Epitaxial device

Abstract

The utility model provides an extension device which comprises a reflecting plate and a plug, the reflecting plate is provided with a first surface facing a bell jar, the first surface of the reflecting plate is provided with a plurality of lamp tubes, the reflecting plate is provided with heat dissipation through holes, and the plug is inserted into the heat dissipation through holes. The heat dissipation through holes are formed in the two sides of the vertical projection of at least one lamp tube on the reflecting plate, and plugs can be inserted into the heat dissipation through holes to block the heat dissipation through holes so as to adjust the heat dissipation capacity of the reflecting plate. By adjusting the distribution of the plugs in the heat dissipation through holes, the reflecting plate can ensure that the temperature of the graphite base and the wafer below the bell jar meets the process requirement, and meanwhile, the temperature of the surface of the bell jar is effectively reduced, so that a coating on the inner wall of the bell jar is reduced, and the product quality is further improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductors, in particular to an epitaxial device. Background Art

[0002] Silicon epitaxial deposition technology is a film-forming method that generates solid substances through chemical reactions between gas compounds and deposits them on the surface of wafers. It can grow single-crystal silicon films with a certain thickness, a certain resistivity and different conductivity types on a single-crystal silicon substrate along the original crystal direction. The by-products generated during the film deposition process are discharged from the equipment exhaust pipeline into the exhaust gas treatment device for combustion and water washing post-treatment.

[0003] In actual use, silicon epitaxial deposition technology still has the following technical problems. For example, the gold-plated reflector of the ASM RP decompression epitaxial furnace is airtight and has no gaps in the middle. As a result, during the production process, as the number of wafers increases, it is easy to form a coating on the inner wall of the quartz bell. The coating on the inner wall of the quartz bell seriously affects the service life of the reaction chamber, shortens the maintenance cycle of the equipment, and increases production costs. What is more serious is that the particles of the coating on the inner wall of the quartz bell enter the product, causing the product particles to exceed the standard and even the process parameters to drift.

[0004] How to provide an epitaxial device that can effectively reduce the temperature of the inner wall surface of the quartz bell jar while ensuring the process temperature and parameters, thereby reducing the generation of coating on the inner wall of the quartz bell jar, increasing the service life of the equipment, extending the equipment maintenance cycle, improving equipment utilization, and improving production efficiency is an urgent problem to be solved. Summary of the invention

[0005] The technical problem to be solved by the utility model is to provide an epitaxial device, which can effectively reduce the temperature of the inner wall surface of the quartz bell jar while ensuring the process temperature and parameters, thereby reducing the generation of the inner wall coating of the quartz bell jar.

[0006] In order to solve the above problems, the utility model provides an extension device, including: a reflecting plate, the reflecting plate having a first surface facing a bell jar, the first surface of the reflecting plate being provided with a plurality of lamp tubes, the reflecting plate having heat dissipation holes, the heat dissipation holes being provided on both sides of a vertical projection of at least one of the lamp tubes on the reflecting plate; a plug, the plug being capable of being inserted into the heat dissipation holes to seal the heat dissipation holes so as to adjust the heat dissipation capacity of the reflecting plate.

[0007] In some embodiments, the first surface of the reflective plate is plated with gold.

[0008] In some embodiments, the reflective plate is provided with a base for fixing the lamp tube, and the lamp tube is screwed to the first surface of the reflective plate.

[0009] In some embodiments, a width of a bottom surface of a cross section of the heat dissipation through hole perpendicular to the axis of the lamp tube is smaller than a width of a top surface.

[0010] In some embodiments, the heat dissipation via is in the shape of an elongated strip, the plug is in the shape of an elongated strip, and the length of the plug is less than or equal to the length of the heat dissipation via.

[0011] In some embodiments, the plug includes a first plug having a first length, and a second plug having a second length, wherein the first length is greater than the second length.

[0012] In some embodiments, one first plug can be inserted into the heat dissipation through hole, or a plurality of second plugs can be inserted into the heat dissipation through hole.

[0013] In some embodiments, the material of the plug is quartz.

[0014] In some embodiments, the width of the bottom surface of the cross section of the heat dissipation through hole perpendicular to the axis of the lamp tube is the same as the width of the top surface.

