Photovoltaic diode module and photovoltaic junction box

Abstract

The utility model relates to the technical field of photovoltaic diode modules. The utility model relates to a photovoltaic diode module and a photovoltaic junction box. The photovoltaic diode module includes: a first conductive sheet; at least one of the first conducting strip and the second conducting strip is provided with a groove; at least one solder layer, wherein each solder layer is correspondingly accommodated in one groove; the diode chip comprises two end parts which are oppositely arranged, the diode chip is arranged between the first conducting strip and the second conducting strip and is electrically connected with the first conducting strip and the second conducting strip respectively, and the end parts of the diode chip are correspondingly accommodated in the grooves and are in contact with the solder layers in the grooves; the heat dissipation performance of the diode chip can be improved under the condition that the cost is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of photovoltaic diode modules, and in particular to a photovoltaic diode module and a photovoltaic junction box. Background Art

[0002] In the related art, the diode chip solder in the photovoltaic diode module is on the conductive sheet, and is connected to the conductive sheet at the other end through the metal connecting sheet. When the diode is working, most of the heat of the chip is transferred to the conductive sheet in direct contact with it, and only a small part of the heat is transferred to the other conductive sheet through the metal connecting sheet. The chip maintains high temperature for a long time, and the heat dissipation of the conductive sheets at both ends is uneven, which poses a safety hazard in the long run. Utility Model Content

[0003] Based on this, it is necessary to provide a photovoltaic diode module and a photovoltaic junction box, which can improve the heat dissipation performance of the diode chip while reducing the cost.

[0004] A first aspect of an embodiment of the present application provides a photovoltaic diode module, comprising:

[0005] a first conductive sheet;

[0006] A second conductive sheet, wherein at least one of the first conductive sheet and the second conductive sheet is provided with a groove;

[0007] At least one solder layer, each of the solder layers is correspondingly accommodated in one of the grooves;

[0008] A diode chip, the diode chip comprising two ends arranged opposite to each other, wherein the diode chip is arranged between the first conductive sheet and the second conductive sheet and the diode chip is electrically connected to the first conductive sheet and the second conductive sheet respectively, and the ends of the diode core are correspondingly accommodated in the groove and in contact with the solder layer in the groove.

[0009] In one embodiment, the first conductive sheet is provided with a first groove, and the second conductive sheet is provided with a second groove, wherein the notches of the first groove and the second groove are arranged opposite to each other;

[0010] The photovoltaic diode module comprises:

[0011] A first solder layer, disposed in the second groove and electrically connected to the first end of the diode chip;

[0012] The second solder layer is disposed in the second groove and electrically connected to the second end of the diode chip.

[0013] In one of the embodiments, the groove bottom and the groove wall are arranged perpendicularly.

[0014] In one of the embodiments, the size of the notch opening of the groove is larger than the size of the groove bottom, and the size of the groove bottom of the groove is larger than or equal to the cross-sectional size of the diode chip.

[0015] In one embodiment, the groove includes a first sub-groove and a second sub-groove, wherein the first sub-groove is connected to the second sub-groove, and the bottom of the first sub-groove is perpendicular to the groove wall, the bottom of the second sub-groove is perpendicular to the groove wall, and the groove opening size of the first sub-groove is larger than the groove bottom size of the second sub-groove.

[0016] In one of the embodiments, the depth of the second sub-groove is greater than or equal to one quarter of the thickness of the diode chip.

[0017] In one of the embodiments, the angle between the groove wall and the groove bottom of the groove is an obtuse angle.

[0018] In one of the embodiments, the first solder layer is disposed at the bottom of the first groove, and the second solder layer is disposed at the bottom of the second groove.

[0019] In one embodiment, the first conductive sheet and the second conductive sheet are both provided with a bus bar through hole and a bus bar solder area, and the bus bar solder area is located between the bus bar through hole and the diode chip;

[0020] The photovoltaic diode module further comprises:

[0021] An insulating layer is disposed around the diode chip, part of the first conductive sheet, and part of the second conductive sheet, and exposes at least part of the bus bar through holes of the first conductive sheet and at least part of the bus bar through holes of the second conductive sheet.

