Heat dissipation structure of electronic equipment

Abstract

The utility model discloses a heat dissipation structure of electronic equipment, the electronic equipment comprises a box body, a box body is arranged in an inner cavity of the box body, the electronic equipment is placed in the box body, the heat dissipation structure is arranged in the inner cavity of the box body, and the heat dissipation structure comprises a cooling liquid feeding box, a water pump, a first heat conduction mechanism, a second heat conduction mechanism and a heat exchanger which are sequentially connected through water pipes. The two heat conduction mechanisms are arranged on the left side and the right side of the box body respectively, each heat conduction mechanism comprises a buried pipe water cooling plate located on the outer side of the box body, and two heat conduction columns are arranged on the side, close to the box body, of each buried pipe water cooling plate. The inner ends of the two heat conduction columns penetrate through the side wall of the box body, then stretch into the box body and are connected with a heat conduction plate, the side, away from the box body, of the buried pipe water cooling plate is connected with two heat conduction copper pipes, and the outer sides of the heat conduction copper pipes are connected with a plurality of cooling fins. Compared with the prior art, the heat dissipation device has the advantage that effective heat dissipation of the electronic equipment is realized.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation devices for electrical equipment, in particular to a heat dissipation structure for electronic equipment. Background Art

[0002] With the continuous updating and improvement of electronic equipment, the heat dissipation methods of electronic equipment are increasingly pursuing lightness and high efficiency. While some electronic equipment have more sophisticated structures and more compact sizes, they also bring about the problem of heat dissipation difficulties.

[0003] In the existing heat dissipation of electronic equipment, some electronic equipment is placed in an outer frame, and water mist is sprayed on the outer frame to cool the outer frame, thereby cooling and dissipating the electronic equipment placed inside the outer frame. When the outer frame of the electronic equipment is far away, the electronic equipment cannot have a good heat dissipation effect, thereby reducing the service life of the electronic equipment. Utility Model Content

[0004] The utility model aims to overcome the deficiencies of the prior art and provides a heat dissipation structure for electronic equipment to achieve effective heat dissipation of the electronic equipment and extend its service life.

[0005] The utility model is realized by the following technical solutions:

[0006] A heat dissipation structure for an electronic device, the electronic device comprises a box body, a box body is arranged in an inner cavity of the box body, the electronic device that needs heat dissipation is placed inside the box body, the heat dissipation structure is arranged in the inner cavity of the box body, the heat dissipation structure comprises a coolant delivery box, a water pump, a first heat conduction mechanism, a second heat conduction mechanism and a heat exchanger connected in sequence through water pipes, the water outlet of the heat exchanger is connected to the water inlet of the coolant delivery box through a return pipe, the first heat conduction mechanism and the second heat conduction mechanism are respectively arranged on the left and right sides of the box body, each heat conduction mechanism comprises an embedded tube water cooling plate, the embedded tube water cooling plate is located outside the box body, two heat conduction columns are arranged on a side of the embedded tube water cooling plate close to the box body, the inner ends of the two heat conduction columns pass through the side wall of the box body and extend into the inside of the box body and are connected to the heat conduction plate, two heat conduction copper tubes are connected to a side of the embedded tube water cooling plate away from the box body, and a plurality of heat dissipation fins are connected to the outer sides of the heat conduction copper tubes.

[0007] As a preferred solution for the above-mentioned heat dissipation structure, front heat dissipation mounting holes are respectively opened on the front side plate of the box body at positions corresponding to the two heat-conducting mechanisms, and intake fans are respectively installed in the two front heat dissipation mounting holes; rear heat dissipation mounting holes are respectively opened on the rear side plate of the box body at positions corresponding to the two heat-conducting mechanisms, and exhaust fans are respectively installed in the two rear heat dissipation mounting holes.

[0008] As a preferred solution for the above-mentioned heat dissipation structure, a sliding sleeve that slides with the heat-conducting column is provided on the side wall of the box body, and a section of the heat-conducting column extending into the box body is provided with a reset spring, and the inner and outer ends of the reset spring are respectively connected to the heat-conducting plate and the inner wall of the box body.

[0009] As a preferred scheme of the above-mentioned heat dissipation structure, the buried tube water-cooling plate of the first heat-conducting mechanism is a first buried tube water-cooling plate, the buried tube water-cooling plate of the second heat-conducting mechanism is a second buried tube water-cooling plate, the water inlet of the first buried tube water-cooling plate is connected to the outlet end of the water pump through a first water pipe, the water outlet of the first buried tube water-cooling plate is connected to the water inlet of the second buried tube water-cooling plate through a second water pipe, the water outlet of the second buried tube water-cooling plate is connected to the water inlet of the heat exchanger through a third water pipe, and the water outlet of the coolant delivery box is connected to the inlet end of the water pump through a fourth water pipe.

