Bearing assembly and graphite boat
By using the designed bearing components, including graphite boat sheet, conductive part and stop part, in the POLY process, the problem of uneven electric field on the silicon wafer working surface is solved, and the uniform formation of the dielectric layer and the improvement of the quality of the battery cell is achieved.
Patent Information
- Application Number
- CN202420530250.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-19
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2034-03-19
AI Technical Summary
In the POLY process, due to the contact between the conductive part and the silicon wafer, the electric field of the silicon wafer is uneven, which affects the pinhole density and passivation effect of the dielectric layer, thereby reducing the quality of the battery.
A bearing assembly is designed, including a graphite boat sheet, a conductive part and a stop portion. The conductive part abuts on one side of the silicon wafer and is electrically connected to it. The stop portion and the graphite boat sheet are spaced to form a space to accommodate the silicon wafer and limit its displacement in the thickness direction, so that the electric field at the contact position of the working surface of the silicon wafer and the stop portion is more consistent with the remaining positions.
By making the formation of the dielectric layer on the silicon wafer more uniformly, the quality of the battery is improved.
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Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of battery production and manufacturing, in particular to a bearing component and a graphite boat. Background Art
[0002] The POLY (polycrystalline silicon) process is an important process in the production of solar cells. In the POLY process, a silicon wafer needs to be placed on a graphite boat sheet of a graphite boat, and the silicon wafer needs to be fixed to the surface of the graphite boat sheet through a conductive part, and at the same time, the conductive part and the silicon wafer are electrically conductive, and then a dielectric layer and a crystalline silicon layer are sequentially formed on one side of the silicon wafer along its own thickness direction (hereinafter referred to as the working surface) by plasma enhanced chemical vapor deposition (PECVD). However, since the conductive part needs to fix the silicon wafer, the conductive part and the working surface of the silicon wafer will have a certain contact area, and there is a strong electric field at the position where the working surface of the silicon wafer contacts the conductive part, resulting in a thicker dielectric layer formed at the position where the working surface of the silicon wafer contacts the conductive part relative to the rest of the working surface of the silicon wafer, which in turn results in a lower pinhole density of the dielectric layer at this position, affecting the passivation effect at this position, and ultimately affecting the quality of the produced solar cell. Utility Model Content
[0003] The embodiment of the utility model discloses a bearing assembly and a graphite boat, which can make the dielectric layer formed on the silicon wafer more uniform in the POLY process, thereby improving the quality of the battery sheet finally produced.
[0004] In order to achieve the above-mentioned object, in a first aspect, the utility model discloses a bearing assembly, wherein the bearing assembly is used to bear a silicon wafer, and the bearing assembly comprises:
[0005] A graphite boat having a first side along a thickness direction of the graphite boat;
[0006] a conductive portion, the conductive portion being disposed on the first side, the conductive portion being used to abut against one side of the silicon wafer along a first direction, and the conductive portion being electrically connected to the silicon wafer; and
[0007] A stopper, the stopper being disposed on the first side, and being spaced apart from the graphite boat sheet along the thickness direction to form a first space, the first space being used to accommodate at least a portion of the silicon wafer, the stopper being used to limit the displacement of the silicon wafer along the thickness direction, and the stopper being configured to be insulated from the silicon wafer;
[0008] Wherein, the first direction intersects with the thickness direction.
[0009] As an optional implementation manner, in an embodiment of the first aspect of the utility model, the stop portion and the conductive portion are arranged at intervals on the surface where the first side is located.
[0010] As an optional implementation, in an embodiment of the first aspect of the utility model, the stop portion includes a supporting portion and a stopping portion, the supporting portion is arranged on the first side, and the supporting portion and the conductive portion are spaced apart on the surface where the first side is located, the supporting portion is used to support one side of the silicon wafer along the first direction, and the stopping portion is arranged on the side of the supporting portion away from the graphite boat sheet, and along the thickness direction, the projection of the supporting portion on the first side is located within the projection of the stopping portion on the first side, and the first space is formed between the stopping portion and the first side; wherein, the supporting portion and the stopping portion are both made of insulating material.
[0011] As an optional implementation, in an embodiment of the first aspect of the utility model, a first mounting hole is provided on the first side, the conductive portion includes a first mounting portion and a contact portion, the first mounting portion is provided in the first mounting hole, the contact portion is connected to one side of the first mounting portion along the thickness direction, and the contact portion is used to abut against one side of the silicon wafer along the first direction to be electrically connected to the silicon wafer;
[0012] A second mounting hole is provided on the first side, and the second mounting holes are spaced apart on the surface where the first side is located. The stop portion also includes a second mounting part, and the second mounting part is provided in the second mounting hole. One end of the supporting part facing away from the stop part is connected to one side of the second mounting part along the thickness direction.
