Modularized heat flow plate for high-power component

Abstract

The utility model provides a modularized heat flow plate for a high-power component, which belongs to the technical field of electronic cooling and comprises a plate body, a channel is arranged in the plate body in a penetrating manner, an embedded block is arranged at the side part of the plate body, a through hole communicated with the channel is formed in the embedded block in a penetrating manner, a groove is formed in the plate body in a penetrating manner relative to the embedded block, and a connecting cylinder is arranged in the groove. The connecting cylinder is provided with a connecting groove in a penetrating mode, the connecting groove can allow the embedded block to be embedded in, the connecting groove is communicated with the channel, the at least two inserting blocks are oppositely arranged on the side portion of the plate body along the embedded block, the inserting blocks are provided with first magnets, the side, opposite to the inserting blocks, of the plate body is provided with inserting grooves in a penetrating mode, the inserting blocks can be inserted into the inserting grooves, and second magnets attracted with the first magnets are arranged in the inserting grooves. According to the heat flow plate, the embedded blocks and the connecting cylinders are arranged, and the embedded blocks and the inserting blocks are correspondingly inserted into the connecting grooves and the inserting grooves respectively, so that splicing between the two plate bodies is achieved, the channels are communicated with the through holes, rapid installation between the two plate bodies is conveniently achieved, and the installation efficiency of the heat flow plate is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic cooling, in particular to a modular heat flux plate for high-power components. Background Art

[0002] In electronic devices, especially those high-power components such as chips and processors, a lot of heat will be generated during operation. If this heat is not dissipated in time, the temperature of the device will rise, affecting performance and even damaging the device. Therefore, heat dissipation has become an important consideration in electronic design. The heat transfer methods of components mainly include conduction, convection and radiation. In traditional heat dissipation solutions, air cooling is a common heat dissipation method, but its heat flux density is limited and may not be effective for high-power components. In addition, as electronic products develop towards miniaturization and integration, the power of components is getting higher and higher, while the heat dissipation space is getting smaller and smaller, which puts higher requirements on heat dissipation technology.

[0003] In order to address the above problems, people have produced modular heat flow plates, which are usually composed of multiple small-sized heat dissipation units and can be flexibly combined according to different heat dissipation requirements. Each heat dissipation unit can be independently disassembled and replaced. This design facilitates maintenance and upgrades. The main material of the heat flow plate is usually made of copper or aluminum-based composite materials with high thermal conductivity to improve heat transfer efficiency. It is designed with a microchannel structure inside, which uses a microfluidic circulation system and uses water or other coolants as cooling media to improve heat exchange efficiency.

[0004] However, when existing modular heat flux plates are spliced, the internal microchannel connection process is relatively complicated, resulting in low installation efficiency of the heat flux plates. Therefore, the utility model provides a modular heat flux plate for high-power components to meet the needs. Utility Model Content

[0005] The purpose of the utility model is to solve the problems existing in the above-mentioned background technology and to propose a modular heat flux plate for high-power components.

[0006] The technical problem to be solved by the utility model is to provide a modular heat flow plate for high-power components to solve the problem that the microchannel connection process inside the existing modular heat flow plate is relatively complicated during splicing, resulting in low installation efficiency of the heat flow plate.

[0007] In order to solve the above technical problems, the utility model provides the following technical solutions:

[0008] A modular heat flux plate for high power components, comprising:

[0009] A plate body, wherein a channel is penetrated inside, an embedded block is provided on the side of the plate body, and a through hole communicating with the channel is penetrated through the embedded block, and a groove is penetrated through the plate body relative to the embedded block, and a connecting cylinder is provided in the groove, and a connecting groove is penetrated on the connecting cylinder for the embedded block to be embedded, and the connecting groove is communicated with the channel;

[0010] At least two plug-in blocks are arranged along the embedded block on the side of the plate body, and a magnet is provided on the plug-in block. A slot for inserting the plug-in block is provided on one side of the plate body opposite to the plug-in block, and a magnet is provided in the slot for attracting the magnet.

[0011] Preferably, the embedding block comprises an embedding end and a connecting end which are arranged in a stepped manner, the embedding end is fitted with the connecting groove, and the embedding end is fitted with an interface between the connecting groove and the channel.

[0012] Preferably, a sealing gasket 1 is fixedly connected in the connecting groove and fits with the connecting end.

[0013] Preferably, a sealing mechanism is provided in the plate body along the groove to seal the interface between the embedded block and the connecting groove, and the sealing mechanism includes:

[0014] A movable rod, which is movably arranged in the plate body;

[0015] A wedge block is fixedly connected to the first end of the movable rod, an end of the wedge block facing away from the movable rod abuts against the insert block, and the wedge block is movably connected to the plate body;

[0016] A clamping plate is fixedly connected to the second end of the movable rod, the clamping plate is located in the groove, and the clamping plate has an arc-shaped end surface that fits with the interface between the embedded block and the connecting groove.

