Device for planarization gold removal

Abstract

The utility model relates to the technical field of microelectronic packaging and radio equipment, in particular to a device for planar gold removal, which comprises a gold removal table, a molten pool is arranged on the gold removal table, a support plate is arranged in the molten pool, a plurality of through holes penetrating through the support plate are arranged on the support plate, and the through holes are communicated with the molten pool. A negative suction plate is further arranged on the gold removing table. During use, the tin-lead alloy is firstly melted into a molten pool, the liquid level just submerges the height of a supporting plate in the molten pool by about 1 mm, then an oxide layer on the surface of the brazing filler metal is driven away through a scraper, then a planar product without gold is clamped through tweezers and put into the molten pool to melt gold, gold removal is completed, and the melting time of the gold layer with each thickness is executed according to different gold layer thicknesses. And the product is taken out of the molten pool and placed in the corresponding air exhaust hole in the negative suction plate, brazing filler metal on the product is exhausted under the action of negative pressure, and the gold removal work is completed after the gold removal product is cooled.

Description

Technical Field

[0001] The utility model relates to the technical field of microelectronic packaging and radio equipment, in particular to a device for planarization and gold removal. Background Art

[0002] In microelectronic packaging and radio equipment technology, there are many applications involving soldering on the gold-plated surface. The purpose of gold plating is to improve the metal's resistance to oxidation and corrosion.

[0003] There are many types of solders used for soft soldering on the surface of gold-plated parts, mainly tin-based alloys and indium-based alloys. The most representative tin-based alloys are Sn63Pb37, SAC305, etc., and indium-based alloys mainly include InPb, InAg and other solders according to different components.

[0004] According to the mutual melting characteristics of metals, gold and tin are very easy to melt, so tin-based solder is easy to wet when soldering on the gold-plated surface. Under the protection of anti-oxidation protective gas, soldering can be performed without flux. According to relevant domestic and foreign literature reports, after soldering gold and tin, various gold-tin alloys will be formed. These alloys are usually brittle, that is, gold brittle. When used, these alloys may crack or break, affecting product reliability. There are relevant international and domestic standards that require that when soldering tin-based solder on the gold-plated surface, the corresponding gold removal process must be carried out to reduce the various effects caused by gold brittleness.

[0005] In microelectronic packaging and radio equipment technology, some planar products with tin-based soldering on the gold-plated surface are equipped with chips or components of various materials, such as bare chips. For such products, gold removal must be performed before soldering to effectively reduce the impact of gold brittleness. For such planar products equipped with chips (especially bare chips) or components, there is no easy-to-operate or dedicated device in the industry to remove gold. Utility Model Content

[0006] The utility model aims to provide a device for planarization and gold removal, so as to solve the technical problem that there is no easy-to-operate or dedicated device for planarization products of chips (especially bare chips) or components in the prior art.

[0007] The utility model discloses a device for planarization gold removal, comprising a gold removal platform, a molten pool is arranged on the gold removal platform, a support plate is arranged in the molten pool, a plurality of through holes penetrating the support plate are arranged on the support plate, and a negative suction plate is also arranged on the gold removal platform.

[0008] Working principle: When using, first melt the tin-lead alloy into the molten pool, and the liquid level just submerges the support plate in the molten pool by about 1 mm. Then use a scraper to remove the oxide layer on the surface of the solder, and then use tweezers to pick up the flattened product to be gold-removed and put it into the molten pool to melt the gold to complete the gold removal. The melting time of each thickness of the gold layer is carried out according to the different gold layer thicknesses. Take out the product from the molten pool, place the product on the corresponding exhaust hole on the negative suction plate, and remove the solder on the product under the action of negative pressure. After the gold-removed product is cooled, the gold removal work is completed. By setting up a molten pool, the gold removal of the product can be achieved and the gold removal effect can be guaranteed. By setting up a negative suction plate, the solder on the product can be removed under the action of negative pressure to complete the gold removal operation.

[0009] Furthermore, the diameter of the through hole is 2 mm, and a plurality of the through holes are distributed in an array.

[0010] Furthermore, the support plate is detachably connected to the molten pool.

[0011] The molten pool material and the solder do not melt and wet each other, usually metals such as titanium. The support plate must be wetted with the solder, and the solder forms a solder film on the surface of the support plate. The support plate is usually made of copper and other metals. Due to the different selections of the two materials, and the need to replace the solder and support plate in the molten pool later, a detachable connection structure is set.