[0013] As an optional implementation, in an embodiment of the first aspect of the utility model, the graphite boat sheet further has a second side along its own thickness direction, the first mounting hole penetrates to the second side, the number of the contact portions is two, and the two contact portions are respectively connected to two sides of the first mounting portion along the thickness direction;
[0014] The second mounting hole passes through to the second side, and the number of the supporting parts and the stopper parts are both two. The two supporting parts are respectively connected to the two sides of the second mounting part along the thickness direction, and each stopper part is respectively connected to one side of each supporting part away from the graphite boat sheet.
[0015] As an optional implementation manner, in an embodiment of the first aspect of the utility model, the stopper portion is provided on a side of the conductive portion facing away from the graphite boat sheet.
[0016] As an optional implementation, in an embodiment of the first aspect of the present utility model, the stopper includes a stopper portion, the stopper portion is provided on a side of the conductive portion away from the graphite boat sheet, along the thickness direction, a projection of the conductive portion on the first side is located within a projection of the stopper portion on the first side, the first space is formed between the stopper portion and the first side, and the stopper portion is made of insulating material;
[0017] Alternatively, the stop portion includes a stop part and an isolation layer, the stop part is arranged on the side of the conductive part away from the graphite boat sheet, along the thickness direction, the projection of the conductive part on the first side is located within the projection of the stop part on the first side, the isolation layer is arranged on the side of the stop part facing the first side, the first space is formed between the isolation layer and the first side, and the isolation layer is made of insulating material.
[0018] As an optional embodiment, in an embodiment of the first aspect of the utility model, a first mounting hole is provided on the first side, the conductive part includes a first mounting portion and a contact portion, the first mounting portion is provided in the first mounting hole, the contact portion is connected to one side of the first mounting portion along the thickness direction, the contact portion is used to abut against one side of the silicon wafer along the first direction to be electrically connected to the silicon wafer, and the stop portion is provided on the side of the contact portion away from the graphite boat sheet.
[0019] As an optional embodiment, in an embodiment of the first aspect of the utility model, the graphite boat sheet also has a second side opposite to the first side along its own thickness direction, the first mounting hole passes through the second side, the number of the contact parts is two, and the two contact parts are respectively connected to the two sides of the first mounting part along the thickness direction, the number of the stop parts is two, and each of the stop parts is arranged at one end of each of the contact parts away from the graphite boat sheet.
[0020] In a second aspect, the utility model discloses a graphite boat, comprising a plurality of bearing assemblies as described in the first aspect, wherein the plurality of bearing assemblies are arranged at intervals along the thickness direction of the bearing assemblies.
[0021] Compared with the prior art, the beneficial effects of the present invention are:
[0022] The load-bearing assembly and graphite boat provided by the embodiment of the utility model are provided with a conductive part and a stopper, wherein the conductive part is used to abut against one side of the silicon wafer along the first direction and is electrically connected to the silicon wafer at the same time, so that the silicon wafer can be fixed relative to the graphite boat in the first direction and can meet the requirement of electrifying the silicon wafer in the POLY process, and the first space formed between the stopper and the graphite boat can accommodate the silicon wafer, thereby limiting the movement of the silicon wafer relative to the graphite boat in the thickness direction. Since the conductive part abuts against one side of the silicon wafer along the first direction, the movement of the silicon wafer in the thickness direction is limited by the stopper, and the stopper is configured to be insulated from the silicon wafer. In the POLY process, the electric field at the position where one side of the silicon wafer in the thickness direction contacts (or is adjacent to) the stopper is relatively consistent with the electric field at the other positions of the working surface of the silicon wafer, so that the dielectric layer formed on the silicon wafer is relatively uniform, thereby improving the quality of the battery cell finally produced. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0024] Figure 1 It is a structural schematic diagram of the carrier assembly (split type) and the silicon wafer disclosed in the first aspect of the embodiment of the present application;
[0025] Figure 2 yes Figure 1 A side view of a stopper portion of the load-bearing assembly;
[0026] Figure 3 yes Figure 1 A side view of the conductive portion of the load-bearing assembly;
[0027] Figure 4 yes Figure 1 A schematic diagram of the structure of the graphite boat sheet of the bearing assembly;
[0028] Figure 5 It is a structural schematic diagram of a carrier assembly (integrated) and a silicon wafer disclosed in the first aspect of the embodiment of the present application;
[0029] Figure 6 yes Figure 5 A side view of a conductive portion and a stopper portion of an example of a load-bearing assembly;
[0030] Figure 7 yes Figure 5 A side view of another example of a conductive portion and a stopper portion of a load-bearing assembly;
[0031] Figure 8 yes Figure 5 Schematic diagram of the structure of the graphite boat sheet of the load-bearing component.
