Silicon wafer clamp and porous silicon preparation device

Abstract

The embodiment of the utility model provides a silicon wafer clamp and a porous silicon preparation device. The clamp body is provided with a first surface and a second surface which are parallel to each other and side faces located on the first surface and the second surface, the side faces are connected with the first surface and the second surface at the same time, and the clamp body is provided with a containing space penetrating through the first surface and the second surface; and the flexible tensioning piece is arranged in the accommodating space. According to the silicon wafer clamp, the fragment rate can be reduced while the full-area corrosion of the silicon wafer is realized.

Description

Technical Field

[0001] The utility model relates to the technical field of porous silicon preparation, in particular to a silicon wafer clamp and a porous silicon preparation device. Background Art

[0002] Epitaxial single crystal silicon has been widely used in power devices and integrated circuit chips due to its excellent crystal integrity and resistivity uniformity. At the same time, epitaxial single crystal silicon has also attracted attention from the photovoltaic industry.

[0003] At present, epitaxial single crystal silicon is usually prepared by epitaxial layer transfer technology. The epitaxial layer transfer technology combines epitaxial silicon wafer growth technology with porous silicon preparation technology. First, one or more porous silicon layers with loose structure and weak mechanical strength are prepared on the surface of the single crystal silicon substrate as a sacrificial layer, and then an epitaxial single crystal silicon layer is prepared on the porous silicon surface. Finally, the epitaxial layer and the substrate are peeled off by mechanical stretching or chemical solution selective corrosion. When preparing porous silicon by anodic corrosion, the silicon wafer is fixed on the anode fixture and electrically connected to the positive electrode of the DC power supply, and then the electrolyte is filled into the etching tank so that the front of the silicon wafer is immersed in the electrolyte. After power is turned on, an electrochemical corrosion reaction occurs on the polished surface of the silicon wafer using the principle of electrochemical reaction, thereby forming one or more loose porous silicon layers with controllable thickness and porosity.

[0004] In order to ensure that the front and back sides of the silicon wafer are insulated from each other, a sealing ring is usually set on the surface of the silicon wafer when the porous silicon layer is formed by etching to prevent the leakage of electrolyte and prevent short circuit. However, the setting of the sealing ring makes it impossible to form a porous silicon layer in the area of ​​the silicon wafer surface blocked by the sealing ring, which increases the subsequent laser ring cutting process and causes material waste. In order to solve the above defects, the industry has achieved full-area etching of the silicon wafer to form a porous silicon layer, or fixed the silicon wafer to be corroded by vacuum adsorption, or clamped the silicon wafer to be corroded from the side of the silicon wafer by a mechanical device to ensure the sealing effect.

[0005] The above-mentioned methods of fixing the silicon wafer either cannot completely avoid corrosion on the other side of the silicon wafer or easily cause the silicon wafer to break. Utility Model Content

[0006] The utility model provides a silicon slice clamp and a porous silicon preparation device, aiming to solve the problem that the silicon slice is easy to break when the full area is etched.

[0007] The present invention provides a silicon wafer fixture, which includes:

[0008] A clamp body, the clamp body having a first surface and a second surface parallel to each other, and side surfaces located on the first surface and the second surface, the side surfaces being connected to the first surface and the second surface at the same time, and the clamp body being provided with a receiving space penetrating the first surface and the second surface;

[0009] A flexible tensioning member is disposed in the accommodating space.

[0010] Optionally, the silicon wafer fixture further comprises a fixture cover plate;

[0011] The clamp cover plate has a third surface and a fourth surface which are parallel to each other, and the clamp cover plate is provided with a through hole which passes through the third surface and the fourth surface;

[0012] The clamp cover is fixedly connected to the clamp body, the through hole is communicated with the accommodating space, and the flexible tensioning member is clamped between the clamp body and the clamp cover.

[0013] Optionally, the clamp body has a handle portion.

[0014] Optionally, the clamp body increases in width from bottom to top along the central axis of the first surface.

[0015] Optionally, the silicon wafer clamp further includes a first sealant, which is disposed on a side of the clamp body.

[0016] Optionally, the surface of the flexible tensioning member in contact with the side wall of the silicon wafer is a curved surface with an arc, and the concave opening of the curved surface faces the center of the accommodating space.