[0012] Furthermore, the number of the molten pools is at least 1.

[0013] Furthermore, the number of molten pools is 1-4.

[0014] Furthermore, the number of molten pools is 2.

[0015] By setting up two molten pools, the requirement of removing gold twice is met when the thickness of the gold-plated layer is greater than 2.5 microns.

[0016] Furthermore, the molten pool is connected to a heating device.

[0017] By providing a heating device, the solder in the molten pool can be heated to melt it, thereby achieving the purpose of the solder dissolving the gold.

[0018] Furthermore, the heating device is located at the bottom of the gold removal platform.

[0019] By arranging the heating device at the bottom of the gold removal platform, heating can be achieved from the bottom of the molten pool, and the heating effect can be guaranteed.

[0020] Furthermore, the negative suction plate is connected to an air pump, and the air pump is connected to a negative suction controller.

[0021] By setting up a vacuum pump, the negative suction effect of the negative suction plate can be achieved. By setting up a negative suction controller, the vacuum mode can be controlled as needed to achieve continuous or intermittent vacuuming, and the vacuum volume can be adjusted.

[0022] Furthermore, an array of air suction holes is provided on the negative suction plate, the array of air suction holes is connected to the air suction pump, and the number of the array of air suction holes is 2-100.

[0023] By setting the array of exhaust holes, normal exhaust can be ensured.

[0024] Furthermore, a single air suction hole is provided on one side of the array of air suction holes, and the single air suction hole is connected to the air suction pump.

[0025] By setting a single-hole exhaust hole, the array exhaust holes can be covered for smaller products, and only the single-hole exhaust hole is used.

[0026] Furthermore, the diameter of the entire row of exhaust holes and the single exhaust hole is 0.5 to 5 mm.

[0027] Furthermore, a storage tank is provided below the negative suction plate.

[0028] By setting up a storage pool, the extracted solder is temporarily stored in the storage pool, and when it accumulates to a certain level, it is cleaned out of the storage pool.

[0029] Furthermore, a partition wall is provided on one side of the storage tank, a filter tank is provided on one side of the partition wall, an air extraction interface is provided on one side of the filter tank, and the air extraction interface is located on the upper part of the partition wall.

[0030] By setting up partition walls and filter tanks, the group of partition masts and filter tanks can store the extracted solder in the storage pool to ensure that the solder in the solder pool will not be extracted. When the solder and air enter the upper part of the storage pool through the exhaust hole at the same time, the air density is low and the solder density is high. The solder falls directly into the storage pool, forming a negative pressure in the storage pool, which has the effect of continuous exhaust.

[0031] Furthermore, the gold removal platform is arranged on a desktop.

[0032] By setting up the desktop, materials can be stacked and the gold removal operation can be facilitated.

[0033] Furthermore, the gold removing platform is detachably connected to the desktop.

[0034] By providing a detachable connection between the gold removing table and the desktop, gold removing tables of different sizes can be conveniently replaced for easy use.

[0035] Furthermore, the negative suction controller is connected to a foot switch.

[0036] By setting a foot switch, the vacuum demand can be cut off at any time as needed. When the solder on the planarized product is extracted, the vacuum pump is connected, and when the planarized product is taken away, the vacuum pump is disconnected.

[0037] Compared with the prior art, the utility model has the following beneficial effects:

[0038] 1. By setting up a molten pool, the product can be de-golded to ensure the de-golding effect;

[0039] 2. By setting a negative suction plate, the solder on the product is sucked away under the action of negative pressure to complete the gold removal operation;

[0040] 3. By providing a support plate that is detachably connected to the molten pool, it is convenient to replace the solder and the support plate in the molten pool;

[0041] 4. By setting a heating device, the solder in the molten pool can be heated to melt it, so as to achieve the purpose of solder dissolving gold;

[0042] 5. By setting the heating device at the bottom of the gold removal platform, heating can be achieved from the bottom of the molten pool, which can ensure the heating effect;

[0043] 6. By setting up a vacuum pump, the negative suction effect of the negative suction plate can be achieved. By setting up a negative suction controller, the vacuum mode can be controlled as needed to achieve continuous or intermittent vacuuming, and the vacuum volume can be adjusted;

[0044] 7. By setting up a storage pool, the drawn solder is temporarily stored in the storage pool, and when it accumulates to a certain level, it is cleaned out of the storage pool;

[0045] 8. By setting up partition walls and filter tanks, the group of partition masts and filter tanks can store the extracted solder in the storage pool to ensure that the solder in the solder pool will not be extracted. When the solder and air enter the upper part of the storage pool through the exhaust hole at the same time, the air density is low and the solder density is high. The solder falls directly into the storage pool, forming a negative pressure in the storage pool, which has the effect of continuous exhaust. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0047] Figure 1 It is a structural schematic diagram of the gold removal platform of the utility model.