[0010] As a preferred solution of the above heat dissipation structure, the bottom of the box body is supported in the inner cavity by four supporting columns, and the heat exchanger, coolant delivery box and water pump are located below the box body and arranged in sequence.

[0011] As a preferred solution of the above heat dissipation structure, a box cover that can be opened and closed is provided on the top of the box body.

[0012] Compared with the prior art, the utility model has the following advantages:

[0013] The utility model provides a heat dissipation structure for an electronic device. By arranging the heat dissipation structure in the inner cavity of a box body, the coolant in the buried pipe water cooling plate can effectively cool and dissipate the electronic equipment placed inside the box body, and with the cooperation of the heat dissipation fins and the inlet fan and the exhaust fan, the electronic equipment placed inside the box body can be quickly and significantly cooled and dissipated, the heat dissipation effect is improved, the electronic equipment is protected, and thus the service life of the electronic equipment is increased. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural schematic diagram of the utility model.

[0015] Figure 2 It is a schematic diagram of the internal structure of the box body of the utility model.

[0016] Figure 3 It is a structural schematic diagram of a box body of the utility model after a part is cut away.

[0017] Numbers in the figure: 1 box body; 2 box cover; 3 box body; 4 support column; 5 coolant delivery box; 6 water pump; 7 return water pipe; 8 first buried tube water cooling plate; 9 heat transfer column; 10 sliding sleeve; 11 return spring; 12 heat transfer copper tube; 13 heat dissipation fin; 14 second buried tube water cooling plate; 15 first water pipe; 16 second water pipe; 17 third water pipe; 18 fourth water pipe; 19 inlet fan; 20 exhaust fan; 21 heat transfer plate; 22 heat exchanger. DETAILED DESCRIPTION

[0018] The following is a detailed description of an embodiment of the utility model. This embodiment is implemented on the premise of the technical solution of the utility model, and a detailed implementation method and a specific operation process are given, but the protection scope of the utility model is not limited to the following embodiment.

[0019] See also Figures 1 to 3 This embodiment discloses a heat dissipation structure of an electronic device, the electronic device includes a box body 1, and a box cover 2 that can be opened and closed is provided on the top of the box body 1. A box body 3 is provided in the inner cavity of the box body 1, and the bottom of the box body 3 is supported in the inner cavity of the box body by four support columns 4. The electronic device that needs to dissipate heat is placed inside the box body 3. A heat dissipation structure is provided in the inner cavity of the box body 1, and the heat dissipation structure includes a coolant delivery box 5, a water pump 6, a first heat conduction mechanism, a second heat conduction mechanism and a heat exchanger 22 connected in sequence through water pipes. The water outlet of the heat exchanger 22 is connected to the water inlet of the coolant delivery box 5 through a return pipe 7. The heat exchanger 22, the coolant delivery box 5, and the water pump 6 are located below the box body 3 and arranged in sequence. The first heat conduction mechanism and the second heat conduction mechanism are respectively arranged on the left and right sides of the box body 3.

[0020] Each heat conduction mechanism includes an embedded pipe water cooling plate, which is located outside the box body 3. Two heat conduction columns 9 are provided on the side of the embedded pipe water cooling plate close to the box body 3. The inner ends of the two heat conduction columns 9 pass through the side wall of the box body 3 and extend into the inside of the box body 3 and are connected to the heat conduction plate 21. The side wall of the box body 3 is provided with a sliding sleeve 10 that slides with the heat conduction column 9. The section of the heat conduction column 9 extending into the inside of the box body 3 is sleeved with a reset spring 11. The inner and outer ends of the reset spring 11 are respectively connected to the heat conduction plate 21 and the inner wall of the box body 3. Two heat conduction copper tubes 12 are connected to the side of the embedded pipe water cooling plate away from the box body 3, and a plurality of heat dissipation fins 13 are connected to the outer side of the heat conduction copper tube 12.

[0021] The buried tube water-cooling plate of the first heat-conducting mechanism is the first buried tube water-cooling plate 8, and the buried tube water-cooling plate of the second heat-conducting mechanism is the second buried tube water-cooling plate 14. The water inlet of the first buried tube water-cooling plate 8 is connected to the outlet end of the water pump 6 through the first water pipe 15, the water outlet of the first buried tube water-cooling plate 8 is connected to the water inlet of the second buried tube water-cooling plate 14 through the second water pipe 16, the water outlet of the second buried tube water-cooling plate 14 is connected to the water inlet of the heat exchanger 22 through the third water pipe 17, and the water outlet of the coolant delivery box 5 is connected to the inlet end of the water pump 6 through the fourth water pipe 18.

