Heat dissipation structure, power single tube mounting structure and electronic equipment

Abstract

The utility model provides a heat dissipation structure, a power single tube installation structure and electronic equipment, and relates to the field of electrical technology. The heat dissipation structure comprises an insulation heat conduction structure and a radiator, the insulation heat conduction structure comprises a first face and a second face which are oppositely arranged, the first face of the insulation heat conduction structure is attached to the radiator, the second face of the insulation heat conduction structure is used for being attached to a part to be cooled, and a positioning structure is arranged between the insulation heat conduction structure and the radiator. The two parts, located on the two sides of any set plane, of the positioning structure are asymmetrically arranged relative to the set plane, and the set plane intersects with the positioning structure and forms a preset included angle with the first face. The positioning structure can realize relative position positioning of the insulating heat-conducting structure and the radiator, avoids reverse installation of the first surface and the second surface, is beneficial to ensuring the insulating heat-conducting performance of a to-be-cooled part such as a power single tube and the radiator through the insulating heat-conducting structure, ensures the heat dissipation performance of the to-be-cooled part, improves the use performance of the to-be-cooled part, and is high in practicability.

Description

Technical Field

[0001] The utility model relates to the field of electrical technology, in particular to a heat dissipation structure, a power single-tube installation structure and electronic equipment. Background Art

[0002] In the field of electrical technology, some components have heat dissipation requirements. For example, in the inverter circuit of the inverter, there are usually a large number of power tubes, such as MOS tubes (Metal-Oxide-Semiconductor Field-Effect Transistor). The power tubes need to be electrically connected to the circuit board and also need to be cooled. For example, the power tubes are in contact with the heat sink for heat dissipation. An insulating pad is usually provided between the power tubes and the heat sink. The insulating pads are provided with heat conduction areas for heat conduction on one side or both sides along the thickness direction, and the heat conduction areas are used to ensure the heat conduction and heat dissipation performance of the power tubes.

[0003] However, the shape of the insulating pad is usually rectangular. When installing a single power tube, the heat conduction area is easily misplaced. When the heat conduction area is misplaced, it will affect the thermal contact area, affect the heat dissipation performance of the single tube, and further affect the performance of the single tube. Utility Model Content

[0004] The utility model aims to solve the problem of how to ensure the heat dissipation performance of a single-tube heat dissipation element to be cooled and improve the use performance of the heat dissipation element to be cooled in the related technology to a certain extent.

[0005] In order to solve at least one aspect of the above-mentioned problems to at least a certain extent, in a first aspect, the utility model provides a heat dissipation structure, including an insulating heat-conducting structure and a heat sink, the insulating heat-conducting structure including a first surface and a second surface arranged opposite to each other, the first surface of the insulating heat-conducting structure is fitted with the heat sink, the second surface of the insulating heat-conducting structure is used to fit with the heat dissipation component to be dissipated, a positioning structure is arranged between the insulating heat-conducting structure and the heat sink, the two parts of the positioning structure located on both sides of any set plane are asymmetrically arranged with respect to the set plane, and the set plane is a plane intersecting with the positioning structure and forming a preset angle with the first surface.

[0006] Optionally, the positioning structure includes a mounting groove and a plug-in structure connected in a plug-in manner, the mounting groove is arranged on the heat sink, and the lower end of the insulating heat-conducting structure forms the plug-in structure.

[0007] Optionally, the positioning structure further comprises a sub-positioning structure, and the sub-positioning structure comprises a convex portion and a concave portion matching each other;

[0008] One of the protrusion and the recessed portion is arranged in the installation groove so that the two parts of the installation groove located on both sides of any set plane are asymmetrically arranged with respect to the set plane, and the other of the protrusion and the recessed portion is arranged in the plug-in structure of the insulating heat-conducting structure.

[0009] Optionally, one of the protrusion and the recess is disposed at a circumferential edge of the mounting groove, and the other of the protrusion and the recess is disposed at a circumferential edge of the plug-in structure of the insulating heat-conducting structure.

[0010] Optionally, when the convex portion is provided on the circumferential edge of the mounting groove, the convex portion is provided on the circumferential side wall of the mounting groove to protrude toward the inside of the mounting groove, and the concave portion is provided on the circumferential outer wall of the insulating heat-conducting structure to be concave toward the inside of the insulating heat-conducting structure;

[0011] When the recessed portion is provided at the circumferential edge of the mounting groove, the recessed portion is recessed at the circumferential side wall of the mounting groove toward the outside of the mounting groove, and the raised portion is raised at the circumferential outer wall of the insulating heat-conducting structure toward the outside of the insulating heat-conducting structure.

