "connection" in the following embodiments should be understood as "electrical connection", "communication connection", etc. if the connected circuits, modules, units, etc. have electrical signals or data transmission between each other.

[0032] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" etc. specify the presence of stated features, wholes, steps, operations, components, parts or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts or combinations thereof.

[0033] like Figure 1-3 The electric displacement point changing device of a temperature-controlled crystal 3 shown in the figure comprises an X-axis displacement stage 1 and a Z-axis displacement stage 2, both of which are high-precision screw slide structures driven by motors. The X-axis displacement stage 1 is placed horizontally, and its platform surface is kept horizontal. The Z-axis displacement stage 2 is installed on its platform surface, and the platform surface of the Z-axis displacement stage 2 is placed vertically. A heat sink component is installed on the platform surface of the Z-axis displacement stage 2, and a through hole is opened on the heat sink component. The axial direction of the through hole is parallel to the platform surface of the Z-axis displacement stage 2, that is, the movement of the X-axis displacement stage 1 and the Z-axis displacement stage 2 simultaneously drives the axial direction of the through hole to move along the X-axis and Z-axis directions.

[0034] A crystal 3 is inserted into the through hole of the heat sink assembly. In order to improve the temperature control effect of the heat sink assembly, an indium foil layer wrapping the crystal 3 is provided on the inner wall of the through hole. Due to the good ductility of indium, most of the gap between the crystal 3 and the heat sink is filled, thereby increasing the contact area between the crystal 3 and the heat sink and improving the heat conduction effect. In the light-emitting operation, the crystal 3 needs to be kept at a certain temperature, so a heating plate 4 with temperature control is attached to the heat sink assembly.

[0035] The temperature of the heat sink assembly will directly affect the X-axis translation stage 1 and the Z-axis translation stage 2. Since the X-axis translation stage 1 and the Z-axis translation stage 2 are precision components, and components such as motors cannot withstand high temperatures, this solution connects a heat insulation board to the Z-axis translation stage 2. The heat insulation board is an L-shaped structure, and the heat sink assembly is placed on the heat insulation board. The two sides of the L-shaped heat insulation board are parallel to the X-axis and the Z-axis, respectively, to isolate the heat from being transferred to the X-axis translation stage 1 and the Z-axis translation stage 2. Specifically, the heat insulation board includes a seat plate 7 and a bottom plate 8. The seat plate 7 is vertically fixedly connected to the platform surface of the Z-axis translation stage 2 (fixed by bolts), and the bottom plate 8 is arranged at the bottom of the seat plate 7 and is kept horizontally connected to the seat plate 7 as a whole.

[0036] A fixing plate 9 is arranged on the bottom plate 8, and the fixing plates 9 are arranged on both sides of the bottom plate 8. A slot for accommodating the fixing plates 9 is formed between the fixing plates 9 on both sides. The heat sink assembly is fixed by inserting the heat sink assembly into the slot from the end face of the bottom plate 8. The heat sink assembly includes a heat sink cover 5 and a heat sink base 6. The heat sink cover 5 and the heat sink base 6 form a through hole together. Specifically, the heat sink cover 5 and the heat sink base 6 are both L-shaped structures, and the through hole is formed by mirror-symmetrical splicing. A screw hole with a depth reaching the inside of the heat sink base 6 is opened on the top surface of the heat sink cover 5. A screw 12 is connected to the inner thread of the screw hole. A spring 13 is sleeved on the screw 12, and the spring 13 applies an upward elastic force to the screw 12. The spring 13 maintains the elastic force in order to make the heat sink cover 5 and the heat sink base 6 fit tightly. At the same time, the tight fit can squeeze the metal indium foil layer, so that the gap between the crystal 3 and the heat sink assembly is as small as possible to improve the heat conduction efficiency. The heating plate 4 is connected to the heat sink upper cover 5 and the heat sink base 6 respectively, and conducts heat with both to improve efficiency.

[0037] Preferably, the top of the seat plate 7 is connected to a horizontally arranged top plate 10, and a side plate 11 is connected between the top plate 10 and the edge of the bottom plate 8, and a notch is provided on the side plate 11 for the emission of the crystal 3 pipeline. The side plate 11 is used to further isolate the damage caused by the heat dissipation of the side to the X-axis translation stage 1 and the Z-axis translation stage 2. The bottom plate 8, the top plate 10, the side plate 11 and the seat plate 7 form a box body with an opening on the platform surface of the Z-axis translation stage 2. The box body can effectively block the heat dissipation, thereby causing damage to the external precision structure X-axis translation stage 1 and the Z-axis translation stage 2. At the same time, the heat dissipation is slower, which is more conducive to temperature control and makes the light emission more stable.

[0038] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A temperature-controlled crystal electric displacement point changing device, characterized in that: include: X-axis translation stage; A Z-axis translation stage, slidably connected above the X-axis translation stage; A heat sink assembly is connected to the Z-axis displacement stage and has a through hole formed along the Y-axis direction; A crystal is inserted into the through hole; The heating plate is connected to the heat sink assembly.

2. A temperature-controlled crystal electric displacement point changing device according to claim 1, characterized in that: The Z-axis translation stage is connected with a heat insulation board, the heat insulation board is an L-shaped structure, and the heat sink assembly is placed on the heat insulation board.

3. A temperature-controlled crystal electric displacement point changing device according to claim 2, characterized in that: The heat insulation plate includes a seat plate and a bottom plate. The seat plate is vertically fixedly connected to the table top of the Z-axis translation stage. The bottom plate is arranged at the bottom of the seat plate and is horizontally fixedly connected to the seat plate. A fixing plate is arranged on the bottom plate, and the fixing plate forms a slot for clamping the heat sink assembly.

4. A temperature-controlled crystal electric displacement point changing device according to claim 3, characterized in that: The top of the seat plate is connected to a top plate arranged horizontally, a side plate is connected between the edge lines of the top plate and the bottom plate, and a notch is provided on the side plate for the transistor line to project out.

5. The temperature-controlled crystal electric displacement point changing device according to claim 1, characterized in that: The heat sink assembly comprises a heat sink upper cover and a heat sink base, and the heat sink upper cover and the heat sink base together form a through hole.

6. A temperature-controlled crystal electric displacement point changing device according to claim 5, characterized in that: The heat sink upper cover and the heat sink base are both L-shaped structures, and are spliced ​​in mirror symmetry to form a through hole.

7. The temperature-controlled crystal electric displacement point changing device according to claim 1, characterized in that: An indium foil layer wrapping the crystal is arranged on the inner wall of the through hole.

8. The temperature-controlled crystal electric displacement point changing device according to claim 5, characterized in that: A screw hole with a depth reaching the inside of the heat sink base is opened on the top surface of the heat sink upper cover, a screw is threadedly connected to the screw hole, a spring is sleeved on the screw, and the spring applies an upward elastic force to the screw.

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