[0015] In some embodiments, the plug includes a body and a head, the head having a size larger than a size of the body.

[0016] In some embodiments, the reflective plate is formed by splicing a sub-reflective plate including the heat dissipation through holes and a sub-reflective plate not including the heat dissipation through holes.

[0017] The above technical solution provides an epitaxial device, including a reflector and a plug, wherein the reflector has a first surface facing a bell jar, and a plurality of lamp tubes are arranged on the first surface of the reflector, and the reflector has heat dissipation holes, and the heat dissipation holes are arranged on both sides of the vertical projection of at least one of the lamp tubes on the reflector, and the plug is inserted into the heat dissipation hole to block the heat dissipation hole, so as to adjust the heat dissipation capacity of the reflector. By adjusting the distribution of the plugs in the heat dissipation holes, the reflector can ensure that the temperature of the graphite base and the wafer under the bell jar meets the process requirements, and the temperature of the surface of the bell jar is effectively reduced, thereby reducing the coating on the inner wall of the bell jar, thereby improving the quality of the product.

[0018] It should be understood that the above general description and the detailed description below are only exemplary and explanatory and cannot limit the present invention. The techniques, methods and devices known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the techniques, methods and devices should be considered as part of the authorization specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments of the utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 is a schematic top view of an epitaxial device provided in the first embodiment of the utility model;

[0021] Figure 2 It is a front view schematic diagram of an epitaxial device provided in the first embodiment of the utility model;

[0022] Figure 3 It is a partial enlarged schematic diagram of the front view of the reflector provided by the first embodiment of the utility model;

[0023] Figure 4 It is a schematic diagram of the shape of the heat dissipation through hole provided in the first embodiment of the utility model;

[0024] Figure 5 It is a schematic diagram of the shape of the plug provided in the first embodiment of the utility model;

[0025] Figure 6 It is a partial enlarged schematic diagram of the front view of the epitaxial device provided by the second embodiment of the utility model;

[0026] Figure 7 It is a partial enlarged schematic diagram of the front view of the epitaxial device provided in the third embodiment of the utility model;

[0027] Figure 8 is a schematic top view of an epitaxial device provided in a fourth embodiment of the utility model;

[0028] Fig. 9 It is a front view schematic diagram of an epitaxial device provided in the fourth embodiment of the utility model. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] Please also read Figure 1 to Figure 5 ,in, Figure 1 is a top view schematic diagram of an epitaxial device provided in the first embodiment of the utility model, Figure 2is a front view schematic diagram of an epitaxial device provided in the first embodiment of the utility model, Figure 3 is a partially enlarged schematic diagram of the front view of the reflector provided by the first embodiment of the utility model, Figure 4 is a schematic diagram of the shape of the heat dissipation through hole provided in the first embodiment of the utility model, Figure 5 It is a schematic diagram of the shape of the plug provided in the first embodiment of the utility model.

[0031] like Figure 1 , Figure 2 As shown, the epitaxial device includes: a reflector 11, and a plug 14. The reflector 11 has a first surface 110 facing a bell jar 12, and a plurality of lamp tubes 13 are arranged on the first surface 110 of the reflector 11. The reflector 11 has heat dissipation holes 111, and the heat dissipation holes 111 are arranged on both sides of the vertical projection of at least one of the lamp tubes 13 corresponding to the reflector 11. The plug 14 can be inserted into the heat dissipation holes 111 to block the heat dissipation holes 111, so as to adjust the heat dissipation capacity of the reflector 11.

[0032] In this embodiment, the epitaxial device is used in an epitaxial furnace, and a graphite base is provided on the side of the bell jar 12 opposite to the reflector 11, on which a wafer is placed. In the epitaxial process, the process deposition temperature is 1080°, and the reaction source gas used is dichlorosilane (SiH 2 CL 2 , referred to as DCS), the process characteristics of this gas are that the higher the temperature, the faster the growth rate, and the lower the pattern drift rate, and the high process temperature is conducive to hydrochloric acid (HCl) etching after epitaxy, so that the etching effect is good. However, the high process temperature will easily cause the reaction source gas to deposit on the inner wall of the bell jar 12 to form a coating. The particles of the coating enter the surface of the wafer, which will affect the quality of the product.