[0012] Optionally, the cross-section of the mounting groove is rectangular, the mounting groove is symmetrically arranged with respect to two symmetric planes, the two symmetric planes are two set planes perpendicular to each other, and the two symmetric planes divide the mounting groove into four areas;

[0013] Wherein, an odd number of the regions are correspondingly provided with the sub-positioning structures;

[0014] Alternatively, the two areas located at diagonally opposite corners are respectively provided with the sub-positioning structures, and the sub-positioning structures are arranged non-centrally symmetrically with respect to the center of the rectangle;

[0015] Alternatively, the sub-positioning structures are correspondingly arranged at two adjacent areas, and the sub-positioning structures corresponding to the two areas are asymmetrically arranged with respect to the symmetry plane between the two areas.

[0016] Optionally, there are multiple mounting slots on the heat sink.

[0017] Optionally, at least two of the installation slots are connected in a set area, and the sub-positioning structures corresponding to the different connected installation slots are all located outside the set area.

[0018] Optionally, the heat dissipation element is pressed onto the heat sink by a pressing element, and the pressing element is detachably connected to the heat sink;

[0019] And / or, both the first surface and the second surface of the insulating heat-conducting structure are provided with heat-conducting areas, and a projection of the heat-conducting area of ​​the first surface on the second surface falls outside the coverage of the heat-conducting area of ​​the second surface.

[0020] In the second aspect, the utility model provides a power single tube installation structure, including a power single tube, a circuit board and the heat dissipation structure as described in the first aspect above, the power single tube is attached to the second surface of the insulating heat conductive structure of the heat dissipation structure, and the first surface of the insulating heat conductive structure is pressed against the heat sink of the heat dissipation structure, and the power single tube is electrically connected to the circuit board.

[0021] In a third aspect, the utility model provides an electronic device, comprising the heat dissipation structure as described in the first aspect above, and / or, comprising the power single tube installation structure as described in the second aspect above.

[0022] Compared with the related prior art, in the heat dissipation structure, power single tube mounting structure and electronic device of the utility model, the first surface of the insulating heat conductive structure is bonded to the heat sink, the second surface of the insulating heat conductive structure opposite to the first surface is used to bond to the heat dissipation component, and a positioning structure is arranged between the insulating heat conductive structure and the heat sink, and the two parts of the positioning structure located on both sides of any set plane are asymmetrically arranged with respect to the set plane, and the set plane is a plane intersecting with the positioning structure and forming a preset angle with the first surface, that is, the positioning structure does not have a set plane that makes it constitute an axisymmetric structure, and the positioning structure does not constitute an axisymmetric structure in any direction parallel to the first surface. Therefore, the setting of the positioning structure can realize the relative position positioning of the insulating heat conductive structure and the heat sink and obtain a foolproof effect, so that the insulating heat conductive structure can only be bonded to the heat sink in a preset posture, avoiding the first surface and the second surface from being installed reversely, thereby ensuring the insulating heat conductive performance of the first surface of the insulating heat conductive structure when it contacts the heat sink, which is beneficial to ensure the insulating heat conductive performance of the heat dissipation component to be cooled, such as the power single tube, through the insulating heat conductive structure and the heat sink, ensuring the heat dissipation performance of the heat dissipation component to be cooled, and improving the use performance of the heat dissipation component to be cooled, with a simple structure and strong practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of the heat dissipation structure in an embodiment of the utility model;

[0024] Figure 2 for Figure 1 A partial enlarged view of the middle A;

[0025] Figure 3 for Figure 1 A schematic diagram of the structure of the solution shown in the figure after removing the heat dissipation parts and the pressing parts;

[0026] Figure 4 for Figure 3 A partial enlarged view of point B in the middle;

[0027] Figure 5 This is a structural schematic diagram of a heat sink provided with a mounting groove in an embodiment of the utility model;

[0028] Figure 6 for Figure 5 A partial enlarged view of point C in the middle;

[0029] Figure 7 for Figure 1 A schematic diagram of the structure of the insulating heat-conducting structure in the illustrated scheme;

[0030] Figure 8 It is a structural schematic diagram when the recessed portion of the sub-positioning structure is arranged at a vertex of the mounting groove;

[0031] Fig. 9 For Figure 8 A schematic diagram of a structure in which a protruding portion matching a recessed portion is disposed at a vertex of an insulating heat-conducting structure;

[0032] Fig.10 This is a schematic diagram of the structure when the protrusion of the sub-positioning structure is arranged on one side of the installation groove;

[0033] Fig.11 For Fig.10 A schematic diagram of a structure in which a recessed portion matching a protruding portion is arranged on one side of the insulating heat-conducting structure.

