GaN diode regular collection device
By designing a GaN diode regular collection device including a base, a raised plate, a movable rod, a slider and a baffle, the problem of extrusion deformation and inconvenience in the stacking of diodes is solved, and the stable and regular collection of diodes is achieved.
Patent Information
- Application Number
- CN202421400880.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-19
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2034-06-19
AI Technical Summary
Existing GaN diodes are easily squeezed when stacked together, causing deformation at both ends and inconvenient access.
A GaN diode regular collection device is designed, including a base, a vertical plate, a placement table, a movable rod, a slider and a baffle. The placement groove is opened through the grip pull mechanism to facilitate the removal and alignment of the diode.
It effectively avoids extrusion deformation of GaN diodes during stacking, and simplifies the diode access and regularization process.
Smart Images
Figure CN222539290U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of diode regular collection devices, in particular to a GaN diode regular collection device. Background Art
[0002] GaN diode is a RF diode made of gallium nitride material. GaN material has excellent carrier mobility and saturation drift velocity characteristics, which enables gallium nitride RF diodes to provide excellent performance in high-frequency and high-power applications. Such diodes are widely used in wireless communications, radar systems, microwave communications, and aerospace electronics. They can be used in RF circuits such as amplification, mixing, detection, and modulation. Compared with traditional silicon or gallium arsenide materials, gallium nitride RF diodes have higher operating frequency and power density capabilities, and can provide higher gain and lower distortion.
[0003] With respect to the existing related technologies, the inventors believe that the following defects exist: in the prior art, GaN diodes are generally stacked together, which can easily cause squeezing, resulting in deformation of both ends of the GaN diodes, and it is inconvenient to take out the GaN diodes when they are stacked together. Utility Model Content
[0004] In order to solve the technical problems that the existing GaN diodes are squeezed when stacked together, resulting in deformation of both ends of the GaN diodes and inconvenience in taking out the GaN diodes when stacked together, the utility model provides a GaN diode regular collection device.
[0005] The utility model is implemented by the following technical scheme: a GaN diode regular collection device, including a base and a diode body, the top of the base is fixedly connected to two vertical plates, the tops of the two vertical plates are fixedly connected to a placement table, the bottoms of the two placement tables are movably connected to two movable rods, one end of the two movable rods is fixedly connected to a connecting rod, the connecting rod is located at one end of the placement table, one side of the connecting rod is fixedly connected to a handle, the top of the movable rod is fixedly connected to a plurality of slides, the slides are movably connected to the inside of the placement table, the top of the slide is fixedly connected to a baffle, the baffle is movably connected to the top of the placement table, the top of the placement table is processed with a plurality of placement grooves, and the baffle is located at the top of the placement grooves.
[0006] Preferably, a plurality of support columns are fixedly connected to the top of the base, the middle of the diode body is located on the top of the support columns, and both ends of the diode body are located inside the placement groove.
[0007] Preferably, the bottom of the placing table is fixedly connected to two limit blocks, and the movable rod is movably connected between the two limit blocks.
[0008] Preferably, a plurality of limiting grooves are processed inside the placing table, and the slide plate is movably connected inside the limiting grooves.
[0009] Preferably, one end of the movable rod is fixedly connected to a movable block, the top of the movable block is movably connected to the bottom of the placing table, a fixed block is provided on one side of the movable block, the top of the fixed block is fixedly connected to the bottom of the placing table, and a return spring is provided between the movable block and the fixed block.
[0010] Preferably, one end of the return spring is fixedly connected to one side of the movable block, and the other end of the return spring is fixedly connected to one side of the fixed block.
[0011] Compared with the prior art, the beneficial effects of the utility model are:
[0012] When the utility model is in use, the handle is pulled outward, the handle will drive the connecting rod to move, the connecting rod will drive two movable rods to move, the two movable rods will drive multiple slides to move inside the limiting groove, the multiple slides will drive multiple baffles to move away from the top of the placement groove, thereby facilitating the removal of the diode body, and by placing the two ends of the diode body inside the placement groove, the diodes can be easily collected in an orderly manner.