[0032] Icons: 1. Carrying component; 10. Graphite boat; 100. First side; 101. First space; 102. First mounting hole; 103. Second mounting hole; 11. Conductive part; 110. First mounting part; 111. Contact part; 12. Stop part; 120. Supporting part; 121. Stop part; 1210. Inclined surface; 122. Second mounting part; 123. Isolation layer; 2. Graphite boat; 3. Silicon wafer; X, thickness direction. DETAILED DESCRIPTION
[0033] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0034] The technical solution of the utility model will be further described below in conjunction with embodiments and drawings.
[0035] See also Figure 1 The first aspect of the utility model embodiment provides a bearing assembly 1, the bearing assembly 1 is used to bear the silicon wafer 3, the bearing assembly 1 comprises a graphite boat 10, a conductive part 11 and a stopper 12, the graphite boat 10 has a thickness direction X (see Figure 2 ), the conductive portion 11 is disposed on the first side 100, the conductive portion 11 is used to abut against one side of the silicon wafer 3 along the first direction, and the conductive portion 11 is electrically connected to the silicon wafer 3, the stopper 12 is disposed on the first side 100, and along the thickness direction X, the stopper 12 is spaced apart from the graphite boat sheet 10 to form a first space 101 (see Figure 2 ), the first space 101 is used to accommodate at least part of the silicon wafer 3, the stopper 12 is used to limit the displacement of the silicon wafer 3 along the thickness direction X, and the stopper 12 is configured to be insulated from the silicon wafer 3, and the first direction intersects with the thickness direction X.
[0036] The graphite boat provided in the first aspect of the embodiment of the utility model is provided with a conductive part 11 and a stopper 12. The conductive part 11 is used to abut against one side of the silicon wafer 3 along the first direction and is electrically connected to the silicon wafer 3 at the same time. It can not only fix the silicon wafer 3 in the first direction relative to the graphite boat 10, but also meet the requirement of electrifying the silicon wafer 3 in the POLY process. The first space 101 formed between the stopper 12 and the graphite boat 10 can accommodate the silicon wafer 3, thereby limiting the movement of the silicon wafer 3 in the thickness direction X relative to the graphite boat 10. Since the conductive portion 11 is in contact with one side of the silicon wafer 3 along the first direction, the movement of the silicon wafer 3 in the thickness direction X is limited by the stop portion 12, and the stop portion 12 is configured to be insulated from the silicon wafer 3. In the POLY process, the electric field at the position where one side of the silicon wafer 3 in the thickness direction X (hereinafter referred to as the working surface) contacts (or is close to) the stop portion 12 is relatively consistent with the electric field at the other positions of the working surface of the silicon wafer 3, so that the dielectric layer formed on the silicon wafer 3 is relatively uniform, thereby improving the quality of the battery cell finally produced.
[0037] Optionally, the material of the conductive part 11 may be conductive materials such as graphite and carbon fiber, which may be selected according to actual conditions and is not specifically limited in this embodiment.
[0038] Since the silicon wafer 3 is usually a sheet-like structure, preferably, the first direction can be a direction perpendicular to the thickness direction X, so that when the conductive part 11 abuts against one side of the silicon wafer 3 along the first direction, the conductive part 11 and the working surface of the silicon wafer 3 have no facing surfaces, thereby further reducing the influence of the conductive part 11 on the electric field of the working surface of the silicon wafer 3.
[0039] Optionally, the stopper portion 12 and the conductive portion 11 may be disposed in a separate type or an integrated type, and these two types will be described below in conjunction with the drawings.
[0040] split type
[0041] See also Figure 1 In some embodiments, the stopper 12 and the conductive part 11 are disposed in a split manner, and the stopper 12 and the conductive part 11 are disposed at intervals on the surface where the first side 100 is located. Since the functions of the stopper 12 and the conductive part 11 are different (the conductive part 11 needs to satisfy the function of connecting electricity, while the stopper 12 needs to satisfy the function of insulating), by making the stopper 12 and the conductive part 11 in a split manner, the material selection of the stopper 12 and the conductive part 11 can be made more flexible, and the production process of the stopper 12 and the conductive part 11 is also relatively simple.