[0033] See also Figure 1 and Figure 2 The lamp tubes 13 are arranged in parallel on the first surface 110 of the reflective plate 11. The lamp tubes 13 may be infrared lamp tubes for heating.

[0034] In this embodiment, if Figure 1As shown, the five lamp tubes 13 on the reflector 11 located in the center of the first surface 110 of the reflector 11 are provided with the heat dissipation holes 111 on both sides of the vertical projection of the reflector 11, and the leftmost and rightmost two lamp tubes 13 are not provided with the heat dissipation holes 111 on both sides of the vertical projection of the reflector 11. Accordingly, after the heat dissipation holes 111 are added on both sides of the vertical projection of the reflector 11 by the lamp tubes 13, the reflection efficiency of the area near the opening of the reflector 11 is reduced to a certain extent, but by adding the heat dissipation holes 111, the cooling wind flow efficiency of the reflector 11 can be effectively increased, so that the heat of the epitaxial device can be drawn away by the cooling fan, thereby effectively reducing the temperature of the surface of the bell jar 12. In addition, the leftmost and rightmost lamp tubes 13 are not located above the wafer position in the process, but are located at the front and rear ends of the process chamber. In order to maintain the temperature and increase the etching effect of hydrochloric acid, the leftmost and rightmost lamp tubes 13 do not add openings on both sides of the vertical projection of the reflector 11. Further, the reflector 11 can ensure that the temperature of the graphite base and the wafer under the bell jar 12 meets the process requirements, while effectively reducing the temperature of the surface of the bell jar 12, reducing the generation of the inner wall coating of the bell jar 12, and thus improving the quality of the product.

[0035] See also Figure 2 The bell jar 12 is made of transparent quartz and is a common device in the epitaxial process. The high-temperature reaction can easily deposit on the inner wall of the bell jar 12 to form a coating.

[0036] In this embodiment, the first surface 110 of the reflector 11 is gold-plated. The gold-plated mirror surface has high strength and stability, and high reflectivity in the infrared band.

[0037] In this embodiment, the reflector 11 is provided with a base (not shown in the figure) for fixing the lamp tube 13, and the lamp tube 13 is screwed to the first surface 110 of the reflector 11 by screws. The reflector 11 has screw holes (not shown in the figure), some of which are used to fix the lamp tube 13, and some are used to fix the reflector 11 itself. Figure 2 As shown, the lamp tube 13 is disposed on the first surface 110 of the reflector 11 and has a certain distance from the bell jar 12 .

[0038] In this embodiment, the width of the bottom surface 1112 of the cross section of the heat dissipation through hole 111 perpendicular to the axis of the lamp tube is smaller than the width of the top surface 1111. Figure 3 The cross-section of the heat dissipation through hole 111 perpendicular to the axis of the lamp tube is in a trapezoidal shape, which is convenient for placing the plug 14 in the heat dissipation through hole 111, and the plug 14 can be stuck in the heat dissipation through hole 111 and not fall off.

[0039] In this embodiment, the heat dissipation through hole 111 is in the shape of a long strip. Figure 4 As shown, the heat dissipation through hole 111 is a column with a trapezoidal cross section perpendicular to the axis of the lamp tube.

[0040] In this embodiment, the plug 14 is in an elongated shape, and the length of the plug 14 is less than or equal to the length of the heat dissipation through hole 111. The shape and length of the plug 14 enable the plug 14 to be placed in the heat dissipation through hole 111 to cover the heat dissipation through hole 111.

[0041] See also Figure 5 The plug 14 includes a first plug 141 having a first length and a second plug 142 having a second length, wherein the first length is greater than the second length. The first plug 141 and the second plug 142 are both square prisms, and the length of the prism is the length of the plug. When the first plug 141 or the second plug 142 is placed in the heat dissipation through hole 111, the cross section thereof perpendicular to the axis of the lamp tube 13 is a rectangle, such as Figure 3 As shown, the width of the rectangle is greater than the width of the bottom surface 1112 of the heat dissipation through hole 111 , and the width of the rectangle is less than the width of the top surface 1111 of the heat dissipation through hole 111 .