[0034] Description of reference numerals:

[0035] 1-insulating heat-conducting structure; 2-heat sink; 21-fin; 3-heat dissipation part; 4-positioning structure; 41-sub-positioning structure; 411-protrusion; 412-recess; 42-mounting groove; 5-pressing part; A1-first area; A2-second area; A3-third area; A4-fourth area; S1-first symmetry plane; S2-second symmetry plane. DETAILED DESCRIPTION

[0036] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0037] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In the description of this specification, the description with reference to the terms "embodiment", "one embodiment", "some embodiments", "exemplarily" and "one embodiment" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or embodiment are included in at least one embodiment or embodiment of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or embodiment. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or embodiments in a suitable manner.

[0039] The terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0040] In the accompanying drawings, the Z axis represents the vertical direction, that is, the up and down position, and the positive direction of the Z axis (that is, the direction of the arrow of the Z axis) represents the up, and the negative direction of the Z axis represents the down; the X axis in the accompanying drawings represents the front and back position, and the positive direction of the X axis (that is, the direction of the arrow of the X axis) represents the front side, and the negative direction of the X axis represents the back side; the Y axis in the accompanying drawings represents the horizontal direction and is designated as the left and right position, and the positive direction of the Y axis (that is, the direction of the arrow of the Y axis) represents the right side, and the negative direction of the Y axis represents the left side; it should be noted that the aforementioned Z axis, Y axis and X axis are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention.

[0041] like Figures 1 to 7 As shown, a heat dissipation structure is provided in an embodiment of the utility model, including an insulating heat-conducting structure 1 and a heat sink 2, the insulating heat-conducting structure 1 includes a first surface and a second surface arranged opposite to each other, the first surface of the insulating heat-conducting structure 1 is bonded to the heat sink 2, the second surface of the insulating heat-conducting structure 1 is used to bond to a heat dissipation component 3, a positioning structure 4 is arranged between the insulating heat-conducting structure 1 and the heat sink 2, and the two parts of the positioning structure 4 located on both sides of any set plane are asymmetrically arranged with respect to the set plane, and the set plane is a plane intersecting with the positioning structure 4 and forming a preset angle with the first surface.

[0042] It should be noted that, in this specification, the heat dissipation component 3 is a power single tube, and the power single tube is pressed onto the heat sink 2 by the pressing member 5, that is, the power single tube presses the insulating heat-conducting structure 1 onto the heat sink 2 as an example to illustrate the contents of the utility model, but it should be understood that without violating the design concept of the utility model, the heat dissipation structure of the utility model can also be used in other similar occasions requiring heat dissipation.

[0043] The structure of the radiator 2 is not limited, and it can be an air-cooled heat dissipation structure or a liquid-cooled heat dissipation structure, and can adopt relevant technologies. The radiator 2 can include fins 21 .

[0044] like Figures 1 to 7 As shown, in this embodiment, the first surface and the second surface of the insulating heat-conducting structure 1 are relatively arranged along the up-down direction, that is, the Z-axis direction in the figure, that is, the first surface of the insulating heat-conducting structure 1 is the bottom surface, and the second surface is the top surface. The first surface is in contact with the top surface of the radiator 2, and the second surface is in contact with the power single tube, so as to achieve insulation and heat conduction between the power single tube and the radiator 2. The specific insulating and heat-conducting method of the insulating heat-conducting structure 1 can adopt relevant technologies, which will be exemplified later. The fin 21 is usually located on the radiator 2 on a different side from the top, for example, the fin 21 is located at the lower end of the radiator 2. When the insulating heat-conducting structure 1 is misplaced, it may affect the heat transfer between the insulating heat-conducting structure 1 and the power single tube, as well as the heat transfer between the insulating heat-conducting structure 1 and the radiator 2, thereby affecting the heat dissipation performance of the power single tube.

[0045] The setting planes are all based on the situation that the first surface of the insulating heat-conducting structure 1 is in contact with the heat sink 2. The setting planes are planes that intersect with the positioning structure 4 and are at right angles to the first surface (in practice, they can be approximately perpendicular). Here, the intersection of the setting plane and the positioning structure 4 means that the positioning structure 4 can be divided into two parts with the setting plane as the boundary.