[0042] Optionally, the number of the stopper 12 and the conductive part 11 may be one or more, which may be selected according to actual conditions and is not specifically limited in this embodiment. The first direction refers to any direction intersecting with the thickness direction X, which may refer to one direction or multiple directions. When the number of the stopper 12 and the conductive part 11 is multiple, the multiple stopper 12 and the conductive part 11 are arranged at intervals on the surface where the first side 100 is located, and the multiple stopper 12 and the conductive part 11 may abut against different sides of the silicon wafer 3 in different first directions, so that the silicon wafer 3 is fixed relative to the graphite boat 10 in the plane direction of the first side 100. Preferably, the number of the stopper 12 and the conductive part 11 corresponds one to one, and the corresponding stopper 12 and the conductive part 11 are arranged adjacent to each other, so that the electric field distribution on the working surface of the silicon wafer 3 is more uniform, and the fixation of the silicon wafer 3 relative to the graphite boat 10 is more stable.
[0043] See also Figure 2 In some embodiments, the stopper 12 includes a supporting portion 120 and a stopping portion 121. The supporting portion 120 is disposed on the first side 100, and the supporting portion 120 and the conductive portion 11 are spaced apart on the surface of the first side 100. The supporting portion 120 is used to support one side of the silicon wafer 3 along the first direction, and the stopping portion 121 is disposed on the side of the supporting portion 120 away from the graphite boat sheet 10. Along the thickness direction X, the projection of the supporting portion 120 on the first side 100 is located within the projection of the stopping portion 121 on the first side 100, and a first space 101 is formed between the stopping portion 121 and the first side 100; wherein the supporting portion 120 and the stopping portion 121 are both made of insulating materials.
[0044] In this way, the supporting portion 120 and the conductive portion 11 will simultaneously abut against one side of the silicon wafer 3 along the first direction, and together play the role of fixing the silicon wafer 3 relative to the graphite boat 10 in the first direction, so that the silicon wafer 3 is more firmly fixed in the first direction of the first side 100. The projection of the supporting portion 120 on the first side 100 is located within the projection of the stop portion 121 on the first side 100, and the stop portion 121 will protrude from the supporting portion 120 in the first direction. A first space 101 will be formed between the portion of the stop portion 121 protruding from the supporting portion 120 and the graphite boat 10, thereby limiting the displacement of the silicon wafer 3 relative to the graphite boat 10 in the thickness direction X.
[0045] Optionally, the insulating material of the supporting part 120 and the stopper part 121 can be ceramic, insulating plastic, etc., which can be selected according to actual conditions and is not specifically limited in this embodiment. Preferably, the insulating material of the supporting part 120 and the stopper part 121 is ceramic, and the hardness of the ceramic material is relatively moderate, which can not only have good structural strength, but also have good support and stop effects on the silicon wafer 3, and can avoid damage to the graphite boat 10 and the silicon wafer 3 due to excessive hardness. At the same time, the ceramic material also has good surface smoothness, which can reduce the damage to the silicon wafer 3 when rubbing with the silicon wafer 3.
[0046] In this embodiment, the supporting portion 120 and the stopping portion 121 are columnar structures, and the diameter of the stopping portion 121 is greater than the diameter of the supporting portion 120 .
[0047] Since the thickness of the silicon wafer 3 and the interval between the stopper portion 121 and the graphite boat 10 (ie, the thickness of the first space 101) are both small, it is not convenient to put the silicon wafer 3 into the first space 101. Based on this, please refer to Figure 2 In some embodiments, the stopper 121 is provided with an inclined surface 1210 on one side facing the graphite boat 10, and the inclined surface 1210 is arranged around the circumference of the stopper 121. When the silicon wafer 3 is placed on the graphite boat 10, the inclined surface 1210 on the stopper 121 can guide the silicon wafer 3, so that the silicon wafer 3 is easily placed in the first space 101.