[0042] When the first plug 141 is used, one first plug 141 is placed in the heat dissipation through hole 111. In this embodiment, the first plug 141 is 2 mm shorter than the length of the heat dissipation through hole 111, and the width of the first plug 141 (i.e. Figure 5 The width of the middle column cross section) is greater than the width of the top surface 1111 of the heat dissipation through hole 111, and less than the width of the bottom surface 1112 of the heat dissipation through hole 111, so that the first plug 141 can be just placed in the heat dissipation through hole 111 to cover the heat dissipation through hole 111.

[0043] When the second plug 142 is used, a plurality of the second plugs 142 are placed in the heat dissipation through hole 111. Specifically, the length of the second plug 142 (i.e. Figure 5 The length of the middle column is less than half the length of the heat dissipation through hole 111, and two second plugs 142 can be placed in the heat dissipation through hole 111. Figure 1 As shown, a pyrometer 15 is disposed in the middle of the heat dissipation through hole 111 where the second plug 142 is located. Placing two relatively short second plugs 142 can shield the heat dissipation through hole 111 without affecting the pyrometer 15 .

[0044] In some embodiments, the plug 14 has various lengths and specifications, and can be filled in the heat dissipation through hole 111 as needed, and the number of plugs in the heat dissipation through hole 111 can reach three or more. The plugs 14 of different lengths can flexibly fill the heat dissipation through hole 111, so that the heat dissipation through hole 111 is effectively shielded, and the temperature of the reflector 11 area can be more flexibly adjusted.

[0045] In this embodiment, the plug 14 is placed in the heat dissipation through hole 111 to cover part of the opening, thereby adjusting the position of the opening on the reflecting plate 11, and then adjusting the temperature distribution to the most suitable state, so that the reflecting plate 11 can ensure that the temperature of the graphite base and the wafer on the side of the bell jar 12 opposite to the reflecting plate 11 meets the process requirements, while reducing the coating on the inner wall of the bell jar 12 to improve the quality of the product.

[0046] In addition, the heat dissipation through hole 111 and the plug 14 on the reflecting plate 11 can be used to debug the optimal position of the opening of the heat dissipation through hole 111. When the temperature zone distribution of the heat dissipation through hole 111 and the plug 14 on the reflecting plate 11 is adjusted to the optimal allocation scheme, the position where the plug 14 is inserted can be changed to a reflecting plate without a hole, and a reflecting plate without using the plug 14 can be designed according to the allocation scheme.

[0047] In this embodiment, the plug is made of quartz, which has good light transmittance, high temperature resistance, corrosion resistance, and electrical insulation, and is very suitable for use in epitaxial process equipment.

[0048] Figure 6 Schematic diagram of partial enlargement of the epitaxial device provided in the second embodiment of the utility model. Figure 1 Similar, front view schematic diagram and Figure 2 Similar, please also refer to Figure 1 , Figure 2 The epitaxial device includes: a reflector 21, and a plug 24. The reflector 21 has a first surface 210 facing a bell jar 12, and a plurality of lamp tubes 13 are arranged on the first surface 210 of the reflector 21. The reflector 21 has heat dissipation holes 211, and the heat dissipation holes 211 are arranged on both sides of the vertical projection of at least one of the lamp tubes 13 on the reflector 21; the plug 24 can be inserted into the heat dissipation holes 211 to block the heat dissipation holes 211, so as to adjust the heat dissipation capacity of the reflector 21.

[0049] See also Figure 6In this embodiment, the plug 24 includes a body 242 and a head 241, and the size of the head 241 is larger than that of the body 242. Specifically, the plug 24 is in the shape of an elongated strip, wherein the shape of the body 242 is consistent with the heat dissipation through hole 211, so that the plug 24 can be more tightly inserted into the heat dissipation through hole 211 to shield the heat dissipation through hole 211; the maximum width of the head 241 is greater than the maximum width of the body 242, so that the plug 24 can be fixed on the reflector 21 and the plug 24 is more stable in the heat dissipation through hole 211. When the plug 24 is inserted into the heat dissipation through hole 211, the shape of the cross section of the plug 24 perpendicular to the axis of the lamp tube 13 includes an upper and lower part, wherein the upper part of the cross section is located on the upper surface of the reflector 21 and is elliptical in shape, corresponding to the head 241, and the lower part of the cross section is located in the heat dissipation through hole 211 and is trapezoidal in shape, corresponding to the body 242.