[0022] A second aspect of an embodiment of the present application provides a photovoltaic junction box, comprising a box body and the aforementioned photovoltaic diode module.

[0023] The above-mentioned photovoltaic diode module and photovoltaic junction box include a first conductive sheet, a second conductive sheet, a diode chip and at least one solder layer, wherein at least one of the first conductive sheet and the second conductive sheet is provided with a groove; each solder layer is correspondingly accommodated in a groove, the diode chip is arranged between the first conductive sheet and the second conductive sheet and the diode chip is electrically connected to the first conductive sheet and the second conductive sheet respectively, so that the diode chip can be directly electrically connected through the first conductive sheet and the second conductive sheet, and the heat generated by the diode chip when working can be evenly conducted to the first conductive sheet and the second conductive sheet, which can improve the heat dissipation capacity of the diode; since the two metal connecting sheets are omitted, the production cost can also be reduced. In addition, at least one of the first conductive sheet and the second conductive sheet is provided with a groove for accommodating the diode chip, and the end of the diode core is correspondingly accommodated in the groove and contacts with the solder layer in the groove to realize the positioning of the diode chip, and can also effectively avoid the solder flowing around the conductive sheet during welding, and avoid the uneven distribution of solder after welding, resulting in the problem of cold soldering of the diode chip, thereby greatly improving the reliability of the photovoltaic diode module. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] FIG1 is a schematic diagram of a photovoltaic diode module according to an embodiment of the present invention;

[0025] FIG2 is a second schematic diagram of the structure of a photovoltaic diode module provided in an embodiment of the present application;

[0026] FIG3 is a third structural schematic diagram of a photovoltaic diode module provided in an embodiment of the present application;

[0027] FIG4 is a fourth structural schematic diagram of a photovoltaic diode module provided in an embodiment of the present application;

[0028] FIG5 is a fifth structural schematic diagram of a photovoltaic diode module provided in an embodiment of the present application;

[0029] FIG6 is a schematic diagram of the structure of the first groove shown in FIG5;

[0030] FIG7 is a sixth structural schematic diagram of a photovoltaic diode module provided in an embodiment of the present application;

[0031] FIG8 is a schematic top view of a photovoltaic diode module provided in an embodiment of the present application.

[0032] Description of Figure Numbers:

[0033] 110, first conductive sheet; 101, first groove; 1011, first sub-groove; 1022, second sub-groove; 120, second conductive sheet; 102, second groove;

[0034] 130, diode chip; 141, first solder layer; 142, second solder layer; 150, insulating layer;

[0035] 103. Busbar through hole; 104. Busbar solder area; 105. Positioning hole. DETAILED DESCRIPTION

[0036] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.

[0037] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0038] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0039] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0041] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0042] In the related technology, the diode chip solder is currently on the conductive sheet, and is connected to the conductive sheet at the other end through the metal connecting sheet. When the diode is working, most of the heat of the chip is transferred to the conductive sheet in direct contact with it, and only a small part of the heat is transferred to the other conductive sheet through the metal connecting sheet. The chip maintains high temperature for a long time, and the heat dissipation of the conductive sheets at both ends is uneven, which poses a safety hazard in the long run.

[0043] Based on this, an embodiment of the present application provides a photovoltaic diode module, in which the diode chip adopts a new connection method, and the two metal connecting plates in the related technology can be omitted, and the heat dissipation capacity of the diode can be directly improved through the first conductive plate and the second conductive plate; since the two metal connecting plates are omitted, the production cost can be reduced. In addition, a groove for accommodating the diode chip is provided on at least one of the first conductive plate and the second conductive plate to achieve the positioning of the diode chip, and a corresponding solder layer is arranged in the corresponding groove, which can improve the solder quality of the diode chip and improve its reliability.

