Semiconductor wafer back side clamping and cleaning device
By designing a semiconductor wafer back clamping cleaning device, the clamping assembly and rotary cleaning assembly are used to directly clean the back of the wafer, solving the problem of damage to the front of the wafer by wet wet cleaning technology, achieving higher finished product yield and lower surface array loss.
Patent Information
- Application Number
- CN202421138186.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-22
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2034-05-22
AI Technical Summary
In the prior art, when wet impregnation cleaning technology is used to remove the fluid thermal conductivity medium on the back side of the semiconductor wafer, it is easy to cause damage to the front of the wafer, resulting in a decrease in photoresist loss and a reduction in finished product yield.
A semiconductor wafer back clamping cleaning device is designed to fix the wafer by clamping components, and the back side of the wafer is directly rotated and cleaned using a rotating table and cleaning stick to avoid wet impregnation and cleaning.
This device can effectively clean the back side of the wafer without damaging the front photoresist, reduce the necessity of the secondary photolithography process, reduce the surface array loss, and improve the finished product yield of the semiconductor wafer.
Smart Images
Figure CN222546309U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor wafer cleaning, in particular to a semiconductor wafer back side clamping and cleaning device. Background Art
[0002] In the process of preparing large-scale integrated circuits on semiconductor wafers, dry etching is one of the important production processes. In order to control the temperature of the wafer dry etching process, fluid heat conduction medium is often used as a filler between the back of the wafer and the carrier to improve the thermal conductivity between the wafer and the carrier under low pressure and control the actual temperature of the wafer during the dry etching process.
[0003] After the dry etching is completed, the fluid heat-conducting medium filled on the back side of the wafer needs to be removed. The existing method for removing the fluid heat-conducting medium mostly adopts wet immersion cleaning technology to immerse and clean the wafer to achieve the purpose of removing the fluid heat-conducting medium; however, when this method is used to clean the wafer, the photoresist on the front side of the wafer will be damaged. After the cleaning is completed, a secondary photolithography process is required, which is easy to cause surface array loss on the wafer and reduce the finished product yield of the semiconductor wafer. Utility Model Content
[0004] To this end, the technical problem to be solved by the utility model is to overcome the problem in the prior art that when the fluid heat-conducting medium on the back side of the semiconductor wafer is removed by wet immersion cleaning technology, the front side of the semiconductor wafer is easily damaged. A semiconductor wafer back side clamping and cleaning device is provided to directly clean the back side of the wafer, eliminating the need for wet immersion cleaning, and retaining the photoresist on the front side of the semiconductor wafer, so that the semiconductor wafer can be directly processed in the relevant process steps after etching, thereby reducing the surface array loss of the semiconductor wafer caused by the secondary photolithography process and improving the yield of semiconductor wafer products.
[0005] In order to solve the above technical problems, the utility model provides a semiconductor wafer back side clamping and cleaning device, comprising:
[0006] A clamping assembly, comprising a bracket and two clamping arms arranged on the bracket, each of the clamping arms having a clamping claw at the end thereof, the two clamping claws cooperate to clamp and support the semiconductor wafer so that the semiconductor wafer is arranged horizontally with the back side facing downward;
[0007] A cleaning component is arranged below the clamping arm, and includes a rotating table and a cleaning table arranged on the rotating table. A cleaning paste is arranged on a side of the cleaning table facing the clamping arm, and the cleaning paste contacts the back side of the semiconductor wafer. The cleaning paste rotates and cleans the back side of the semiconductor wafer when driven by the rotating table.
[0008] In one embodiment of the utility model, the clamping assembly also includes: a telescopic connection part, one end of the telescopic connection part is connected to the bracket, and the other end of the telescopic connection part is connected to the two clamping arms, and the telescopic connection part can be telescopically adjusted in length, thereby changing the height of the clamping claw.
[0009] In one embodiment of the utility model, the two clamping arms are connected to the telescopic connection part by pivoting, and the distance between the two clamping claws can be adjusted by adjusting the relative opening and closing angle between the two clamping arms.
[0010] In an embodiment of the present invention, the claws are made of flexible material.