[0048] Please also read Figure 3 and Figure 4 In some embodiments, a first mounting hole 102 is provided on the first side 100, and the conductive portion 11 includes a first mounting portion 110 and a contact portion 111. The first mounting portion 110 is provided in the first mounting hole 102, and the contact portion 111 is connected to one side of the first mounting portion 110 along the thickness direction X, and the contact portion 111 is used to abut against one side of the silicon wafer 3 along the first direction to be electrically connected to the silicon wafer 3; a second mounting hole 103 is provided on the first side 100, and the second mounting holes 103 are spaced apart on the surface where the first side 100 is located, and the stop portion 12 also includes a second mounting portion 122, and the second mounting portion 122 is provided in the second mounting hole 103, and one end of the supporting portion 120 away from the stop portion 121 is connected to one side of the second mounting portion 122 along the thickness direction X.
[0049] In this way, by arranging the first mounting hole 102 and the second mounting hole 103 at intervals on the first side 100, the conductive part 11 can be installed on the graphite boat sheet 10 through the first mounting part 110, and the stopper 12 can also be installed on the graphite boat sheet 10 through the second mounting part 122, and the connection structure and the installation method are relatively simple (for example, through the interference fit between the first mounting part 110 and the first mounting hole 102, and the interference fit between the second mounting part 122 and the second mounting hole 103), which can reduce the difficulty of production and assembly of the conductive part 11, the stopper 12 and the graphite boat sheet 10, and the contact part 111 is connected to one side of the first mounting part 110 along the thickness direction X, and can abut against one side of the silicon wafer 3 along the first direction to achieve electrical connection with the silicon wafer 3.
[0050] In this embodiment, the contact portion 111 can be a cylindrical structure, so that the contact surface between the contact portion 111 and the silicon wafer 3 can be regarded as a straight line, thereby improving the tightness of the abutment between the contact portion 111 and the silicon wafer 3, thereby improving the stability of the conductivity between the contact portion 111 and the silicon wafer 3 in the POLY process, while also reducing the production accuracy of the conductive part 11 and the installation accuracy with the graphite boat sheet 10.
[0051] In some embodiments, the graphite boat 10 further has a second side (not shown) opposite to the first side 100 along its own thickness direction X, the first mounting hole 102 passes through the second side, the number of contact portions 111 is two, and the two contact portions 111 are respectively connected to the two sides of the first mounting portion 110 along the thickness direction X; the second mounting hole 103 passes through the second side, the number of supporting portions 120 and the number of stopping portions 121 are both two, the two supporting portions 120 are respectively connected to the two sides of the second mounting portion 122 along the thickness direction X, and each stopping portion 121 is respectively connected to the side of each supporting portion 120 away from the graphite boat 10. By setting the first mounting hole 102 to penetrate from the first side 100 to the second side along the thickness direction X, that is, the first mounting hole 102 penetrates the graphite boat 10, the two contact portions 111 provided on both sides of the first mounting portion 110 along the thickness direction X are respectively located on the first side 100 and the second side of the graphite boat 10, and by setting the second mounting hole 103 to penetrate from the first side 100 to the second side along the thickness direction X, that is, the second mounting hole 103 penetrates the graphite boat 10, the two supporting portions 120 provided on both sides of the second mounting portion 122 along the thickness direction X are respectively located on the first side 100 and the second side of the graphite boat 10, and the two stop portions 121 are respectively provided on the two supporting portions 120, so that both the first side 100 and the second side of the graphite boat 10 can support and fix the silicon wafer 3, and realize electrical connection with the silicon wafer 3, thereby improving the production efficiency per unit area of the graphite boat using such a graphite boat 10.
[0052] All-in-one
[0053] See also Figure 5 In some embodiments, the stopper 12 and the conductive part 11 are provided in an integrated manner, and the stopper 12 is provided on the side of the conductive part 11 away from the graphite boat 10. The integrated stopper 12 and conductive part 11 can reduce the number of components of the graphite boat 10, and at the same time reduce the total contact area between the silicon wafer 3 and the stopper 12 and the conductive part 11, thereby reducing the wear of the silicon wafer 3 by the stopper 12 and the conductive part 11.
[0054] Optionally, the number of the stopper 12 and the conductive part 11 can be one or more, which can be selected according to actual conditions and is not specifically limited in this embodiment. The first direction refers to any direction intersecting with the thickness direction X, which can refer to one direction or multiple directions. When the number of the stopper 12 and the conductive part 11 is multiple, the multiple conductive parts 11 are arranged at intervals on the surface where the first side 100 is located, and the multiple conductive parts 11 can abut against different sides of the silicon wafer 3 in different first directions, so that the silicon wafer 3 is fixed relative to the graphite boat sheet 10 in the plane direction of the first side 100.