[0044] 1-3 are schematic diagrams of the structure of the photovoltaic diode module provided in the embodiment of the present application. Please continue to refer to FIG1-3, the photovoltaic diode module includes: a first conductive sheet 110, a second conductive sheet 120, a diode chip 130 and at least one solder layer.

[0045] Exemplarily, the diode chip 130 may be a Schottky diode or a MOS diode (MOS is the abbreviation of MOSFET, Metal-Oxide-Semiconductor Field-Effect Transistor).

[0046] At least one of the first conductive sheet 110 and the second conductive sheet 120 is provided with a groove; each solder layer 140 is correspondingly accommodated in a groove. Exemplarily, the first conductive sheet 110 is provided with a first groove 101, and a first solder layer 141 is provided in the first groove 101, as shown in FIG1. ​​Optionally, the second conductive sheet 120 is provided with a second groove 102, and a second solder layer 142 is provided in the second groove 102, as shown in FIG2. Optionally, the first conductive sheet 110 is provided with a first groove 101, and a first solder layer 141 is provided in the first groove 101, and the second conductive sheet 120 is provided with a second groove 102, and a second solder layer 142 is provided in the second groove 102, as shown in FIG3.

[0047] The diode chip 130 includes two ends that are arranged opposite to each other, wherein the diode chip 130 is arranged between the first conductive sheet 110 and the second conductive sheet 120 and the diode chip 130 is electrically connected to the first conductive sheet 110 and the second conductive sheet 120 respectively, and the ends of the diode core are correspondingly accommodated in the groove and contact the solder layer 140 in the groove. It can be understood that the bottom size of the groove is greater than or equal to the cross-sectional size of the diode chip 130. When the solder layer 140 is provided in the groove, the corresponding conductive part is electrically connected to the diode chip through the solder layer 140.

[0048] In the thickness direction of the photovoltaic diode module, the first conductive sheet 110, the diode chip 130, and the second conductive sheet 120 are sequentially arranged. The diode chip 130 includes a first end and a second end that are arranged opposite to each other, wherein the first end of the diode chip 130 is electrically connected to the first conductive sheet 110, and the second end of the diode chip 130 is electrically connected to the second conductive sheet 120. Exemplarily, one of the first end and the second end of the diode chip 130 may be the positive terminal of the diode chip 130, and the other of the first end and the second end of the diode chip 130 may be the negative terminal of the diode chip 130.

[0049] Optionally, the thickness of the first conductive sheet 110 and the second conductive sheet 120 can be set based on the size of the diode chip 130. Exemplarily, the thickness of the first conductive sheet 110 and the second conductive sheet 120 can range from 0.1 mm to 5 mm. It should be noted that in the embodiment of the present application, the thickness of the first conductive sheet 110 and the second conductive sheet 120 can be the same or different.

[0050] In the embodiment of the present application, the photovoltaic diode module includes a first conductive sheet 110, a second conductive sheet 120, a diode chip 130 and at least one solder layer 140, wherein at least one of the first conductive sheet 110 and the second conductive sheet 120 is provided with a groove; each solder layer 140 is correspondingly accommodated in a groove, and the diode chip 130 is arranged between the first conductive sheet 110 and the second conductive sheet 120 and the diode chip 130 is electrically connected to the first conductive sheet 110 and the second conductive sheet 120 respectively, so that the diode chip 130 can be directly connected to the first conductive sheet 110 and the second conductive sheet 120. The second conductive sheet 120 is used to realize electrical connection, so that the heat dissipation capacity of the diode can be improved directly through the first conductive sheet 110 and the second conductive sheet 120; since the two metal connecting sheets are omitted, the production cost can be reduced; in addition, a groove for accommodating the diode chip 130 is provided on at least one of the first conductive sheet 110 and the second conductive sheet 120, and the end of the diode chip 130 is correspondingly accommodated in the groove and contacts with the solder layer 140 in the groove to realize the positioning of the diode chip 130, and the solder quality of the diode chip 130 can also be improved to improve its reliability.