[0046] Specifically, without considering other factors, the part where the positioning structure 4 is arranged on the insulating heat-conducting structure 1 makes the two parts of the insulating heat-conducting structure 1 located on both sides of any set plane asymmetric with respect to the set plane. That is to say, the positioning structure 4 is arranged so that the insulating heat-conducting structure 1 does not constitute an axisymmetric structure in any direction parallel to the first surface, and the part where the positioning structure 4 is arranged on the radiator 2 makes the part of the radiator 2 used to connect with the insulating heat-conducting structure 1 not constitute an axisymmetric structure in any direction parallel to the first surface, so that the insulating heat-conducting structure 1 can only be positioned with the radiator 2 in a predetermined posture, and misalignment of the two can be avoided. Specifically, the insulating heat-conducting structure 1 can only be attached to the radiator 2 through the first surface and the second surface can be attached to the heat dissipation component 3, and it cannot be flipped 180° to make the first surface attached to the heat dissipation component 3 and the second surface attached to the radiator 2. The positioning structure 4 will be described in detail in conjunction with specific embodiments later.

[0047] In this embodiment, the first surface of the insulating heat-conducting structure 1 is fitted with the heat sink 2, and the second surface of the insulating heat-conducting structure 1 opposite to the first surface is used to fit with the heat dissipation component 3 to be cooled, and a positioning structure 4 is provided between the insulating heat-conducting structure 1 and the heat sink 2. The two parts of the positioning structure 4 located on both sides of any set plane are asymmetrically arranged with respect to the set plane. The set plane is a plane intersecting with the positioning structure 4 and forming a preset angle with the first surface. That is to say, the positioning structure 4 does not have a set plane that allows it to form an axisymmetric structure, and the positioning structure 4 does not form an axis in any direction parallel to the first surface. Symmetrical structure, thus, the setting of the positioning structure 4 can realize the relative position positioning of the insulating heat-conducting structure 1 and the heat sink 2 and obtain a fool-proof effect, so that the insulating heat-conducting structure 1 can only be fitted with the heat sink 2 in a preset posture, avoiding the first surface and the second surface from being installed reversely, thereby ensuring the insulating heat-conducting performance of the first surface of the insulating heat-conducting structure 1 when it contacts the heat sink 2, which is beneficial to ensure the insulating heat-conducting performance of the heat dissipation component 3 to be cooled, such as a single power tube, through the insulating heat-conducting structure 1 and the heat sink 2, ensuring the heat dissipation performance of the heat dissipation component 3 to be cooled, and improving the use performance of the heat dissipation component 3 to be cooled, with a simple structure and strong practicality.

[0048] In the above embodiments, it should be understood that the heat dissipation element 3 is usually connected to the heat sink 2, so that the insulating heat conductive structure 1 is pressed against the heat sink 2. When the heat dissipation element 3 is connected to the heat sink 2, the relative position positioning of the heat dissipation element 3 and the heat sink 2 can be achieved, and the insulating heat conductive structure 1 and the heat sink 2 are positioned to prevent foolishness through the upper positioning structure 4, so that the relative position positioning of the heat dissipation element 3 and the insulating heat conductive structure 1 can be achieved. At this time, the connection structure between the heat dissipation element 3 and the heat sink 2 is preferably capable of foolproofing the installation of the heat dissipation element 3, or can be visually foolproof. For example, when the pressing member 5 described later is used to press the heat dissipation element 3, the pressing member 5 can press the heat dissipation element 3 against the heat sink 2 in a preset posture. Of course, in addition to this, a structure similar to the positioning structure 4 can also be provided between the heat dissipation element 3 and the insulating heat conductive structure 1, which will not be described in detail in this specification.

[0049] like Figures 1 to 6 As shown, optionally, the positioning structure 4 includes a plug-in installation groove 42 and a plug-in structure, the installation groove 42 is arranged on the heat sink 2, and the lower end of the insulating heat-conducting structure 1 forms the plug-in structure.

[0050] In this way, the insulating heat-conducting structure 1 can be positioned on the heat sink 2 through the mounting groove 42 to avoid the insulating heat-conducting structure 1 from moving relative to the heat sink 2. The provision of the mounting groove 42 is conducive to ensuring the position stability of the insulating heat-conducting structure 1 on the heat sink 2. Moreover, compared with providing the mounting groove 42 on the insulating heat-conducting structure 1, it is conducive to reducing the complexity of the insulating heat-conducting structure 1 to a certain extent.

[0051] Optionally, the positioning structure 4 further includes a sub-positioning structure 41, and the sub-positioning structure 41 includes a convex portion 411 and a concave portion 412 that match each other;

[0052] One of the raised portion 411 and the recessed portion 412 is arranged in the mounting groove 42 so that the two parts of the mounting groove 42 located on both sides of any set plane are asymmetrically arranged with respect to the set plane, and the other of the raised portion 411 and the recessed portion 412 is arranged in the plug-in structure of the insulating heat-conducting structure 1.