[0055] See also Figure 6 In one example, the stopper 12 includes a stopper portion 121, which is disposed on a side of the conductive portion 11 away from the graphite boat sheet 10. Along the thickness direction X, a projection of the conductive portion 11 on the first side 100 is located within a projection of the stopper portion 121 on the first side 100. A first space 101 is formed between the stopper portion 121 and the first side 100, and the stopper portion 121 is made of insulating material.
[0056] In this way, the projection of the conductive part 11 on the first side 100 is located within the projection of the stop part 121 on the first side 100, and the stop part 121 will protrude from the conductive part 11 in the first direction, and a first space 101 will be formed between the part of the stop part 121 protruding from the conductive part 11 and the graphite boat 10, thereby limiting the displacement of the silicon wafer 3 relative to the graphite boat 10 in the thickness direction X, and because the stop part 121 is made of insulating material, in the POLY process, the electric field at the position where the working surface of the silicon wafer 3 contacts (or is close to) the stop part 121 is relatively consistent with the electric field at the rest of the working surface of the silicon wafer 3, so that the dielectric layer formed on the silicon wafer 3 is relatively uniform, thereby improving the quality of the battery cell finally produced.
[0057] Optionally, the insulating material of the stopper portion 121 may be ceramic, insulating plastic, etc., which may be selected according to actual conditions and is not specifically limited in this embodiment. Preferably, the insulating material of the stopper portion 121 is ceramic, which has a moderate hardness, and can have a good structural strength, can have a good stopping effect on the silicon wafer 3, and can avoid damage to the graphite boat 10 and the silicon wafer 3 due to excessive hardness. At the same time, the ceramic material also has a good surface smoothness, which can reduce the damage to the silicon wafer 3 when rubbing against the silicon wafer 3.
[0058] In some embodiments, a mounting groove (not shown) is provided at one end of the conductive part 11 away from the graphite boat sheet 10, and the stopper portion 121 is provided with a through hole (not shown) penetrating the stopper portion 121 along the thickness direction X. The graphite boat sheet 10 further includes a fastener (not shown), which is passed through the through hole and connected to the mounting groove, so that the stopper portion 121 is fixed relative to the conductive part 11. In this way, the fastener can pass through the through hole of the engaging portion and connect to the mounting groove of the conductive part 11, so that the conductive part 11 is fixed to the stopper portion 121. Such a connection method is relatively simple and can improve the connection strength between the conductive part 11 and the stopper portion 121.
[0059] Optionally, the fastener may be a pin, a rivet, etc., which may be selected according to actual conditions and is not specifically limited in this embodiment.
[0060] Please refer to 7, in another example, the stopper 12 includes a stopper portion 121 and an isolation layer 123, the stopper portion 121 is arranged on the side of the conductive portion 11 away from the graphite boat sheet 10, along the thickness direction X, the projection of the conductive portion 11 on the first side 100 is located within the projection of the stopper portion 121 on the first side 100, the isolation layer 123 is arranged on the side of the stopper portion 121 facing the first side 100, a first space 101 is formed between the isolation layer 123 and the first side 100, and the isolation layer 123 is made of insulating material.
[0061] In this way, the projection of the conductive part 11 on the first side 100 is located within the projection of the stop part 121 on the first side 100, and the stop part 121 will protrude from the conductive part 11 in the first direction. The isolation layer 123 is provided at the portion of the stop part 121 protruding from the conductive part 11, so that a first space 101 will be formed between the isolation layer 123 and the graphite boat 10, thereby limiting the displacement of the silicon wafer 3 relative to the graphite boat 10 in the thickness direction X, and because the isolation layer 123 is made of insulating material, in the POLY process, the electric field at the position where the working surface of the silicon wafer 3 contacts (or is adjacent to) the isolation layer 123 is relatively consistent with the electric field at the other positions of the working surface of the silicon wafer 3, so that the dielectric layer formed on the silicon wafer 3 is relatively uniform, thereby improving the quality of the battery cell finally produced.
[0062] Optionally, the isolation layer 123 may be a polyurethane coating, an epoxy resin coating, a silicone rubber coating, etc., which may be selected according to actual conditions and is not specifically limited in this embodiment.
[0063] In this embodiment, the conductive part 11 and the stopper part 121 are columnar structures, and the diameter of the stopper part 121 is larger than the diameter of the conductive part 11. This allows the contact surface between the conductive part 11 and the silicon wafer 3 to be considered as a straight line, thereby improving the tightness of the contact between the conductive part 11 and the silicon wafer 3, thereby improving the stability of the conduction between the conductive part 11 and the silicon wafer 3 in the POLY process, while also reducing the production accuracy of the conductive part 11 and the installation accuracy with the graphite boat 10. The diameter of the stopper part 121 is larger than the diameter of the conductive part 11 to ensure the stopping effect on the silicon wafer 3.