[0022] When the water pump 6 is started, the water pump 6 pumps the coolant in the coolant delivery box 5 into the two buried pipe water cooling plates in turn, and the coolant in the buried pipe water cooling plates takes away the heat to achieve cooling and heat dissipation of the electronic equipment. After absorbing the heat, the coolant flows into the heat exchanger 22, where the coolant is cooled again and flows into the coolant delivery box 5, performing secondary circulation heat exchange cooling.

[0023] Front heat dissipation mounting holes are respectively opened on the front side plate of the box body 1 at the positions corresponding to the two heat conducting mechanisms, and intake fans 19 are respectively installed in the two front heat dissipation mounting holes; rear heat dissipation mounting holes are respectively opened on the rear side plate of the box body 1 at the positions corresponding to the two heat conducting mechanisms, and exhaust fans 20 are respectively installed in the two rear heat dissipation mounting holes.

[0024] When in use, the electronic device that needs heat dissipation is placed inside the box body 3 and between the two heat-conducting plates 21. Under the elastic force of the reset spring 11, the two heat-conducting plates 21 automatically contact the left and right surfaces of the electronic device. The heat on both sides of the electronic device is respectively introduced into the two buried tube water-cooling plates by the heat-conducting plates 21 and the heat-conducting columns 9. The heat is taken away by the coolant in the two buried tube water-cooling plates, which has the effect of cooling and dissipating heat. At the same time, the heat-conducting copper tube 12 can export part of the heat of the buried tube water-cooling plate, and then dissipate the heat through the heat dissipation fins 13. In conjunction with the corresponding inlet fan 19 and exhaust fan 20, the air flow speed in the box body 1 is accelerated, further improving the heat dissipation effect of the two sets of heat dissipation fins 13.

[0025] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A heat dissipation structure of an electronic device, the electronic device comprises a box body, a box body is arranged in the inner cavity of the box body, and the electronic device requiring heat dissipation is placed inside the box body, characterized in that: A heat dissipation structure is provided in the inner cavity of the box body, and the heat dissipation structure includes a coolant delivery box, a water pump, a first heat conduction mechanism, a second heat conduction mechanism and a heat exchanger which are connected in sequence through water pipes. The water outlet of the heat exchanger is connected to the water inlet of the coolant delivery box through a return pipe. The first heat conduction mechanism and the second heat conduction mechanism are respectively arranged on the left and right sides of the box body. Each heat conduction mechanism includes an embedded tube water cooling plate, which is located on the outside of the box body. Two heat conduction columns are provided on the side of the embedded tube water cooling plate close to the box body. The inner ends of the two heat conduction columns pass through the side wall of the box body and extend into the interior of the box body and are connected to the heat conduction plate. Two heat conduction copper tubes are connected to the side of the embedded tube water cooling plate away from the box body, and a number of heat dissipation fins are connected to the outside of the heat conduction copper tubes.

2. The heat dissipation structure of an electronic device as claimed in claim 1, characterized in that: The front side plate of the box body is respectively provided with front side heat dissipation mounting holes at positions corresponding to the two heat conducting mechanisms, and intake fans are respectively installed in the two front side heat dissipation mounting holes; the rear side plate of the box body is respectively provided with rear side heat dissipation mounting holes at positions corresponding to the two heat conducting mechanisms, and exhaust fans are respectively installed in the two rear side heat dissipation mounting holes.

3. The heat dissipation structure of an electronic device as claimed in claim 1, characterized in that: The side wall of the box body is provided with a sliding sleeve which slidably cooperates with the heat-conducting column. A section of the heat-conducting column extending into the box body is provided with a reset spring. The inner and outer ends of the reset spring are respectively connected to the heat-conducting plate and the inner wall of the box body.

4. The heat dissipation structure of an electronic device as claimed in claim 1, characterized in that: The buried tube water-cooling plate of the first heat-conducting mechanism is a first buried tube water-cooling plate, and the buried tube water-cooling plate of the second heat-conducting mechanism is a second buried tube water-cooling plate. The water inlet of the first buried tube water-cooling plate is connected to the outlet end of the water pump through a first water pipe, the water outlet of the first buried tube water-cooling plate is connected to the water inlet of the second buried tube water-cooling plate through a second water pipe, the water outlet of the second buried tube water-cooling plate is connected to the water inlet of the heat exchanger through a third water pipe, and the water outlet of the coolant delivery box is connected to the inlet end of the water pump through a fourth water pipe.

5. The heat dissipation structure of an electronic device as claimed in claim 1, characterized in that: The bottom of the box body is supported in the body cavity by four supporting columns, and the heat exchanger, the coolant delivery box and the water pump are located below the box body and arranged in sequence.

6. The heat dissipation structure of an electronic device as claimed in claim 1, characterized in that: The top of the box body is provided with a box cover which can be opened and closed.

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