[0013] When the utility model is in use, a reset spring is provided, after the handle is pulled to open the placement slot, when the handle is released, the reset spring will be reset and contracted, and one end of the reset spring will drive the movable block, the movable rod, the slide plate and the baffle plate to move and reset, so that the baffle plate closes the top of the placement slot, thereby limiting the two ends of the diode body from being separated from the interior of the placement slot. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0015] Figure 2 It is a cross-sectional view of the placement table of the utility model;
[0016] Figure 3 For the utility model Figure 2 Enlarged schematic diagram of part A in the middle.
[0017] In the figure: 1. base; 2. diode body; 3. vertical plate; 4. placement table; 5. support column; 6. handle; 7. connecting rod; 8. movable rod; 9. slide plate; 10. baffle; 11. placement slot; 12. limit slot; 13. limit block; 14. movable block; 15. reset spring; 16. fixed block. DETAILED DESCRIPTION
[0018] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.
[0019] Example 1: Please refer to Figure 1 - Figure 3 A GaN diode regular collection device of the present embodiment includes a base 1 and a diode body 2, the top of the base 1 is fixedly connected with two vertical plates 3, the tops of the two vertical plates 3 are fixedly connected with a placement table 4, the bottoms of the two placement tables 4 are movably connected with two movable rods 8, one end of the two movable rods 8 is fixedly connected with a connecting rod 7, the connecting rod 7 is located at one end of the placement table 4, one side of the connecting rod 7 is fixedly connected with a handle 6, the top of the movable rod 8 is fixedly connected with a plurality of slides 9, the slides 9 are movably connected to the inside of the placement table 4, the top of the slides 9 is fixedly connected with a baffle 10, the baffle 10 is movably connected to the top of the placement table 4, the top of the placement table 4 is processed with a plurality of placement grooves 11, and the baffle 10 is located at the top of the placement grooves 11;
[0020] When it is necessary to open the top of the placement groove 11 to take out the diode body 2, the handle 6 is pulled outward, the handle 6 will drive the connecting rod 7 to move, the connecting rod 7 will drive the two movable rods 8 to move, the two movable rods 8 will drive the multiple slides 9 to move inside the placement table 4, the multiple slides 9 will drive the multiple baffles 10 to move, so that the baffles 10 are separated from the top of the placement groove 11, thereby facilitating the removal of the diode body 2;
[0021] Secondly, by placing the two ends of the diode body 2 inside the placement groove 11, it is convenient to collect the diodes in an orderly manner;
[0022] Further, a plurality of support columns 5 are fixedly connected to the top of the base 1, the middle of the diode body 2 is located on the top of the support columns 5, and both ends of the diode body 2 are located inside the placement groove 11. By providing the support columns 5, the middle of the diode body 2 is placed on the top of the support columns 5, so that the support columns 5 will provide support for the diode body 2, so that the diode body 2 is placed more stably and deformation of the diode body 2 is avoided;
[0023] Furthermore, the bottom of the placement table 4 is fixedly connected to two limit blocks 13, and the movable rod 8 is movably connected between the two limit blocks 13. When the connecting rod 7 drives the movable rod 8 to move, the movable rod 8 will move along the inside of the limit blocks 13. By setting the limit blocks 13, the movable rod 8 is limited, so that the movable rod 8 can move stably at the bottom of the placement table 4.
