Crystal oscillator
By using silicone shock absorber and accommodating cavity structure in the crystal oscillator, the problem of difficult disassembly and assembled component substrates in the prior art is solved, and the earthquake resistance function and convenient disassembly are achieved.
Patent Information
- Application Number
- CN202421184247.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-28
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2034-05-28
AI Technical Summary
While the existing crystal oscillators are shock-resistant, it is difficult to disassemble and assemble the component substrate, and the fixing method of the fixed columns leads to inconvenient disassembly and assemble.
By configuring a silicone shock absorber between the base and the component substrate, the silicone shock absorber provides shock resistance. After the component substrate, the silicone shock absorber is superimposed and assembled, the oscillating element is placed for disassembly.
Based on the earthquake resistance function, the disassembly and assembly process of crystal oscillating components and component substrates is simplified, and the maintenance convenience of the equipment is improved.
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Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electronic components, in particular to a crystal oscillator. Background Art
[0002] Crystal oscillators are currently widely used in different systems. Their main purpose is to provide a reference for the system's oscillation frequency, and constant temperature controlled crystal oscillators are core components in the fields of clocks, communications, etc.
[0003] A structure that generally increases the shock resistance of a crystal oscillator.
[0004] In the Chinese patent with publication number CN218549877U, a constant temperature shock-absorbing device for a crystal oscillator is disclosed, which includes a base, a sealing cover and a component substrate; a sealed cavity is formed between the inner cavity of the sealing cover and the base; the component substrate is located in the sealed cavity; the component substrate is provided with supporting lead pins; the component substrate is provided with a crystal oscillator, a shock-absorbing component, a heating element, a temperature control element, a metal cover and a heat insulation cover; the metal cover covers the crystal oscillator, the shock-absorbing component, the heating element and the temperature control element; the crystal oscillator is installed in the shock-absorbing component; the shock-absorbing component can reduce the vibration of the crystal oscillator; the heating element is electrically connected to the temperature control element. Among them, the anti-seismic function of the crystal oscillator element is mainly provided by the external shock-absorbing component, but the component substrate on which the crystal oscillator element is installed is fixed by four fixing columns. While having the anti-seismic function, the crystal oscillator element / component substrate is difficult to disassemble and assemble due to the fixing method of the fixing columns.
[0005] Therefore, based on the above problems, solutions are urgently needed. Utility Model Content
[0006] The utility model aims to provide a crystal oscillator which can facilitate the disassembly and assembly of crystal oscillating elements under the premise of having anti-vibration function.
[0007] In order to achieve the above purpose, the technical solutions of the utility model include:
[0008] A crystal oscillator, comprising:
[0009] Base;
[0010] A component substrate carrying an oscillating element, wherein the component substrate is mounted on a base;
[0011] Wherein, a silicone shock-absorbing sheet is arranged between the base and the component substrate;
[0012] The silicone shock-absorbing sheet is partially hollowed out, and a receiving cavity is formed after the component substrate, the silicone shock-absorbing sheet and the base are stacked and assembled, and the oscillating element on the component substrate is placed in the receiving cavity; and there is a spacing distance between the lower end of the oscillating element and the base.
[0013] Compared with the prior art, the utility model discloses a crystal oscillator, comprising a base, a component substrate equipped with an oscillating element, a silicone shock-absorbing sheet is arranged between the base and the component substrate, the silicone shock-absorbing sheet is used to provide an anti-vibration function, the silicone shock-absorbing sheet is partially hollowed out, and an accommodating cavity is formed after the component substrate, the silicone shock-absorbing sheet and the base are stacked and assembled, the oscillating element on the component substrate is placed in the accommodating cavity, the accommodating cavity is used to limit the left and right vibration deviation of the vibration element, and there is a spacing distance between the lower end of the oscillating element and the base to prevent the base from interfering with the vibration of the oscillating element, in addition, the component substrate, the silicone shock-absorbing sheet and the base are stacked and assembled, and while realizing the anti-vibration function, no fixing parts are used to fix the component substrate, so that the component substrate / oscillating element is easy to disassemble.
[0014] Further, the shape of the accommodating cavity matches the shape of the oscillating element;
[0015] After the oscillating element on the element substrate is located in the accommodating cavity, the peripheral wall of the oscillating element is in close contact with the silicone shock-absorbing sheet.
[0016] Furthermore, the silicone shock-absorbing sheet is a square silicone shock-absorbing sheet, and a circular through hole is provided in the middle thereof.
[0017] Furthermore, the base is provided with a plurality of pin columns protruding upward, and the upper ends of the pin columns are welded with wires;
[0018] The other end of the wire is welded to the element substrate.
[0019] In order to better understand and implement the present invention, the present invention is described in detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 is a schematic diagram of the structure of a crystal oscillator in this embodiment;
[0021] Figure 2 It is a structural schematic diagram indicating that a component substrate and an oscillation component are not installed in a crystal oscillator in this embodiment. DETAILED DESCRIPTION
[0022] In order to better illustrate the present invention, the present invention is further described in detail below with reference to the accompanying drawings.
[0023] It should be clear that the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the embodiments of the present application.
[0024] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the embodiments of the present application. The singular forms of "a", "said" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.
[0025] When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the attached claims. In the description of the present application, it should be understood that the terms "first", "second", "third", etc. are only used to distinguish similar objects, and do not have to be used to describe a specific order or sequence, nor can they be understood as indicating or implying relative importance. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.
[0026] In addition, in the description of this application, unless otherwise specified, "plurality" means two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the associated objects are in an "or" relationship.
