Double-sided grinding machine for semiconductor silicon wafer processing

Abstract

The utility model belongs to the technical field of semiconductor silicon wafer processing, and discloses a double-sided grinding machine for semiconductor silicon wafer processing, which comprises a bottom box, a lower grinding structure and an upper grinding structure, and is characterized in that a bottom plate is arranged at the top of the bottom box, and a liquid conveying structure, a bearing, a bearing frame and a liquid falling hole are arranged on the bottom plate; the lower grinding structure is arranged on the bottom plate, the upper grinding structure is arranged on the bearing frame, and the upper grinding structure corresponds to the lower grinding structure. The first motor drives the lower transmission shaft and the driving wheel on the lower transmission shaft to rotate, the driving wheel drives the driven wheel to rotate through the belt, then the driven shafts and the lower grinding disc installed on the driven shafts are driven to rotate, the lower grinding disc conducts grinding treatment on the bottom surface of a semiconductor silicon wafer, and the lower transmission shaft drives the driven shafts to rotate. Therefore, a plurality of semiconductor silicon wafers can be ground at the same time, and the grinding efficiency of the semiconductor silicon wafers is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor silicon wafer production, in particular to a double-sided grinding machine for semiconductor silicon wafer processing. Background Art

[0002] During the production process of semiconductor silicon wafers, after the semiconductor silicon wafers are cut, in order to improve the quality of the semiconductor silicon wafers, the cut surface needs to be polished. For example, patent publication number CN209304294U specifically discloses an ultra-precision and efficient double-sided grinding and processing equipment for silicon wafers, including a housing and a grinding disc, the grinding disc is fixedly connected to the surface of the housing, one side of the grinding disc is provided with an electric hydraulic rod and a dust cover, the inner side wall of the housing is connected to the dust box through a slide rail buckle, and a handle is welded on the side wall of the dust box, an exhaust fan, an activated carbon filter and water are respectively provided inside the dust box, a fine sand layer and a ceramic silica gel plate are respectively provided at the bottom of the housing, the inner side wall of the housing is rotatably connected to the cooling fan, and a bump pad is bonded to the surface of the housing, the utility model has a novel design and a simple structure, and when the double-sided grinder is grinding silicon wafers, it is difficult to grind silicon wafers of different sizes, and multiple semiconductor silicon wafers cannot be ground at the same time, which makes the processing efficiency and effect unsatisfactory.

[0003] Based on this, the applicant proposes a double-sided grinder for semiconductor silicon wafer processing. Utility Model Content

[0004] The utility model aims to provide a double-sided grinder for semiconductor silicon wafer processing which has high structural strength, can grind silicon wafers of different sizes, can grind multiple semiconductor silicon wafers at the same time, and improves processing efficiency and processing effect, in order to solve the problems that the existing double-sided grinder for semiconductor silicon wafer processing has difficulty in grinding silicon wafers of different sizes, cannot grind multiple semiconductor silicon wafers at the same time, and makes the processing efficiency and processing effect unsatisfactory.

[0005] The technical solution adopted by the utility model to solve the technical problem is:

[0006] A double-sided grinder for processing semiconductor silicon wafers comprises a bottom box, a lower grinding structure and an upper grinding structure. A bottom plate is arranged on the top of the bottom box, and an infusion structure, a bearing, a support frame and a liquid drop hole are arranged on the bottom plate. The lower grinding structure is arranged on the bottom plate, and the upper grinding structure is arranged on the support frame, and the upper grinding structure corresponds to the lower grinding mechanism.

[0007] Preferably, the lower grinding structure includes a motor 1, a driven shaft, and a lower grinding disc, the motor 1 is arranged on a base plate, a lower transmission shaft is arranged on the motor 1, and a driving wheel is arranged on the lower transmission shaft, the driven shaft vertically passes through a bearing, a driven wheel is arranged at the bottom of the driven shaft, and the driven wheel is connected to the driving wheel through a belt, a lower mounting ring is arranged on the lower grinding disc, and the lower mounting ring is mounted on the bottom end of the driven shaft, the motor 1 drives the lower transmission shaft and the driving wheel on the lower transmission shaft to rotate, the driving wheel drives the driven wheel to rotate through the belt, and then drives the driven shaft and the lower grinding disc installed on the driven shaft to rotate, so that the lower grinding disc grinds the bottom surface of the semiconductor silicon wafer, and the lower transmission shaft drives multiple driven shafts to rotate, so that multiple semiconductor silicon wafers can be ground at the same time, thereby improving the grinding efficiency of semiconductor silicon wafers.