[0017] Optionally, the flexible tensioner includes a pneumatic tensioner or a shape memory alloy tensioner.

[0018] Optionally, the pneumatic tensioner is an annular airbag arranged along the circumference of the accommodation space; or,

[0019] The pneumatic tensioner includes a plurality of airbag bags distributed at intervals along the circumference of the accommodation space, and a second sealing member arranged between two adjacent airbag bags.

[0020] Optionally, the annular airbag comprises:

[0021] An airbag body, the airbag body is annular in shape and is arranged on the inner wall of the accommodating space;

[0022] A trachea is communicated with the airbag body.

[0023] Optionally, the clamp body is provided with a channel through which the air pipe passes.

[0024] Optionally, the thickness of the air cavity close to the center of the airbag body is smaller than the thickness of the air cavity away from the center of the airbag body, and the air cavity thickness is the dimension of the cavity of the airbag body along the axial centerline direction of the airbag body.

[0025] The embodiment of the utility model further provides a porous silicon preparation device, the porous silicon preparation device comprising an electrolytic cell and any of the aforementioned silicon wafer fixtures;

[0026] The silicon wafer fixture is detachably connected to the electrolytic cell.

[0027] When the silicon wafer clamp of the embodiment of the utility model is used for full-area etching of silicon wafers, the silicon wafer is embedded and fixed in the accommodation space provided by the clamp body, and the silicon wafer can be clamped and fixed by the flexible tensioning member in the accommodation space, so that the silicon wafer maintains a vertical posture, and the front and back of the silicon wafer can be in contact with the electrolyte respectively. This clamp uses a flexible tensioning member to achieve flexible clamping of the silicon wafer, and the clamping force can be adjusted by adjusting the deformation size of the flexible tensioning member, which can avoid the risk of fragmentation caused by rigid contact. Therefore, this silicon wafer clamp can reduce the fragmentation rate while achieving full-area etching of the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the description of the embodiments of the utility model will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 An exploded schematic diagram of a silicon wafer clamp in an embodiment of the utility model is shown;

[0030] Figure 2 A schematic diagram of the structure of the clamp body in an embodiment of the utility model is shown;

[0031] Figure 3 The utility model embodiment is shown Figure 2 A schematic cross-sectional view of the AA position;

[0032] Figure 4 A schematic diagram showing the insertion of a silicon wafer fixture into an electrolytic cell in an embodiment of the utility model is shown;

[0033] Figure 5 A schematic diagram of a silicon wafer fixture suitable for a square silicon wafer in an embodiment of the utility model is shown;

[0034] Figure 6 It shows a schematic structural diagram of a clamp cover plate in an embodiment of the utility model;

[0035] Figure 7 The utility model embodiment is shown Figure 6 A cross-sectional schematic diagram of the BB position;

[0036] Figure 8 The figure shows the assembly diagram of the clamp cover and the clamp body in the embodiment of the utility model;

[0037] Fig. 9 The utility model embodiment is shown Figure 8 A cross-sectional schematic diagram of the CC position;

[0038] Fig.10 The utility model embodiment is shown Fig. 9 A local enlarged schematic diagram of the I position;

[0039] Fig.11 The utility model embodiment is shown Fig. 9 A local enlarged schematic diagram of the II position;

[0040] Fig.12 A schematic diagram of the structure of an airbag in an embodiment of the utility model is shown;

[0041] Fig.13 The utility model embodiment is shown Fig.12 A cross-sectional schematic diagram of the DD position;

[0042] Fig.14 The utility model embodiment is shown Fig.13 A local enlarged schematic diagram of the III position;

[0043] Fig.15 A schematic diagram showing a silicon wafer fixture in an electrolytic cell in an embodiment of the utility model is shown;

[0044] Fig.16 A cross-sectional schematic diagram of a silicon wafer fixture located in an electrolytic cell in an embodiment of the utility model is shown.