[0051] Please continue to refer to FIG. 3. In one embodiment, corresponding grooves are respectively formed on the first conductive sheet 110 and the second conductive sheet 120. Specifically, the first conductive sheet 110 is formed with a first groove 101, and the second conductive sheet 120 is formed with a second groove 102. A first solder layer 141 is formed in the first groove 101, and a second solder layer 142 is formed in the second groove 102. The first end of the diode chip is accommodated in the first groove 101 and electrically connected to the first solder layer; the second end of the diode chip is accommodated in the second groove 102 and electrically connected to the second solder layer.

[0052] For ease of explanation, in the thickness direction of the photovoltaic diode module, the first conductive sheet 110, the diode chip 130 and the second conductive sheet 120 are arranged in a sequence from bottom to top. Specifically, the notches of the first groove 101 and the second groove 102 are arranged opposite to each other to fix the diode chip 130. The first groove 101 is opened on the side surface of the first conductive sheet 110 facing the diode chip 130, wherein the first solder layer 141 is arranged in the first groove 101. The first end of the diode chip 130 is accommodated in the first groove 101 and contacts the first solder layer 141. Correspondingly, the second groove 102 is opened on the side surface of the second conductive sheet 120 facing the diode chip 130, wherein the second solder layer 142 is arranged in the second groove 102. The second end of the diode chip 130 is accommodated in the second groove 102 and contacts the second solder layer 142.

[0053] The depth of the first groove 101 and the second groove 102 ranges from 0.01 mm to 1 mm.

[0054] The cross-section of the first groove 101 and the second groove 102 may be square, rectangular, circular or other special shapes. The cross-sectional shape of the first groove 101 and the second groove 102 may be set based on the shape of the diode chip 130. It should be noted that the cross-section is set perpendicular to the thickness direction of the photovoltaic diode module.

[0055] Exemplarily, if the groove cross section is a square, its size range is 1mm×1mm to 10mm×10mm. Exemplarily, if the groove cross section is a rectangle, its short side size range is 1mm to 10mm, and its long side size range is 1mm to 11mm, and the long side size is always larger than the short side size.

[0056] It should be noted that the dimensions of the first conductive sheet 110 and the second conductive sheet 120 may be the same or different, and the dimensions of the first groove 101 and the second groove 102 may be the same or different.

[0057] In the present embodiment, the diode chip 130 is arranged between the first conductive sheet 110 and the second conductive sheet 120, wherein the first end of the diode chip 130 is accommodated in the first groove 101, contacts the first solder layer 141, and is electrically connected to the first conductive sheet 110 through the first solder layer 141. Correspondingly, the second end of the diode chip 130 is accommodated in the second groove 102, contacts the second solder layer 142, and is electrically connected to the second conductive sheet 120 through the second solder layer 142. The heat dissipation capacity of the diode can be directly improved through the first conductive sheet 110 and the second conductive sheet 120; since two metal connecting sheets are omitted, the production cost can be reduced. In addition, the first groove 101 and the second groove 102 for accommodating the diode chip 130 are respectively provided on the first conductive sheet 110 and the second conductive sheet 120 to realize the positioning of the diode chip 130, and the corresponding solder layer 140 is provided in the corresponding groove, which can improve the solder quality of the diode chip 130 and improve its reliability.

[0058] In one embodiment, the sum of the depths of the first groove 101 and the second groove 102 is less than or equal to the thickness of the diode chip 130. For example, if the sum of the depths of the first groove 101 and the second groove 102 is equal to the thickness of the diode chip 130, since the first groove 101 and the second groove 102 are respectively provided with a solder layer 140 having a certain thickness, the sum of the thicknesses of the diode chip 130, the first solder layer 141, and the second solder layer 142 must be greater than the sum of the depths of the first groove 101 and the second groove 102, so that the first conductive sheet 110 and the second conductive sheet 120 can be spaced and insulated in other areas. Other areas can be understood as areas other than those contacting with the solder layer 140.