[0008] Preferably, the lower grinding disc is configured as a replaceable structure on the driven shaft through a lower mounting ring, and the lower mounting ring on the lower grinding disc is mounted on the driven shaft through threads, thereby improving the installation efficiency of the lower grinding disc on the driven shaft and the stability of the lower grinding disc on the driven shaft. On the other hand, according to different grinding requirements of semiconductor silicon wafers, the corresponding lower grinding disc is selected to improve the versatility of the double-sided grinder and expand the scope of application of the double-sided grinder.

[0009] Preferably, the infusion structure includes an infusion pump and a spray tube. The infusion pump is arranged on the bottom plate. A suction tube and an infusion tube are arranged on the infusion pump. The suction tube is extended into the bottom of the bottom box. The spray tube is arranged on the support frame through a connecting rod. The spray tube is connected to the infusion tube, and a nozzle is arranged on the spray tube. The infusion pump draws out the grinding liquid in the bottom box through the suction tube, transports it to the spray tube through the infusion tube, and sprays it through the nozzle. The sprayed grinding liquid is sprayed between the upper grinding disk and the lower grinding disk to perform double-sided grinding on the semiconductor silicon wafer, which can not only reduce the grinding difficulty of the semiconductor silicon wafer, but also improve the grinding quality of the semiconductor silicon wafer. The used grinding liquid flows into the bottom box through the liquid drop hole, realizes the recycling of the grinding liquid, and improves the utilization efficiency of the grinding liquid.

[0010] Preferably, a filter layer with a transverse structure is provided in the bottom box, and the used grinding liquid flows into the bottom box through the liquid drop hole. The filter layer can filter the impurities entering the bottom box with the grinding liquid, thereby improving the purity of the grinding liquid and further improving the grinding quality of semiconductor silicon wafers.

[0011] Preferably, the upper grinding structure includes motor 2, an adjustment plate, motor 3, and an upper grinding disc. Motor 2 is arranged at the top of the carrier frame, a rotating stud is arranged on motor 2, and motor 2 is arranged as a servo motor. The adjustment plate is arranged as a cross-shaped structure, and the four end points of the adjustment plate are extended from the carrier frame. A connecting screw ring is arranged on the adjustment plate, and the connecting screw ring is sleeved on the rotating stud. Motor 3 is arranged on the adjustment plate, an upper transmission shaft is arranged on motor 3, an upper mounting ring is arranged on the upper grinding disc, and the upper mounting ring is mounted on the upper transmission shaft. Motor 2 drives the rotating stud to rotate forward or reversely, so that the adjustment plate can move vertically on the carrier, thereby driving motor 3 and the upper grinding disc to rise or fall. Motor 3 drives the upper grinding disc to rotate, so that the upper grinding disc grinds the top surface of the semiconductor silicon wafer, and the rotation directions of the upper grinding disc and the lower grinding disc are set in opposite directions, so that the semiconductor silicon wafer can maintain a stable state between the upper grinding disc and the lower grinding disc, thereby improving the grinding quality of the semiconductor silicon wafer.

[0012] Preferably, the upper grinding disc is configured as a structure that can be replaced on the upper transmission shaft through an upper mounting ring, and the upper grinding disc is configured as a structure that can be replaced on the upper transmission shaft through an upper mounting ring, and the upper mounting ring on the upper grinding disc is installed on the upper transmission shaft through a thread, thereby improving the installation efficiency of the upper grinding disc on the upper transmission shaft and the stability of the upper grinding disc on the upper transmission shaft. On the other hand, according to different grinding requirements of semiconductor silicon wafers, the corresponding upper grinding disc is selected to improve the versatility of the double-sided grinder and expand the scope of application of the double-sided grinder.