[0045] Description of reference numerals:

[0046] Clamp body-10, first surface-10a, second surface-10b, side-10c, flexible tensioner-11, first sealing member-12, clamp cover-13, third surface-13a, fourth surface-13b, accommodating space-101, connecting portion-102, handle portion-103, airbag body-111, air pipe-112, through hole-131, electrolytic cell-20, crimping buckle-21, silicon wafer-30. DETAILED DESCRIPTION

[0047] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0048] Reference Figures 1 to 4 , shows a schematic structural diagram of a silicon wafer fixture provided by the utility model, the silicon wafer fixture comprising:

[0049] A clamp body 10, wherein the clamp body 10 has a first surface 10a and a second surface 10b which are parallel to each other, and a side surface 10c located between the first surface 10a and the second surface 10b, wherein the side surface 10c is connected to both the first surface 10a and the second surface 10b, and the clamp body 10 is provided with a receiving space 101 which passes through the first surface 10a and the second surface 10b;

[0050] A flexible tensioning member 11 is disposed in the accommodating space 101 .

[0051] The present invention provides a silicon wafer fixture, which is used to fix the silicon wafer when the surface of the silicon wafer is electrochemically etched to form a porous silicon layer. Figures 1 to 3 As shown in the figure, the silicon wafer clamp described in the utility model includes a clamp body 10, which is a flat plate-shaped part with a certain thickness and is made of acid- and alkali-resistant materials such as Teflon or polypropylene. One side of the clamp body 10 is a first surface 10a, and the other opposite side is a second surface 10b. The first surface 10a and the second surface 10b can be two surfaces parallel to each other, and the distance between the two surfaces is the thickness of the clamp body 10. In addition, between the first surface 10a and the second surface 10b and connected to the two surfaces at the same time is the side surface 10c of the clamp body 10. Along the direction from the first surface 10a to the second surface 10b, the width corresponding to the side surface 10c is also the thickness of the clamp body 10. Combined with the figure, it is easy to understand that when the first surface 10a and the second surface 10b are both quadrilaterals, the side surface 10c can be an annular surface surrounding the four sides of the first surface 10a and the second surface 10b.

[0052] like Figures 1 to 3As shown in the figure, a receiving space 101 for receiving a silicon wafer is provided on the clamp body 10. The receiving space 101 may be a through hole formed along the thickness direction of the clamp body 10. One opening of the through hole is located on the first surface 10a, and the other opening is located on the second surface 10b. A flexible tensioning member 11 is fixed inside the receiving space 101. When the flexible tensioning member 11 is in a relaxed state, the internal space of the receiving space 101 is relatively large and loose, and the silicon wafer can be placed therein very conveniently. After the silicon wafer is placed into the receiving space 101, the flexible tensioning member 11 is controlled to begin to deform and gradually tighten until the silicon wafer is stably and reliably clamped and fixed in the receiving space 101 and stops.

[0053] It should be noted that the flexible tensioning member 11 of the embodiment of the utility model is a part that can be deformed in shape or volume, and can use its own deformation tension to provide a soft clamping force to the silicon wafer. In addition, since the flexible tensioning member 11 is fixed to the inner wall of the accommodation space 101, when the silicon wafer is placed in the accommodation space 101, the flexible tensioning member 11 mainly applies a clamping force to the side wall of the silicon wafer, which can avoid the obstruction of the silicon wafer caused by applying a clamping force from the front or back of the silicon wafer, and therefore, it also helps to increase the surface area of ​​the silicon wafer corrosion.

[0054] In addition, combined Figure 1 and Figure 4 As shown in FIG. 1 , when the silicon wafer fixture of the embodiment of the utility model is used for full-area etching, the silicon wafer is clamped and immersed in an electrolytic tank 20 containing an electrolyte. One side of the silicon wafer is on the same side as the first surface 10a of the fixture body 10, and the other side of the silicon wafer is on the same side as the second surface 10b of the fixture body 10. The two surfaces of the silicon wafer undergo electrochemical reactions respectively to achieve surface etching.

[0055] It should be noted that the circular through hole corresponding to the accommodation space 101 in the figure is a schematic diagram of an embodiment of the utility model, and this silicon wafer clamp can be used to clamp a circular wafer. Figure 5 As shown, when the silicon wafer is a square silicon wafer used in the photovoltaic industry, the through hole can be a square hole, and the side length of the square hole is slightly larger than the side length of the silicon wafer.