[0048] Figure 2 It is a schematic diagram of the structure of the device for planarization gold removal of the utility model.

[0049] In the above drawings, the meanings of the various marks are: 1-gold removal table, 2-molten pool, 3-support plate, 4-through hole, 5-negative suction plate, 6-heating device, 7-vacuum pump, 8-negative suction controller, 9-array suction holes, 10-storage pool, 11-partition wall, 12-filter tank, 13-exhaust interface, 14-single-hole suction hole, 15-desktop, 16-foot switch. DETAILED DESCRIPTION

[0050] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments.

[0051] Example 1

[0052] The technical solutions adopted in this embodiment are as follows:

[0053] like Figure 1-Figure 2 As shown, a device for planarization gold removal includes a gold removal platform 1, a molten pool 2 is arranged on the gold removal platform 1, a support plate 3 is arranged in the molten pool 2, a plurality of through holes 4 penetrating the support plate 3 are arranged on the support plate 3, and a negative suction plate 5 is also arranged on the gold removal platform 1.

[0054] Working principle: When in use, first melt the tin-lead alloy into the molten pool 2, and the liquid level just submerges the support plate 3 in the molten pool 2 by about 1 mm. Then use a scraper to remove the oxide layer on the surface of the solder, and then use tweezers to pick up the planarized product to be de-golded and put it into the molten pool 2 to melt the gold to complete the de-golding. The melting time of each thickness of the gold layer is carried out according to the different gold layer thicknesses. Take out the product from the molten pool 2, place the product on the corresponding exhaust hole on the negative suction plate 5, and draw out the solder on the product under the action of negative pressure. After the de-golded product is cooled, the de-golding work is completed. By setting up the molten pool 2, the de-golding of the product can be achieved and the de-golding effect can be guaranteed. By setting up the negative suction plate 5, the solder on the product is drawn out under the action of negative pressure to complete the de-golding operation.

[0055] Example 2

[0056] In this embodiment, as a preferred embodiment of the present utility model, the specific structure is as follows Figure 1-Figure 2 As shown, it discloses the following improvements on the basis of Implementation Mode 1: the diameter of the through hole 4 is 2 mm, and the plurality of through holes 4 are distributed in an array, the support plate 3 is detachably connected to the molten pool 2, the number of the molten pools 2 is 2, the molten pool 2 is connected to a heating device 6, and the heating device 6 is located at the bottom of the gold removal platform 1.

[0057] The material of the molten pool 2 and the solder do not melt and wet each other, usually metals such as titanium. The support plate 3 must be wetted with the solder, and the solder forms a solder film on the surface of the support plate 3. The support plate 3 is usually made of copper and other metals. Due to the different selections of the two materials, and the need to replace the solder in the molten pool 2 and the support plate 3 later, a detachable connection structure is set.

[0058] By setting two molten pools 2, the requirement of removing gold twice is met when the thickness of the gold-plated layer is greater than 2.5 microns.

[0059] By providing the heating device 6, the solder in the molten pool 2 can be heated to melt it, thereby achieving the purpose of the solder dissolving the gold.

[0060] By arranging the heating device 6 at the bottom of the gold removal platform 1, heating can be achieved from the bottom of the molten pool 2, and the heating effect can be guaranteed.

[0061] Example 3

[0062] In this embodiment, as a preferred embodiment of the present utility model, the specific structure is as follows Figure 1-Figure 2 As shown, it discloses the following improvements on the basis of implementation mode 2, the negative suction plate 5 is connected to the air pump 7, the air pump 7 is connected to the negative suction controller 8, the negative suction plate 5 is provided with an array of air suction holes 9, the array of air suction holes 9 is connected to the air pump 7, the number of the array of air suction holes 9 is 2-100, a single-hole air suction hole 14 is provided on one side of the array of air suction holes 9, the single-hole air suction hole 14 is connected to the air pump 7, the diameters of the array of air suction holes 9 and the single-hole air suction hole 14 are 0.5-5 mm, a storage tank 10 is provided below the negative suction plate 5, a partition wall 11 is provided on one side of the storage tank 10, a filter tank 12 is provided on one side of the partition wall 11, a suction interface 13 is provided on one side of the filter tank 12, and the suction interface 13 is located on the upper part of the partition wall 11.