[0050] In this embodiment, the heat dissipation through hole 211 is in the shape of a long strip, and the cross section of the heat dissipation through hole 211 perpendicular to the axis of the lamp tube 13 is in the shape of a trapezoid. Figure 4 same.

[0051] Figure 7 Schematic diagram of partial enlargement of the epitaxial device provided in the third embodiment of the utility model. Figure 1 Similar, front view schematic diagram and Figure 2 Similar, please also refer to Figure 1 , Figure 2 .like Figure 7 As shown, the epitaxial device includes: a reflector 31, and a plug 34. The reflector 31 has a first surface 310 facing a bell jar 12, and a plurality of lamp tubes 13 are arranged on the first surface 310 of the reflector 31. The reflector 31 has heat dissipation holes 311, and the heat dissipation holes 311 are arranged on both sides of the vertical projection of at least one of the lamp tubes 13 on the reflector 31; the plug 34 can be inserted into the heat dissipation holes 311 to block the heat dissipation holes 311, so as to adjust the heat dissipation capacity of the reflector 31.

[0052] In this embodiment, the width of the bottom surface 3112 of the heat dissipation hole 311 perpendicular to the axis of the lamp tube is the same as the width of the top surface 3111. Specifically, the heat dissipation hole 311 is a long strip, and the cross section of the heat dissipation hole 311 perpendicular to the axis of the lamp tube 13 is a rectangle.

[0053] In this embodiment, the plug 34 is in the shape of an elongated strip, and includes a body 342 and a head 341, and the size of the head 341 is larger than the size of the body 342. Specifically, when the plug 34 is inserted into the heat dissipation through hole 311, the shape of the cross section of the plug 34 perpendicular to the axis of the lamp tube 13 includes an upper and lower part, wherein the upper part of the cross section is located on the upper surface of the reflector 31 and is elliptical in shape, corresponding to the head 341, and the lower part of the cross section is located in the heat dissipation through hole 311 and is rectangular in shape, corresponding to the body 342. The maximum width of the head 341 is larger than the maximum width of the body 342, as shown in FIG. Figure 7 As shown, the width of the head 341 is greater than the width of the top surface 3111 of the heat dissipation through hole 311, so that the body 342 can be inserted into the heat dissipation through hole 311 and fixed on the reflection plate 31 through the head 341 without falling.

[0054] Figure 8 is a top view schematic diagram of an epitaxial device provided in a fourth embodiment of the utility model, Fig. 9 It is a front view schematic diagram of an epitaxial device provided in the fourth embodiment of the utility model.

[0055] See also Figure 8 , Fig. 9 The epitaxial device includes: a reflector 41, and a plug 14. The reflector 41 has a first surface 410 facing a bell jar 12, and a plurality of lamp tubes 13 are arranged on the first surface 410 of the reflector 41. The reflector 41 has heat dissipation holes 111, and the heat dissipation holes 111 are arranged on both sides of the vertical projection of at least one of the lamp tubes 13 on the reflector 41; the plug 14 can be inserted into the heat dissipation holes 111 to block the heat dissipation holes 111, so as to adjust the heat dissipation capacity of the reflector 41.

[0056] In this embodiment, the reflector 41 is composed of a sub-reflector 4101, a sub-reflector 4102 and a sub-reflector 4103. The sub-reflector 4101 and the sub-reflector 4103 do not include the heat dissipation through-holes 111. Since the wafer is located at the center of the side opposite to the first surface 410 of the reflector 41 during the process, in order to maintain the temperature and increase the etching effect of hydrochloric acid, the sub-reflector 4101 and the sub-reflector 4103 without holes are arranged on both sides of the reflector 41.