[0053] Specifically, at least the lower end of the insulating heat-conducting structure 1 is accommodated in the mounting groove 42, and the sub-positioning structure 41 is formed between the inner wall of the mounting groove 42 and the outer wall of the insulating heat-conducting structure 1. Only when the insulating heat-conducting structure 1 is positioned correctly, the lower end of the insulating heat-conducting structure 1 can be inserted into the mounting groove 42. The portion of the sub-positioning structure 41 located in the mounting groove 42 can be formed together with the mounting groove 42.

[0054] In this way, the insulating heat-conducting structure 1 is at least partially accommodated by the mounting groove 42, and a fool-proof connection between the insulating heat-conducting structure 1 and the heat sink 2 is achieved through the sub-positioning structure 41. The connection structure between the insulating heat-conducting structure 1 and the heat sink 2 is compact and highly reliable.

[0055] Optionally, one of the protrusion 411 and the recess 412 is disposed at a circumferential edge of the mounting groove 42 , and the other of the protrusion 411 and the recess 412 is disposed at a circumferential edge of the plug-in structure of the insulating heat-conducting structure 1 .

[0056] like Figures 4 to 7 as well as Fig.10 and Fig.11 As shown, exemplarily, the raised portion 411 of the sub-positioning structure 41 is arranged on the inner wall of the mounting groove 42, such as the bottom wall or side wall of the mounting groove 42, and is arranged at the circumferential edge of the mounting groove 42, and the matching recessed portion 412 corresponding to the raised portion 411 is arranged on the bottom end or outer wall of the insulating heat-conducting structure 1, and is arranged at the circumferential edge of the insulating heat-conducting structure 1. The setting of the raised portion 411 makes the mounting groove 42 constitute a non-axisymmetric structure. When installing the insulating heat-conducting structure 1, only when the position of the matching raised portion 411 is aligned with the position of the recessed portion 412, the lower end of the insulating heat-conducting structure 1 can be smoothly inserted into the mounting groove 42.

[0057] like Figure 8 and Fig. 9As shown, exemplarily, the recessed portion 412 of the sub-positioning structure 41 is arranged on the inner wall of the mounting groove 42, such as the bottom wall or side wall of the mounting groove 42, and is arranged at the circumferential edge of the mounting groove 42, and the matching raised portion 411 corresponding to the recessed portion 412 is arranged on the bottom end or outer wall of the insulating heat-conducting structure 1, and is arranged at the circumferential edge of the insulating heat-conducting structure 1. The setting of the recessed portion 412 makes the mounting groove 42 constitute a non-axisymmetric structure. When installing the insulating heat-conducting structure 1, only when the position of the matching raised portion 411 is aligned with the position of the recessed portion 412, the lower end of the insulating heat-conducting structure 1 can be smoothly inserted into the mounting groove 42.

[0058] It should be understood that, in some cases, two sub-positioning structures 41 can be arranged between the insulating heat-conducting structure 1 and the heat sink 2, wherein a raised portion 411 of one of the sub-positioning structures 41 is arranged on the bottom wall or side wall of the mounting groove 42, and a matching recessed portion 412 corresponding to the raised portion 411 is arranged on the bottom end or outer wall of the insulating heat-conducting structure 1, and a recessed portion 412 of the other sub-positioning structure 41 is arranged on the bottom wall or side wall of the mounting groove 42, and a matching raised portion 411 corresponding to the raised portion 411 is arranged on the bottom end or outer wall of the insulating heat-conducting structure 1, which will not be described in detail here.

[0059] In this way, it is convenient for the part of the sub-positioning structure 41 set on the heat sink 2 and the structure of the mounting groove 42 to be formed, and it is convenient for the part of the sub-positioning structure 41 set on the insulating heat-conducting structure 1 to be formed in the structure of the insulating heat-conducting structure 1. In the process of positioning the insulating heat-conducting structure 1 to the mounting groove 42, it is convenient to visually manage the installation of the insulating heat-conducting structure 1, and the structure is simple.

[0060] Optionally, when a protrusion 411 is provided on the circumferential edge of the mounting groove 42, the protrusion 411 is provided on the circumferential side wall of the mounting groove 42 to protrude into the mounting groove 42, and the recess 412 is provided on the circumferential outer wall of the insulating heat-conducting structure 1 to be recessed into the insulating heat-conducting structure 1.