[0059] Furthermore, the first solder layer 141 is disposed at the bottom of the first groove 101, and the second solder layer 142 is disposed at the bottom of the second groove 102. In this way, the solder layer 140 is disposed at the bottom of the groove, which can improve the welding quality of the diode chip 130 and will not affect the working performance of the diode chip 130.

[0060] Please continue to refer to FIG. 3 , in one embodiment, the groove bottom of the groove is arranged perpendicular to the groove wall. It can be understood that the groove opening size of the groove is equal to the groove bottom size. In the case where the first conductive sheet 110 and the second conductive sheet 120 are respectively provided with grooves, the groove bottom of at least one of the first groove 101 and the second groove 102 is arranged perpendicular to the groove wall.

[0061] For the sake of convenience, the bottom of the first groove 101 and the second groove 102 are arranged vertically to the groove wall, and the first groove 101 and the second groove 102 have the same size specifications. For example, the first conductive sheet 110 and the second conductive sheet 120 are both rectangular sheets with the same size specifications. For example, the thickness of the conductive sheet is 0.8 mm, the width is 12.5 mm, and the length is 19 mm. Among them, the first groove 101 and the second groove 102 are both formed by vertical direct grooving. For example, the depth of the first groove 101 and the second groove 102 is 0.4 mm, and the cross-section of the first groove 101 and the second groove 102 is a square with a size of 5 mm×5 mm.

[0062] The first groove 101 on the upper surface of the first conductive sheet 110 corresponds to the second groove 102 on the lower surface of the first conductive sheet 110. A first solder layer 141 is provided at the bottom of the first groove 101, and a second solder layer 142 is provided at the bottom of the second groove 102. The diode chip 130 is located between the first solder layer 141 and the second solder layer 142, and can be soldered between the first conductive sheet 110 and the second conductive sheet 120.

[0063] In the photovoltaic diode module of the present embodiment, the diode chip 130 is directly welded between the first conductive sheet 110 and the second conductive sheet 120. The heat generated by the diode chip 130 during operation can be evenly transferred to the first conductive sheet 110 and the second conductive sheet 120, thereby avoiding uneven heat dissipation of the conductive sheets at both ends, thereby greatly improving the heat dissipation capacity of the photovoltaic diode module, extending the working life of the photovoltaic diode module (diode chip 130, conductive sheet), and improving the long-term reliability of the photovoltaic diode module; in addition, the diode chip 130 is directly welded between the two conductive sheets. This connection structure does not require the use of additional metal connecting sheets, thereby reducing production costs; corresponding grooves are provided on the conductive sheets, which can effectively avoid the phenomenon of displacement of the diode chip 130 during welding, thereby improving welding quality and the reliability of the photovoltaic diode module; at the same time, a solder layer is provided at the bottom of the groove, which can effectively avoid the solder flowing around the conductive sheet during welding, and avoid uneven solder distribution after welding, resulting in the problem of cold soldering of the diode chip 130, thereby greatly improving the reliability of the photovoltaic diode module.

[0064] Different from the above-mentioned embodiments, as shown in FIGS. 4 to 6 , the notch size of the groove in this embodiment is larger than the groove bottom size. In this embodiment, the groove bottom size of the groove is larger than or equal to the cross-sectional size of the diode chip 130. In the case where the first conductive sheet 110 and the second conductive sheet 120 are respectively provided with grooves, the notch size of at least one of the first groove 101 and the second groove 102 is larger than the groove bottom size.

[0065] For the sake of convenience, it is taken as an example that the size of the first groove 101 and the second groove 102 is larger than the size of the groove bottom, and the first groove 101 and the second groove 102 are both formed by a groove digging method with a width at the top and a narrowness at the bottom.