[0057] The heat dissipation through hole 111 is arranged on both sides of the vertical projection of the lamp tube 13 on the bottom surface of the sub-reflector 4102, and the heat dissipation through hole 111 is in the shape of a long strip, and the bottom width of the cross section of the heat dissipation through hole 111 perpendicular to the axis of the lamp tube 13 is smaller than the top width, and the shape of the heat dissipation through hole 111 is similar to Figure 3 , Figure 4 The plug 14 is in the shape of an elongated strip, and the length of the plug 14 is less than or equal to the length of the heat dissipation through-hole 111, wherein the plug 14 includes a first plug 141 having a first length, and a second plug 142 having a second length, wherein the first length is greater than the second length. The length of the first plug 141 is smaller than the length of the heat dissipation through-hole 111. In this embodiment, the length of the first plug 141 is 2 mm smaller than the length of the heat dissipation through-hole 111, and one first plug 141 can be inserted into the heat dissipation through-hole 111; the length of the second plug 142 is less than half the length of the heat dissipation through-hole 111, and two second plugs 142 can be placed in the heat dissipation through-hole 111. In this embodiment, a pyrometer 15 is provided in the middle of the heat dissipation through-hole 111 where the second plug 142 is located. Placing two short second plugs 142 can facilitate shielding the heat dissipation through-hole 111 without affecting the pyrometer 15. The shape of the plug 14 is referred to Figure 5 The plug 14 is made of quartz.

[0058] The above technical solution provides an epitaxial device, including a reflector and a plug, wherein the bottom surface of the reflector has a first surface facing a bell jar, the bottom surface of the reflector is provided with a plurality of lamp tubes, the reflector has heat dissipation holes, the heat dissipation holes are provided on both sides of the vertical projection of at least one of the lamp tubes on the reflector, and the plug can be inserted into the heat dissipation hole to block the heat dissipation hole, so as to adjust the heat dissipation capacity of the reflector. By adjusting the distribution of the plugs in the heat dissipation holes, the reflector can ensure that the temperature of the graphite base and the wafer under the bell jar meets the process requirements, while effectively reducing the temperature of the surface of the bell jar, thereby reducing the coating on the inner wall of the bell jar, thereby improving the quality of the product.

[0059] It should be noted that, in this document, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion. The various embodiments in this specification are described in a related manner, and the same and similar parts between the various embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments.

[0060] The above is only a preferred embodiment of the utility model, and is not intended to limit the protection scope of the utility model. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the utility model, and these improvements and modifications should also be regarded as the protection scope of the utility model.

Claims

1. An epitaxial device, characterized in that: include: A reflector, the reflector having a first surface facing a bell jar, the first surface of the reflector being provided with a plurality of lamp tubes, the reflector having heat dissipation through holes, the heat dissipation through holes being provided on both sides of a vertical projection of at least one of the lamp tubes on the reflector; A plug can be inserted into the heat dissipation through hole to block the heat dissipation through hole, so as to adjust the heat dissipation capacity of the reflection plate.

2. The epitaxial device according to claim 1, characterized in that: The first surface of the reflection plate is plated with gold.

3. The epitaxial device according to claim 1, characterized in that: The reflective plate is provided with a base for fixing the lamp tube, and the lamp tube is screwed to the first surface of the reflective plate.

4. The epitaxial device according to claim 1, characterized in that: The width of the bottom surface of the cross section of the heat dissipation through hole perpendicular to the axis of the lamp tube is smaller than the width of the top surface.

5. The epitaxial device according to claim 1, characterized in that: The heat dissipation through hole is in the shape of an elongated strip, the plug is in the shape of an elongated strip, and the length of the plug is less than or equal to the length of the heat dissipation through hole.

6. The epitaxial device according to claim 1, characterized in that: The plug includes a first plug having a first length, and a second plug having a second length, wherein the first length is greater than the second length.

7. The epitaxial device according to claim 6, characterized in that: One first plug can be inserted into the heat dissipation through hole, or a plurality of second plugs can be inserted into the heat dissipation through hole.

8. The epitaxial device according to claim 1, characterized in that: The material of the plug is quartz.

9. The epitaxial device according to claim 1, characterized in that: The width of the bottom surface of the cross section of the heat dissipation through hole perpendicular to the axis of the lamp tube is the same as the width of the top surface.

10. The epitaxial device according to claim 1, characterized in that: The plug includes a body and a head, the size of the head being larger than the size of the body.

11. The epitaxial device according to claim 1, characterized in that: The reflective plate is formed by splicing a sub-reflective plate including the heat dissipation through holes and a sub-reflective plate not including the heat dissipation through holes.

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