Clamp for semiconductor wafer processing

Abstract

The utility model discloses a clamp for semiconductor wafer processing, which relates to the technical field of semiconductor processing and comprises a concave base, a lifting adjusting mechanism is arranged in the concave base, and driving boxes driven by the lifting adjusting mechanism to move are arranged on the inner walls of the two sides of the concave base in a sliding manner; according to the clamp for processing the semiconductor wafer, the two groups of driving boxes are driven by the lifting adjusting mechanism to drive the motor box and the clamp box to lift and displace until wafer raw materials clamped between the two groups of clamp boxes are driven to lift to a proper position, so that the clamp for processing the semiconductor wafer is convenient to carry out proper height adjustment on the semiconductor wafer raw materials according to actual processing requirements; and the rotating motor drives the clamp boxes to rotate until the wafer raw materials clamped between the two sets of clamp boxes are driven to rotate to a proper position, so that the clamp for semiconductor wafer processing is convenient to carry out proper rotation adjustment on the semiconductor wafer raw materials according to actual processing requirements.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a clamp for semiconductor wafer processing. Background Art

[0002] Semiconductor refers to materials with electrical conductivity between conductors and insulators at room temperature. It is used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. Semiconductor wafer refers to silicon wafers used to make silicon semiconductor circuits. The raw material is silicon. In the processing of semiconductor wafers, it is inevitable to clamp the wafer raw materials through corresponding fixtures.

[0003] For example, the utility model patent with application number 202320631631.8 discloses a fixture for semiconductor processing, including a base, a servo motor is fixedly installed on the outer wall of the base, a first screw rod is fixedly connected to the output shaft of the servo motor, the surface of the first screw rod is provided with two threaded segments with opposite rotation directions, and the surfaces of the two threaded segments are both screwed with guide rods through threads, and the upper end of the guide rod is also rotatably penetrated by a connecting rod, and the ends of the connecting rods close to each other are fixedly installed with a clamping seat, and a micro motor is fixedly installed on the clamping seat.

[0004] Based on the findings in the prior art, most of the existing semiconductor wafer processing fixtures have single functions and only have simple spacing adjustment and automatic clamping functions, but do not have the function of lifting and rotating the semiconductor wafer raw materials, which makes it inconvenient to perform appropriate height adjustment and rotation adjustment on the semiconductor wafer raw materials according to actual processing needs, is inconvenient to use, and has low practicality. Therefore, the utility model proposes a semiconductor wafer processing fixture to solve the problems existing in the prior art. Utility Model Content

[0005] In view of the above problems, the purpose of the utility model is to propose a clamp for semiconductor wafer processing, which solves the problem that the existing clamp for semiconductor wafer processing does not have the function of lifting and rotating the semiconductor wafer raw materials, making it inconvenient to properly adjust the height and rotation of the semiconductor wafer raw materials according to actual processing needs.

[0006] In order to achieve the purpose of the utility model, the utility model is implemented through the following technical solutions: a clamp for semiconductor wafer processing, including a concave base, a lifting adjustment mechanism is provided inside the concave base, and a driving box driven by the lifting adjustment mechanism is slidably provided on the inner walls on both sides of the concave base, and a translation adjustment mechanism is provided inside the driving box, and two groups of driving boxes are provided with motor boxes driven by the translation adjustment mechanism on opposite sides, and a rotating motor is provided inside the motor box, and the output end shaft of the rotating motor passes through the outside of the motor box through a bearing and is fixed with a clamp box, and a wafer clamping plate driven by a motor and displaced is symmetrically provided on the side of the clamp box away from the motor box.

[0007] A further improvement is that the output end of the motor passes through the inside of the fixture box through a bearing and is fixed with a bidirectional screw. The two groups of wafer clamps symmetrically distributed up and down slide through the fixture box at one end close to the fixture box and are respectively threaded on both sides of the bidirectional screw.

[0008] A further improvement is that a support ring plate is fixed to one side of the motor box close to the fixture box, a support plate located inside the support ring plate is symmetrically fixed to one side of the fixture box close to the motor box, and a roller rotatably connected to the support plate and in contact with the inner wall of the support ring plate.

[0009] A further improvement is that the translation adjustment mechanism includes a first one-way screw that is rotatably connected to the inside of the drive box and driven to rotate by a servo motor, and a first threaded plate that is threadedly sleeved on the first one-way screw, and a support rod that slides through the drive box is symmetrically fixed between the first threaded plate and the motor box.