[0027] As a preferred embodiment of the present application, Figure 1 and Figure 2 As shown, a crystal oscillator comprises:
[0028] A base 1; and an element substrate 2 carrying an oscillating element 21, wherein the element substrate 2 is mounted on the base 1;
[0029] Wherein, a silicone shock-absorbing sheet 3 is arranged between the base 1 and the component substrate 2;
[0030] The silicone shock-absorbing sheet 3 is partially hollowed out, and a receiving cavity 100 is formed after the component substrate 2, the silicone shock-absorbing sheet 3 and the base 1 are stacked and assembled. The oscillating element 21 on the component substrate 2 is placed in the receiving cavity 100; and there is a spacing distance between the lower end of the oscillating element 21 and the base 1.
[0031] A crystal oscillator of the present application includes a base 1 and a component substrate 2 equipped with an oscillating element 21. A silicone shock-absorbing sheet 3 is arranged between the base 1 and the component substrate 2. The silicone shock-absorbing sheet 3 is used to provide an anti-vibration function. The silicone shock-absorbing sheet 3 is partially hollowed out. After the component substrate 2, the silicone shock-absorbing sheet 3 and the base 1 are stacked and assembled, a accommodating cavity 100 is formed. The oscillating element 21 on the component substrate 2 is placed in the accommodating cavity 100. The accommodating cavity 100 is used to limit the left and right vibration deviation of the vibration element. There is a spacing distance between the lower end of the oscillating element 21 and the base 1 to prevent the base 1 from interfering with the vibration of the oscillating element 21. In addition, the component substrate 2, the silicone shock-absorbing sheet 3 and the base 1 are stacked and assembled. While achieving the anti-vibration function, no fixing parts are used to fix the component substrate 2, so that the component substrate 2 / oscillating element 21 can be easily disassembled.
[0032] In this embodiment, if Figure 1 As shown, the silicone shock-absorbing sheet 3 is a square silicone shock-absorbing sheet 3, the middle of which has a circular through hole. After the component substrate 2, the silicone shock-absorbing sheet 3 and the base 1 are stacked and assembled, a receiving cavity 100 is formed at the position of the through hole. The shape of the receiving cavity 100 matches the shape of the oscillation element 21. After the oscillation element 21 located on the component substrate 2 is located in the receiving cavity 100, the peripheral wall of the oscillation element 21 is tightly attached to the silicone shock-absorbing sheet 3, thereby limiting the vibration deviation of the oscillation element 21 in the left and right directions.
[0033] In addition, the peripheral wall of the oscillating element 21 is in close contact with the silicone shock-absorbing sheet 3 to prevent external air from entering the accommodating cavity 100 .
[0034] Furthermore, after the oscillating element 21 located on the element substrate 2 is located in the accommodating cavity 100, there is a spacing distance between the lower end of the oscillating element 21 and the base 1, that is, the spacing cavity 101. The spacing cavity 101 is used as a sound-absorbing cavity, so that the crystal oscillator also has a sound-absorbing effect.
[0035] According to the existing design, the silicone shock-absorbing sheet 3 itself has the characteristics of moisture-proof, dust-proof and corrosion-resistant. The crystal oscillator using the silicone shock-absorbing sheet 3 also has the advantages of moisture-proof, dust-proof and corrosion-resistant.
[0036] In this embodiment, the base 1 is provided with a plurality of pin columns 4 protruding upward, and a wire 5 is welded to the upper end of the pin column 4; the other end of the wire 5 is welded to the component substrate 2, thereby forming a complete feedback circuit to realize the function of the crystal oscillator.
[0037] In addition, it can be understood that when the component substrate 2 on the crystal oscillator is disassembled, the wire 5 is disconnected and the component substrate 2 is taken out upwards to complete the disassembly of the oscillation element 21 / component substrate 2.
[0038] According to the disclosure and teaching of the above description, the technical personnel in the field to which the utility model belongs can also change and modify the above implementation. Therefore, the utility model is not limited to the specific implementation methods disclosed and described above, and some modifications and changes to the utility model should also fall within the scope of protection of the claims of the utility model. In addition, although some specific terms are used in this specification, these terms are only for the convenience of description and do not constitute any limitation to the utility model.
Claims
1. A crystal oscillator, characterized in that: include: Base; A component substrate carrying an oscillating element, wherein the component substrate is mounted on a base; Wherein, a silicone shock-absorbing sheet is arranged between the base and the component substrate; The silicone shock-absorbing sheet is partially hollowed out, and a receiving cavity is formed after the component substrate, the silicone shock-absorbing sheet and the base are stacked and assembled, and the oscillating element on the component substrate is placed in the receiving cavity; and There is a spacing distance between the lower end of the oscillating element and the base.
2. The crystal oscillator according to claim 1, characterized in that: The shape of the accommodating cavity matches the shape of the oscillating element; After the oscillating element on the element substrate is located in the accommodating cavity, the peripheral wall of the oscillating element is in close contact with the silicone shock-absorbing sheet.
3. The crystal oscillator according to claim 1, characterized in that: The silicone shock-absorbing sheet is a square silicone shock-absorbing sheet, and a circular through hole is provided in the middle thereof.
4. The crystal oscillator according to claim 1, characterized in that: The base is provided with a plurality of pin columns protruding upward, and the upper ends of the pin columns are welded with wires; The other end of the wire is welded to the element substrate.
Citation Information
Patent Citations
Constant-temperature damping device of crystal oscillator
CN218549877U