[0011] In one embodiment of the present invention, the clamping claw has a multi-tooth structure, and a limiting groove for clamping the semiconductor wafer is formed between two adjacent teeth.
[0012] In one embodiment of the present invention, the rotating platform comprises: a rotating driving source and a base connected to an output end of the rotating driving source, and the cleaning platform is fixed on the base.
[0013] In an embodiment of the present invention, the base and the cleaning table are both made of stainless steel.
[0014] In one embodiment of the utility model, one end of the cleaning table contacts the center of the semiconductor wafer, and the other end of the cleaning table contacts the edge of the semiconductor wafer. The cleaning table revolves around the center of the semiconductor wafer driven by the rotating table.
[0015] In one embodiment of the utility model, one side of the cleaning patch is an adhesive-backed side, and the other side of the cleaning patch is a velvet-rich side.
[0016] In one embodiment of the present invention, a cleaning agent is coated on a surface of the cleaning paste that contacts the back side of the semiconductor wafer.
[0017] The above technical solution of the utility model has the following advantages compared with the prior art:
[0018] The semiconductor wafer back side clamping and cleaning device of the utility model can directly clean the back side of the semiconductor wafer after fixing the semiconductor wafer, eliminating the need for wet immersion cleaning, and can retain the photoresist on the front side of the semiconductor wafer, so that the semiconductor wafer can be directly processed in the relevant process steps after etching, thereby reducing the wafer surface array loss caused by the secondary photolithography process and improving the semiconductor wafer product yield;
[0019] Furthermore, the cleaning device of the present application, after clamping and fixing the semiconductor wafer, cleans the back side of the semiconductor wafer in a revolution manner, thereby ensuring the comprehensiveness and completeness of the back side cleaning, and effectively preventing the relative stillness of the semiconductor wafer that may be caused by the rotation of the cleaning table driving the semiconductor wafer to rotate, thereby avoiding the problem of incomplete cleaning of the back of the semiconductor wafer caused by this. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to make the content of the utility model easier to understand, the utility model is further described in detail according to the specific embodiments of the utility model in combination with the accompanying drawings, wherein:
[0021] Figure 1 It is a schematic diagram of the overall structure of the semiconductor wafer backside clamping and cleaning device of the utility model;
[0022] Figure 2 It is a structural schematic diagram of the clamping assembly of the utility model;
[0023] Figure 3 It is a structural schematic diagram of the cleaning component of the utility model.
[0024] Explanation of the reference numerals in the specification: 1. bracket; 2. clamping arm; 3. claw; 31. teeth; 32. limiting groove; 4. rotating table; 41. rotating driving source; 42. base; 5. cleaning table; 6. cleaning sticker; 7. telescopic connection part; 100. semiconductor wafer. DETAILED DESCRIPTION
[0025] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.
[0026] Reference Figure 1As shown, the utility model discloses a semiconductor wafer back side clamping and cleaning device, comprising: a clamping assembly and a cleaning assembly, wherein: the clamping assembly comprises: a bracket 1 and two clamping arms 2, one end of the two clamping arms 2 is arranged on the bracket 1, and the other end of the two clamping arms 2 extends outward to form a clamping space, and a clamping claw 3 is arranged at the end of each clamping arm 2, and the clamping claw 3 is arranged on the inner side of the clamping arm 2, and the two clamping claws 3 are arranged correspondingly, and the two clamping claws 3 can be clamped on both sides of the semiconductor wafer 100 respectively, and the semiconductor wafer 100 is clamped and fixed from the edge by the two clamping claws 3, The semiconductor wafer 100 is arranged horizontally, with the front and back sides of the semiconductor wafer 100 exposed, and when clamped, the back side of the semiconductor wafer 100 is limited to face downward; the cleaning component is arranged below the clamping arm 2, and the cleaning component includes a rotating table 4 and a cleaning table 5 arranged on the rotating table 4, and a cleaning sticker 6 is arranged on the side of the cleaning table 5 facing the clamping arm 2, and the cleaning sticker 6 can contact the back side of the semiconductor wafer 100. When the rotating table 4 drives the cleaning table 5 to rotate, the cleaning sticker 6 rotates and cleans the back side of the semiconductor wafer 100.