[0010] A further improvement is that the lifting and lowering adjustment mechanism includes a second one-way screw that is rotatably connected to both sides of the concave base and driven to rotate by a knob, and a second threaded plate is threadedly sleeved on the second one-way screw. The end of the second threaded plate close to the drive box slides through the outside of the concave base and is fixedly connected to the drive box.

[0011] A further improvement is that a rotating shaft is fixed to the bottom end of the knob, the lower part of the rotating shaft passes through the concave base through a bearing and is fixedly sleeved with a first sprocket that is symmetrically distributed up and down, and the lower parts of the two groups of the second one-way screw rods are fixed with a second sprocket, and a transmission chain is jointly sleeved on the first sprocket and the second sprocket.

[0012] Further improvements are: anti-slip rubber pads are fixed to the opposite sides of the upper and lower groups of wafer clamps, a rubber support pad is fixed to the bottom of the concave base, and fixing blocks are fixed to the lower part of the outer walls on both sides of the concave base, and fixing bolts are threaded through the fixing blocks.

[0013] The beneficial effects of the utility model are as follows: the utility model includes a concave base, and drives two groups of drive boxes through a lifting and adjusting mechanism to drive the motor box and the clamp box to lift and displace, until the wafer raw materials clamped between the two groups of clamp boxes are lifted and lifted to an appropriate position, so that the semiconductor wafer processing clamp is convenient for appropriately adjusting the height of the semiconductor wafer raw materials according to actual processing needs, and drives the clamp box to rotate through a rotating motor until the wafer raw materials clamped between the two groups of clamp boxes are rotated to an appropriate position, so that the semiconductor wafer processing clamp is convenient for appropriately rotating and adjusting the semiconductor wafer raw materials according to actual processing needs, and is easy to use, rich in functions, and highly practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a front view of the utility model;

[0015] Figure 2 It is a front sectional view of the utility model;

[0016] Figure 3 This utility model Figure 2 A in the enlarged view;

[0017] Figure 4 It is a cross-sectional view of the fixture box of the present utility model.

[0018] Among them: 1. concave base; 2. drive box; 3. motor box; 4. rotating motor; 5. fixture box; 6. motor; 7. wafer clamp; 8. bidirectional screw; 9. support ring plate; 10. support plate; 11. roller; 12. servo motor; 13. first unidirectional screw; 14. first threaded plate; 15. support rod; 16. knob; 17. second unidirectional screw; 18. second threaded plate; 19. rotating shaft; 20. first sprocket; 21. second sprocket; 22. transmission chain; 23. anti-slip rubber pad; 24. rubber support pad; 25. fixing block. DETAILED DESCRIPTION

[0019] In order to deepen the understanding of the present invention, the present invention will be further described in detail below in conjunction with an embodiment. The embodiment is only used to explain the present invention and does not constitute a limitation on the protection scope of the present invention.

[0020] according to Figure 1 , Figure 2 , Figure 3 , Figure 4As shown, the present embodiment provides a fixture for semiconductor wafer processing, comprising a concave base 1 with a hollow interior and a driving box 2 symmetrically arranged on the inner walls of the left and right sides of the concave base 1, the driving box 2 slidingly fits with the inner wall of the concave base 1, and the interior of the concave base 1 is also provided with a lifting adjustment mechanism for driving the driving box 2 to perform lifting and displacement, and the interior of the driving box 2 is provided with a translation adjustment mechanism, two groups of driving boxes 2 are provided with motor boxes 3 on opposite sides, and the motor box 3 is driven by the translation adjustment mechanism and performs lateral horizontal displacement, a rotating motor 4 is fixed inside the motor box 3 by bolts, the output end shaft of the rotating motor 4 passes through a bearing to the outside of the motor box 3 and is fixed with a fixture box 5 by bolts, a motor 6 is fixed to the top of the fixture box 5 by screws, and the two groups of fixture boxes 5 are relatively one The two sides are provided with wafer clamps 7 which are driven by a motor 6 to move and are symmetrically distributed up and down. The motor 6 drives the upper and lower groups of wafer clamps 7 to move toward each other and clamp the semiconductor wafer raw material. The lifting and adjusting mechanism drives the two groups of drive boxes 2 to drive the motor box 3 and the clamp box 5 to move up and down until the wafer raw material clamped between the two groups of clamp boxes 5 is lifted to an appropriate position, so that the semiconductor wafer processing fixture can be convenient for appropriate height adjustment of the semiconductor wafer raw material according to actual processing needs, and the rotating motor 4 drives the clamp box 5 to rotate until the wafer raw material clamped between the two groups of clamp boxes 5 is rotated to an appropriate position, so that the semiconductor wafer processing fixture can be convenient for appropriate rotation adjustment of the semiconductor wafer raw material according to actual processing needs.

