Bonding tool of semiconductor module

Abstract

The utility model relates to the technical field of semiconductor modules, and discloses a bonding tool of a semiconductor module, which comprises a supporting device and a positioning device, the supporting device comprises a fixing frame, a workbench is fixedly arranged at the tops of four connecting columns, four supporting columns are arranged in the middle of the top of the workbench, and the positioning device is arranged on the fixing frame. A heat conduction compression spring is arranged in the middle of the interior of the supporting column, a heat conduction pressing plate is fixedly installed at the top of the heat conduction compression spring, a heater is arranged in the middle of the interior of the workbench, a vapor chamber is fixedly installed at the tops of the four second-section heat conduction rods, and the positioning device comprises fixing blocks arranged on the left side and the right side of the vapor chamber at the top of the workbench; sliding grooves are formed in the fixing blocks correspondingly, positioning rods are arranged in the sliding grooves correspondingly, rotating shafts are arranged at the tops of the positioning rods correspondingly, and positioning plates are rotationally connected to the tops of the rotating shafts. According to the bonding tool of the conductor module, worn parts of the positioning device can be rapidly replaced, and the bonding tool is convenient for a user to use.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor modules, in particular to a bonding tool for a semiconductor module. Background Art

[0002] The bonding tooling for semiconductor modules is a special tooling used for the bonding process in the manufacturing process of semiconductor devices. In the semiconductor industry, the bonding process is one of the key steps to connect the semiconductor chip to the packaging substrate or lead. This process requires high-precision positioning, temperature and pressure control to ensure the quality and reliability of the bonding.

[0003] The positioning devices in the bonding tooling of semiconductor modules currently on the market are easily affected by factors such as mechanical wear when the semiconductor modules are fixed again and again, which may lead to low positioning accuracy of the semiconductor chip and the packaging substrate, affecting the accuracy of bonding. The positioning devices are often fixed on the workbench by bolts or welded, which is inconvenient to replace. Therefore, a bonding tooling for semiconductor modules is proposed to solve the above problems. Utility Model Content

[0004] 1. Technical issues to be solved

[0005] In view of the deficiencies in the prior art, the utility model provides a bonding tool for a semiconductor module, which has the advantages of convenient disassembly and replacement of bonding components, etc., and solves the problem that the positioning device in the bonding tool for semiconductor modules currently on the market is easily affected by factors such as mechanical wear when the semiconductor module is repeatedly fixed. This may result in low positioning accuracy of the semiconductor chip and the packaging substrate, affecting the accuracy of the bonding, and the positioning device is often fixed on the workbench by fixing bolts or welding, which makes it inconvenient to replace.

[0006] (II) Technical solution

[0007] In order to achieve the above-mentioned purpose of conveniently disassembling and replacing the bonding components, the utility model provides the following technical solutions:

[0008] A bonding tool for a semiconductor module, comprising a supporting device and a positioning device, wherein the positioning device is arranged on the supporting device;

[0009] The support device comprises a fixed frame, four connecting columns are fixedly installed on the top of the fixed frame, a workbench is fixedly installed on the top of the four connecting columns, four supporting columns are arranged in the middle of the top of the workbench, a heat-conducting compression spring is arranged in the middle of the support column, a heat-conducting pressure plate is fixedly installed on the top of the heat-conducting compression spring, a heater is arranged in the middle of the workbench, a first section of heat-conducting rod is arranged between the supporting column and the heater, the first section of the heat-conducting rod is connected to the bottom of the heat-conducting compression spring, a second section of heat-conducting rod is fixedly installed on the top of the heat-conducting pressure plate, and a heat-spreading plate is fixedly installed on the top of the four second section of the heat-conducting rods;

[0010] The positioning device includes fixed blocks arranged on the left and right sides of the heat spreader on the top of the workbench, the fixed blocks are provided with slide grooves, the slide grooves are provided with positioning rods, the tops of the positioning rods are provided with rotating shafts, and the tops of the rotating shafts are rotatably connected to the positioning plates.

[0011] As a preferred technical solution of the utility model, the heat-conducting pressure plate is slidably connected to the inner wall of the support column, and the support column is fixedly installed on the top of the workbench.

[0012] As a preferred technical solution of the utility model, a plurality of positioning plates are arranged in the middle of the top of the heat spreader, and baffles are fixedly installed on the outer edge of the top of the heat spreader.

[0013] As a preferred technical solution of the utility model, the fixing block is L-shaped, and a positioning bolt is inserted into the outer wall of one end of the fixing block away from the heat spreader, and a pull ring is fixedly installed on one end of the positioning bolt away from the fixing block.