[0013] Preferably, limiting rods are provided on opposite sides of the adjustment plate, limiting grooves are provided on the carrier frame, and the limiting rods are inserted into the limiting grooves. The adjustment plate moves vertically under the action of motor 2, so that the adjustment plate rises or falls in the carrier frame. The limiting rods on the adjustment plate move back and forth in the limiting grooves, which can limit the vertically moving adjustment plate, thereby improving the stability of the adjustment plate in the process of driving motor 3 and the upper grinding disc to move up and down, and enhancing the grinding quality of the upper grinding disc on semiconductor silicon wafers.

[0014] Beneficial effects:

[0015] 1. The motor drives the lower transmission shaft and the driving wheel on the lower transmission shaft to rotate, and the driving wheel drives the driven wheel to rotate through the belt, thereby driving the driven shaft and the lower grinding disc installed on the driven shaft to rotate, so that the lower grinding disc grinds the bottom surface of the semiconductor silicon wafer, and the lower transmission shaft drives multiple driven shafts to rotate, so that multiple semiconductor silicon wafers can be ground at the same time, thereby improving the grinding efficiency of semiconductor silicon wafers;

[0016] 2. Connect the spray pipe with the infusion pipe, and set a nozzle on the spray pipe. The infusion pump draws out the grinding liquid in the bottom box through the suction pipe, transports it to the spray pipe through the infusion pipe, and sprays it out through the nozzle. The sprayed grinding liquid is sprayed between the upper grinding disc and the lower grinding disc to perform double-sided grinding of the semiconductor silicon wafer, which can reduce the grinding difficulty of the semiconductor silicon wafer and improve the grinding quality of the semiconductor silicon wafer. The used grinding liquid flows into the bottom box through the liquid drop hole, realizing the recycling of the grinding liquid and improving the utilization efficiency of the grinding liquid;

[0017] 3. Motor 2 drives the rotating stud to rotate forward or reversely, so that the adjustment plate can move vertically on the carrier, thereby driving motor 3 and the upper grinding disk to rise or fall. Motor 3 drives the upper grinding disk to rotate, so that the upper grinding disk grinds the top surface of the semiconductor silicon wafer, and sets the rotation directions of the upper grinding disk and the lower grinding disk in opposite directions, so that the semiconductor silicon wafer can maintain a stable state between the upper grinding disk and the lower grinding disk, thereby improving the grinding quality of the semiconductor silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of the utility model.

[0019] Figure 2 It is a partial structural schematic diagram of the utility model, illustrating the connection structure between the bottom plate and the bearing frame.

[0020] Figure 3 It is a partial structural schematic diagram of the utility model, illustrating the connection structure between the bearing frame and the adjustment plate.

[0021] Figure 4 It is a partial structural schematic diagram of the utility model, illustrating the connection structure between the limiting rod and the limiting groove.

[0022] Figure 5 It is a partial structural schematic diagram of the utility model, illustrating the connection structure between the liquid spray pipe and the nozzle.

[0023] Figure 6 It is another schematic diagram of the implementation structure of the utility model.

[0024] In the figure: 1. bottom box, 2. bottom plate, 3. filter layer, 4. bearing, 5. support frame, 6. drop hole, 7. motor 1, 8. driven shaft, 9. lower grinding disc, 10. lower transmission shaft, 11. driving wheel, 12. driven wheel, 13. belt, 14. lower mounting ring, 15. infusion pump, 16. suction tube, 17. infusion tube, 18. motor 2, 19. adjustment plate, 20. motor 3, 21. upper grinding disc, 22. rotating stud, 23. connecting screw ring, 24. limiting rod, 25. limiting groove, 26. upper transmission shaft, 27. upper mounting ring, 28. connecting rod, 29. spray pipe, 30. nozzle, 31. retaining ring. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0026] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0027] Embodiment 1:

[0028] As attached Figure 1-5 As shown, a double-sided grinder for semiconductor silicon wafer processing includes a bottom box 1, a lower grinding structure and an upper grinding structure. A bottom plate 2 is arranged on the top of the bottom box 1, and an infusion structure, a bearing 4, a supporting frame 5, and a liquid drop hole 6 are arranged on the bottom plate 2. The lower grinding structure is arranged on the bottom plate 2, and the upper grinding structure is arranged on the supporting frame 5, and the upper grinding structure corresponds to the lower grinding structure.