[0061] like Figure 6 to Figure 7 As shown, for example, the cross-sectional shape of the mounting groove 42 is rectangular, and the protrusion 411 is arranged at a vertex of the rectangle, so that the actual cross-sectional shape of the mounting groove 42 is a rectangle with a notch, such as a triangular notch, at the vertex. At this time, the cross-sectional shape of the insulating heat-conducting structure 1 is rectangular, and the recessed portion 412 is arranged at a vertex of the rectangle, so that the actual cross-sectional shape of the insulating heat-conducting structure 1 is a rectangle with a notch, such as a triangular notch, at the vertex.

[0062] Optionally, when a recessed portion 412 is provided on the circumferential edge of the mounting groove 42, the recessed portion 412 is recessed on the circumferential side wall of the mounting groove 42 toward the outside of the mounting groove 42, and the raised portion 411 is protruded on the circumferential outer wall of the insulating heat-conducting structure 1 toward the outside of the insulating heat-conducting structure 1.

[0063] like Figure 8 and Fig. 9 As shown, for example, the cross-sectional shape of the mounting groove 42 is rectangular, and the recessed portion 412 is disposed at a vertex of the rectangle, so that the actual cross-sectional shape of the mounting groove 42 is a rectangle with a protrusion, such as a rectangular protrusion, at the vertex. At this time, the cross-sectional shape of the insulating heat-conducting structure 1 is rectangular, and the raised portion 411 is disposed at a vertex of the rectangle, so that the actual cross-sectional shape of the insulating heat-conducting structure 1 is a rectangle with a rectangular protrusion at the vertex.

[0064] In this way, the size of the part of the sub-positioning structure 41 set on the radiator 2 in the up and down directions can be consistent with the groove depth of the mounting groove 42, and the part of the sub-positioning structure 41 set on the insulating thermal conductive structure 1 can be the same thickness as other parts of the insulating thermal conductive structure 1, which can reduce the structural complexity of the insulating thermal conductive structure 1 and the radiator 2.

[0065] In the above embodiment, optionally, the cross-sectional shape of the mounting groove 42 is rectangular, and the mounting groove 42 is symmetrically arranged with respect to two symmetric planes, the two symmetric planes are two set planes perpendicular to each other, and the two symmetric planes divide the mounting groove 42 into four areas.

[0066] like Figure 8 As shown, two symmetry planes are defined, namely the first symmetry plane S1 and the second symmetry plane S2. The first symmetry plane S1 is parallel to the XZ plane, and the second symmetry plane S2 is parallel to the YZ plane. Four areas are defined, namely the first area A1, the second area A2, the third area A3 and the fourth area A4. The first area A1 and the second area A2 are symmetrically arranged with respect to the first symmetry plane S1, the third area A3 and the fourth area A4 are arranged with respect to the first symmetry plane S1, the first area A1 and the fourth area A4 are arranged with respect to the second symmetry plane S2, and the second area A2 and the third area A3 are arranged with respect to the second symmetry plane S2.

[0067] In optional solution 1, sub-positioning structures 41 are provided corresponding to odd-numbered areas.

[0068] For example Figure 8 As shown, only the vertices corresponding to the first area A1 are provided with the recessed portions 412 of the sub-positioning structures 41. Fig. 9 The insulating heat-conducting structure 1 shown can only be placed in the installation groove 42 in a predetermined position with the first surface facing downward. In this case, it can prevent the first surface and the second surface from being reversed, and can also prevent the insulating heat-conducting structure 1 from being rotated horizontally and then placed in the installation groove 42, which can further improve the foolproof effect.

[0069] In the optional scheme 2, two regions located at diagonally opposite corners are respectively provided with sub-positioning structures 41, and the sub-positioning structures 41 are arranged non-center-symmetrically with respect to the center of the rectangle (not shown in the diagram of this scheme).

[0070] For example, the first area A1 and the third area A3 are respectively provided with a corresponding recessed portion 412 of the sub-positioning structure 41 , and the distances from the two recessed portions 412 corresponding to the first area A1 and the third area A3 to the center of the rectangle are not equal.

[0071] In optional scheme three, two adjacent regions are provided with corresponding sub-positioning structures 41, and the sub-positioning structures 41 corresponding to the two regions are arranged non-axisymmetrically with respect to the symmetry plane between the two regions (not shown in the diagram of this scheme).

[0072] For example, the first area A1 and the second area A2 are respectively provided with a corresponding recessed portion 412 of the sub-positioning structure 41 , and the distances between the two recessed portions 412 corresponding to the first area A1 and the second area A2 and the first symmetry plane S1 are not equal.