[0017] Preferably, the width of the magnet 1 is smaller than the width of the insert block.

[0018] Preferably, a movable plate is sleeved on the movable rod, a movable groove for the movable plate to move is provided in the plate body, a spring is provided in the movable groove, and the spring is sleeved on the movable rod.

[0019] Preferably, the movable rod is a square structure, and one end of the clamping plate away from the movable rod is fixedly connected with a second sealing gasket.

[0020] Compared with the prior art, the utility model has at least the following beneficial effects:

[0021] In the above scheme, by providing an embedded block and a connecting tube, and by inserting the embedded block and the plug block into the corresponding connecting groove and the slot respectively, the splicing between the two plates is achieved and the channel and the through hole are connected, which facilitates the rapid installation between the two plates and improves the installation efficiency of the heat flux plate.

[0022] In the above scheme, by providing a sealing mechanism, when the inserting block is inserted into the slot, the sealing mechanism is driven to clamp the interface between the connecting groove and the embedding block, thereby improving the sealing performance of the two. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings, which are incorporated herein and constitute a part of the specification, illustrate embodiments of the present disclosure and, together with the description, further serve to explain the principles of the present disclosure and to enable those skilled in the relevant art to make and use the present disclosure.

[0024] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0025] Figure 2 For this utility model Figure 1 A schematic diagram of the enlarged structure at A in the middle;

[0026] Figure 3 It is a schematic diagram of the structure of two plates of the utility model when they are spliced ​​together;

[0027] Figure 4 It is a partial structural schematic diagram of the sealing gasket 2, the movable rod and the clamping plate of the utility model.

[0028] [reference numerals]

[0029] 1. Plate body; 2. Channel; 3. Insert block; 4. Magnet 1; 5. Magnet 2; 6. Slot; 7. Embedded block; 71. Embedded end; 72. Connecting end; 8. Connecting tube; 9. Sealing mechanism; 91. Clamping plate; 92. Movable rod; 93. Wedge block; 10. Through hole; 11. Connecting groove; 12. Groove; 13. Sealing gasket 1; 14. Spring; 15. Movable plate; 16. Movable groove; 17. Sealing gasket 2. DETAILED DESCRIPTION

[0030] like Figures 1 to 4As shown, an embodiment of the utility model provides a modular heat flux plate for high-power components, including a plate body 1, a channel 2 is penetrated inside the plate body 1, an embedded block 7 is provided on the side of the plate body 1, the embedded block 7 is penetrated by a through hole 10 connected with the channel 2, a groove 12 is penetrated by the plate body 1 relative to the embedded block 7, a connecting cylinder 8 is provided in the groove 12, a connecting groove 11 is penetrated on the connecting cylinder 8 for the embedded block 7 to be embedded, the connecting groove 11 is connected with the channel 2, at least two plug-in blocks 3 are arranged on the side of the plate body 1 along the embedded block 7, a magnet 1 4 is provided on the plug-in block 3, a slot 6 for the plug-in block 3 to be inserted is penetrated on the side of the plate body 1 relative to the plug-in block 3, and a magnet 2 5 attracted to the magnet 1 4 is provided in the slot 6.

[0031] Specifically, the embedding block 7 can be embedded in the connecting groove 11 so that the through hole 10 and the channel 2 are connected, and the setting of the magnet 1 4 and the magnet 2 5 is used to fix the insert block 3 in the slot 6, thereby realizing the splicing between the two plate bodies 1 and connecting the channel 2 and the through hole 10, facilitating the rapid installation of the two plate bodies 1, improving the installation efficiency of the heat flow plate, and solving the problem that the connection process of the microchannel 2 inside the existing modular heat flow plate is relatively complicated when splicing, resulting in low installation efficiency of the heat flow plate.

[0032] like Figure 1 and Figure 3 As shown, in this embodiment, the embedding block 7 includes an embedding end 71 and a connecting end 72 arranged in a stepped manner, the embedding end 71 is in contact with the connecting groove 11 , and the embedding end 71 is in contact with the interface between the connecting groove 11 and the channel 2 .

[0033] like Figure 2 As shown, in this embodiment, a sealing gasket 13 is fixedly connected in the connecting groove 11 and is in contact with the connecting end 72 .