[0064] Since the thickness of the silicon wafer 3 and the interval between the stopper portion 121 and the graphite boat 10 (ie, the thickness of the first space 101) are both small, it is not convenient to put the silicon wafer 3 into the first space 101. Based on this, please refer to Figure 6 and Figure 7 In some embodiments, the stopper 121 is provided with an inclined surface 1210 on one side facing the graphite boat 10, and the inclined surface 1210 is arranged around the circumference of the stopper 121. When the silicon wafer 3 is placed on the graphite boat 10, the inclined surface 1210 on the stopper 121 can guide the silicon wafer 3, so that the silicon wafer 3 is easily placed in the first space 101.
[0065] Please also read Figures 6 to 8 In some embodiments, a first mounting hole 102 is provided on the first side 100, and the conductive portion 11 includes a first mounting portion 110 and a contact portion 111. The first mounting portion 110 is provided in the first mounting hole 102, and the contact portion 111 is connected to one side of the first mounting portion 110 along the thickness direction X. The contact portion 111 is used to abut against one side of the silicon wafer 3 along the first direction to be electrically connected to the silicon wafer 3, and the stop portion 121 is provided on the side of the contact portion 111 away from the graphite boat sheet 10.
[0066] In this way, by providing the first mounting hole 102, the conductive part 11 can be installed on the graphite boat sheet 10 through the first mounting portion 110, and the connection structure and the mounting method are relatively simple (for example, through the interference fit between the first mounting portion 110 and the first mounting hole 102), which can reduce the difficulty of production and assembly of the conductive part 11 and the graphite boat sheet 10. The contact portion 111 is connected to one side of the first mounting portion 110 along the thickness direction X, and can abut against one side of the silicon wafer 3 along the first direction to achieve electrical connection with the silicon wafer 3. At the same time, the contact portion 111 makes a certain distance between the stop portion 121 provided on the side of the contact portion 111 away from the graphite boat sheet 10 and the graphite boat sheet 10, thereby forming a first space 101 between the stop portion 12 and the graphite boat sheet 10.
[0067] In this embodiment, the contact portion 111 can be a cylindrical structure, so that the contact surface between the contact portion 111 and the silicon wafer 3 can be regarded as a straight line, thereby improving the tightness of the abutment between the contact portion 111 and the silicon wafer 3, thereby improving the stability of the conductivity between the contact portion 111 and the silicon wafer 3 in the POLY process, while also reducing the production accuracy of the conductive part 11 and the installation accuracy with the graphite boat sheet 10.
[0068] In some embodiments, the graphite boat 10 further has a second side opposite to the first side 100 along its own thickness direction X, the first mounting hole 102 passes through the second side, the number of the contact portions 111 is two, and the two contact portions 111 are respectively connected to the two sides of the first mounting portion 110 along the thickness direction X, the number of the stop portions 121 is two, and each stop portion 121 is arranged at an end of each contact portion 111 away from the graphite boat 10. By setting the first mounting hole 102 to pass through from the first side 100 to the second side along the thickness direction X, that is, the first mounting hole 102 passes through the graphite boat 10, the two contact portions 111 arranged on both sides of the first mounting portion 110 along the thickness direction X are respectively located on the first side 100 and the second side of the graphite boat 10, and the two stop portions 121 are respectively arranged on the two contact portions 111, so that the first side 100 and the second side of the graphite boat 10 can both support and fix the silicon wafer 3, and realize electrical connection with the silicon wafer 3, thereby improving the production efficiency per unit area of the graphite boat using such a graphite boat 10.
[0069] The second aspect of the embodiment of the utility model discloses a graphite boat 2, comprising a plurality of bearing assemblies 1 as described in the first aspect of the embodiment, wherein the plurality of bearing assemblies 1 are spaced apart along the thickness direction X thereof.
[0070] The load-bearing assembly and graphite boat disclosed in the embodiments of the present invention are introduced in detail above. Specific examples are used in this article to illustrate the principle and implementation mode of the present invention. The description of the above embodiments is only used to help understand the load-bearing assembly and graphite boat of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of the present invention, there will be changes in the specific implementation mode and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.