[0029] Among them, the lower grinding structure includes a motor 7, a driven shaft 8, and a lower grinding disc 9. The motor 7 is arranged on the base plate 2, and a lower transmission shaft 10 is arranged on the motor 7, and a driving wheel 11 is arranged on the lower transmission shaft 10. The driven shaft 8 vertically passes through the bearing 4, and a driven wheel 12 is arranged at the bottom of the driven shaft 8, and the driven wheel 12 is connected to the driving wheel 11 through a belt 13. A lower mounting ring 14 is arranged on the lower grinding disc 9, and the lower mounting ring 14 is installed on the bottom end of the driven shaft 8. The lower grinding disc 9 is arranged as a structure that can be replaced on the driven shaft 8 through the lower mounting ring 14.

[0030] Among them, the infusion structure includes an infusion pump 15 and a spray tube 29. The infusion pump 15 is arranged on the bottom plate 2. A suction tube 16 and an infusion tube 17 are arranged on the infusion pump 15. The suction tube 16 is extended into the bottom of the bottom box 1. The spray tube 29 is arranged on the supporting frame 5 through a connecting rod 28. The spray tube 29 is connected to the infusion tube 17, and a nozzle 30 is arranged on the spray tube 29. A filter layer 3 with a horizontal structure is arranged in the bottom box 1.

[0031] Among them, the upper grinding structure includes motor 2 18, adjustment plate 19, motor 3 20, and upper grinding disc 21. Motor 2 18 is arranged at the top of the supporting frame 5. A rotating stud 22 is arranged on motor 2 18, and motor 2 18 is set as a servo motor. The adjustment plate 19 is set as a cross-shaped structure, and the four end points of the adjustment plate 19 are extended from the supporting frame 5. A connecting screw ring 23 is arranged on the adjustment plate 19, and the connecting screw ring 23 is sleeved on the rotating stud 22. Motor 3 20 is arranged on the adjustment plate 19, and an upper transmission shaft 26 is arranged on motor 3 20. An upper mounting ring 27 is arranged on the upper grinding disc 21, and the upper mounting ring 27 is installed on the upper transmission shaft 26. The upper grinding disc 21 is set as a structure that can be replaced on the upper transmission shaft 26 through the upper mounting ring 27. Limit rods 24 are arranged on opposite sides of the adjustment plate 19. A limiting groove 25 is arranged on the supporting frame 5, and the limiting rod 24 is inserted into the limiting groove 25.

[0032] Embodiment 2:

[0033] This embodiment is further described on the basis of the first embodiment. Figure 6 As shown: a retaining ring 31 is arranged on the bottom plate 2. During the grinding process of the semiconductor silicon wafer, the grinding liquid splashes out on the surface of the semiconductor silicon wafer during the rotation process. The retaining ring 31 can prevent the grinding liquid from splashing randomly, which can reduce the waste of the grinding liquid and improve the environmental protection performance.