[0027] The semiconductor wafer backside clamping and cleaning device described in this embodiment directly cleans the backside of the semiconductor wafer 100 after fixing the semiconductor wafer 100, eliminating the need for wet immersion cleaning, and can retain the photoresist on the front side of the semiconductor wafer 100, so that the semiconductor wafer 100 can be directly processed in related process steps after etching, thereby reducing the surface array loss of the semiconductor wafer 100 caused by the secondary photolithography process and improving the product yield of the semiconductor wafer 100;
[0028] Furthermore, the cleaning device of the present application, after clamping and fixing the wafer, cleans the back side of the semiconductor wafer 100 by revolving around the center of the semiconductor wafer 100, thereby ensuring the comprehensiveness and completeness of the back side cleaning, and effectively preventing the relative stillness of the semiconductor wafer 100 that may be caused by the rotation of the cleaning table 5 driving the semiconductor wafer 100 to rotate, thereby avoiding the problem of incomplete cleaning of the back of the semiconductor wafer 100 caused by this.
[0029] Reference Figure 2 As shown, the clamping assembly is further provided with: a telescopic connection part 7, one end of the telescopic connection part 7 is connected to the bracket 1, and the other end of the telescopic connection part 7 is connected to the two clamping arms 2, and the telescopic connection part 7 can telescope and adjust its own length, thereby changing the height of the claw 3, so that the claw 3 can be tightly attached to the cleaning table 5 after clamping the semiconductor wafer 100.
[0030] Specifically, the telescopic connection part 7 can be an automatic telescopic part, such as a hydraulic cylinder, an electric telescopic rod, etc. These existing telescopic mechanisms can meet the telescopic function and can adjust the height of the clamping claw, which will not be described in detail here; the telescopic connection part 7 can also be a mechanical adjustment structure with threaded rotation. The telescopic connection part 7 is arranged to be rotatably connected to the bracket 1 through a threaded interface. The height of the clamping claw 3 can be quickly adjusted by rotating the telescopic connection part 7. This technical solution is more applicable in this embodiment, which can not only reduce costs but also facilitate adjustment.
[0031] Specifically, in order to improve the application scope of the cleaning device of the utility model, in this embodiment, the two clamping arms 2 are connected to the telescopic connection part 7 by pivot rotation, and the relative opening and closing angle between the two clamping arms 2 can be adjusted to adjust the distance between the two claws 3. By adjusting the distance between the two claws 3, it can be suitable for clamping semiconductor wafers 100 of different sizes.
[0032] Specifically, in actual use, in order to prevent the clamped semiconductor wafer 100 from shaking up and down, the semiconductor wafer 100 needs to be limited and fixed. In this embodiment, the clamping claw 3 is provided with a multi-tooth 31 structure, and a limiting groove 32 for clamping the semiconductor wafer 100 is formed between two adjacent teeth 31. The semiconductor wafer 100 is embedded in the limiting groove 32, which can effectively prevent the semiconductor wafer 100 from sliding and falling off.
[0033] Furthermore, fixing the semiconductor wafer 100 by means of the teeth 31 can ensure that the contact area with the semiconductor wafer 100 is minimized, thereby ensuring a cleaning effect.
[0034] Furthermore, in actual use, in order to prevent the semiconductor wafer 100 from being pinched by the claw 3, the claw 3 is made of a flexible material, such as a rubber material, so that the claw 3 has a certain elastic support when in contact with the semiconductor wafer 100, thereby preventing the semiconductor wafer 100 from being damaged by rigid contact.
[0035] Reference Figure 3 As shown, the rotating table 4 includes: a rotating driving source 41 and a base 42 connected to the output end of the rotating driving source 41, the output end of the rotating driving source 41 is vertically upward, the base 42 is horizontally arranged at the output end of the rotating driving source 41, and the cleaning table 5 is fixed on the base 42.
[0036] In order to ensure that the cleaning sticker 6 on the cleaning table 5 can clean the back side of the entire semiconductor wafer 100, one end of the cleaning table 5 contacts the center of the semiconductor wafer 100, and the other end of the cleaning table 5 contacts the edge of the semiconductor wafer 100. The cleaning table 5 revolves around the center of the semiconductor wafer 100 driven by the rotating table 4, so that after the cleaning table 5 rotates, the cleaning sticker 6 can cover the entire semiconductor wafer 100.