Claims
1. A load-bearing assembly, characterized in that: The carrying assembly is used to carry the silicon wafer, and the carrying assembly includes: A graphite boat having a first side along a thickness direction of the graphite boat; a conductive portion, the conductive portion being disposed on the first side, the conductive portion being used to abut against one side of the silicon wafer along a first direction, and the conductive portion being electrically connected to the silicon wafer; and A stopper, the stopper being disposed on the first side, and being spaced apart from the graphite boat sheet along the thickness direction to form a first space, the first space being used to accommodate at least a portion of the silicon wafer, the stopper being used to limit the displacement of the silicon wafer along the thickness direction, and the stopper being configured to be insulated from the silicon wafer; Wherein, the first direction intersects with the thickness direction.
2. The bearing assembly according to claim 1, characterized in that: The stopper portion and the conductive portion are spaced apart from each other on the surface where the first side is located.
3. The bearing assembly according to claim 2, characterized in that: The stop portion includes a supporting portion and a stopping portion, the supporting portion is arranged on the first side, and the supporting portion and the conductive portion are spaced apart on the surface where the first side is located, the supporting portion is used to support one side of the silicon wafer along the first direction, and the stopping portion is arranged on the side of the supporting portion away from the graphite boat sheet, along the thickness direction, the projection of the supporting portion on the first side is located within the projection of the stopping portion on the first side, and the first space is formed between the stopping portion and the first side; wherein, the supporting portion and the stopping portion are both made of insulating materials.
4. The bearing assembly according to claim 3, characterized in that: A first mounting hole is provided on the first side, the conductive portion comprises a first mounting portion and a contact portion, the first mounting portion is provided in the first mounting hole, the contact portion is connected to one side of the first mounting portion along the thickness direction, and the contact portion is used to abut against one side of the silicon wafer along the first direction to be electrically connected to the silicon wafer; A second mounting hole is provided on the first side, and the second mounting holes are spaced apart on the surface where the first side is located. The stop portion also includes a second mounting part, and the second mounting part is provided in the second mounting hole. One end of the supporting part facing away from the stop part is connected to one side of the second mounting part along the thickness direction.
5. The bearing assembly according to claim 4, characterized in that: The graphite boat sheet also has a second side along its own thickness direction, the first mounting hole penetrates to the second side, the number of the contact parts is two, and the two contact parts are respectively connected to two sides of the first mounting part along the thickness direction; The second mounting hole passes through to the second side, and the number of the supporting parts and the stopper parts are both two. The two supporting parts are respectively connected to the two sides of the second mounting part along the thickness direction, and each stopper part is respectively connected to one side of each supporting part away from the graphite boat sheet.
6. The bearing assembly according to claim 1, characterized in that: The stopper is arranged on a side of the conductive portion away from the graphite boat.
7. The bearing assembly according to claim 6, characterized in that: The stopper comprises a stopper portion, the stopper portion is arranged on a side of the conductive portion away from the graphite boat sheet, along the thickness direction, the projection of the conductive portion on the first side is located within the projection of the stopper portion on the first side, the first space is formed between the stopper portion and the first side, and the stopper portion is made of insulating material; Alternatively, the stop portion includes a stop part and an isolation layer, the stop part is arranged on the side of the conductive part away from the graphite boat sheet, along the thickness direction, the projection of the conductive part on the first side is located within the projection of the stop part on the first side, the isolation layer is arranged on the side of the stop part facing the first side, the first space is formed between the isolation layer and the first side, and the isolation layer is made of insulating material.
8. The bearing assembly according to claim 7, characterized in that: A first mounting hole is provided on the first side, and the conductive part includes a first mounting portion and a contact portion, the first mounting portion is provided in the first mounting hole, the contact portion is connected to one side of the first mounting portion along the thickness direction, the contact portion is used to abut against one side of the silicon wafer along the first direction to be electrically connected to the silicon wafer, and the stop portion is provided on a side of the contact portion away from the graphite boat sheet.
9. The bearing assembly according to claim 8, characterized in that: The graphite boat sheet also has a second side opposite to the first side along its own thickness direction, the first mounting hole passes through to the second side, the number of the contact parts is two, and the two contact parts are respectively connected to the two sides of the first mounting part along the thickness direction, the number of the stop parts is two, and each of the stop parts is arranged at one end of each contact part away from the graphite boat sheet.
10. A graphite boat, characterized in that: It comprises a plurality of bearing components as described in any one of claims 1 to 9, wherein the plurality of bearing components are arranged at intervals along the thickness direction of the bearing components.