[0014] As a preferred technical solution of the utility model, a plurality of limiting grooves are provided on the outer wall of the positioning plate, and the positioning bolt fixes the positioning rod inside the sliding groove through the limiting grooves.

[0015] As a preferred technical solution of the utility model, a soft pad is fixedly installed on the bottom of the positioning plate, and the positioning plate is rotatably connected to the workbench through a rotating shaft.

[0016] (III) Beneficial effects

[0017] Compared with the prior art, the utility model provides a bonding tool for a semiconductor module, which has the following beneficial effects:

[0018] The bonding tooling of the semiconductor module can provide the required temperature control during the bonding process through the thermally conductive compression spring, heater, thermally conductive rod, heat spreader and other components inside the support column. At the same time, the thermally conductive compression spring can provide a certain buffering effect for the semiconductor module placed on the heat spreader. The baffles around the heat spreader and the positioning plate in the middle can provide simple limiting for the semiconductor module during the bonding process, which is convenient for users.

[0019] The bonding tooling of the semiconductor module can adjust the clamping height of the positioning device to adapt to different semiconductor modules by providing components such as a fixing block, a positioning rod, a positioning plate, and a positioning bolt. At the same time, the rotating shaft can allow the positioning plate to rotate to reduce obstacles to the installation of the semiconductor module. The positioning bolt can fix the positioning rod and release the positioning rod at the same time, making it easy to replace the positioning rod and the positioning components thereon, thereby facilitating use by users. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the structure of the utility model;

[0021] Figure 2 It is an enlarged view of part A in the utility model;

[0022] Figure 3 It is a top schematic diagram of the structure of the utility model.

[0023] In the figure: 1. fixing frame; 2. connecting column; 3. working table; 4. supporting column; 5. heat-conducting compression spring; 6. heat-conducting pressure plate; 7. heater; 8. heat-conducting rod; 9. heat spreader; 10. fixing block; 11. slide groove; 12. positioning rod; 13. rotating shaft; 14. positioning plate; 15. positioning plate; 16. positioning bolt; 17. cushion. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] In the description of the present invention, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0026] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] See also Figure 1-3 A semiconductor module bonding tool, comprising a supporting device and a positioning device, wherein the positioning device is arranged on the supporting device, the supporting device comprises a fixing frame 1, wherein four connecting columns 2 are fixedly installed on the top of the fixing frame 1, a workbench 3 is fixedly installed on the top of the four connecting columns 2, four supporting columns 4 are arranged in the middle of the top of the workbench 3, a heat-conducting compression spring 5 is arranged in the middle of the supporting column 4, a heat-conducting pressure plate 6 is fixedly installed on the top of the heat-conducting compression spring 5, a heater 7 is arranged in the middle of the workbench 3, and a heat-conducting pressure plate 6 is fixedly installed on the top of the heat-conducting compression spring 5. A first section heat-conducting rod 8 is provided, which is connected to the bottom of the heat-conducting compression spring 5. A second section heat-conducting rod 8 is fixedly installed on the top of the heat-conducting pressure plate 6. A heat-spreading plate 9 is fixedly installed on the top of the four second section heat-conducting rods 8. The positioning device includes fixed blocks 10 arranged on the left and right sides of the heat-spreading plate 9 on the top of the workbench 3. A slide groove 11 is opened inside the fixed block 10. A positioning rod 12 is arranged inside the slide groove 11. A rotating shaft 13 is arranged on the top of the positioning rod 12. A positioning plate 14 is rotatably connected to the top of the rotating shaft 13.

[0028] In this embodiment, the heat-conducting pressure plate 6 is slidably connected to the inner wall of the support column 4 , and the support column 4 is fixedly installed on the top of the workbench 3 .

[0029] It should be noted that the heat-conducting pressure plate 6 can conveniently compress the heat-conducting compression spring 5 , so as to facilitate buffering when the semiconductor module is placed on the heat spreader 9 .

[0030] In this embodiment, a plurality of positioning plates 15 are arranged in the middle of the top of the heat spreader 9 , and baffles are fixedly installed on the outer edges of the top of the heat spreader 9 .

[0031] It should be noted that the positioning plate 15 can place the semiconductor module in a suitable position, and the baffle can simply limit the semiconductor module to prevent it from detaching from the heat spreader 9 .

[0032] In this embodiment, the fixing block 10 is L-shaped, and a positioning bolt 16 is inserted into the outer wall of one end of the fixing block 10 away from the heat spreader 9 , and a pull ring is fixedly installed on one end of the positioning bolt 16 away from the fixing block 10 .