[0066] For example, when the notch size of the groove is larger than the groove bottom size, and the groove bottom of the groove can be a square, the difference between the side length of the square with the largest cross section of the groove and the side length of the positive deformation with the smallest cross section is in the range of 0.1 mm to 5 mm. For example, the size of the square with the largest cross section is 6 mm×6 mm, and the size of the square with the smallest cross section is 5 mm×5 mm.

[0067] When the size of the groove opening is larger than the size of the groove bottom, and the groove bottom can be a rectangle, the difference between the largest rectangular side length of the groove opening and the smallest long deformation side length of the groove bottom is in the range of 0.1 mm to 5 mm.

[0068] The depth of the first groove 101 and the second groove 102 is 0.4 mm, and the cross-section of the first groove 101 and the second groove 102 is a square. The size of the square with the largest cross-section is 6 mm×6 mm, and the size of the square with the smallest cross-section is 5 mm×5 mm.

[0069] The first groove 101 on the upper surface of the first conductive sheet 110 corresponds to the second groove 102 on the lower surface of the first conductive sheet 110. A first solder layer 141 is provided at the bottom of the first groove 101, and a second solder layer 142 is provided at the bottom of the second groove 102. The diode chip 130 is located between the first solder layer 141 and the second solder layer 142, and can be soldered between the first conductive sheet 110 and the second conductive sheet 120.

[0070] The photovoltaic diode module in this embodiment can reduce production costs, greatly improve the heat dissipation capacity of the photovoltaic diode module, extend the working life of the photovoltaic diode module (diode chip 130, conductive sheet), and effectively avoid the problem of solder flowing around the conductive sheet during welding, and avoid uneven solder distribution after welding, which leads to the problem of cold solder joints of the diode chip 130, greatly improving the reliability of the photovoltaic diode module and improving the long-term reliability of the photovoltaic diode module. In addition, the first groove 101 and the second groove 102 are wide at the top and narrow at the bottom, which makes it more convenient and quick to place the diode chip 130, and avoids friction between the diode chip 130 and the edge of the groove, which causes damage to the diode chip 130, reduces the yield, affects production efficiency, and other problems.

[0071] Please continue to refer to Figures 4 and 5. In one embodiment, each groove (for example, the first groove 101) may include a first sub-groove 1011 and a second sub-groove 1022, wherein the first sub-groove 1011 is connected to the second sub-groove 1022, and the groove size L1 of the first sub-groove 1011 is set to be larger than the groove bottom size L2 of the second sub-groove 1022.

[0072] The depth of the second sub-groove 1022 is greater than or equal to one-fourth of the thickness of the diode chip 130. Exemplarily, the depths of the first sub-groove 1011 and the second sub-groove 1022 are 0.4 mm respectively, and their cross-sections are square. The largest square size of the cross-section of the first sub-groove 1011 and the second sub-groove 1022 is 6 mm×6 mm, and the smallest square size of the cross-section is 5 mm×5 mm. The depth of the second sub-groove 1022 is 0.2 mm.

[0073] Exemplarily, the angle between the groove wall of the first sub-groove 1011 and the groove bottom of the second sub-groove 1022 is an obtuse angle, and the groove wall of the second sub-groove 1022 is perpendicular to the groove bottom of the second sub-groove 1022 .

[0074] Optionally, the groove wall of the first sub-groove 1011 and the groove wall of the second sub-groove 1022 are respectively arranged perpendicular to the groove bottom of the second sub-groove 1022 .

[0075] Optionally, the notch may include a plurality of connected sub-grooves, and the groove walls of the plurality of connected sub-grooves may be side walls with a plurality of steps. In the embodiment of the present application, the number of sub-grooves is not limited.

[0076] In this embodiment, at least one of the first groove 101 and the second groove 102 includes a plurality of connected sub-grooves, so that the groove walls of the first groove 101 and the second groove 102 can be side walls with a plurality of steps, which makes it more convenient and faster to place the diode chip 130, and can also avoid friction between the diode chip 130 and the edge of the groove, which may cause damage to the diode chip 130, reduce the yield, affect production efficiency, and other problems.

