Metal oxide semiconductor (MOS) transistor pin bending jig

Abstract

The utility model discloses a metal oxide semiconductor (MOS) transistor pin bending jig which comprises a base body, a machining table is fixedly installed on the top of the base body, a plurality of limiting grooves are formed in the top of the machining table at intervals in the length direction of the machining table, the limiting grooves are used for embedded installation of MOS transistors, and the front end and the rear end of each limiting groove are open. Limiting columns are arranged at the front end of the limiting groove at intervals, so that pin grooves allowing the MOS tube pins to penetrate through are formed between the adjacent limiting columns and between the limiting columns and the inner wall of the limiting groove correspondingly, and limiting blocks are elastically connected to the two opposite side walls located at the rear end of the limiting groove correspondingly. The left end and the right end of the top of the machining table are each provided with a fixing frame, and a pressing plate is slidably connected between the two fixing frames. According to the MOS transistor pin bending jig, the MOS transistor can be rapidly limited and fixed, the position precision of the MOS transistor is greatly improved, the bending machining effect is improved, and the MOS transistor pin bending jig is simple in structure and convenient to operate.

Description

Technical Field

[0001] The utility model relates to the technical field of MOS tube pin bending, in particular to a MOS transistor pin bending jig. Background Art

[0002] MOS tube is one of the important control elements in microelectronic circuits. MOS tube is a metal-oxide-semiconductor field effect transistor, or metal-insulator-semiconductor. The most common FET uses a thin layer of silicon dioxide as an insulator under the GATE pole. This transistor is called a metal oxide semiconductor (MOS) transistor, or a metal oxide semiconductor field effect transistor (MOSFET). Because MOS tubes are smaller and more power-saving, they have replaced bipolar transistors in many applications. In actual use, the three sets of pins of the MOS tube need to be bent. The traditional method is manual bending, but the accuracy of manual bending is difficult to grasp.

[0003] After searching, the Chinese patent publication number CN217647358U discloses a motor controller MOS transistor pin bending jig, including a base, a support plate is arranged on the left side of the upper end face of the base, a plurality of protrusions are integrally connected to the left end face of the support plate, a mounting block is fixedly welded on the front side of the support plate, the mounting block is fixedly connected to the base by a locking bolt, and a fixture seat is arranged on the right side of the upper end face of the base. When bending, the device places the MOS tube body inside the card slot, the pin in the middle of the MOS tube body will contact the protrusion, the card slot clamps and positions the MOS tube body, and the first positioning block and the second positioning block reposition the MOS tube body, thereby facilitating the production of the MOS tube body after the pin is bent.

[0004] In the prior art, during the pin bending process of the MOS tube, the MOS tube is simply placed in the groove and the MOS tube is limited by the groove, but the MOS tube is not fixed. As a result, during the pin bending process, the force on the pin may easily cause the position of the MOS tube as a whole to shift or warp, thereby affecting the bending effect. Utility Model Content

[0005] The utility model aims to provide a MOS transistor pin bending jig, which can realize rapid limiting and fixing of the MOS tube, greatly improves the position accuracy of the MOS tube, avoids the deviation of the MOS tube during the pin bending process, improves the bending processing effect, and has a simple structure and convenient operation.

[0006] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a MOS transistor pin bending fixture, comprising: a seat body, a processing table is fixedly installed on the top of the seat body, and a plurality of limit grooves are arranged at intervals along the length direction of the processing table at the top of the processing table, and the limit grooves are used for embedding and installing the MOS tube;

[0007] The front and rear ends of the limiting groove are both opened, and a limiting column is arranged at intervals at the front end of the limiting groove, so that a pin groove for the MOS tube pin to pass through is formed between adjacent limiting columns and between the limiting column and the inner wall of the limiting groove;

[0008] A limit block is elastically connected to the two opposite side walls at the rear end of the limit groove, and a fixed frame is respectively installed on the left and right ends of the top of the processing table, and a pressing plate is slidably connected between the two fixed frames to make the limit block press-fit and connect with the MOS tube.

[0009] The further improved scheme in the above technical scheme is as follows:

[0010] 1. In the above scheme, a slide groove is provided on the rear end side wall of the limiting groove and in the vertical direction, and the limiting block can slide up and down along the slide groove.

[0011] 2. In the above solution, a spring is provided between the limit block and the inner wall of the slide groove.

[0012] 3. In the above solution, when the limit block is at the uppermost end of the slide slot, the spring is in a compressed state.

[0013] 4. In the above solution, a first inclined surface is provided on both sides of the top of the limit block, and a second inclined surface matching the first inclined surface is provided at the end of the pressing plate.