[0034] Working principle: According to the size of the semiconductor silicon wafer to be ground, select the corresponding lower grinding disc 9 and upper grinding disc 21, install the lower mounting ring 14 on the lower grinding disc 9 on the bottom end of the driven shaft 8, and install the upper mounting ring 27 on the upper grinding disc 21 on the upper transmission shaft 26, place the semiconductor silicon wafer to be ground on the lower grinding disc 9, start the infusion pump 15, and the nozzle 30 sprays the grinding liquid onto the surface of the semiconductor silicon wafer, start the motor 2 18, and the motor 2 18 drives the rotating stud 22 to rotate, so that the adjustment plate 19 can move vertically on the carrier 5, thereby driving the motor 3 20 and the upper grinding disc 21 to descend, so that the upper grinding disc 21 contacts the semiconductor silicon wafer, and start the motor 1 7 , motor three 20, motor one 7 drives the lower grinding disk 9 to rotate, motor three 20 drives the upper grinding disk 21 to rotate, and the rotation directions of the upper grinding disk 21 and the lower grinding disk 9 are set in opposite directions, so that the semiconductor silicon wafer can maintain a stable state between the upper grinding disk 21 and the lower grinding disk 9, so that the upper grinding disk 21 and the lower grinding disk 9 grind the top surface and the bottom surface of the semiconductor silicon wafer respectively. After the double-sided grinding of the semiconductor silicon wafer is completed, motor one 7 and motor three 20 are turned off, and the adjustment plate 19 rises under the action of motor two 18 to separate the upper grinding disk 21 from the semiconductor silicon wafer, and the double-sided ground semiconductor silicon wafer is removed from the lower grinding disk 9 to complete the double-sided grinding of the semiconductor silicon wafer.

[0035] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

[0036] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0037] The parts not involved in the present invention are the same as the prior art or can be implemented by using the prior art.

Claims

1. A double-sided grinder for semiconductor silicon wafer processing, comprising a bottom box, a lower grinding structure and an upper grinding structure, characterized in that: The top of the bottom box is provided with a bottom plate, on which an infusion structure, a bearing, a support frame, and a liquid drop hole are arranged. The lower grinding structure is arranged on the bottom plate, and the upper grinding structure is arranged on the support frame, and the upper grinding structure corresponds to the lower grinding mechanism.

2. The double-sided grinding machine for semiconductor silicon wafer processing according to claim 1, characterized in that: The lower grinding structure includes a motor 1, a driven shaft, and a lower grinding disc. The motor 1 is arranged on a bottom plate, a lower transmission shaft is arranged on the motor 1, and a driving wheel is arranged on the lower transmission shaft. The driven shaft vertically passes through the bearing, a driven wheel is arranged at the bottom of the driven shaft, and the driven wheel is connected to the driving wheel through a belt. A lower mounting ring is arranged on the lower grinding disc, and the lower mounting ring is installed on the bottom end of the driven shaft.

3. The double-sided grinding machine for semiconductor silicon wafer processing according to claim 2, characterized in that: The lower grinding disc is arranged as a replaceable structure on the driven shaft through a lower mounting ring.

4. The double-sided grinding machine for semiconductor silicon wafer processing according to claim 1, characterized in that: The infusion structure includes an infusion pump and a spray tube. The infusion pump is arranged on the base plate. A suction tube and an infusion tube are arranged on the infusion pump. The suction tube is extended into the bottom of the bottom box. The spray tube is arranged on the supporting frame through a connecting rod. The spray tube is connected to the infusion tube, and a nozzle is arranged on the spray tube.

5. The double-sided grinding machine for semiconductor silicon wafer processing according to claim 4, characterized in that: A filter layer with a transverse structure is arranged in the bottom box.

6. The double-sided grinding machine for semiconductor silicon wafer processing according to claim 1, characterized in that: The upper grinding structure includes motor 2, an adjustment plate, motor 3, and an upper grinding disc. Motor 2 is arranged at the top of the carrier frame, a rotating stud is arranged on motor 2, and motor 2 is arranged as a servo motor. The adjustment plate is arranged as a cross-shaped structure, and the four end points of the adjustment plate are extended from the carrier frame. A connecting screw ring is arranged on the adjustment plate, and the connecting screw ring is sleeved on the rotating stud. Motor 3 is arranged on the adjustment plate, an upper transmission shaft is arranged on motor 3, an upper mounting ring is arranged on the upper grinding disc, and the upper mounting ring is mounted on the upper transmission shaft.

7. The double-sided grinding machine for semiconductor silicon wafer processing according to claim 6, characterized in that: The upper grinding disc is arranged as a replaceable structure on the upper transmission shaft through an upper mounting ring.

8. The double-sided grinding machine for semiconductor silicon wafer processing according to claim 6, characterized in that: Limiting rods are arranged on opposite sides of the adjustment plate, and limiting grooves are arranged on the bearing frame, and the limiting rods are inserted into the limiting grooves.

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