[0077] Different from the above-mentioned embodiment, as shown in FIG6 , the angle between the groove wall and the groove bottom of the groove is an obtuse angle. It is understandable that the groove wall of the groove is an inclined surface, which can form an angle with the groove bottom, and the angle is an obtuse angle. Exemplarily, the groove wall can be an inclined plane or an inclined arc surface. In the embodiment of the present application, the shape of the groove wall is not limited, nor is it limited to the above-mentioned examples.

[0078] In this embodiment, the side wall of at least one of the first groove 101 and the second groove 102 is an inclined surface, which can form an obtuse angle with the groove bottom. In this way, it is more convenient and faster to place the diode chip 130, and it can also avoid the friction between the diode chip 130 and the edge of the groove, which may cause damage to the diode chip 130, reduce the yield, affect the production efficiency, and other problems.

[0079] Optionally, the material of the first conductive sheet 110 and the second conductive sheet 120 may include at least one of brass, copper and iron bronze. In the embodiment of the present application, the materials of the first conductive sheet 110 and the second conductive sheet 120 may be the same or different. Exemplarily, the materials of the first conductive sheet 110 and the second conductive sheet 120 may both include copper.

[0080] In this embodiment, the materials of the first conductive sheet 110 and the second conductive sheet 120 both include copper, which can improve the electrical and thermal conductivity of the corresponding conductive sheets, so as to further enhance the heat dissipation performance of the photovoltaic diode module.

[0081] As shown in FIG. 7 and FIG. 8 , based on any of the foregoing embodiments, the first conductive sheet 110 and the second conductive sheet 120 are both provided with a bus bar through hole 103 and a bus bar solder area 104 , and the bus bar solder area 104 is located between the bus bar through hole 103 and the diode chip 130 .

[0082] The first conductive sheet 110 and the second conductive sheet 120 can be used for conductive connection with the busbar of the photovoltaic module, and the first conductive sheet 110 and the second conductive sheet 1201 are used to connect the positive electrode and the negative electrode of the photovoltaic module respectively. The busbar through hole 103 is used to penetrate the busbar of the photovoltaic module, and the busbar solder area 104 is used to be welded and connected with the busbar to conductively connect the photovoltaic bypass diode module with the busbar.

[0083] The photovoltaic diode module further includes an insulating layer 150. The insulating layer 150 is disposed outside the diode chip 130, a portion of the first conductive sheet 110, and a portion of the second conductive sheet 120, and exposes at least a portion of the busbar through-holes 103 of the first conductive sheet 110 and at least a portion of the busbar through-holes 103 of the second conductive sheet 120.

[0084] Alternatively, the material of the insulating layer 150 may include ceramics.

[0085] Optionally, the first conductive sheet 110 and the second conductive sheet 120 are both provided with a plurality of positioning holes 105 to facilitate installation of the photovoltaic diode module to the photovoltaic junction box.

[0086] In this embodiment, the photovoltaic diode module further includes an insulating layer 150 . The insulating layer 150 has good heat dissipation and insulation properties, and can effectively ensure the heat dissipation performance of the diode chip 130 , while effectively preventing the diode chip 130 from being short-circuited.

[0087] An embodiment of the present application further provides a photovoltaic junction box, comprising a box body and the photovoltaic diode module in any of the aforementioned embodiments.

[0088] The photovoltaic junction box includes a box body and a photovoltaic diode module, wherein the photovoltaic diode module includes a first conductive sheet, a second conductive sheet, a diode chip and at least one solder layer, wherein at least one of the first conductive sheet and the second conductive sheet is provided with a groove; each solder layer is correspondingly accommodated in a groove, the diode chip is arranged between the first conductive sheet and the second conductive sheet and the diode chip is electrically connected to the first conductive sheet and the second conductive sheet respectively, the end of the diode core is correspondingly accommodated in the groove and contacts with the solder layer in the groove, so that the diode chip can be directly electrically connected through the first conductive sheet and the second conductive sheet, the heat generated by the diode chip when working can be evenly conducted to the first conductive sheet and the second conductive sheet, which can improve the heat dissipation capacity of the diode; since two metal connecting sheets are omitted, the production cost can also be reduced, in addition, at least one of the first conductive sheet and the second conductive sheet is provided with a groove for accommodating the diode chip to realize the positioning of the diode chip, and a corresponding solder layer is arranged in the corresponding groove, which can effectively avoid the problem that the solder flows around the conductive sheet during welding, and avoids the uneven distribution of the solder after welding, resulting in the problem of cold soldering of the diode chip, thereby greatly improving the reliability of the photovoltaic diode module and the photovoltaic junction box.