[0034] like Figure 1 and Figure 2As shown, in this embodiment, a sealing mechanism 9 is provided along the groove 12 in the plate body 1 to seal the interface between the embedded block 7 and the connecting groove 11. The sealing mechanism 9 includes a movable rod 92, which is movably arranged in the plate body 1, a wedge block 93, which is fixedly connected to the first end of the movable rod 92, and the end of the wedge block 93 away from the movable rod 92 is in contact with the insert block 3, and the wedge block 93 is movably connected to the plate body 1, and a clamping plate 91, which is fixedly connected to the second end of the movable rod 92, and the clamping plate 91 is located in the groove 12, and the clamping plate 91 has an interface with the embedded block 7 and the connecting groove 11 The movable rod 92 is provided with a movable plate 15, and a movable groove 16 for the movable plate 15 to move is provided in the plate body 1. A spring 14 is provided in the movable groove 16, and the spring 14 is sleeved on the movable rod 92. Specifically, the movable rod 92 is a square structure. When the plug block 3 is inserted into the slot 6, the plug block 3 pushes the wedge block 93 to mobilize the movable rod 92 to move, so that the movable rod 92 drives the clamping plate 91 to clamp the interface between the connecting groove 11 and the embedded block 7, thereby improving the sealing of the two.

[0035] like Figure 4 As shown, in this embodiment, one end of the clamping plate 91 away from the movable rod 92 is fixedly connected with a sealing gasket 17.

[0036] Working principle:

[0037] When the plate bodies 1 are spliced, the two plate bodies 1 are placed horizontally, and the embedded block 7 and the plug block 3 of one of the plate bodies 1 correspond to the groove 12 and the slot 6 of the other plate body 1, and then the two plate bodies 1 are spliced ​​together, so that the plug block 3 drives the magnet 1 4 and the magnet 2 5 to attract each other, and at the same time, the connecting end 72 of the embedded block 7 fits with the connecting groove 11 of the connecting tube 8, and the embedded end 71 is connected with the channel 2. At this time, the connection between the two plate bodies 1 is realized, and the communication between the channel 2 and the through hole 10 is realized, and at the same time, When the insert block 3 is inserted into the slot 6, it will push the wedge block 93 to move, so that the wedge block 93 drives the movable rod 92 to move, and the movable rod 92 drives the clamping plate 91 to clamp the interface between the embedded block 7 and the connecting groove 11, thereby improving the sealing performance of the interface between the embedded block 7 and the connecting groove 11. The overall installation steps are simple, which facilitates the rapid installation between the two plate bodies 1, improves the installation efficiency of the heat flow plate, and solves the problem that the existing modular heat flow plate has a relatively complicated internal microchannel connection process when splicing, resulting in low installation efficiency of the heat flow plate.

Claims

1. A modular heat flux plate for high power components, characterized in that: include: A plate body (1) is provided with a channel (2) therein, an embedded block (7) is provided on the side of the plate body (1), the embedded block (7) is provided with a through hole (10) communicating with the channel (2), the plate body (1) is provided with a groove (12) relative to the embedded block (7), a connecting cylinder (8) is provided in the groove (12), the connecting cylinder (8) is provided with a connecting groove (11) for the embedded block (7) to be embedded, and the connecting groove (11) is communicated with the channel (2); At least two insert blocks (3) are arranged along the embedded block (7) on the side of the plate body (1) opposite to each other, and a magnet (4) is provided on the insert block (3). A slot (6) for inserting the insert block (3) is provided through one side of the plate body (1) opposite to the insert block (3), and a magnet (5) for attracting the magnet (4) is provided in the slot (6).

2. The modular heat flux plate for high power components according to claim 1, characterized in that: The embedding block (7) comprises an embedding end (71) and a connecting end (72) arranged in a stepped manner, the embedding end (71) being in contact with the connecting groove (11), and the embedding end (71) being in contact with the interface between the connecting groove (11) and the channel (2).

3. The modular heat flux plate for high power components according to claim 2, characterized in that: A sealing gasket (13) is fixedly connected in the connection groove (11) and is in contact with the connection end (72).

4. The modular heat flux plate for high power components according to claim 1, characterized in that: A sealing mechanism (9) is provided along the groove (12) in the plate body (1) to seal the interface between the embedded block (7) and the connecting groove (11), and the sealing mechanism (9) comprises: A movable rod (92) movably disposed in the plate body (1); a wedge block (93) fixedly connected to the first end of the movable rod (92), the end of the wedge block (93) away from the movable rod (92) abutting against the insert block (3), and the wedge block (93) is movably connected to the plate body (1); A clamping plate (91) is fixedly connected to the second end of the movable rod (92), the clamping plate (91) is located in the groove (12), and the clamping plate (91) has an arc-shaped end surface that fits the interface between the embedded block (7) and the connecting groove (11).

5. The modular heat flux plate for high power components according to claim 4, characterized in that: The width of the magnet 1 (4) is smaller than the width of the insert block (3).

6. The modular heat flux plate for high power components according to claim 4, characterized in that: A movable plate (15) is sleeved on the movable rod (92), a movable groove (16) for the movable plate (15) to move is provided in the plate body (1), a spring (14) is provided in the movable groove (16), and the spring (14) is sleeved on the movable rod (92).

7. The modular heat flux plate for high power components according to claim 4, characterized in that: The movable rod (92) is a square structure, and one end of the clamping plate (91) away from the movable rod (92) is fixedly connected to a second sealing pad (17).

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