[0073] In this way, the sub-positioning structure 41 makes the installation groove 42 neither form an axially symmetrical structure nor a centrally symmetrical structure, which can prevent the first surface and the second surface from being installed reversely, and can also prevent the first surface from being installed incorrectly after being rotated horizontally.

[0074] In the above embodiment, optionally, there are multiple mounting grooves 42 on the heat sink 2 .

[0075] The number of insulating heat-conducting structures 1 corresponds to the number of mounting slots 42, so that heat dissipation of multiple heat dissipating parts 3 can be achieved. It should be understood that one insulating heat-conducting structure 1 can be used for heat dissipation of one or more heat dissipating parts 3, which is not a limitation.

[0076] Optionally, at least two installation slots 42 are connected in a set area, and the sub-positioning structures 41 corresponding to the different connected installation slots 42 are all located outside the set area.

[0077] like Figure 5 and Figure 6 As shown, two mounting grooves 42 are grouped together, the two mounting grooves 42 in each group are connected, and the two mounting grooves 42 are both provided with a protrusion 411 at a vertex, and the protrusions 411 of the two mounting grooves 42 are both located outside the set area where the two mounting grooves 42 are connected.

[0078] In this way, on the one hand, the installation grooves 42 can be arranged more compactly, and on the other hand, the processing and forming of the installation grooves 42 is also facilitated, and the structure is simple and practical.

[0079] In the above embodiment, optionally, the heat dissipation element 3 is pressed onto the heat sink 2 by a pressing element 5 , and the pressing element 5 is detachably connected to the heat sink 2 .

[0080] Exemplarily, the pressing piece 5 is connected to the heat sink 2 by snap-fitting.

[0081] Exemplarily, the pressing member 5 is connected to the heat sink 2 via fasteners, for example, a plurality of fasteners pass through the pressing member 5 and are threadedly connected to the heat sink 2 .

[0082] In this way, the heat dissipation component 3 and the insulating heat-conducting structure 1 can be fixed to the heat sink 2 by the pressing member 5 , thereby ensuring the heat dissipation performance from the heat dissipation component 3 to the heat sink 2 .

[0083] In the above embodiment, optionally, both the first surface and the second surface of the insulating heat-conducting structure 1 are provided with heat-conducting areas, and the projection of the heat-conducting area of ​​the first surface on the second surface falls outside the coverage of the heat-conducting area of ​​the second surface.

[0084] Exemplarily, the insulating heat-conducting structure 1 can be an insulating pad, and the heat-conducting area on the first surface and the heat-conducting area on the second surface can be formed by coating thermal conductive adhesive on the insulating pad, and the coverage position and area size of the thermal conductive adhesive on the first surface and the second surface are different.

[0085] The heat dissipation structure of the present invention is conducive to ensuring that the heat conduction area on the first side of the insulating heat-conducting structure 1 contacts the heat conduction area on the radiator 2, ensuring that the heat conduction area on the second side of the insulating heat-conducting structure 1 contacts the heat dissipation area of ​​the heat dissipation element 3, and ensuring the heat dissipation performance of the heat dissipation element 3.

[0086] Another embodiment of the utility model provides a power single tube installation structure, which includes a power single tube, a circuit board and a heat dissipation structure as described in the above embodiment, wherein the power single tube is attached to the second surface of the insulating heat conductive structure 1 of the heat dissipation structure, and the first surface of the insulating heat conductive structure 1 is pressed against the heat sink 2 of the heat dissipation structure, and the power single tube is electrically connected to the circuit board.

[0087] For example, the conductive pins of the power single tube are electrically connected to the circuit board, and the power single tube installation structure also includes a clamping piece 5, and the clamping piece 5 is used to realize the clamping between the power unit and the heat sink 2. It can refer to the embodiment of the above-mentioned heat dissipation structure and will not be described in detail here.

[0088] Another embodiment of the present invention provides an electronic device, including the heat dissipation structure of the above embodiment, and / or, including the power single tube installation structure of the above embodiment. For example, the electronic device is an inverter.

[0089] Another embodiment of the present invention provides a power system, including the electronic device of the above embodiment. For example, the power system is a photovoltaic system.

[0090] Although the utility model is disclosed as above, the protection scope of the utility model is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the utility model, and these changes and modifications will fall within the protection scope of the utility model.