[0056] From the above-mentioned process of clamping and fixing the silicon wafer, it can be seen that the clamping part of the silicon wafer clamp of the embodiment of the utility model is located on the side wall of the silicon wafer, which will not block the front or back of the silicon wafer. Therefore, it can ensure that the front of the silicon wafer is corroded or the front and back are corroded at the same time, so that full-area corrosion can be achieved. In addition, this clamp uses a flexible tensioner to achieve flexible clamping of the silicon wafer. The clamping force can be adjusted by adjusting the deformation of the flexible tensioner, which can avoid the risk of fragmentation caused by rigid contact. Therefore, this silicon wafer clamp can reduce the fragmentation rate while achieving full-area corrosion of the silicon wafer.

[0057] Optionally, refer to Figure 1 , Figures 6 to 11 , the silicon wafer fixture further includes a fixture cover plate 13;

[0058] The fixture cover plate 13 has a third surface 13a and a fourth surface 13b which are parallel to each other, and the fixture cover plate 13 is provided with a through hole 131 which passes through the third surface 13a and the fourth surface 13b;

[0059] The clamp cover plate 13 is fixedly connected to the clamp body 10 , the through hole 131 is communicated with the accommodating space 101 , and the flexible tensioning member 11 is clamped between the clamp body 10 and the clamp cover plate 13 .

[0060] Specifically, if Figure 1 As shown in the embodiment of the present invention, in order to facilitate the installation and removal of the flexible tensioning member 11, another flat clamp cover 13 can be used in combination with the clamp body 10. Figure 6 and Figure 7 As shown, similar to the fixture body 10, the fixture cover 13 is a flat plate-shaped part with a certain thickness and is made of acid- and alkali-resistant materials such as Teflon or polypropylene. One side of the fixture cover 13 is a third surface 13a, and the other opposite side is a fourth surface 13b. The third surface 13a and the fourth surface 13b can be two surfaces parallel to each other, and the distance between the two surfaces is the thickness of the fixture cover 13.

[0061] like Figure 6 and Figure 7 As shown in the figure, the fixture cover plate 13 is provided with a through hole 131 along its thickness direction, one opening of the through hole 131 is located on the third surface 13a, and the other opening is located on the fourth surface 13b. Figures 8 to 11 As shown in the figure, in one embodiment, the opening of the accommodating space 101 on the first surface 10a can be larger than the opening on the second surface 10b, and the flexible tensioner 11 can be placed from the opening of the first surface 10a into the accommodating space 101 and fixed tightly against the inner wall thereof. One side of the flexible tensioner 11 is blocked by the narrower opening of the second surface 10b to prevent it from falling. Then, the clamp cover 13 is docked with the clamp body 10, and the clamp cover 13 is installed and fixed on the side of the first surface 10a. An annular groove for placing the flexible tensioner 11 can be formed between the clamp cover 13 and the clamp body 10, and the clamp cover 13 can prevent the flexible tensioner 11 from falling out from the side of the first surface 10a. Therefore, the use of the clamp cover 13 and the clamp body 10 can make it easier to load and unload the flexible tensioner 11, and can ensure that the flexible tensioner 11 does not fall off after installation. Combined with Fig. 9 As shown in the diagram, it can be seen that the side wall of the silicon wafer 30 is in contact with the flexible tensioning member 11 and can be clamped and fixed around the side wall of the silicon wafer 30 by the flexible tensioning member 11.

[0062] Optionally, refer to Figure 2 , Figure 8 and Fig. 9 The opening of the accommodating space 101 is provided with a connecting portion 102 , and the clamp cover 13 is fixed to the connecting portion 102 .

[0063] Specifically, if Figure 2 , Figure 8 and Fig. 9 As shown, in the embodiment of the utility model, the connection portion 102 can be formed by processing at the opening portion of the accommodating space 101. For example, the connection portion 102 can be an annular stepped groove located at the opening portion of the first surface 10a. The clamp cover 13 can be embedded in the annular stepped groove, and then the clamp cover 13 and the clamp body 10 are fastened together using screws. Of course, the connection portion 102 can also be a structure protruding from the first surface 10a of the clamp body 10. The structural shape of the connection portion 102 is not limited in the embodiment of the utility model. Its function is to position and fix the clamp cover 13 so that it can be reliably connected to the clamp body 10.