[0033] It should be noted that the pull ring can facilitate the installation and removal of the positioning bolt 16.

[0034] In this embodiment, a plurality of limiting grooves are formed on the outer wall of the positioning rod 12 , and the positioning bolt 16 fixes the positioning rod 12 inside the sliding groove 11 through the limiting grooves.

[0035] It should be noted that the positioning bolt 16 can quickly fix the positioning rod 12 .

[0036] In this embodiment, a soft pad 17 is fixedly installed on the bottom of the positioning plate 14 , and the positioning plate 14 is rotatably connected to the workbench 3 via the rotating shaft 13 .

[0037] It should be noted that the soft pad 17 can reduce the wear of the contact surface of the positioning device on the semiconductor module.

[0038] To sum up, the bonding tooling of the semiconductor module can provide the required temperature control during the bonding process through the heat-conducting compression spring 5, heater 7, heat-conducting rod 8, heat spreader 9 and other components inside the support column 4. At the same time, the heat-conducting compression spring 5 can provide a certain buffering effect for the semiconductor module placed on the heat spreader 9. The baffles around the heat spreader 9 and the positioning plate 15 in the middle can provide simple limiting for the semiconductor module during the bonding process. Then, by setting components such as the fixing block 10, the positioning rod 12, the positioning plate 14, and the positioning bolt 16, the clamping height of the positioning device can be adjusted to adapt to different semiconductor modules. At the same time, the rotating shaft 13 can allow the positioning plate 14 to rotate to reduce obstacles to the installation of the semiconductor module. The positioning bolt 16 can fix the positioning rod 12 and release the positioning rod 12 at the same time, which is convenient for replacing the positioning rod 12 and the positioning components thereon, which is convenient for users to use.

[0039] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A bonding tool for a semiconductor module, comprising a supporting device and a positioning device, wherein the positioning device is arranged on the supporting device; Features: The support device comprises a fixed frame (1), four connecting columns (2) are fixedly installed on the top of the fixed frame (1), a workbench (3) is fixedly installed on the top of the four connecting columns (2), four supporting columns (4) are arranged in the middle of the top of the workbench (3), a heat-conducting compression spring (5) is arranged in the middle of the support column (4), a heat-conducting pressure plate (6) is fixedly installed on the top of the heat-conducting compression spring (5), a heater (7) is arranged in the middle of the workbench (3), a first section of heat-conducting rod (8) is arranged between the support column (4) and the heater (7), the first section of the heat-conducting rod (8) is connected to the bottom of the heat-conducting compression spring (5), a second section of heat-conducting rod (8) is fixedly installed on the top of the heat-conducting pressure plate (6), and a heat-spreading plate (9) is fixedly installed on the top of the four second section of the heat-conducting rods (8); The positioning device comprises fixed blocks (10) arranged on the left and right sides of the heat spreader (9) at the top of the workbench (3), the fixed blocks (10) are provided with slide grooves (11) inside, the slide grooves (11) are provided with positioning rods (12) inside, the tops of the positioning rods (12) are provided with rotating shafts (13), and the tops of the rotating shafts (13) are rotatably connected with positioning plates (14).

2. A semiconductor module bonding tool according to claim 1, characterized in that: The heat-conducting pressure plate (6) is slidably connected to the inner wall of the support column (4), and the support column (4) is fixedly mounted on the top of the workbench (3).

3. The bonding tool for a semiconductor module according to claim 1, characterized in that: A plurality of positioning plates (15) are arranged in the middle of the top of the heat spreader (9), and baffles are fixedly installed on the outer edge of the top of the heat spreader (9).

4. The semiconductor module bonding tool according to claim 1, characterized in that: The fixing block (10) is L-shaped, and a positioning bolt (16) is inserted into the outer wall of one end of the fixing block (10) away from the heat spreader (9), and a pull ring is fixedly installed on one end of the positioning bolt (16) away from the fixing block (10).

5. The semiconductor module bonding tool according to claim 4, characterized in that: The outer wall of the positioning rod (12) is provided with a plurality of limiting grooves, and the positioning bolt (16) fixes the positioning rod (12) inside the sliding groove (11) through the limiting grooves.

6. The semiconductor module bonding tool according to claim 1, characterized in that: A soft pad (17) is fixedly mounted on the bottom of the positioning plate (14), and the positioning plate (14) is rotatably connected to the workbench (3) via a rotating shaft (13).

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