[0014] Due to the application of the above technical solution, the utility model has the following advantages compared with the prior art:

[0015] The utility model discloses a MOS transistor pin bending jig, wherein both the front and rear ends of a limiting groove are openly arranged, and a limiting column is arranged at intervals at the front end of the limiting groove, so that a pin groove for the MOS tube pin to pass through is formed between adjacent limiting columns and between the limiting column and the inner wall of the limiting groove, and a limiting block is elastically connected to two opposite side walls at the rear end of the limiting groove, and a fixing frame is respectively installed at the left and right ends of the top of the processing table, and a pressing plate is slidably connected between the two fixing frames, and the MOS tube is placed inside the limiting groove, the pin of the MOS tube is placed in the pin groove at the front end of the limiting groove, and the limiting block is arranged at the rear end of the limiting groove, and the limiting block is pressed with the MOS tube by the pressing plate, so that the MOS tube can be quickly limited and fixed, the position accuracy of the MOS tube is greatly improved, the deviation of the MOS tube during the pin bending process is avoided, the bending processing effect is improved, and the structure is simple and the operation is convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Attached Figure 1 This is a schematic diagram of the structure of the MOS transistor pin bending fixture of the utility model;

[0017] Attached Figure 2 The local structure of the MOS transistor pin bending fixture of the utility model is shown in FIG. Figure 1 ;

[0018] Attached Figure 3 The local structure of the MOS transistor pin bending fixture of the utility model is shown in FIG. Figure 2 ;

[0019] Attached Figure 4 It is a partial structural cross-sectional view of the MOS transistor pin bending fixture of the utility model;

[0020] Attached Figure 5 For the utility model Figure 4 Enlarged view of point A.

[0021] In the above figures: 1, seat body; 2, processing table; 3, limit groove; 4, limit column; 5, pin groove; 6, limit block; 7, fixing frame; 8, pressing plate; 9, first inclined surface; 10, second inclined surface; 11, elastic block; 12, spring; 13, slide groove. DETAILED DESCRIPTION

[0022] The present invention can be further understood through the specific embodiments given below, but they are not intended to limit the present invention.

[0023] Embodiment 1: A MOS transistor pin bending jig comprises: a base body 1, a processing table 2 is fixedly mounted on the top of the base body 1, a plurality of limiting grooves 3 are arranged at intervals on the top of the processing table 2 and along the length direction thereof, and the limiting grooves 3 are used for embedding and installing the MOS tube;

[0024] The front and rear ends of the limiting groove 3 are both opened, and a limiting column 4 is arranged at intervals at the front end of the limiting groove 3, so that a pin groove 5 for the MOS tube pin to pass through is formed between adjacent limiting columns 4 and between the limiting columns 4 and the inner wall of the limiting groove 3;

[0025] The MOS tube is placed in the limiting groove of the processing table, and the pins of the MOS tube are embedded in the pin grooves between the limiting pillars, thereby realizing the initial fixation of the MOS tube;

[0026] A limit block 6 is elastically connected to the two opposite side walls at the rear end of the limit groove 3, and a fixing frame 7 is respectively installed at the left and right ends of the top of the processing table 2, and a pressing plate 8 is slidably connected between the two fixing frames 7, so that the limit block 6 is pressed and connected with the MOS tube;

[0027] The pressing plate is passed through the two fixing frames. During the movement of the pressing plate, the second inclined surface at the end of the pressing plate contacts the first inclined surface of the limit block, so that the compression spring of the limit block moves downward in the slide groove until the bottom of the limit block is tightly fitted with the surface of the MOS tube, thereby further fixing the MOS tube.

[0028] A slide groove 13 is provided on the rear end side wall of the limit groove 3 in the vertical direction, and the limit block 6 can slide up and down along the slide groove 13; a spring 12 is provided between the limit block 6 and the inner wall of the slide groove 13; when the limit block 6 is at the uppermost end of the slide groove 13, the spring 12 is in a compressed state.

[0029] After the MOS tube is processed and formed, the pressing plate is pulled out, and the compressed spring is reset to drive the limit block to move upward, so that the processed MOS tube can be taken out.

[0030] A first inclined surface 9 is disposed on both sides of the top of the limiting block 6 , and a second inclined surface 10 matching the first inclined surface 9 is disposed at the end of the pressing plate 8 .

[0031] Embodiment 2: A MOS transistor pin bending jig comprises: a base body 1, a processing table 2 is fixedly mounted on the top of the base body 1, a plurality of limiting grooves 3 are arranged at intervals on the top of the processing table 2 and along the length direction thereof, and the limiting grooves 3 are used for embedding and installing the MOS tube;

[0032] The front and rear ends of the limiting groove 3 are both opened, and a limiting column 4 is arranged at intervals at the front end of the limiting groove 3, so that a pin groove 5 for the MOS tube pin to pass through is formed between adjacent limiting columns 4 and between the limiting columns 4 and the inner wall of the limiting groove 3;

[0033] A limit block 6 is elastically connected to the two opposite side walls at the rear end of the limit groove 3, and a fixing frame 7 is respectively installed at the left and right ends of the top of the processing table 2, and a pressing plate 8 is slidably connected between the two fixing frames 7, so that the limit block 6 is pressed and connected with the MOS tube;

[0034] By placing the MOS tube inside the limiting groove, the pin of the MOS tube is placed in the pin groove at the front end of the limiting groove, and a limiting block is arranged at the rear end of the limiting groove, the limiting block and the MOS tube are pressed together by a pressing plate, so that the MOS tube can be quickly limited and fixed, which greatly improves the position accuracy of the MOS tube, avoids the deviation of the MOS tube during the pin bending process, improves the bending processing effect, and has a simple structure and convenient operation.