[0064] Optionally, refer to Figure 8 and Fig. 9 The clamp body 10 has a handle portion 103 .

[0065] Specifically, if Figure 8 and Fig. 9 As shown in FIG. 1 , the clamp body 10 in the embodiment of the utility model is provided with a handle portion 103 for operation and lifting, which can facilitate workers to hold the clamp. The handle portion 103 can be a handle or a pull ring welded and fixed on the clamp body 10, or it can be a lifting beam formed by slotting the clamp body 10.

[0066] Optionally, refer to Figure 8 The width of the clamp body 10 increases from bottom to top along the central axis of the first surface 10a.

[0067] Specifically, if Figure 8 As shown in FIG. 1 , the clamp body 10 is in an axisymmetric shape, and the central axis P of the first surface 10a is the axis of symmetry of the clamp body 10. The end farther from the handle 103 is the bottom end of the clamp body 10, and the end closer to the handle 103 is the top end of the clamp body 10. When the silicon wafer clamp is inserted into the electrolytic cell, the bottom end contacts the bottom of the electrolytic cell, and the top end is located above the electrolyte level of the electrolytic cell. Figure 8The Z direction is the direction from the bottom to the top, and the width of the clamp body 10 gradually increases along the Z direction (i.e., along the axis P from bottom to top). For example, the clamp body 10 can be in a trapezoidal shape or a wedge shape. Thus, the clamp body 10 with a narrow bottom is easier to insert into the electrolytic cell, and the inclined side can also form a better downward pressure, which helps to improve the sealing effect.

[0068] Optionally, refer to Figure 1 and Figure 4 The silicon wafer clamp further includes a first sealing member 12 , which is disposed on a side of the clamp body 10 .

[0069] Specifically, if Figure 1 and Figure 4 As shown in FIG. 1 , in order to ensure that the electrochemical reaction on both surfaces of the silicon wafer is effectively carried out, a first sealing member 12 is fixed to a part of the side surface 10c of the clamp body 10 to seal and isolate the corrosive environment on both sides of the clamp body 10. For example, the first sealing member 12 can be a sealing strip made of a corrosion-resistant material, and the sealing strip can be bonded or embedded in the side surfaces 10c below and on both sides of the clamp body 10, so that when the clamp body 10 is inserted into the electrolytic cell 20, it can be effectively sealed and isolated.

[0070] Optionally, refer to Figure 12 to Figure 14 The surface of the flexible tensioning member 11 that contacts the side wall of the silicon wafer is a curved surface with an arc, and the concave opening of the curved surface faces the center of the accommodating space 101.

[0071] Specifically, if Figure 12 to Figure 14 As shown in the figure, a part of the outer wall of the flexible tensioner 11 is in contact with the inner wall of the accommodation space 101 and fixed together, and another part of the outer wall of the flexible tensioner 11 is exposed in the accommodation space 101 and can contact the side wall of the silicon wafer. The surface of the part of the flexible tensioner 11 in contact with the side wall of the silicon wafer is a curved surface with an arc, and the concave opening of the curved surface faces the center of the accommodation space 101. Therefore, when the silicon wafer is clamped by the flexible tensioner 11, the side wall of the silicon wafer is in contact with the curved surface, so that it can be stably fixed in the flexible tensioner 11.

[0072] Optionally, the flexible tensioner 11 includes a pneumatic tensioner or a shape memory alloy tensioner.

[0073] Specifically, in the embodiment of the utility model, the deformation of the flexible tensioner 11 can be controlled by air pressure, and the flexible tensioner 11 is a pneumatic tensioner. In addition, the flexible tensioner 11 can be made of shape memory alloy material, and the deformation and tensioning effect of the shape memory alloy material can be used to achieve flexible clamping of the silicon wafer.

[0074] Optionally, the pneumatic tensioner is an annular airbag arranged along the circumference of the accommodation space 101; or,

[0075] The pneumatic tensioner includes a plurality of airbag bags spaced apart from each other along the circumference of the accommodation space 101 , and a second sealing member disposed between two adjacent airbag bags.