[0089] Optionally, each conductive sheet on the photovoltaic diode module is provided with a connecting portion, and the connecting portion is used to be fixedly connected to the box body of the photovoltaic junction box, so as to install the photovoltaic bypass diode module to the box body of the photovoltaic junction box.

[0090] Optionally, the connection portion may be a connection hole, and the connection hole is fixedly connected to the box body by a fastener or cold riveting. Optionally, the connection portion may be a plug-in column, and the plug-in column is connected to the box body by plug-in cooperation.

[0091] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0092] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A photovoltaic diode module, characterized in that: The photovoltaic diode module comprises: a first conductive sheet; A second conductive sheet, wherein at least one of the first conductive sheet and the second conductive sheet is provided with a groove; At least one solder layer, each of the solder layers is correspondingly accommodated in one of the grooves; A diode chip, the diode chip comprising two ends arranged opposite to each other, wherein the diode chip is arranged between the first conductive sheet and the second conductive sheet and the diode chip is electrically connected to the first conductive sheet and the second conductive sheet respectively, and the ends of the diode core are correspondingly accommodated in the groove and in contact with the solder layer in the groove.

2. The photovoltaic diode module according to claim 1, characterized in that: The first conductive sheet is provided with a first groove, and the second conductive sheet is provided with a second groove, wherein the notches of the first groove and the second groove are arranged opposite to each other; The photovoltaic diode module comprises: A first solder layer, disposed in the second groove and electrically connected to the first end of the diode chip; The second solder layer is disposed in the second groove and electrically connected to the second end of the diode chip.

3. The photovoltaic diode module according to claim 1, characterized in that: The groove bottom and the groove wall are arranged perpendicularly.

4. The photovoltaic diode module according to claim 1, characterized in that: The size of the notch opening of the groove is larger than the size of the groove bottom, and the size of the groove bottom of the groove is larger than or equal to the cross-sectional size of the diode chip.

5. The photovoltaic diode module according to claim 4, characterized in that: The groove includes a first sub-groove and a second sub-groove, wherein the first sub-groove is connected to the second sub-groove, and the groove opening size of the first sub-groove is larger than the groove bottom size of the second sub-groove.

6. The photovoltaic diode module according to claim 5, characterized in that: The depth of the second sub-groove is greater than or equal to one quarter of the thickness of the diode chip.

7. The photovoltaic diode module according to claim 4, characterized in that: The angle between the groove wall and the groove bottom of the groove is an obtuse angle.

8. The photovoltaic diode module according to claim 2, characterized in that: The first solder layer is disposed at the bottom of the first groove, and the second solder layer is disposed at the bottom of the second groove.

9. The photovoltaic diode module according to claim 1, characterized in that: The first conductive sheet and the second conductive sheet are both provided with a bus bar through hole and a bus bar solder area, and the bus bar solder area is located between the bus bar through hole and the diode chip; The photovoltaic diode module further comprises: An insulating layer is disposed around the diode chip, part of the first conductive sheet, and part of the second conductive sheet, and exposes at least part of the bus bar through holes of the first conductive sheet and at least part of the bus bar through holes of the second conductive sheet.

10. A photovoltaic junction box, characterized in that: The photovoltaic junction box comprises a box body and the photovoltaic diode module according to any one of claims 1 to 9.

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