[0063] By providing the array of air extraction holes 9, normal air extraction can be ensured.

[0064] By providing the single-hole air extraction hole 14 , the array air extraction holes 9 can be covered for smaller products, and only the single-hole air extraction hole 14 can be used.

[0065] By setting up the partition wall 11 and the filter tank 12, the group of the partition wall and the filter tank 12 can store the extracted solder in the storage pool 10, ensuring that the solder in the solder pool will not be sucked away. When the solder and air enter the upper part of the storage pool 10 through the exhaust hole at the same time, the air density is low and the solder density is high. The solder falls directly into the storage pool 10, and the storage pool 10 forms a negative pressure, which has the effect of continuous exhaust.

[0066] By providing the storage pool 10 , the drawn solder is temporarily stored in the storage pool 10 , and is cleaned out of the storage pool 10 when accumulated to a certain level.

[0067] By providing the vacuum pump 7, the negative suction effect of the negative suction plate 5 can be achieved. By providing the negative suction controller 8, the vacuum mode can be controlled as needed to achieve continuous or intermittent vacuuming, and the vacuum volume can be adjusted.

[0068] Example 4

[0069] In this embodiment, as a preferred embodiment of the present utility model, the specific structure is as follows Figure 1 and Figure 2 As shown, the following improvements are disclosed based on Implementation Example 3: the gold removal table 1 is arranged on the desktop 15, the gold removal table 1 is detachably connected to the desktop 15, and the negative suction controller 8 is connected to a foot switch 16.

[0070] By providing the table 15, materials can be stacked and the gold removal operation can be facilitated.

[0071] By providing a detachable connection between the gold removing table 1 and the desktop 15, gold removing tables 1 of different sizes can be conveniently replaced for easy use.

[0072] By setting the foot switch 16, the vacuum demand can be cut off at any time as needed. When the solder on the planarized product is extracted, the vacuum pump 7 is connected, and when the planarized product is taken away, the vacuum pump 7 is disconnected.

[0073] The above are the implementation methods listed in this embodiment, but this embodiment is not limited to the above optional implementation methods. Those skilled in the art can arbitrarily combine the above methods to obtain other various implementation methods. Anyone can derive other various forms of implementation methods under the inspiration of this embodiment. The above specific implementation methods should not be understood as limiting the scope of protection of this embodiment. The scope of protection of this embodiment shall be based on the definition in the claims, and the description can be used to interpret the claims.

Claims

1. A device for planarization gold removal, characterized in that: The invention comprises a gold removal platform (1), wherein a molten pool (2) is arranged on the gold removal platform (1), a support plate (3) is arranged in the molten pool (2), a plurality of through holes (4) penetrating the support plate (3) are arranged on the support plate (3), and a negative suction plate (5) is also arranged on the gold removal platform (1).

2. The device for planarization gold removal according to claim 1, characterized in that: The support plate (3) is detachably connected to the molten pool (2).

3. The device for planarization gold removal according to claim 1, characterized in that: The molten pool (2) is connected to a heating device (6).

4. The device for planarization gold removal according to claim 3, characterized in that: The heating device (6) is located at the bottom of the gold removal platform (1).

5. The device for planarization gold removal according to claim 1, characterized in that: The negative suction plate (5) is connected to an air pump (7), and the air pump (7) is connected to a negative suction controller (8).

6. The device for planarization gold removal according to claim 5, characterized in that: An array of air suction holes (9) is provided on the negative suction plate (5), the array of air suction holes (9) is connected to the air suction pump (7), and the number of the array of air suction holes (9) is 2-100.

7. The device for planarization gold removal according to claim 6, characterized in that: A single-hole air suction hole (14) is provided on one side of the array of air suction holes (9), and the single-hole air suction hole (14) is connected to the air suction pump (7).

8. The device for planarization gold removal according to claim 1, characterized in that: A material storage tank (10) is arranged below the negative suction plate (5).

9. The device for planarization gold removal according to claim 8, characterized in that: A partition wall (11) is provided on one side of the material storage tank (10), a filter tank (12) is provided on one side of the partition wall (11), an air extraction interface (13) is provided on one side of the filter tank (12), and the air extraction interface (13) is located on the upper part of the partition wall (11).

10. The device for planarization gold removal according to claim 9, characterized in that: The gold removal platform (1) is arranged on a table top (15).

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