[0037] In actual use, in order to facilitate replacement of the cleaning table 5 , the cleaning table 5 is detachably fixed to the base 42 by bolts. When cleaning semiconductor wafers 100 of different types, cleaning tables 5 of different sizes can be replaced.
[0038] Specifically, one side of the cleaning patch 6 is a backing adhesive surface, and the other side of the cleaning patch 6 is a velvet-rich surface. The backing adhesive surface can be attached to the cleaning table 5. On the one hand, the velvet-rich surface can flexibly contact the semiconductor wafer 100 to prevent damage to the semiconductor wafer 100. On the other hand, when cleaning, it is necessary to coat the cleaning agent on the side of the cleaning patch 6 that contacts the back side of the semiconductor wafer 100. The velvet-rich surface is more conducive to the adsorption of the cleaning agent and can achieve a better cleaning effect.
[0039] It should be noted that the cleaning device of the present application adopts an inverted cleaning method to clean the back side of the semiconductor wafer 100 from below, and the cleaning liquid flows downward under the action of gravity, and will not cause pollution to the front side of the semiconductor wafer 100;
[0040] Specifically, in this embodiment, the base 42 and the cleaning table 5 are both made of stainless steel, which is not easily corroded after long-term use.
[0041] Obviously, the above embodiments are merely examples for the purpose of clear explanation and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention of the utility model.
Claims
1. A semiconductor wafer backside clamping and cleaning device, characterized in that: include: A clamping assembly, comprising a bracket and two clamping arms arranged on the bracket, each of the clamping arms having a clamping claw at the end thereof, the two clamping claws cooperate to clamp and support the semiconductor wafer so that the semiconductor wafer is arranged horizontally with the back side facing downward; A cleaning component is arranged below the clamping arm, and includes a rotating table and a cleaning table arranged on the rotating table. A cleaning paste is arranged on a side of the cleaning table facing the clamping arm, and the cleaning paste contacts the back side of the semiconductor wafer. The cleaning paste rotates and cleans the back side of the semiconductor wafer when driven by the rotating table.
2. The semiconductor wafer backside clamping and cleaning device according to claim 1, characterized in that: The clamping assembly also includes: a telescopic connection part, one end of which is connected to the bracket, and the other end of which is connected to the two clamping arms. The telescopic connection part can be telescopically adjusted in length, thereby changing the height of the clamping claw.
3. The semiconductor wafer backside clamping and cleaning device according to claim 2, characterized in that: The two clamping arms are connected to the telescopic connection part by pivoting, and the distance between the two clamping claws can be adjusted by adjusting the relative opening and closing angle between the two clamping arms.
4. The semiconductor wafer backside clamping and cleaning device according to claim 1, characterized in that: The clamping claw is made of flexible material.
5. The semiconductor wafer backside clamping and cleaning device according to claim 1, characterized in that: The clamping claw has a multi-tooth structure, and a limiting groove for clamping the semiconductor wafer is formed between two adjacent teeth.
6. The semiconductor wafer backside clamping and cleaning device according to claim 1, characterized in that: The rotating platform comprises: a rotating driving source and a base connected to an output end of the rotating driving source, and the cleaning platform is fixed on the base.
7. The semiconductor wafer backside clamping and cleaning device according to claim 6, characterized in that: The base and the cleaning table are both made of stainless steel.
8. The semiconductor wafer backside clamping and cleaning device according to claim 1, characterized in that: One end of the cleaning platform contacts the center of the semiconductor wafer, and the other end of the cleaning platform contacts the edge of the semiconductor wafer. The cleaning platform revolves around the center of the semiconductor wafer driven by the rotating platform.
9. The semiconductor wafer backside clamping and cleaning device according to claim 1, characterized in that: One side of the cleaning patch is an adhesive backing surface, and the other side of the cleaning patch is a velvet-rich surface.
10. The semiconductor wafer backside clamping and cleaning device according to claim 1, characterized in that: A cleaning agent is coated on the side of the cleaning paste that contacts the back side of the semiconductor wafer.