[0035] A slide groove 13 is provided on the rear end side wall of the limit groove 3 in the vertical direction, and the limit block 6 can slide up and down along the slide groove 13; a spring 12 is provided between the limit block 6 and the inner wall of the slide groove 13; when the limit block 6 is at the uppermost end of the slide groove 13, the spring 12 is in a compressed state.

[0036] A first inclined surface 9 is disposed on both sides of the top of the limiting block 6 , and a second inclined surface 10 matching the first inclined surface 9 is disposed at the end of the pressing plate 8 .

[0037] The top and bottom of the inner wall of the fixing frame 7 are both provided with an elastic block 11; the elastic block 11 is a rubber block. The elastic blocks are provided on the upper and lower inner walls of the fixing frame, so that the pressing plate has space to move up and down in the fixing frame, thereby preventing the MOS tube from being damaged by excessive pressure from the limit block.

[0038] The working principle is:

[0039] When in use, the MOS tube is placed in the limiting groove of the processing table, and the pins of the MOS tube are embedded in the pin grooves between the limiting columns, so as to realize the initial fixation of the MOS tube. The pressing plate is passed through the two fixing frames. During the movement of the pressing plate, the second inclined surface of the end of the pressing plate contacts the first inclined surface of the limiting block, so that the compression spring of the limiting block moves downward in the slide groove until the bottom of the limiting block is tightly fitted with the surface of the MOS tube, so as to realize further fixation of the MOS tube. Elastic blocks are arranged on the upper and lower inner walls of the fixing frame, so that the pressing plate has space for upward and downward movement in the fixing frame, thereby preventing the MOS tube from being crushed by excessive pressure of the limiting block. After the MOS tube is processed and formed, the pressing plate is pulled out, and the compressed spring is reset to drive the limiting block to move upward, so that the processed MOS tube can be taken out.

[0040] When the above-mentioned MOS transistor pin bending jig is used, the MOS tube is placed inside the limiting groove, the pin of the MOS tube is placed in the pin groove at the front end of the limiting groove, and a limiting block is arranged at the rear end of the limiting groove. The limiting block and the MOS tube are pressed together by a pressing plate, so that the MOS tube can be quickly limited and fixed, which greatly improves the position accuracy of the MOS tube, avoids the deviation of the MOS tube during the pin bending process, improves the bending processing effect, and has a simple structure and convenient operation.

[0041] The above embodiments are only for illustrating the technical concept and features of the utility model, and their purpose is to enable people familiar with the technology to understand the content of the utility model and implement it accordingly, and they cannot be used to limit the protection scope of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. A MOS transistor pin bending jig, comprising: A base body (1), a processing table (2) is fixedly mounted on the top of the base body (1), a plurality of limit grooves (3) are arranged at intervals on the top of the processing table (2) and along its length direction, and the limit grooves (3) are used for embedding and installing the MOS tube; The invention is characterized in that the front and rear ends of the limiting groove (3) are both opened, and a limiting column (4) is arranged at intervals at the front end of the limiting groove (3), so that a pin groove (5) for the MOS tube pin to pass through is formed between adjacent limiting columns (4) and between the limiting columns (4) and the inner wall of the limiting groove (3); A limit block (6) is elastically connected to two opposite side walls at the rear end of the limit groove (3), and a fixing frame (7) is respectively installed at the left and right ends of the top of the processing table (2), and a pressing plate (8) is slidably connected between the two fixing frames (7) so that the limit block (6) is pressed and connected to the MOS tube.

2. The MOS transistor pin bending jig according to claim 1, characterized in that: A slide groove (13) is provided on the rear end side wall of the limiting groove (3) in the vertical direction, and the limiting block (6) can slide up and down along the slide groove (13).

3. The MOS transistor pin bending jig according to claim 2, characterized in that: A spring (12) is provided between the limit block (6) and the inner wall of the slide groove (13).

4. The MOS transistor pin bending jig according to claim 3, characterized in that: When the limit block (6) is at the uppermost end of the slide groove (13), the spring (12) is in a compressed state.

5. The MOS transistor pin bending jig according to claim 1, characterized in that: A first inclined surface (9) is provided on both sides of the top of the limit block (6), and a second inclined surface (10) cooperating with the first inclined surface (9) is provided at the end of the pressing plate (8).

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