[0024] Furthermore, a plurality of limit grooves 12 are processed inside the placing table 4, and the slide plate 9 is movably connected inside the limit groove 12. When the movable rod 8 drives the slide plate 9 to move, the slide plate 9 will move along the inside of the limit groove 12. By setting the limit groove 12, the movement of the slide plate 9 will be limited;
[0025] Further, one end of the movable rod 8 is fixedly connected to a movable block 14, the top of the movable block 14 is movably connected to the bottom of the placement table 4, a fixed block 16 is provided on one side of the movable block 14, one end of the movable block 14 is fixedly connected to a return spring 15, and one end of the return spring 15 is fixedly connected to one side of the fixed block 16;
[0026] One end of the movable rod 8 is fixedly connected to a movable block 14, the top of the movable block 14 is movably connected to the bottom of the placement table 4, a fixed block 16 is provided on one side of the movable block 14, the top of the fixed block 16 is fixedly connected to the bottom of the placement table 4, a return spring 15 is provided between the movable block 14 and the fixed block 16, one end of the return spring 15 is fixedly connected to one side of the movable block 14, and the other end of the return spring 15 is fixedly connected to one side of the fixed block 16;
[0027] Among them, when the connecting rod 7 drives the movable rod 8 to move, the movable rod 8 will drive the movable block 14 to move, and the movable block 14 will drive one end of the reset spring 15 to stretch. When the handle 6 is released, the reset spring 15 will reset and contract, and one end of the reset spring 15 will drive the movable block 14 to move. The movable block 14 will move the movable rod 8, and the movable rod 8 will drive the slide plate 9 to move. The slide plate 9 will drive the baffle 10 to move and reset, so that the baffle 10 is located above the placement groove 11, thereby limiting the two ends of the diode body 2 from escaping from the inside of the placement groove 11.
[0028] Working principle: by pulling the handle 6 outward, the handle 6 will drive the connecting rod 7 to move, the connecting rod 7 will drive the two movable rods 8 to move, the two movable rods 8 will drive multiple slides 9 to move inside the limiting groove 12, and the multiple slides 9 will drive the multiple baffles 10 to move away from the top of the placement groove 11, thereby facilitating the removal of the diode body 2, and placing the middle part of the diode body 2 on the top of the support column 5, so that the support column 5 will provide support for the diode body 2, making the placement of the diode body 2 more stable, and at the same time avoiding deformation of the diode body 2, by placing the two ends of the diode body 2 inside the placement groove 11, it is convenient to collect the diodes in an orderly manner.
[0029] The above-mentioned implementation modes are only preferred implementation modes of the present invention, and cannot be used to limit the protection scope of the present invention. Any non-substantial changes and substitutions made by technicians in this field on the basis of the present invention shall fall within the scope of protection required by the present invention.
Claims
1. A GaN diode regular collection device, comprising a base (1) and a diode body (2), characterized in that: The top of the base (1) is fixedly connected to two vertical plates (3), the tops of the two vertical plates (3) are fixedly connected to a placement table (4), the bottoms of the two placement tables (4) are movably connected to two movable rods (8), one end of the two movable rods (8) is fixedly connected to a connecting rod (7), the connecting rod (7) is located at one end of the placement table (4), one side of the connecting rod (7) is fixedly connected to a handle (6), the top of the movable rod (8) is fixedly connected to a plurality of slides (9), the slides (9) are movably connected to the inside of the placement table (4), the top of the slides (9) is fixedly connected to a baffle (10), the baffle (10) is movably connected to the top of the placement table (4), the top of the placement table (4) is processed with a plurality of placement grooves (11), and the baffle (10) is located at the top of the placement grooves (11).
2. A GaN diode regular collection device according to claim 1, characterized in that: A plurality of support columns (5) are fixedly connected to the top of the base (1), the middle of the diode body (2) is located on the top of the support columns (5), and both ends of the diode body (2) are located inside the placement groove (11).
3. A GaN diode regular collection device according to claim 1, characterized in that: The bottom of the placement table (4) is fixedly connected to two limit blocks (13), and the movable rod (8) is movably connected between the two limit blocks (13).
4. A GaN diode regular collection device according to claim 1, characterized in that: The placement table (4) is internally processed with a plurality of limiting grooves (12), and the slide plate (9) is movably connected inside the limiting grooves (12).
5. The GaN diode regular collection device according to claim 1, characterized in that: One end of the movable rod (8) is fixedly connected to a movable block (14), the top of the movable block (14) is movably connected to the bottom of the placement table (4), a fixed block (16) is provided on one side of the movable block (14), the top of the fixed block (16) is fixedly connected to the bottom of the placement table (4), and a return spring (15) is provided between the movable block (14) and the fixed block (16).
6. A GaN diode regular collection device according to claim 5, characterized in that: One end of the return spring (15) is fixedly connected to one side of the movable block (14) and the other end of the return spring (15) is fixedly connected to one side of the fixed block (16).