[0076] Specifically, in one embodiment, Fig.12 As shown, when the flexible tensioner 11 of the embodiment of the utility model is a pneumatic tensioner, the pneumatic tensioner can be an annular airbag with the same shape as the accommodating space 101. When the annular airbag is inflated, it can not only play the role of flexibly clamping and fixing the silicon wafer, but also has a sealing effect to prevent the liquid on both sides of the silicon wafer from leaking and flowing. In addition, in another embodiment, the pneumatic tensioner can include multiple airbag bags, each of which can be inflated separately or inflated by a common air pipe. The multiple airbag bags are arranged at intervals along the circumference of the accommodating space 101 to form an annular array. In order to ensure airtightness, a second sealing member can be provided between two adjacent airbag bags to prevent the liquid on both sides of the silicon wafer from leaking and flowing.

[0077] Optionally, refer to Fig.12 and Fig.13 , the annular airbag comprises:

[0078] An airbag body 111, wherein the airbag body 111 is annular in shape and is disposed on an inner wall of the accommodating space 101;

[0079] The air pipe 112 is communicated with the airbag body 111 .

[0080] Specifically, if Fig.12 and Fig.13 In one embodiment, the annular airbag of the utility model embodiment includes an annular airbag body 111, which is embedded in the inner wall of the accommodating space 101. The airbag body 111 is also connected to an air pipe 112, one end of the air pipe 112 is connected to the airbag body 111, and the other end is connected to a gas supply device such as a compression pump outside the silicon wafer clamp. The gas pumping amount of the external gas supply device can be controlled to control the expansion degree of the airbag body 111, thereby adjusting the clamping force of the silicon wafer. The airbag body 111 and the air pipe 112 can be made of acid and alkali resistant rubber materials such as perfluoroether or nitrile.

[0081] Optionally, the clamp body 13 is provided with a passage through which the air pipe 112 passes.

[0082] Specifically, in order to fix the air pipe 112 and prevent the air pipe 112 from bending and blocking, a channel can be opened in the fixture body 13, and the air pipe 112 is inserted into the channel to form a protective structure for the air pipe 112. The shape of the channel is not limited to a long straight hole or a strip groove.

[0083] Optionally, refer to Fig.14 The thickness of the air cavity close to the center of the airbag body 111 is smaller than the thickness of the air cavity far from the center of the airbag body 111 , and the air cavity thickness is the dimension of the cavity of the airbag body 111 along the axis L of the airbag body 111 .

[0084] Specifically, if Fig.14 As shown in the figure, in the embodiment of the utility model, the thickness of the inner air cavity of the airbag body 111 close to the axis L can be smaller, and the thickness of the outer air cavity of the airbag body 111 away from the axis L can be larger. The larger thickness of the outer air cavity can provide a more sufficient air storage space, and the smaller thickness of the inner air cavity can prevent the airbag body 111 from blocking the silicon wafer when it is inflated. Based on the thin-inside-thick-outside structure of this embodiment, the longitudinal section of the airbag body 111 can be a teardrop shape or a T-shape, and the longitudinal section is a section passing through the axis L of the airbag body 111.

[0085] Reference Fig.15 Fig.16 , the embodiment of the utility model further provides a porous silicon preparation device, the porous silicon preparation device comprises an electrolytic cell 20 and any of the aforementioned silicon wafer fixtures;

[0086] The silicon wafer fixture is detachably connected to the electrolytic cell 20 .

[0087] like Figure 15 to Figure 16 As shown in the figure, the silicon wafer clamp of the embodiment of the utility model can form a new porous silicon preparation device with the electrolytic cell 20. A slot for inserting the silicon wafer clamp can be provided in the cell body of the electrolytic cell 20. When porous silicon needs to be prepared, the silicon wafer to be corroded is first mounted and fixed on the silicon wafer clamp, and then the silicon wafer clamp is inserted and installed in the electrolytic cell 20 along the slot, and then the electrolyte is injected into the cell and energized for corrosion. It should be noted that the electrolytic cell 20 in the porous silicon preparation device of the embodiment of the utility model can be a single cell or a double cell, and the utility model does not limit the structure of the electrolytic cell 20. By adopting this porous silicon preparation device of the embodiment of the utility model, a higher yield rate can be achieved during full-area corrosion.