[0021] The output end shaft of the motor 6 passes through the interior of the clamp box 5 through a bearing and is fixed with a bidirectional screw 8. The two groups of wafer clamps 7 symmetrically distributed above and below are slid into the clamp box 5 at one end close to the clamp box 5. The two groups of clamp boxes 5 are provided with through grooves adapted to the wafer clamps 7 on opposite sides for the wafer clamps 7 to slide through. The upper and lower groups of wafer clamps 7 are located on one side of the clamp box 5 and are respectively threadedly connected to the two sides of the bidirectional screw 8 in opposite directions. The motor 6 drives the bidirectional screw 8 to rotate, so that the wafer clamps 7 threadedly connected on both sides of the bidirectional screw 8 are displaced toward each other, thereby achieving the clamping and fixation of the semiconductor wafer raw materials.

[0022] A support ring plate 9 is fixed to the side wall of the motor box 3 close to the clamp box 5 by bolts. Four groups of support plates 10 symmetrically distributed and located on the inner side of the support ring plate 9 are welded and fixed to the side of the clamp box 5 close to the motor box 3. A roller 11 is rotatably connected to the support plate 10, and the side of the roller 11 close to the support ring plate 9 is in contact with the inner wall of the support ring plate 9. The support ring plate 9 provides auxiliary support for the roller 11, so that the clamp box 5 is more stable during rotation.

[0023] The translation adjustment mechanism includes a first one-way screw rod 13 and a first threaded plate 14, wherein the first one-way screw rod 13 is rotatably connected to the inside of the drive box 2 through a bearing, and the outer walls of the two groups of drive boxes 2 on opposite sides are fixed with servo motors 12 by bolts, and the end of the first one-way screw rod 13 close to the servo motor 12 passes through the bearing to the outside of the drive box 2 and is connected to the output end shaft of the servo motor 12, the first threaded plate 14 is located in the drive box 2 and is threadedly sleeved on the first one-way screw rod 13, and a support rod 15 is symmetrically fixed on the side of the first threaded plate 14 close to the motor box 3, and the end of the support rod 15 away from the first threaded plate 14 slides through the outside of the drive box 2 and is fixedly connected to the motor box 3, and the first one-way screw rod 13 is driven to rotate by the servo motor 12, so that the first threaded plate 14 threadedly sleeved on the first one-way screw rod 13 moves along the first one-way screw rod 13, and drives the motor box 3 to move through the support rod 15.

[0024] The lifting and lowering adjustment mechanism includes two groups of second one-way screw rods 17, which are rotatably connected to the left and right sides of the concave base 1 through bearings and driven to rotate by a knob 16 at the middle position of the bottom inner end of the concave base 1. The two groups of second one-way screw rods 17 are both threadedly sleeved with second threaded plates 18, and the two groups of second threaded plates 18 slide through the outside of the concave base 1 at one opposite end. The end of the second threaded plate 18 located outside the concave base 1 is fixedly connected to the drive box 2, and the second one-way screw rod 17 is driven to rotate by the knob 16, so that the second threaded plate 18 threadedly sleeved on the second one-way screw rod 17 moves up and down along the second one-way screw rod 17, and drives the drive box 2 to rise and fall.

[0025] A rotating shaft 19 is fixed to the bottom end of the knob 16, and the lower part of the rotating shaft 19 passes through the concave base 1 through a bearing and is fixedly sleeved with a first sprocket 20. There are two groups of first sprockets 20 and they are symmetrically distributed up and down inside the concave base 1. Second sprockets 21 are fixed to the lower parts of the two groups of second one-way screw rods 17. The positions of the two groups of second sprockets 21 correspond to the positions of the two groups of first sprockets 20 one by one. A transmission chain 22 is sleeved on the first sprocket 20 and the second sprocket 21 is connected through the transmission chain 22. The rotating shaft 19 is driven by turning the knob 16 to drive the first sprocket 20 to rotate, and the first sprocket 20 drives the second sprocket 21 to rotate through the transmission chain 22, thereby realizing the rotation of the second one-way screw rod 17.

[0026] Anti-skid rubber pads 23 are fixed to the opposite sides of the upper and lower groups of wafer clamps 7 to play an anti-skid buffering role. A rubber support pad 24 is fixed to the bottom end of the concave base 1. Fixed blocks 25 are fixed to the lower parts of the outer walls on both sides of the concave base 1. The fixed blocks 25 are threaded with fixing bolts. The concave base 1 is fixed to the desktop through the fixing bolts, thereby realizing the fixed installation of the fixture for semiconductor wafer processing.