Claims

1. A heat dissipation structure, characterized in that: The invention comprises an insulating heat-conducting structure (1) and a heat sink (2), wherein the insulating heat-conducting structure (1) comprises a first surface and a second surface arranged opposite to each other, the first surface of the insulating heat-conducting structure (1) is fitted with the heat sink (2), and the second surface of the insulating heat-conducting structure (1) is used to fit with a heat dissipation component (3) to be dissipated, and a positioning structure (4) is arranged between the insulating heat-conducting structure (1) and the heat sink (2), and two parts of the positioning structure (4) located on both sides of any set plane are asymmetrically arranged with respect to the set plane, and the set plane is a plane intersecting with the positioning structure (4) and forming a preset angle with the first surface.

2. The heat dissipation structure according to claim 1, characterized in that: The positioning structure (4) comprises a plug-in connected mounting groove (42) and a plug-in structure, the mounting groove (42) is arranged on the heat sink (2), and the lower end of the insulating heat-conducting structure (1) forms the plug-in structure.

3. The heat dissipation structure according to claim 2, characterized in that: The positioning structure (4) further comprises a sub-positioning structure (41), wherein the sub-positioning structure (41) comprises a convex portion (411) and a concave portion (412) that match each other; One of the protruding portion (411) and the recessed portion (412) is arranged in the installation groove (42) so that the two parts of the installation groove (42) located on both sides of any set plane are asymmetrically arranged with respect to the set plane, and the other of the protruding portion (411) and the recessed portion (412) is arranged in the plug-in structure of the insulating heat-conducting structure (1).

4. The heat dissipation structure according to claim 3, characterized in that: One of the protruding portion (411) and the recessed portion (412) is arranged at the circumferential edge of the mounting groove (42), and the other of the protruding portion (411) and the recessed portion (412) is arranged at the circumferential edge of the plug-in structure of the insulating heat-conducting structure (1).

5. The heat dissipation structure according to claim 4, characterized in that: When the convex portion (411) is provided on the circumferential edge of the mounting groove (42), the convex portion (411) is provided on the circumferential side wall of the mounting groove (42) to protrude toward the inside of the mounting groove (42), and the concave portion (412) is provided on the circumferential outer wall of the insulating heat-conducting structure (1) to be concave toward the inside of the insulating heat-conducting structure (1); When the recessed portion (412) is provided on the circumferential edge of the mounting groove (42), the recessed portion (412) is provided on the circumferential side wall of the mounting groove (42) so as to be recessed toward the outside of the mounting groove (42), and the raised portion (411) is provided on the circumferential outer wall of the insulating heat-conducting structure (1) so as to be raised toward the outside of the insulating heat-conducting structure (1).

6. The heat dissipation structure according to claim 3, characterized in that: The cross-section of the mounting groove (42) is rectangular, the mounting groove (42) is symmetrically arranged with respect to two symmetric planes, the two symmetric planes are two set planes perpendicular to each other, and the two symmetric planes divide the mounting groove (42) into four areas; Wherein, an odd number of the regions are correspondingly provided with the sub-positioning structures (41); Alternatively, the two areas located at diagonally opposite corners are respectively provided with the sub-positioning structures (41), and the sub-positioning structures (41) are arranged non-centrally symmetrically with respect to the center of the rectangle; Alternatively, the sub-positioning structures (41) are correspondingly arranged in two adjacent areas, and the sub-positioning structures (41) corresponding to the two areas are asymmetrically arranged with respect to the symmetry plane between the two areas.

7. The heat dissipation structure according to any one of claims 3 to 6, characterized in that: The number of the mounting grooves (42) on the heat sink (2) is multiple.

8. The heat dissipation structure according to claim 7, characterized in that: At least two of the installation slots (42) are connected in a set area, and the sub-positioning structures (41) corresponding to the different connected installation slots (42) are all located outside the set area.

9. The heat dissipation structure according to any one of claims 1 to 6, characterized in that: The heat dissipation element (3) is pressed onto the heat sink (2) via a pressing element (5), and the pressing element (5) is detachably connected to the heat sink (2); And / or, both the first surface and the second surface of the insulating heat-conducting structure (1) are provided with heat-conducting areas, and a projection of the heat-conducting area of ​​the first surface on the second surface falls outside the coverage of the heat-conducting area of ​​the second surface.

10. A power single tube installation structure, characterized in that: It comprises a power single tube, a circuit board and a heat dissipation structure as claimed in any one of claims 1 to 9, wherein the power single tube is attached to the second surface of the insulating heat-conducting structure (1) of the heat dissipation structure, and the first surface of the insulating heat-conducting structure (1) is pressed against the heat sink (2) of the heat dissipation structure, and the power single tube is electrically connected to the circuit board.

11. An electronic device, characterized in that: It comprises the heat dissipation structure as described in any one of claims 1 to 9, and / or, it comprises the power single tube installation structure as described in claim 10.

Images