[0088] Optionally, refer to Fig.15 , crimping buckles 21 are provided on both sides of the electrolytic cell 20 , and the crimping buckles 21 clamp and fix the silicon wafer fixture on the electrolytic cell 20 .

[0089] Specifically, if Fig.15 As shown in the figure, crimping buckles 21 are arranged on both sides of the electrolytic cell 20. The crimping buckles 21 are movable buckles. When the silicon wafer clamp is inserted into the electrolytic cell 20, the silicon wafer clamp can be locked on the electrolytic cell 20 by switching the state of the crimping buckles 21. Figure 8 As shown in the figure, for the silicon wafer clamp with a shorter bottom width and a longer top width, its side surface is inclined compared to the bottom of the electrolytic cell 20. The pressure exerted by the crimping buckle 21 on the silicon wafer clamp will also form a force perpendicular to the inclined surface, which can improve the sealing effect.

[0090] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0091] The embodiments of the utility model are described above in conjunction with the accompanying drawings, but the utility model is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the enlightenment of the utility model, ordinary technicians in this field can also make many forms without departing from the scope of protection of the utility model and the claims, all of which are within the protection of the utility model.

Claims

1. A silicon wafer fixture, characterized in that: The silicon wafer fixture comprises: A clamp body, the clamp body having a first surface and a second surface parallel to each other, and a side surface located between the first surface and the second surface, the side surface being connected to the first surface and the second surface at the same time, and the clamp body being provided with a receiving space penetrating the first surface and the second surface; A flexible tensioning member is disposed in the accommodating space.

2. The silicon wafer fixture according to claim 1, characterized in that: The silicon wafer fixture also includes a fixture cover plate; The clamp cover plate has a third surface and a fourth surface which are parallel to each other, and the clamp cover plate is provided with a through hole which passes through the third surface and the fourth surface; The clamp cover is fixedly connected to the clamp body, the through hole is communicated with the accommodating space, and the flexible tensioning member is clamped between the clamp body and the clamp cover.

3. The silicon wafer clamp according to claim 1 or 2, characterized in that: The clamp body has a handle portion.

4. The silicon wafer fixture according to claim 1, characterized in that: The clamp body increases in width from bottom to top along the central axis of the first surface.

5. The silicon wafer clamp according to claim 1 or 4, characterized in that: The silicon wafer clamp further includes a first sealing member, which is disposed on a side of the clamp body.

6. The silicon wafer fixture according to claim 1, characterized in that: The surface of the flexible tensioning member in contact with the side wall of the silicon wafer is a curved surface with an arc, and the concave opening of the curved surface faces the center of the accommodating space.

7. The silicon wafer clamp according to claim 1, 2, 4 or 6, characterized in that: The flexible tensioner includes a pneumatic tensioner or a shape memory alloy tensioner.

8. The silicon wafer fixture according to claim 7, characterized in that: The pneumatic tensioner is an annular airbag arranged along the circumference of the accommodation space; or, The pneumatic tensioner includes a plurality of airbag bags distributed at intervals along the circumference of the accommodation space, and a second sealing member arranged between two adjacent airbag bags.

9. The silicon wafer fixture according to claim 8, characterized in that: The annular airbag comprises: The airbag body is annular in shape and is arranged in the airbag receiving space. The inner wall of the room; A trachea is communicated with the airbag body.

10. The silicon wafer fixture according to claim 9, characterized in that: The clamp body is provided with a passage through which the air pipe is passed.

11. The silicon wafer fixture according to claim 9, characterized in that: The thickness of the air cavity close to the center of the airbag body is smaller than the thickness of the air cavity far from the center of the airbag body. The air cavity thickness is the dimension of the cavity of the airbag body along the axial direction of the airbag body.

12. A porous silicon preparation device, characterized in that: The porous silicon preparation device comprises an electrolytic cell and a silicon wafer fixture according to any one of claims 1 to 11; The silicon wafer fixture is detachably connected to the electrolytic cell.

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