[0027] When it is necessary to clamp the wafer raw material during the semiconductor wafer processing process, the translation adjustment mechanism in the driving box 2 is first started to drive the motor box 3 to move, and the motor box 3 then drives the clamp box 5 to move until the distance between the two groups of clamp boxes 5 meets the placement of the wafer raw material to be clamped, and then the wafer raw material to be clamped is placed between the upper and lower groups of wafer clamping plates 7 between the two groups of clamp boxes 5, and then the motor 6 is started to drive the upper and lower groups of wafer clamping plates 7 to move toward each other until the wafer raw material is clamped and fixed, that is, the clamping work is completed;

[0028] When the height of the wafer material after clamping and fixing needs to be adjusted according to actual processing needs, the lifting and adjusting mechanism is started to drive the two sets of driving boxes 2 to drive the motor box 3 and the clamp box 5 to move up and down until the wafer material clamped between the two sets of clamp boxes 5 is lifted to an appropriate position, that is, the processing height adjustment is completed;

[0029] When it is necessary to rotationally adjust the wafer material after clamping according to actual processing needs, start the rotating motor 4 to drive the fixture box 5 to rotate until the wafer material clamped between the two sets of fixture boxes 5 is rotated to the appropriate position, thus completing the rotation adjustment of the wafer material during processing.

[0030] The above shows and describes the basic principles, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principles of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A semiconductor wafer processing fixture, comprising a concave base (1), characterized in that: The concave base (1) is provided with a lifting adjustment mechanism inside, and the inner walls on both sides of the concave base (1) are slidably provided with a drive box (2) driven by the lifting adjustment mechanism. The drive box (2) is provided with a translation adjustment mechanism inside, and the two groups of drive boxes (2) are provided with a motor box (3) driven by the translation adjustment mechanism on the opposite side. The motor box (3) is provided with a rotating motor (4) inside, and the output end shaft of the rotating motor (4) passes through the outside of the motor box (3) through a bearing and is fixed with a clamp box (5). The clamp box (5) is symmetrically provided with a wafer clamp (7) driven by a motor (6) on the side away from the motor box (3).

2. A semiconductor wafer processing fixture according to claim 1, characterized in that: The output end of the motor (6) passes through the interior of the clamp box (5) through a bearing and is fixed with a bidirectional screw (8). The ends of the two groups of wafer clamps (7) symmetrically distributed above and below and close to the clamp box (5) are slid into the clamp box (5) and are respectively threadedly sleeved on both sides of the bidirectional screw (8).

3. A semiconductor wafer processing fixture according to claim 1, characterized in that: A support ring plate (9) is fixed to one side of the motor box (3) close to the clamp box (5), and a support plate (10) located inside the support ring plate (9) is symmetrically fixed to one side of the clamp box (5) close to the motor box (3), and a roller (11) is rotatably connected to the support plate (10) and contacts the inner wall of the support ring plate (9).

4. A semiconductor wafer processing fixture according to claim 1, characterized in that: The translation adjustment mechanism comprises a first one-way screw (13) rotatably connected to the inside of the drive box (2) and driven to rotate by a servo motor (12), and a first threaded plate (14) threadedly sleeved on the first one-way screw (13), and a support rod (15) slidably penetrating the drive box (2) is symmetrically fixed between the first threaded plate (14) and the motor box (3).

5. The semiconductor wafer processing fixture according to claim 1, characterized in that: The lifting and lowering adjustment mechanism comprises a second one-way screw (17) which is rotatably connected to both sides of the inside of the concave base (1) and driven to rotate by a knob (16); a second threaded plate (18) is threadedly sleeved on the second one-way screw (17); an end of the second threaded plate (18) close to the drive box (2) slides through the outside of the concave base (1) and is fixedly connected to the drive box (2).

6. A semiconductor wafer processing fixture according to claim 5, characterized in that: A rotating shaft (19) is fixed at the bottom end of the knob (16); the lower part of the rotating shaft (19) passes through the concave base (1) through a bearing and is fixedly sleeved with a first sprocket (20) symmetrically distributed up and down; the lower parts of the two groups of the second one-way screw rods (17) are both fixed with a second sprocket (21); and a transmission chain (22) is sleeved on the first sprocket (20) and the second sprocket (21).

7. A semiconductor wafer processing fixture according to claim 1, characterized in that: Anti-skid rubber pads (23) are fixed to opposite sides of the upper and lower groups of wafer clamps (7), a rubber support pad (24) is fixed to the bottom end of the concave base (1), and fixing blocks (25) are fixed to the lower parts of the outer walls on both sides of the concave base (1), and fixing bolts are threaded through the fixing blocks (25).

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